CN209922404U - Automatic wafer scraper - Google Patents

Automatic wafer scraper Download PDF

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Publication number
CN209922404U
CN209922404U CN201920280616.7U CN201920280616U CN209922404U CN 209922404 U CN209922404 U CN 209922404U CN 201920280616 U CN201920280616 U CN 201920280616U CN 209922404 U CN209922404 U CN 209922404U
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China
Prior art keywords
film
crystal film
crystal
lower ring
wafer
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CN201920280616.7U
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Chinese (zh)
Inventor
胡海龙
袁春俭
李俊锋
谢少波
朱轩
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Shanghai Jue Enterprise Electronic Technology Co Ltd
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Shanghai Jue Enterprise Electronic Technology Co Ltd
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Abstract

The utility model discloses an automatic wafer scraper, which comprises a frame, wherein a rotatable dividing plate is arranged in the frame, and a plurality of operating stations are arranged on the dividing plate; the frame is also provided with a lower ring feeding and pressing mechanism, a crystal film feeding mechanism, a wafer protective film removing mechanism, an upper ring feeding and pressing mechanism, a labeling and discharging mechanism and a waste film taking mechanism which sequentially correspond to the operation stations. The utility model discloses an automatic brilliant machine of drawing together of wafer, through lower ring feeding hold-down mechanism, brilliant membrane feed mechanism, wafer protection film removal mechanism, go up ring feeding hold-down mechanism, paste mark discharge mechanism, waste film extracting mechanism and accomplish brilliant membrane material loading in proper order, brilliant membrane expands brilliant, the brilliant membrane of finished product pastes the mark and waste film collects the operation, and its process is whole to be automatic operation process, and operating efficiency is high, the product standardization level is high, can also make waste film in time obtain the management simultaneously.

Description

Automatic wafer scraper
Technical Field
The utility model belongs to the technical field of draw together brilliant, concretely relates to automatic brilliant machine of drawing together of wafer.
Background
Today, the energy crisis which is accompanied with the rapid development of social economy is presented to people, and the frequent 'electricity shortage' in various places in recent years causes no small loss as the life pulse of modern industry, business and civil use. The country also adopts a corresponding policy of supporting energy conservation and emission reduction, and due to the appearance of the LED lamp, the aims of energy conservation and environmental protection are achieved to a great extent.
The production of LED lamps requires a large number of wafers. In the production process of the existing LED wafer, the LED wafer forms crystal grains arranged in an array after a scribing process is finished, and the crystal grains arranged in the array are attached to a crystal film. The crystal grains on the crystal film are arranged very tightly, which is not beneficial to the operation of the subsequent crystal fixing procedure. Therefore, in the production process of the LED, the crystal film serving as a carrier of the LED crystal grains must be expanded, so that the crystal grains attached to the crystal film and arranged in an array are uniformly expanded, which is a function required to be realized by the current manual crystal expanding machine.
The lower ring feeding, the crystal film feeding, the removal of the wafer protective film on the surface of the crystal film, the upper ring feeding compression and the labeling of the manual crystal expanding machine are all completed through manual operation, the production efficiency is low, the production efficiency requirement of an automatic factory cannot be met, and meanwhile, the standard difference of products produced through the manual operation is large, so that the standardized production of the factory is not facilitated; in addition, the waste films generated in the existing production process are randomly stacked, so that unified management is inconvenient, and the management difficulty and cost are correspondingly increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that an automatic brilliant machine of drawing together of wafer is provided, the technical problem that manual operating efficiency who draws together brilliant machine among the prior art is low, product standard difference is big and the waste film can not in time be managed has been solved.
For solving the technical problem, the utility model discloses a technical scheme: the utility model provides an automatic brilliant machine of drawing together of wafer, includes the frame, its characterized in that: a rotatable dividing disc is arranged in the rack, and a plurality of operating stations are arranged on the dividing disc; the frame is also provided with a plurality of working positions corresponding to the operating stations in sequence
The lower ring feeding and pressing mechanism is used for pushing the lower ring to the operating station and pressing the lower ring to the operating station;
the crystal film feeding mechanism is used for conveying a crystal film to the lower ring in the operation station;
a wafer protective film removing mechanism for removing the wafer protective film on the surface of the wafer film;
the upper ring feeding and compressing mechanism compresses the upper ring and the lower ring, and cuts off waste films on the edge of the crystal film;
a labeling and discharging mechanism for discharging the crystal film and labeling the crystal film with labels;
the waste film taking mechanism is used for conveying the crystal film waste film to a waste film collecting area;
after the index plate rotates, the operation station completes the crystal drawing operation after sequentially passing through the lower ring feeding and pressing mechanism, the crystal film feeding mechanism, the wafer protective film removing mechanism, the upper ring feeding and pressing mechanism, the labeling and discharging mechanism and the waste film taking mechanism.
Preferably, the operating station comprises a chassis for fixing the lower ring and a chassis driving device for driving the chassis to longitudinally lift.
Preferably, the lower ring feeding and pressing mechanism comprises a lower ring rack for placing the lower ring, a material pushing plate for pushing the lower ring, a lower ring driving device for driving the material pushing plate to push the lower ring to the operation station, and a pressing device for pressing the lower ring to the operation station.
Preferably, the crystal film feeding mechanism comprises a crystal film waiting tray, a crystal film feeding reciprocating device, a crystal film lifting device sliding along the crystal film feeding reciprocating device, and a sucker installed in the crystal film lifting device, wherein the sucker sucks the crystal film waiting tray and conveys the crystal film to the lower ring in the operation station through the feeding reciprocating device and the crystal film lifting device.
Preferably, a positioning pin for positioning the crystal film is arranged in the material waiting plate.
Preferably, the wafer protective film removing mechanism comprises a jaw shifting device, a linear shifting device for driving the jaw shifting device to move above the crystal film, a jaw installed in the jaw shifting device, and a crystal film clamping driving device for driving the jaw to clamp the crystal film.
Preferably, a crystal film protection film collecting tank is further arranged in the rack, and the crystal film protection film collecting tank and the operation stations corresponding to the positions of the wafer protection film removing mechanism are respectively located at the near end and the far end of the linear displacement device.
Preferably, the upper ring feeding and compressing mechanism comprises an upper ring rack for placing an upper ring, a material pushing plate for pushing the upper ring, an upper ring driving device for driving the material pushing plate to push the upper ring into the operation station, an upper ring conveying device for conveying the upper ring into the operation station, a crystal film pressing plate for compressing a crystal film, and a crystal film pressing plate driving device for driving the crystal film pressing plate to move up and down.
Preferably, the labeling and discharging mechanism comprises a crystal film pressing plate for pressing waste films, a crystal film pressing plate driving device for driving the crystal film pressing plate to move up and down, a finished product crystal film taking device for obtaining finished product crystal films in the operation station, a finished product crystal film conveying device for conveying the finished product crystal films to a finished product area, a labeling machine and a labeling device for obtaining labels in the labeling machine and labeling the labels on the finished product crystal films.
Preferably, the waste film taking mechanism comprises a waste film conveying device for conveying the waste film from the operation station to the waste film collecting area, a waste film taking plate and a suction cup mounted at the bottom of the waste film taking plate.
The utility model has the advantages that: the utility model discloses an automatic brilliant machine of drawing together of wafer, through lower ring feeding hold-down mechanism, brilliant membrane feed mechanism, wafer protection film removal mechanism, go up ring feeding hold-down mechanism, paste mark discharge mechanism, waste film extracting mechanism and accomplish brilliant membrane material loading in proper order, brilliant membrane expands brilliant, the brilliant membrane of finished product pastes the mark and waste film collects the operation, its process is whole to be automatic operation process, its operating efficiency is high, the product standardization level is high, can also make waste film in time obtain the management simultaneously.
Drawings
FIG. 1 is a schematic view of an overall structure of an automatic wafer-cleaning machine;
FIG. 2 is a schematic structural view of a lower ring feeding and compressing mechanism;
FIG. 3 is a schematic structural diagram of a crystal film feeding mechanism;
FIG. 4 is a schematic structural diagram of a wafer protective film removing mechanism;
FIG. 5 is a schematic structural view of an upper ring feeding and compressing mechanism;
FIG. 6 is a schematic structural view of a labeling and discharging mechanism;
FIG. 7 is a schematic view of a waste film take off mechanism;
reference numeral in the figure, 1-frame; 2-index plate, 2.1-operation station, 2.1.1-base plate, 2.1.2-vacuum adsorption plate; 3-lower ring feeding and pressing mechanism, 3.1-lower ring material rack, 3.2-material pushing plate, 3.2.1-material pushing plate tongue, 3.3-feeding cylinder, 3.4-swing arm rotating shaft, 3.5-swing arm, 3.6-lower ring pressing cylinder, 3.7-lower ring pressing rod, 3.8-lower ring positioning bracket, 3.8.1-positioning rod and 3.8.2-fixing rod; 4-crystal film feeding mechanism, 4.1-crystal film waiting tray, 4.2-sucker, 4.3-crystal film feeding and conveying cylinder, 4.4-linear guide rail, 4.5-mounting block, 4.6-crystal film lifting cylinder and 4.7-sucker fixing plate; 5-wafer protective film removing mechanism, 5.1-clamping jaw, 5.2-shifting block, 5.3-lifting cylinder, 5.4-motor, 5.5-motor mounting bracket, 5.6-screw rod, 5.7-wafer clamping driving cylinder and 5.8-cylinder mounting block; 6-upper ring feeding and pressing mechanism, 6.1-upper ring feeding and pressing frame, 6.2-material pushing plate, 6.3-crystal film pressing plate, 6.4-crystal film pressing plate lifting cylinder, 6.5-feeding cylinder, 6.6-swing arm rotating shaft, 6.7-swing arm, 6.8-upper ring conveying rotating motor, 6.9-upper ring conveying rotating shaft, 6.10-upper ring conveying lifting cylinder and 6.11-upper ring pressing disc; 7-labeling and discharging mechanism, 7.1-crystal film pressing plate, 7.2-crystal film pressing plate driving device, 7.3-labeling machine, 7.4-labeling device, 7.5-finished product crystal film taking sucker, 7.6-finished product crystal film conveying rotating motor, 7.7-finished product crystal film conveying rotating shaft and 7.8-finished product crystal film conveying lifting cylinder; 8-waste film taking mechanism, 8.1-waste film taking plate, 8.2-sucking disc, 8.3-waste film conveying rotating motor, 8.4-waste film conveying rotating shaft and 8.5-waste film taking lifting cylinder; 9-lower ring; 10-a positioning pin; 11-a crystal film protective film collecting tank; 12-upper ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
an automatic wafer scraper, as shown in fig. 1, comprises a frame 1, an index plate 2 is arranged in the middle of the frame, an index plate rotating motor (not visible in the figure) is fixed at the bottom of the frame 1, and the output end of the index plate rotating motor is connected with the center of the index plate 2 to drive the index plate to rotate. In order to realize automatic operation, a program-controlled controller is arranged in the wafer automatic crystal-drawing machine. The index plate rotating motor is electrically connected with the controller. In this embodiment, the index plate 2 is provided with 6 operation stations 2.1, and the 6 operation stations 2.1 are distributed on the distribution plate at equal angles. With 6 operation station position correspondences, still set gradually in the frame 1: a lower ring feeding and pressing mechanism 3 which pushes the lower ring to the operating station and presses the lower ring into the operating station, and a crystal film feeding mechanism 4 which conveys the crystal film to the lower ring of the operating station; a wafer protective film removing mechanism 5 for removing the wafer protective film on the surface of the wafer film; an upper ring feeding and compressing mechanism 6 for compressing the upper ring and the lower ring and cutting off the waste film at the edge of the crystal film; a labeling and discharging mechanism 7 for discharging the crystal film and labeling the crystal film with a label; and the waste film taking mechanism 8 is used for conveying the crystal film waste film to a waste film collecting area. The index plate rotating motor drives the operation station in the index plate to sequentially pass through the lower ring feeding and pressing mechanism, the crystal film feeding mechanism, the wafer protective film removing mechanism, the upper ring feeding and pressing mechanism, the labeling and discharging mechanism and the waste film taking mechanism, and then the operation is stopped, and the corresponding operation is completed. And when the waste film taking mechanism finishes the waste film taking, the whole crystal-drawing operation is finished.
The operating station 2.1 in the index plate comprises a base plate 2.1.1 for fixing the lower ring and a base plate drive (not visible in the figure) for driving the base plate to move up and down longitudinally. In this embodiment, the chassis driving device is a chassis lifting cylinder. The output end of the chassis lifting cylinder is connected with the chassis 2.1 to drive the chassis to perform lifting movement in the operation station. In order to facilitate the chassis to absorb the crystal film, the upper surface of the chassis 2.1.1 is also provided with a vacuum absorption disk 2.1.2. In order to realize automatic operation, in this embodiment, the chassis lifting cylinder and the vacuum adsorption disc are controlled by the controller to operate.
As shown in fig. 2, the lower ring feeding and pressing mechanism 3 includes a lower ring holder 3.1 for placing a lower ring, a material pushing plate 3.2 for pushing the lower ring, a lower ring driving device for driving the material pushing plate to push the lower ring into the operation station, and a pressing device for pressing the lower ring into the operation station. In this embodiment, the lower rings 9 are stacked longitudinally in the lower ring stack 3.1. The front end of the material pushing plate 3.2 comprises a material pushing plate tongue 3.2.1, and the material pushing plate tongue 3.2.1 is in contact with a lower ring 9 at the bottom of the lower ring material rack. The thickness of the material pushing plate tongue 3.2.1 is smaller than that of the lower ring 9, so that the lower ring positioned above the material pushing plate can be prevented from obstructing the pushing of the material pushing plate in the process of pushing the lower ring by the material pushing plate. In this embodiment, the lower ring driving device includes a feed cylinder 3.3, a swing arm rotating shaft 3.4, and a swing arm 3.5. Wherein the feeding cylinder 3.3 and the swing arm rotation shaft 3.4 are fixed in the frame 1. The output end of the feeding cylinder 3.3 is connected with the middle position of the swing arm 3.5, one end of the swing arm 3.5 is rotatably connected with the swing arm rotating shaft 3.4, and the other end of the swing arm 3.5 is connected with the bottom of the material pushing plate 3.2. After the feeding cylinder 3.3 makes reciprocating motion, the feeding cylinder drives the swing arm to rotate along the swing arm rotating shaft, and then the swing arm pushes the material pushing plate to push the lower ring to the operation station. In this embodiment, the pressing device includes a lower ring pressing cylinder 3.6, a lower ring pressing rod 3.7, and a lower ring positioning bracket 3.8. The lower ring positioning bracket comprises two positioning rods 3.8.1 arranged in parallel and a fixing rod 3.8.2 arranged between the positioning rods and fixed above the positioning rods. Two locating bars 3.8.1 are located on either side of the operating station 2.1 for locating the lower ring. The fixing rod 3.8.2 is used for fixing the lower ring pressing cylinder 3.6. The output end of the lower ring pressing cylinder 3.6 is connected with a lower ring pressing rod 3.7. After the lower ring pressing cylinder 3.6 presses down the lower ring pressing rod 3.7, the two ends of the lower ring pressing rod 3.7 are abutted against the lower ring 9, and the lower ring 9 is pressed on the chassis 2.1.1. In order to realize automatic operation, in this embodiment, the feeding cylinder and the lower ring pressing cylinder are controlled by the controller to operate.
As shown in fig. 3, the crystal film feeding mechanism 4 includes a crystal film tray 4.1, a crystal film feeding reciprocating device, a crystal film lifting device sliding along the crystal film feeding reciprocating device, and a suction cup 4.2 installed in the crystal film lifting device. The crystal film tray 4.1 is used for placing the crystal film to be crystallized. In this embodiment, the crystal film tray 4.1 is provided with two stations, and the four apex angles of every station all are provided with locating pin 10. The positioning pins 10 are used for positioning a crystalline film to be placed. The crystal film feeding reciprocating device comprises a crystal film feeding conveying cylinder 4.3, a linear guide rail 4.4 and a mounting block 4.5. The crystal film feeding and conveying cylinder 4.3 drives the mounting block 4.5 to slide along the linear guide rail 4.4, so that the crystal film in the crystal film tray waiting station is conveyed to the lower ring 9 of the operation station. The crystal film lifting device comprises a crystal film lifting cylinder 4.6 and a sucker fixing plate 4.7. The crystal film lifting cylinder 4.6 is fixed in the mounting block 4.5, and the output end of the crystal film lifting cylinder 4.6 is connected with the sucker fixing plate 4.7. In this embodiment, the suction cup fixing plate 4.7 is a four-claw structure, and a suction cup 4.2 is fixed to each claw. The crystal film lifting cylinder 4.6 descends the sucker fixing plate 4.7, the sucker 4.2 sucks the crystal film after vacuumizing, and then the crystal film lifting cylinder 4.6 ascends the sucker fixing plate 4.7 to further realize crystal film adsorption. In order to realize automatic operation, in this embodiment, the operation of the wafer feeding and conveying cylinder, the wafer lifting cylinder and the chuck is controlled by the controller.
The surface of the crystalline film is usually covered with a crystalline film protective film to protect the crystalline grains in the crystalline film, and the crystalline film protective film needs to be removed before crystallization. The wafer protective film removing mechanism is used for removing the wafer protective film. In this embodiment, as shown in fig. 4, the wafer protection film removing mechanism 5 includes a jaw shifting device, a linear displacement device for driving the jaw shifting device to move above the wafer film, a jaw 5.1 installed in the jaw shifting device, and a wafer film clamping driving device for driving the jaw to clamp the wafer film. In this embodiment, the jaw displacement device comprises a displacement block 5.2 and a lifting cylinder 5.3. The lifting cylinder 5.3 is fixed at the bottom of the shifting block 5.2. The linear displacement device comprises a motor 5.4, a motor mounting bracket 5.5 and a screw rod 5.6. The motor mounting bracket 5.5 is fixed in the frame 1, the screw rod 5.6 is positioned in the motor mounting bracket 5.5, one end of the screw rod 5.6 is rotatably connected with the motor mounting bracket 5.5, the other end of the screw rod passes through the motor mounting bracket and then is connected with the output end of the motor 5.4, and the motor 5.4 is fixed on the motor mounting bracket 5.5. The shifting block 5.2 is in threaded connection with the screw rod 5.6. When the motor drives the screw rod to rotate, the shifting block moves axially along the screw rod. The crystal film clamping driving device comprises a crystal film clamping driving cylinder 5.7 and a cylinder mounting block 5.8. The output end of the lifting cylinder 5.3 is connected with the cylinder mounting block 5.8. And a sucker is arranged at the bottom of the cylinder mounting block 5.8 and used for adsorbing the crystal film protective film. The crystal film clamping driving cylinder 5.7 is fixed on one side of the cylinder mounting block 5.8, the output end of the crystal film clamping driving cylinder 5.7 is connected with the clamping jaw 5.1, and the clamping jaw is driven to clamp the cylinder mounting block. When the wafer protective film is removed, the vacuum adsorption disc in the base plate is vacuumized to further adsorb the wafer, the wafer protective film is adsorbed by the sucker at the bottom of the cylinder installation block under negative pressure, and then the removal of the wafer protective film is completed under the action of the jaw displacement device, the linear displacement device, the jaws and the wafer film clamping driving device. In order to realize automatic operation, in this embodiment, the motor, the crystal film clamping driving cylinder, the suction cup and the vacuum chuck are all controlled by the controller to operate.
In order to effectively collect the crystal film protection film, a crystal film protection film collecting tank 11 is further arranged in the frame 1. The crystal film protective film collecting tank and the operation station corresponding to the position of the wafer protective film removing mechanism are respectively positioned at the near end and the far end of the linear displacement device.
As shown in fig. 5, the upper ring feeding and pressing mechanism 6 includes an upper ring rack 6.1 for placing an upper ring, a material pushing plate 6.2 for pushing the upper ring, an upper ring driving device for driving the material pushing plate to push the upper ring into the operation station, an upper ring conveying device for conveying the upper ring into the operation station, a crystalline film pressing plate 6.3 for pressing the crystalline film, and a crystalline film pressing plate driving device for driving the crystalline film pressing plate to move up and down. When an operation station in the index plate rotates to the upper ring feeding and pressing mechanism, the crystal film pressing plate driving device drives the crystal film pressing plate to press on the crystal film. In this embodiment, the driving device of the crystal film pressing plate is a crystal film pressing plate lifting cylinder 6.4. The output end of the crystal film pressing plate lifting cylinder 6.4 is connected with the crystal film pressing plate 6.3. After the crystal film is compacted, a chassis lifting cylinder in the operation station drives the chassis 2.1.1 to ascend, and then the crystal-included operation is completed. And then fixing the position of the crystal film through the upper ring and cutting off the waste film. In this embodiment, the upper ring stack 6.1 is used to stack the upper rings 12 longitudinally. The structure of the material pushing plate 6.2 is consistent with that of the material pushing plate in the lower ring feeding and pressing mechanism. The upper ring driving device is consistent with the lower ring driving device and comprises a feeding cylinder 6.5, a swing arm rotating shaft 6.6 and a swing arm 6.7. The feeding cylinder drives the material pushing plate to push the upper ring out by pushing the swing arm. In contrast to the lower ring feed, however, the upper ring drive does not directly push the upper ring into the operating position during the upper ring feed, but rather is conveyed into the operating position by the upper ring conveyor. Specifically, the upper ring conveying device comprises an upper ring conveying rotating motor 6.8, an upper ring conveying rotating shaft 6.9, an upper ring conveying lifting cylinder 6.10 and an upper ring pressing disc 6.11. Wherein, the output of the upper ring conveying rotating motor 6.8 is connected with the near end of the upper ring conveying rotating shaft 6.9, the far end of the upper ring conveying rotating shaft 6.9 is fixedly connected with the upper ring conveying lifting cylinder 6.10, and the output of the upper ring conveying lifting cylinder 6.10 is connected with the upper ring pressing disc 6.11. The upper ring pressing disc 6.11 is a disc-shaped structure with an opening at the lower part and the diameter equal to that of the upper ring. The upper ring pressing disc 6.11 is pressed down to pick up the upper ring 12 and is rotationally conveyed to the operation station through the upper ring conveying rotating motor 6.8. And pressing the upper ring pressing disc 6.11 downwards to press the upper ring 9 and the lower ring 12, and cutting off the waste film at the edge of the crystal film by using the shearing force generated by the upper ring pressing disc and the lower ring on the waste film at the edge of the crystal film. In order to realize automatic operation, in this embodiment, the lifting cylinder is carried to brilliant membrane clamp plate lift cylinder, feeding cylinder, upper ring and is carried the rotation motor, upper ring and carry the lifting cylinder all through controller control operation.
As shown in fig. 6, the labeling and discharging mechanism 7 includes a crystal film pressing plate 7.1 for pressing waste films, a crystal film pressing plate driving device 7.2 for driving the crystal film pressing plate to move up and down, a finished crystal film taking device for taking finished crystal films in the operation station, a finished crystal film conveying device for conveying the finished crystal films to a finished area, a labeling machine 7.3, and a labeling device 7.4 for taking labels in the labeling machine and attaching the labels to the finished crystal films. In this embodiment, the crystal film pressing plate 7.1 and the crystal film pressing plate driving device 7.2 are the same as the crystal film pressing plate and the crystal film pressing plate driving device in the upper ring feeding and pressing mechanism. The finished product crystal film taking device is a finished product crystal film taking sucker 7.5. The finished crystal film taking sucker realizes crystal film adsorption by vacuumizing. The finished product crystal film conveying device comprises a finished product crystal film conveying rotating motor 7.6, a finished product crystal film conveying rotating shaft 7.7 and a finished product crystal film conveying lifting cylinder 7.8. Finished crystal film conveying and rotating motor 7.6 is installed in rack 1, the output end of finished crystal film conveying and rotating motor 7.6 is connected with the near end of finished crystal film conveying rotating shaft 7.7, the far end of finished crystal film conveying rotating shaft 7.7 is fixed with finished crystal film conveying lifting cylinder 7.8, and the output end of finished crystal film conveying lifting cylinder 7.8 is connected with finished crystal film taking sucker 7.5. The finished crystal film taking sucker 7.5 is controlled to descend by the finished crystal film conveying lifting cylinder 7.8, the finished crystal film taking sucker 7.5 sucks a finished crystal film, then the finished crystal film conveying lifting cylinder 7.8 controls the finished crystal film taking sucker 7.5 to ascend, the finished crystal film conveying rotating motor 7.6 controls the finished crystal film conveying rotating shaft 7.7 to rotate to a finished product area, then the finished crystal film taking sucker 7.5 is controlled to descend by the finished crystal film conveying lifting cylinder 7.8, and meanwhile, the finished crystal film taking sucker sucks air to enable the crystal film to fall to the finished product area. The labeling machine 7.3 is used for machine labeling, and the labeling device 7.4 is used for attaching labels to finished crystal films after the labels in the labeling machine are obtained. Note that the labeling machine and the labeling device are prior art per se. In order to realize automatic operation, in this embodiment, the crystal film pressing plate driving device, the suction cup, the finished product crystal film conveying rotating motor and the finished product crystal film conveying lifting cylinder are controlled by the controller to operate.
As shown in fig. 7, the waste film take-out mechanism 8 includes a waste film conveying device for conveying the waste film from the operation station to the waste film collecting area, a waste film take-out plate 8.1, and a suction cup 8.2 mounted at the bottom of the waste film take-out plate. In this embodiment, waste film conveyor includes that waste film carries rotating electrical machines 8.3, waste film to carry pivot 8.4 and is used for driving waste film to get the waste film material taking lifting device that the flitch goes up and down. The waste film conveying rotating motor 8.3 is fixed in the frame 1, and the output end of the waste film conveying rotating motor 8.3 is connected with the near end of the waste film conveying rotating shaft 8.4 so as to drive the waste film conveying rotating shaft to rotate. The far end of the waste film conveying rotating shaft 8.4 is fixed with the waste film taking and lifting device. The waste film taking and lifting device is a waste film taking and lifting cylinder 8.5. The output end of the waste film taking lifting cylinder 8.5 is connected with the waste film taking plate 8.1 to drive the waste film taking plate to do lifting motion. In order to realize automation mechanized operation, in this embodiment, the waste film is carried and is rotated motor, waste film and get material lift cylinder and, the sucking disc all through controller control operation.
Automatic draw together brilliant machine's working process as follows: the controller controls the index plate rotating motor to operate, the index plate rotates, and when the operation station reaches the position of the lower ring feeding and pressing mechanism, the controller controls the index plate rotating motor to stop operating. The feeding cylinder starts to control the material pushing plate to push the lower ring to the operation station, and then the lower ring pressing cylinder drives the lower ring pressing rod to press the lower ring on the base plate. After the pressing is finished, the lower ring pressing cylinder drives the lower ring pressing rod to ascend, meanwhile, the index plate rotating motor controls the index plate to continue rotating, and when the operation station reaches the position of the crystal film feeding mechanism, the controller controls the index plate rotating motor to stop operating. The crystal film feeding and conveying cylinder drives the mounting block to slide along the linear guide rail. After the sucking disc fixed plate is just opposite to the crystal film, the crystal film lifting motor controls the sucking disc fixed plate to descend, and meanwhile, the sucking disc is vacuumized to further suck the crystal film. Then the crystal film lifting motor controls the sucker fixing plate to ascend and is matched with the crystal film feeding and conveying cylinder to convey the crystal film to the operation station. The crystal film lifting motor controls the sucker fixing plate to descend again, the sucker sucks gas and then puts down the crystal film onto the base plate, the index plate rotating motor controls the index plate to rotate continuously, and when the operation station reaches the position of the crystal film protective film removing mechanism, the controller controls the index plate rotating motor to stop operating. And a vacuum adsorption disc in the base plate sucks the crystal film after vacuumizing. The motor drives the screw rod to rotate, so that the shifting block is positioned right above the crystal film protective film. The cylinder installation block descends through the lifting cylinder, and meanwhile, the crystal film protective film is sucked by the sucker at the bottom of the cylinder installation block after being vacuumized. The lifting cylinder lifts the cylinder mounting block, and one corner of the crystal film protective film is lifted. Meanwhile, the crystal film clamping driving cylinder drives the clamping jaw to be clamped with the cylinder mounting block. And finally, conveying the crystal film protective film to a crystal film protective film collecting tank by matching with the operation of a motor. The cylinder installation block descends through the lifting cylinder, the crystal film clamping driving cylinder drives the clamping jaw to be separated from the cylinder installation block, and meanwhile the sucking disc at the bottom of the cylinder installation block inhales air, so that the crystal film protection film falls into the crystal film protection film collecting tank. The index plate rotating motor controls the index plate to continue rotating, and when the operation station reaches the position of the upper ring feeding and pressing mechanism, the controller controls the index plate rotating motor to stop operating. The crystal film pressing plate lifting cylinder drives the crystal film pressing plate to descend to press the edge of the crystal film. And then, the chassis lifting cylinder drives the chassis to ascend to expand the crystal film. Then the feeding cylinder operates to drive the material pushing plate to push out the upper ring, the upper ring conveying rotating motor operates to compress the upper ring to the position right above the upper ring. The lifting cylinder is carried to fit with a contraceptive ring and drives to fit with a contraceptive ring and compress tightly the dish decline, picks up and fits with a contraceptive ring, then it carries lifting cylinder to drive to fit with a contraceptive ring and compresses tightly the dish and rise to fit with a contraceptive ring, and it carries the rotation motor operation to drive to fit with a contraceptive ring and compresses tightly the dish and be located position department directly over the brilliant membrane to. The upper ring conveying lifting cylinder drives the upper ring pressing disc to descend and press the upper ring on the lower ring, and the upper ring pressing disc cuts off the edge of the crystal film. After the feeding and the compressing of the upper ring are finished, the index plate rotating motor controls the index plate to continue rotating, and when the operation station reaches the position of the labeling and discharging mechanism, the controller controls the index plate rotating motor to stop operating. The finished crystal film conveying lifting cylinder drives the finished crystal film taking sucker to descend, the finished crystal film taking sucker is vacuumized and then sucks the finished crystal film, the finished crystal film conveying rotating motor conveys the finished crystal film to a finished product area, the labeling machine automatically generates a label, the labeling device attaches the label to the finished crystal film, and labeling operation is completed. The index plate rotating motor controls the index plate to continue rotating, and when the operation station reaches the position of the waste film taking mechanism, the controller controls the index plate rotating motor to stop operating. The waste film taking and lifting cylinder controls the waste film taking plate to descend, the sucking disc vacuumizes to absorb the crystal film waste film, the waste film conveying rotating motor operates to convey the crystal film waste film to the waste film collecting area, and finally the sucking disc sucks air, so that the waste film drops into the waste film collecting area.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides an automatic brilliant machine of drawing together of wafer, includes the frame, its characterized in that: a rotatable dividing disc is arranged in the rack, and a plurality of operating stations are arranged on the dividing disc; the frame is also provided with a plurality of working positions corresponding to the operating stations in sequence
The lower ring feeding and pressing mechanism is used for pushing the lower ring to the operating station and pressing the lower ring to the operating station;
the crystal film feeding mechanism is used for conveying a crystal film to the lower ring in the operation station;
a wafer protective film removing mechanism for removing the wafer protective film on the surface of the wafer film;
the upper ring feeding and compressing mechanism compresses the upper ring and the lower ring, and cuts off waste films on the edge of the crystal film;
a labeling and discharging mechanism for discharging the crystal film and labeling the crystal film with labels;
the waste film taking mechanism is used for conveying the crystal film waste film to a waste film collecting area;
after the index plate rotates, the operation station completes the crystal drawing operation after sequentially passing through the lower ring feeding and pressing mechanism, the crystal film feeding mechanism, the wafer protective film removing mechanism, the upper ring feeding and pressing mechanism, the labeling and discharging mechanism and the waste film taking mechanism.
2. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the operation station comprises a chassis for fixing the lower ring and a chassis driving device for driving the chassis to longitudinally lift.
3. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the lower ring feeding and compressing mechanism comprises a lower ring rack for placing a lower ring, a material pushing plate for pushing the lower ring, a lower ring driving device for driving the material pushing plate to push the lower ring to an operation station, and a compressing device for compressing the lower ring to the operation station.
4. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the crystal film feeding mechanism comprises a crystal film waiting material plate, a crystal film feeding reciprocating device, a crystal film lifting device and a sucker, wherein the crystal film lifting device slides along the crystal film feeding reciprocating device, the sucker is arranged in the crystal film lifting device, sucks the crystal film in the waiting material plate, and the crystal film is conveyed to a lower ring in an operation station through the feeding reciprocating device and the crystal film lifting device.
5. The wafer automatic crystal-cleaning machine according to claim 4, characterized in that: and a positioning pin for positioning the crystal film is arranged in the material waiting plate.
6. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the wafer protective film removing mechanism comprises a jaw shifting device, a linear shifting device for driving the jaw shifting device to move above a crystal film, a jaw arranged in the jaw shifting device, and a crystal film clamping driving device for driving the jaw to clamp the crystal film.
7. The wafer automatic crystal-cleaning machine according to claim 6, characterized in that: and a crystal film protection film collecting tank is also arranged in the rack, and the crystal film protection film collecting tank and an operation station corresponding to the position of the wafer protection film removing mechanism are respectively positioned at the near end and the far end of the linear displacement device.
8. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the upper ring feeding and compressing mechanism comprises an upper ring rack for placing an upper ring, a material pushing plate for pushing the upper ring, an upper ring driving device for driving the material pushing plate to push the upper ring to an operation station, an upper ring conveying device for conveying the upper ring to the operation station, a crystal film pressing plate for compressing a crystal film, and a crystal film pressing plate driving device for driving the crystal film pressing plate to move up and down.
9. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the labeling and discharging mechanism comprises a crystal film pressing plate for pressing waste films, a crystal film pressing plate driving device for driving the crystal film pressing plate to move up and down, a finished product crystal film taking device for obtaining a finished product crystal film in an operation station, a finished product crystal film conveying device for conveying the finished product crystal film to a finished product area, a labeling machine and a labeling device for obtaining labels in the labeling machine and labeling the labels on the finished product crystal film.
10. The wafer automatic crystal-cleaning machine according to claim 1, characterized in that: the waste film taking mechanism comprises a waste film conveying device, a waste film taking plate and a sucking disc, wherein the waste film conveying device is used for conveying a waste film from an operation station to a waste film collecting area, and the sucking disc is installed at the bottom of the waste film taking plate.
CN201920280616.7U 2019-03-05 2019-03-05 Automatic wafer scraper Active CN209922404U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920280616.7U CN209922404U (en) 2019-03-05 2019-03-05 Automatic wafer scraper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920280616.7U CN209922404U (en) 2019-03-05 2019-03-05 Automatic wafer scraper

Publications (1)

Publication Number Publication Date
CN209922404U true CN209922404U (en) 2020-01-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
CN (1) CN209922404U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111640678A (en) * 2020-06-28 2020-09-08 安徽富信半导体科技有限公司 Semiconductor element processing method and forming process
CN112208879A (en) * 2020-10-13 2021-01-12 安徽中巨智能科技有限公司 Plastic film detection and discharge equipment for removing front cover of washing machine
CN113380676A (en) * 2021-07-09 2021-09-10 东莞伏尔甘自动化设备有限公司 Full-automatic crystal expanding machine
CN114291341A (en) * 2021-12-30 2022-04-08 苏州鑫河镜业有限公司 Automobile sun visor lens packaging machine and working method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111640678A (en) * 2020-06-28 2020-09-08 安徽富信半导体科技有限公司 Semiconductor element processing method and forming process
CN112208879A (en) * 2020-10-13 2021-01-12 安徽中巨智能科技有限公司 Plastic film detection and discharge equipment for removing front cover of washing machine
CN112208879B (en) * 2020-10-13 2021-12-24 安徽中巨智能科技有限公司 Plastic film detection and discharge equipment for removing front cover of washing machine
CN113380676A (en) * 2021-07-09 2021-09-10 东莞伏尔甘自动化设备有限公司 Full-automatic crystal expanding machine
CN113380676B (en) * 2021-07-09 2024-05-24 东莞伏尔甘自动化设备有限公司 Full-automatic crystal expanding machine
CN114291341A (en) * 2021-12-30 2022-04-08 苏州鑫河镜业有限公司 Automobile sun visor lens packaging machine and working method thereof

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