CN111302613A - Picosecond laser cutting method for ultra-thick glass - Google Patents

Abstract

The invention discloses a picosecond laser cutting method for super-thick glass, which comprises the following specific steps: 1) placing the glass on a working platform, wherein the light spot of the laser-shaped light wire is positioned on the upper surface of the glass; 2) importing the cutting graph into upper operation software of a laser cutting machine, and setting laser parameters and motion parameters: the laser pulse width is 1-50 ps; shaping the laser into filamentous light spots, wherein the length of the light filament is 0.3-1.0mm, and the diameter of the light spot of the light filament is 0.003-0.02 mm; 3) cutting the glass with a preset pattern to complete a first cutting seam; 4) lowering or raising the cutting head, and repeating the step 3 to complete the second cutting seam); 5) repeating the step 4), and repeating the steps in the same manner until the lowest surface of the glass is cut completely; the cutting repetition times are determined by the length T of the smooth wire and the thickness T of the glass, and the repetition times n = T/[ T- (0.1-0.5) ] is rounded; 6) and (5) splitting the sample to finish splitting. The cutting thickness process has the advantages of wide applicability range, good cutting quality, high efficiency and better practical effect.

Description

Picosecond laser cutting method for ultra-thick glass

Technical Field

The invention relates to a laser cutting process method, in particular to a process method for picosecond laser cutting of glass.

Background art:

at present, laser processing is used as a novel special processing method, has strong processing adaptability, can process various materials, including materials with high hardness, high melting point, brittle materials and the like, and solves the problem which cannot be solved in the traditional processing technology; the light spot is easy to control, the size can be focused to a very small magnitude, and the process requirements with extremely high processing precision requirements such as fixed-point processing, fine processing and the like can be met; high processing efficiency, material saving and good economic benefit.

With the continuous development of glass materials in different application fields, the requirements for processing the glass materials are more and more strict at present, and laser cutting is gradually becoming a main technological method for deep processing of glass as a precision processing technology.

The glass material has the obvious characteristics of hard brittleness, great difficulty is brought to processing, and especially the cutting processing of the super-thick glass becomes the existing technical problem. The traditional super-thick glass cutting means adopts a hard alloy or diamond cutter, is widely applied to a plurality of applications, and the cutting process comprises two steps: firstly, a diamond tool tip or a hard alloy grinding wheel is used for glass to generate a crack on the surface of the glass; secondly, adopting a mechanical means to separate the glass along the crack line; however, the existing cutting methods for scribing and cutting ultra-thick glass have some disadvantages: firstly, the removal of the material can cause the generation of chips, fragments and micro cracks, so that the strength of the cutting edge is reduced, and a CNC fine grinding process is required; secondly, the cutter is easy to wear and needs to be replaced regularly, which belongs to an easy-to-wear product and has high cutting cost; thirdly, the existing method can only cut straight lines, is difficult to cut special-shaped patterns, and has low yield of finished products. Therefore, for the products with the glass cutting thickness of more than or equal to 1mm, especially for the glass with the super-thick glass cutting thickness of 5mm, in order to ensure the glass strength after cutting, improve the cutting efficiency, meet the requirements that the glass thickness is not limited by cutting and the like, the method for cutting the super-thick glass is particularly required to be provided.

Disclosure of Invention

The purpose of the invention is as follows: aiming at the existing problems and defects, the invention aims to provide a method for picosecond laser cutting of super-thick glass, which has the advantages of wide cutting thickness range, good process applicability, good cutting quality and high efficiency.

The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:

a picosecond laser cutting method for super-thick glass comprises the following specific steps:

1) placing the glass with a clean surface on a working platform, adjusting the relative position of a laser cutting machine and the working platform, and enabling the upper light point of a cutting head light wire of the laser cutting machine to be located on the upper surface of the glass;

2) importing the cutting graph into upper operation software of a laser cutting machine, and setting laser parameters and motion parameters: the laser adopts a picosecond infrared or green laser, and the pulse width is 0.1-100 ps; the light spot from the laser passes through a beam expander, a reflector, a cutting head and other lens groups, the round light spot is shaped into a filamentous light spot, the length of the light filament is 0.3-1.0mm, and the diameter of the light spot of the light filament is 0.003-0.02 mm;

the laser cutting parameters are set to be cutting speed of 20-600mm/s, laser output power of 5-50W and laser output frequency of 10 KHz-2 MHz;

3) starting a laser cutting machine to cut the glass with a preset pattern to complete a first cutting seam;

4) after the cutting head is lowered by a certain height or the working platform is raised by a certain height, repeating the step 3) to finish the second joint cutting, wherein the lowering height of the cutting head or the raising height of the working platform H = t- (0.1-0.5);

5) repeating the step 4), and repeating the steps in the same manner until the lowest surface of the glass is cut completely; the cutting repetition times are determined by the length T of the smooth wire and the thickness T of the glass, and the repetition times n = T/[ T- (0.1-0.5) ] is rounded;

6) breaking the sample by adopting a manual breaking or mechanical mode, and cutting the glass into a preset pattern after breaking;

7) and finishing the cutting process.

Has the advantages that: compared with the prior art, the picosecond laser cutting method for the super-thick glass can cut non-toughened glass and toughened glass with the thickness of 1.0-20mm, has wide cutting pattern, can cut straight lines and different patterns, and has wide process applicability range; the strength of the cut glass basically has no great change, and the glass has no micro defects such as chips, fragments, micro cracks and the like, and has good cutting quality; the cutting efficiency is greatly improved, and the actual production requirements can be met; has better practical effect.

Drawings

FIG. 1 is a schematic view of the laser cutting principle of the present invention;

wherein: 1, a laser, 2 beam expanders, 3 reflectors, 4 cutting heads, 5 shaped light silk beams, 6 glass samples and 7 working platforms;

FIG. 2 is a schematic view of the working steps of the present invention for cutting glass with a beam of filament;

wherein: the method comprises the following steps of cutting a first cutting seam by using a light beam I, cutting a second cutting seam by using a light beam II, cutting a third cutting seam by using a light beam III, cutting glass completely, splitting the glass in a mechanical mode IV, and cutting the glass V into two pieces.

Detailed Description

The present invention is further illustrated by the following figures and specific examples, which are to be understood as illustrative only and not as limiting the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.

A picosecond laser cutting method for super-thick glass comprises the following specific steps:

1) placing the glass with a clean surface on a working platform, adjusting the relative position of a laser cutting machine and the working platform, and enabling the upper light point of a cutting head light wire of the laser cutting machine to be located on the upper surface of the glass;

2) importing the cutting graph into upper operation software of a laser cutting machine, and setting laser parameters and motion parameters: the laser adopts a picosecond infrared or green laser, and the pulse width is 0.1-100 ps; the light spot from the laser passes through a beam expander, a reflector, a cutting head and other lens groups, the round light spot is shaped into a filamentous light spot, the length of the light filament is 0.3-1.0mm, and the diameter of the light spot of the light filament is 0.003-0.02 mm;

the laser cutting parameters are set to be cutting speed of 20-600mm/s, laser output power of 5-50W and laser output frequency of 10 KHz-2 MHz;

3) starting a laser cutting machine to cut the glass with a preset pattern to complete a first cutting seam;

4) after the cutting head is lowered by a certain height or the working platform is raised by a certain height, repeating the step 3) to finish the second joint cutting, wherein the lowering height of the cutting head or the raising height of the working platform H = t- (0.1-0.5);

5) repeating the step 4), and repeating the steps in the same manner until the lowest surface of the glass is cut completely; the cutting repetition times are determined by the length T of the smooth wire and the thickness T of the glass, and the repetition times n = T/[ T- (0.1-0.5) ] is rounded;

6) breaking the sample by adopting a manual breaking or mechanical mode, and cutting the glass into a preset pattern after breaking;

7) and finishing the cutting process.

Specifically, the method comprises the following steps: FIG. 1 is a schematic diagram of the laser cutting principle of the present invention; wherein: 1, a laser, 2 beam expanders, 3 reflectors, 4 cutting heads, 5 shaped light silk beams, 6 glass samples and 7 working platforms; the specific principle and process are as follows: laser beam that laser instrument 1 sent passes through beam expanding lens 2, speculum 3 and enters into cutting head 4, forms the smooth silk beam 5 after the plastic, acts on the glass sample 6 that is used for the cutting, and work platform supports adsorbs glass sample 6, accomplishes whole cutting process.

The specific main processing procedures are described as follows: as shown in FIG. 2, it is a schematic diagram of the working steps of the optical fiber beam cutting glass of the present invention: wherein: i, cutting a first cut by a mercerizing beam; in the step II, the mercerizing beams are continuously downwards overlapped to cut a second joint cut; in the step III, the mercerizing beam continues to cut a third cut downwards, and the glass is cut completely; in step IV, the operation staff mechanically splits; in step V, the glass is cut and separated into two pieces, and the laser cutting of the super-thick glass is completed.

The method for cutting the super-thick glass by picosecond laser can cut glass products with the thickness of more than 1mm, can cut non-toughened glass and toughened glass with the thickness of 1.0-20mm, has wide cutting pattern, can cut linear and opposite patterns, and has wide process applicability range; the strength of the cut glass basically has no great change, and the glass has no micro defects such as chips, fragments, micro cracks and the like, and has good cutting quality; the cutting efficiency is greatly improved, and the actual production requirements can be met; has better practical effect.

Claims (1)

1. A picosecond laser cutting method for super-thick glass is characterized in that: the method comprises the following specific steps:

1) placing the glass with a clean surface on a working platform, adjusting the relative position of a laser cutting machine and the working platform, and enabling the upper light point of a cutting head light wire of the laser cutting machine to be located on the upper surface of the glass;

2) importing the cutting graph into upper operation software of a laser cutting machine, and setting laser parameters and motion parameters: the laser adopts a picosecond infrared or green laser, and the pulse width is 0.1-100 ps; the light spot from the laser passes through a beam expander, a reflector, a cutting head and other lens groups, the round light spot is shaped into a filamentous light spot, the length of the light filament is 0.3-1.0mm, and the diameter of the light spot of the light filament is 0.003-0.02 mm;

the laser cutting parameters are set to be cutting speed of 20-600mm/s, laser output power of 5-50W and laser output frequency of 10 KHz-2 MHz;

3) starting a laser cutting machine to cut the glass with a preset pattern to complete a first cutting seam;

4) after the cutting head is lowered to a certain height or the working platform is raised to a certain height, the step 3) is repeated to finish the second joint cutting; the descending height of the cutting head or the ascending height H = t- (0.1-0.5) of the working platform;

5) repeating the step 4), and repeating the steps in the same manner until the lowest surface of the glass is cut completely; the cutting repetition times are determined by the length T of the smooth wire and the thickness T of the glass, and the repetition times n = T/[ T- (0.1-0.5) ] is rounded;

6) breaking the sample by adopting a manual breaking or mechanical mode, and cutting the glass into a preset pattern after breaking;

7) and finishing the cutting process.

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