CN209857424U - Air cooling temperature control platform for semiconductor TEC - Google Patents
Air cooling temperature control platform for semiconductor TEC Download PDFInfo
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- CN209857424U CN209857424U CN201920658878.2U CN201920658878U CN209857424U CN 209857424 U CN209857424 U CN 209857424U CN 201920658878 U CN201920658878 U CN 201920658878U CN 209857424 U CN209857424 U CN 209857424U
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Abstract
The utility model discloses a semiconductor TEC forced air cooling temperature control platform, comprising a base plate, the equal bolt in the left and right sides at bottom plate top has first curb plate, the equal bolt in both sides has the second curb plate around the bottom plate top, the internally mounted of first curb plate has air-cooled heat radiation structure, air-cooled heat radiation structure includes the fan, the surface mounting of fan has the motor, the quantity of fan is two, and the equal bolt in one side that two fans are relative has the board of sealing. The utility model discloses a set up bottom plate, first curb plate, second curb plate, forced air cooling heat radiation structure, fan, seal board, fin, controller and semiconductor refrigeration structure's cooperation and use, solved current refrigeration plant and not adopted the semiconductor refrigeration, the not high problem poor with the radiating effect of temperature control precision, this semiconductor TEC forced air cooling control by temperature change platform, the semiconductor refrigeration, the radiating advantage of temperature control precision height and forced air cooling is worth using widely.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field specifically is a semiconductor TEC forced air cooling temperature control platform.
Background
The refrigerator generally utilizes refrigerant such as freon to carry the position that needs refrigeration through the copper pipe, then absorbs the heat through the gasification of freon and reaches the purpose of refrigeration, then carries the refrigerant after gasifying again in the compressor through the pipe and carries out the compression liquefaction and release heat, and general refrigerator whole device complexity is high, and the cost is expensive, because there is the motor device, and the noise is big, and the reliability is poor, for this reason, we have proposed a semiconductor TEC forced air cooling temperature control platform, in order to solve the problem that the above-mentioned content exists.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor TEC forced air cooling temperature control platform possesses the semiconductor refrigeration, and the radiating advantage of temperature control precision height and forced air cooling has solved current refrigeration plant and has not adopted the semiconductor refrigeration, and the temperature control precision is not high and the poor problem of radiating effect.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor TEC forced air cooling temperature control platform, includes the bottom plate, the equal bolt in the left and right sides at bottom plate top has first curb plate, the equal bolt in both sides has the second curb plate around the bottom plate top, the internally mounted of first curb plate has air-cooled heat radiation structure, air-cooled heat radiation structure includes the fan, the surface mounting of fan has the motor, the quantity of fan is two, and the equal bolt in one side that two fans are relative has sealed the board, seal the inboard inside through-hole of having seted up, and the quantity of through-hole is a plurality of, the top bolt of bottom plate has the fin, the internally mounted of second curb plate has the controller, semiconductor refrigeration structure is installed at air-cooled heat radiation structure's top.
Preferably, the semiconductor refrigeration structure comprises a mounting plate, the bottom of the mounting plate is bolted to the tops of the first side plate and the second side plate respectively, the inside of the mounting plate is provided with four TC modules, and the number of the TC modules is four.
Preferably, the top of the TC module is a heat absorption end, and the bottom of the TC module is a heat release end.
Preferably, the two ends of the left side and the two ends of the right side of the bottom plate are both provided with a convex block, and the surface of the convex block is provided with an elliptical hole.
Preferably, the controller internally comprises a single chip microcomputer, the single chip microcomputer controls the refrigerating or heating rate through PWM, and the current direction is controlled by a pin of the single chip microcomputer.
Preferably, the temperature control precision of the semiconductor refrigeration structure is regulated by PID, and the NTC is adopted for the real-time temperature acquisition of the semiconductor refrigeration structure.
Preferably, the controller adopts a serial port screen for dynamic data display, and adopts character liquid crystal display and thin film keys for display.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up bottom plate, first curb plate, second curb plate, forced air cooling heat radiation structure, fan, seal board, fin, controller and semiconductor refrigeration structure's cooperation and use, solved current refrigeration plant and not adopted the semiconductor refrigeration, the not high problem poor with the radiating effect of temperature control precision, this semiconductor TEC forced air cooling control by temperature change platform, the semiconductor refrigeration, the radiating advantage of temperature control precision height and forced air cooling is worth using widely.
2. The utility model discloses a set up mounting panel and TC module, can have and make the device can carry out the semiconductor refrigeration, through setting up lug and elliptical aperture, can make things convenient for the staff to shift the device to increase the area of contact of bottom plate bottom.
Drawings
FIG. 1 is a three-dimensional schematic diagram of the structure of the present invention;
FIG. 2 is a schematic right sectional view of the structure of the present invention;
FIG. 3 is a schematic sectional view of the structure of the present invention;
fig. 4 is a schematic top view of the structure of the present invention.
In the figure: the structure comprises a base plate 1, a first side plate 2, a second side plate 3, an air-cooled heat dissipation structure 4, a fan 41, a sealing plate 42, a heat dissipation plate 43, a controller 5, a semiconductor refrigeration structure 6, a mounting plate 61, a TC module 62, a bump 7 and an elliptical hole 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-4, an air-cooled temperature control platform for a semiconductor TEC comprises a base plate 1, wherein first side plates 2 are bolted on the left side and the right side of the top of the base plate 1, second side plates 3 are bolted on the front side and the rear side of the top of the base plate 1, an air-cooled heat dissipation structure 4 is installed inside the first side plates 2, the air-cooled heat dissipation structure 4 comprises fans 41, motors for driving the fans 41 to rotate are installed on the surfaces of the fans 41, the number of the fans 41 is two, sealing plates 42 are bolted on the opposite sides of the two fans 41, through holes are formed inside the sealing plates 42, the number of the through holes is several, heat dissipation fins 43 are bolted on the top of the base plate 1, a controller 5 is installed inside the second side plate 3, a semiconductor refrigeration structure 6 is installed on the top of the air-cooled heat dissipation structure 4, the semiconductor refrigeration structure 6 comprises a mounting plate 61, the bottom of the mounting plate 61 is respectively bolted on, the TC modules 62 are arranged inside the mounting plate 61, the number of the TC modules 62 is four, the top of the TC modules 62 is a heat absorption end, the bottom of the TC modules 62 is a heat release end, the two ends of the left side and the two ends of the right side of the bottom plate 1 are respectively provided with the convex blocks 7, the surfaces of the convex blocks 7 are provided with the elliptical holes 8, the controller 5 internally comprises a single chip microcomputer, the single chip microcomputer controls the refrigerating or heating speed through PWM, the direction of current is controlled by pins of the single chip microcomputer, the temperature control precision of the semiconductor refrigerating structure 6 is adjusted by PID, NTC is adopted for temperature real-time collection of the semiconductor refrigerating structure 6, the controller 5 adopts a serial port screen for dynamic data display, the controller 5 adopts character liquid crystal display and film keys, the mounting plate 61 and the TC modules 62 are arranged, the device can carry out semiconductor refrigerating, and the convex blocks 7 and the elliptical holes 8 are arranged, the contact area of the bottom plate 1 is increased, the bottom plate 1, the first side plate 2, the second side plate 3, the air-cooled heat dissipation structure 4, the fan 41, the sealing plate 42, the radiating fins 43, the controller 5 and the semiconductor refrigeration structure 6 are matched for use, the problems that existing refrigeration equipment does not adopt semiconductor refrigeration, temperature control precision is not high and heat dissipation effect is poor are solved, and the semiconductor TEC air-cooled temperature control platform has the advantages of being high in temperature control precision and good in air-cooled heat dissipation, and is worthy of popularization and use.
When the device is used, when the device needs to be refrigerated, the controller 5 starts the TC module 62, the TC module 62 performs refrigeration, heat generated by the TC module 62 is absorbed by the heat sink 43, then the fan 41 is started, the fan 41 rotates, and heat on the TC module 62 and the heat sink 43 is rapidly dissipated through the sealing plate 42.
In summary, the following steps: this semiconductor TEC forced air cooling temperature control platform uses through the cooperation that sets up bottom plate 1, first curb plate 2, second curb plate 3, forced air cooling heat radiation structure 4, fan 41, sealing plate 42, fin 43, controller 5 and semiconductor refrigeration structure 6, has solved current refrigeration equipment and has not adopted the semiconductor refrigeration, and the temperature control precision is not high and the radiating effect is poor problem.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor TEC forced air cooling temperature control platform, includes the bottom plate, its characterized in that: the utility model discloses a semiconductor refrigeration device, including bottom plate, bottom plate top, the equal bolt in both sides has first curb plate, the equal bolt in both sides has the second curb plate around the bottom plate top, the internally mounted of first curb plate has air-cooled heat radiation structure, air-cooled heat radiation structure includes the fan, the surface mounting of fan has the motor, the quantity of fan is two, and the equal bolt in one side that two fans are relative has sealed the board, seal the inboard inside through-hole of having seted up, and the quantity of through-hole is a plurality of, the top bolt of bottom plate has the fin, the internally mounted of second curb plate has the controller, semiconductor refrigeration structure is installed at air-cooled heat radiation structure's top.
2. The semiconductor TEC air-cooled temperature control platform of claim 1, wherein: the semiconductor refrigeration structure comprises a mounting plate, the bottom of the mounting plate is bolted to the tops of the first side plate and the second side plate respectively, the TC modules are arranged inside the mounting plate, and the number of the TC modules is four.
3. The semiconductor TEC air-cooled temperature control platform of claim 2, wherein: the top of the TC module is a heat absorption end, and the bottom of the TC module is a heat release end.
4. The semiconductor TEC air-cooled temperature control platform of claim 1, wherein: the both ends on the left side of bottom plate and both ends on right side all are equipped with the lug, the elliptical hole has been seted up on the surface of lug.
5. The semiconductor TEC air-cooled temperature control platform of claim 1, wherein: the controller comprises a single chip microcomputer inside, the single chip microcomputer controls the refrigerating or heating speed through PWM, and the current direction is controlled by pins of the single chip microcomputer.
6. The semiconductor TEC air-cooled temperature control platform of claim 1, wherein: the temperature control precision of the semiconductor refrigeration structure is adjusted by PID, and the NTC is adopted for real-time temperature acquisition of the semiconductor refrigeration structure.
7. The semiconductor TEC air-cooled temperature control platform of claim 1, wherein: the controller adopts a serial port screen to display dynamic data, and adopts character liquid crystal display and thin film keys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920658878.2U CN209857424U (en) | 2019-05-09 | 2019-05-09 | Air cooling temperature control platform for semiconductor TEC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920658878.2U CN209857424U (en) | 2019-05-09 | 2019-05-09 | Air cooling temperature control platform for semiconductor TEC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209857424U true CN209857424U (en) | 2019-12-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920658878.2U Active CN209857424U (en) | 2019-05-09 | 2019-05-09 | Air cooling temperature control platform for semiconductor TEC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209857424U (en) |
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2019
- 2019-05-09 CN CN201920658878.2U patent/CN209857424U/en active Active
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