CN210065899U - Magnetron sputtering cathode with high target material utilization rate - Google Patents
Magnetron sputtering cathode with high target material utilization rate Download PDFInfo
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- CN210065899U CN210065899U CN201920354514.5U CN201920354514U CN210065899U CN 210065899 U CN210065899 U CN 210065899U CN 201920354514 U CN201920354514 U CN 201920354514U CN 210065899 U CN210065899 U CN 210065899U
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Abstract
The utility model relates to a magnetron sputtering negative pole discloses a magnetron sputtering negative pole of high target utilization ratio, and its core component is the magnetic circuit module that magnet steel group and yoke are constituteed, and the magnetic circuit module includes a magnet steel group, and magnet steel group includes the first magnet steel of three equidistance and vertical setting, and the bottom of first magnet steel respectively is equipped with one second magnet steel, and the second magnet steel directly links to each other with the yoke, and the NS utmost point of second magnet steel is connected rather than the S/N utmost point of the first magnet steel of top respectively. The magnetic circuit structure provided by the utility model enables the magnetic field to provide more magnetic field components parallel to the target, thereby improving the utilization rate of the target, effectively saving materials, and meanwhile, because the etching surface is flatter, the uniformity of the film layer can be effectively improved, and a better film coating effect can be obtained; the target material can be prevented from being frequently replaced, the times of opening the vacuum chamber are reduced, the production continuity can be ensured, the working efficiency is improved, and the cleanliness of the product can be improved; and a water path is provided for cooling so as to prevent the target material from being melted.
Description
Technical Field
The utility model relates to a magnetron sputtering cathode, in particular to a magnetron sputtering cathode with high target utilization rate.
Background
The coating film is a very thin film coated on the surface, and has the functions of wear resistance, lubrication, electric conduction, optics, decoration and the like. With the higher and higher pursuit of products, the surfaces of more and more articles are coated with films. The most common method for coating is coating by a coating machine, while the most commonly used method is sputtering coating, which can be simply understood as bombarding a target material by ions or high-energy laser, and enabling surface components to be sputtered out in the form of atomic groups or ions to be finally deposited on the surface of a substrate to finally form a film.
As shown in fig. 3, the magnetron sputtering cathode, which is usually three magnetic steels, used in the current coating industry is limited by its working principle, and the target utilization rate is very low, which is about 20%, as shown in fig. 4, which results in a large amount of material waste; meanwhile, the low utilization rate of the target material can cause the equipment to need frequent target material replacement, and the production efficiency is greatly influenced.
Disclosure of Invention
The main object of the present invention is to provide a magnetron sputtering cathode with high target utilization, which can effectively solve the problems in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a magnetron sputtering cathode with high target utilization rate comprises a magnetic steel group and a magnetic yoke, wherein the magnetic steel group is connected with the magnetic yoke through magnetic force, a magnetic circuit module comprises at least one magnetic steel group, the magnetic steel group comprises three first magnetic steels which are equidistantly and vertically arranged, magnetic poles of the first magnetic steels are arranged in a staggered manner, the bottoms of the first magnetic steels are respectively provided with a second magnetic steel, and N/S poles of the second magnetic steels are respectively connected with S/N poles of the first magnetic steels above the second magnetic steels; wherein the magnetic yoke is positioned at the bottom of the second magnetic steel 1.2.
Preferably, the magnetic circuit module further comprises a mounting flange, an anode is arranged on the outer side of the top of the mounting flange, and the magnetic circuit module is located between the two anodes.
Preferably, the bottom of the target is provided with a cooling water channel, the bottom of the mounting flange is provided with a water inlet pipe and a water outlet pipe, and the water inlet pipe is communicated with the cooling water channel of the water outlet pipe.
Preferably, a water-stop plate is arranged between the target material and the cooling water channel.
Preferably, the mounting flange is provided with a flange water pipe along the length direction thereof.
Preferably, the volume of the first magnetic steel is smaller than that of the second magnetic steel, the first magnetic steels on the two sides are positioned on the outer sides of the tops of the corresponding second magnetic steels, and the first magnetic steel in the middle is positioned in the center of the tops of the corresponding second magnetic steels.
Compared with the prior art, the utility model discloses following beneficial effect has: the magnetic circuit structure provided by the utility model enables the magnetic field to provide more magnetic field components parallel to the target material; the target surface can be etched in a larger area, so that the utilization rate of the target material is improved, the material is effectively saved, and meanwhile, the uniformity of a film layer can be effectively improved and a better film coating effect can be obtained because the etched surface is flatter; the service life of a single target is prolonged, so that the target can be prevented from being frequently replaced, the times of opening the vacuum chamber are reduced, the production continuity can be ensured, the working efficiency is improved, and the cleanliness of a product can be improved; furthermore, the utility model provides a water route is cooled down, can effectually avoid the target to be melted.
Drawings
Fig. 1 is a schematic structural view of a cathode.
Fig. 2 is a schematic diagram of the target consumption structure in the present application.
Fig. 3 is a schematic structural diagram of a cathode in the prior art.
Fig. 4 is a schematic diagram of a target consumption structure in the prior art.
Fig. 5 is a schematic structural diagram of the present invention.
The names of the parts corresponding to the reference numbers in the drawings are as follows: the magnetic circuit module comprises a magnetic steel group 1, a magnetic steel group 1.1, a first magnetic steel, a second magnetic steel 1.2, a magnetic yoke 2, a mounting flange 3, an anode 4, a magnetic circuit module 5, a target 6, a water-stop plate 7, a cooling water channel 8, a flange water pipe 9, a water inlet pipe 10 and a water outlet pipe 11.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
A magnetron sputtering cathode with high target utilization rate is disclosed, as shown in figures 1, 2 and 5, the magnetron sputtering cathode comprises a magnetic steel group 1 and a magnetic yoke 2, the magnetic steel group 1 is connected with the magnetic yoke 2 through magnetic force, a magnetic circuit module 5 comprises the magnetic steel group 1, the magnetic steel group 1 comprises three first magnetic steels 1.1 which are equidistantly and vertically arranged, magnetic poles of the first magnetic steels 1.1 are arranged in a staggered manner, the bottoms of the first magnetic steels 1.1 are respectively provided with a second magnetic steel 1.2, and N/S poles of the second magnetic steels 1.2 are respectively connected with S/N poles of the first magnetic steels 1.1 above the second magnetic steels; the volume of second magnet steel 1.2 is greater than first magnet steel 1.1, and the first magnet steel 1.1 of both sides is located corresponding second magnet steel 1.2 top outside, and the first magnet steel 1.1 in middle part is located corresponding second magnet steel 1.2 top center. Wherein the magnetic yoke 2 is positioned at the bottom of the second magnetic steel 1.2.
Still include mounting flange 3, the top outside of mounting flange 3 is equipped with positive pole 4, and magnetic circuit module 5 is located between two positive poles 4, and the inboard of magnetic circuit module 5 is used for installing target 6, and target 6 is installed in the upside of magnet steel. The mounting flange 3 is provided with a flange water pipe 9 along the length direction.
The bottom of the target 6 is provided with a cooling water channel 8, the bottom of the mounting flange 3 is provided with a water inlet pipe 10 and a water outlet pipe 11, and the water inlet pipe 10 is communicated with the cooling water channel 8 of the water outlet pipe 11. A water-stop plate 7 is arranged between the target material 6 and the cooling water channel 8.
The present invention also contemplates various changes and modifications that fall within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a magnetron sputtering cathode of high target utilization ratio, its core component is the magnetic circuit module that magnet steel group (1) and yoke (2) are constituteed, and magnet steel group (1) is connected its characterized in that through magnetic force and yoke (2): the magnetic circuit module (5) comprises a magnetic steel group (1), the magnetic steel group (1) comprises three first magnetic steels (1.1) which are equidistant and vertically arranged, magnetic poles of the first magnetic steels (1.1) are arranged in a staggered manner, the bottoms of the first magnetic steels (1.1) are respectively provided with a second magnetic steel (1.2), the second magnetic steels (1.2) are directly connected with a magnetic yoke (2), and N/S poles of the second magnetic steels (1.2) are respectively connected with S/N poles of the first magnetic steels (1.1) above the second magnetic steels; wherein the magnetic yoke (2) is positioned at the bottom of the second magnetic steel (1.2).
2. The magnetron sputtering cathode with high target utilization rate according to claim 1, wherein: still include mounting flange (3), the top outside of mounting flange (3) is equipped with positive pole (4), and magnetic circuit module (5) are located between two positive poles (4).
3. The magnetron sputtering cathode with high target utilization rate according to claim 2, wherein: the bottom of the target (6) is provided with a cooling water channel (8), the bottom of the mounting flange (3) is provided with a water inlet pipe (10) and a water outlet pipe (11), and the water inlet pipe (10) is communicated with the water outlet pipe (11) through the cooling water channel (8).
4. The magnetron sputtering cathode with high target utilization rate according to claim 3, wherein: a water-stop plate (7) is arranged between the target material (6) and the cooling water channel (8).
5. The magnetron sputtering cathode with high target utilization rate according to claim 2, wherein: a flange water pipe (9) is arranged on the mounting flange (3) along the length direction.
6. The magnetron sputtering cathode with high target utilization according to any one of claims 1 to 5, wherein: the volume of the second magnetic steel (1.2) is larger than that of the first magnetic steel (1.1), the first magnetic steels (1.1) on two sides are positioned on the outer side of the top of the corresponding second magnetic steel (1.2), and the first magnetic steel (1.1) in the middle is positioned in the center of the top of the corresponding second magnetic steel (1.2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920354514.5U CN210065899U (en) | 2019-03-20 | 2019-03-20 | Magnetron sputtering cathode with high target material utilization rate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920354514.5U CN210065899U (en) | 2019-03-20 | 2019-03-20 | Magnetron sputtering cathode with high target material utilization rate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115505890A (en) * | 2022-11-28 | 2022-12-23 | 中科纳微真空科技(合肥)有限公司 | Magnetron sputtering planar cathode and magnetic circuit thereof |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115505890A (en) * | 2022-11-28 | 2022-12-23 | 中科纳微真空科技(合肥)有限公司 | Magnetron sputtering planar cathode and magnetic circuit thereof |
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