CN2593130Y - Efficient semiconductor temperature-reducing apparatus - Google Patents
Efficient semiconductor temperature-reducing apparatus Download PDFInfo
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- CN2593130Y CN2593130Y CN 02293820 CN02293820U CN2593130Y CN 2593130 Y CN2593130 Y CN 2593130Y CN 02293820 CN02293820 CN 02293820 CN 02293820 U CN02293820 U CN 02293820U CN 2593130 Y CN2593130 Y CN 2593130Y
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a high-efficiency semiconductor temperature reducing device, which belongs to the technical field of refrigerating equipment. The utility model is used for solving the problem of improving the refrigerating efficiency by quickly reducing the temperature on the hot end of a refrigerating chip. The utility model has the technical proposal that the utility model comprises a working box body, a main semiconductor refrigerating chip which is installed on the internal wall of the working box body in an embedding way and a cooling groove which is arranged on the other surface tightly abutted with the main semiconductor refrigerating chip. The utility model is characterized in that the upper part of a cooling liquid circulating groove is provided with an auxiliary semiconductor refrigerating chip, and the cooling liquid in the cooling liquid circulating groove is forcibly cooled by a cold end of the auxiliary semiconductor refrigerating chip. The utility model adopts a special temperature reducing mode and is matched with the forcible circulation of the cooling liquid, the utility model has the advantages of fast temperature reducing speed, low refrigerating temperature, small influence of environment temperature, simple structure and low cost, and the utility model is especially suitable for a semiconductor temperature reducing device which has relatively large capacity and relatively low working temperature.
Description
Technical field
It is the heat sink of refrigeration source with the semiconductor that the utility model relates to a kind of, belongs to the freezing equipment technical field.
Background technology
Semiconductor cooler (comprise general commercial use refrigeration, and various heat sinks) be to be based upon on the principle that bohr pastes effect, transmit directly by means of the electron motion in the semi-conducting material that energy realizes.When a P-type semiconductor and a N-type semiconductor couple together with conducting strip, form PN junction, connect direct current, power conversion will take place.According to sense of current, an end is emitted heat; The other end absorbs heat.If give heat radiation at the heating end, make it keep certain temperature, then another heat absorbing end just begins refrigeration, imports the heat of this end into up to the external world and when the heat summation that semiconductor refrigeration chip imports into equaled bohr and pastes heat, the temperature of cold junction just reached balance.When utilizing this principle to make refrigerator, generally be that the mode of many semiconductor refrigerating elements with serial or parallel connection coupled together, to improve refrigeration work consumption.Although comparing with compressor type refrigerator, this refrigerator has many advantages, the shortcoming that in the commercialization process, still exists some to be difficult to overcome, as: adopt the wind-cooling heat dissipating effect relatively poor when price is higher, high-power, equipment volume is big when adopting water-cooled, water consumption is big.Therefore, the refrigerator operational efficiency of capacity above 100 liters is lower, generally only makes the refrigeration use that refrigerating box is made article.In general, when unloaded under ideal conditions, the maximum temperature difference of one-level conductor refrigeration chip is about 60 ℃, and when reality is used owing to the influence of load and radiating condition, one-level conductor refrigeration chip does not far reach this temperature difference.Desire to obtain lower temperature, it is to adopt multilevel semiconductor cooling chip (promptly adopting this way No. 97213998 as Chinese patent) that a kind of method is arranged, and to improve temperature gradient, reduces cryogenic temperature, prevents the semiconductor refrigeration chip scaling loss.But will certainly increase the cost of product so greatly.Therefore, managing to improve the heat-sinking capability of cooling module, reduce cryogenic temperature thus, is the some effective that improves semiconductor heat sink operational efficiency and refrigeration work consumption.
Technical problem to be solved in the utility model is: overcome the defective of above-mentioned prior art and a kind of chilled liquid temperature that can reduce rapidly is provided, so as to improving the high efficiency semiconductor heat sink of refrigerating efficiency.
The alleged problem of the utility model is solved by following technical scheme:
A kind of high efficiency semiconductor heat sink, it comprises working box, be inlaid in the main semiconductor cooling chip on the working box inwall and be arranged near another surperficial cooling bath of main semiconductor refrigerating chip, its special feature is: described cooling bath is the liquid circulation groove, be provided with the semiconductor-assisted cooling chip on the top of liquid circulation groove, the outer wall of the cold junction of described semiconductor-assisted cooling chip and liquid circulation groove amplexiforms, hot junction and its fin amplexiform.
Another kind of design of the present utility model is:
A kind of high efficiency semiconductor heat sink, it comprises working box, be inlaid in the main semiconductor cooling chip on the working box inwall and be arranged near another surperficial cooling bath of main semiconductor refrigerating chip, its special feature is: described cooling bath is the liquid circulation groove, on the top of liquid circulation groove, be provided with radiating fin around the outer wall of liquid circulation groove.
Above-mentioned high efficiency semiconductor heat sink is provided with liquid circulation pump in the described liquid circulation groove.
Above-mentioned high efficiency semiconductor heat sink, the cold junction of described main semiconductor refrigerating chip and metal cold-storage thermal-arrest plate amplexiform.
Above-mentioned high efficiency semiconductor heat sink is provided with the heat-conducting silicone grease layer between the surface that described conductor refrigeration chip and fin or metal cold-storage thermal-arrest plate amplexiform.
Above-mentioned high efficiency semiconductor heat sink is provided with hole in the described liquid circulation groove, and semiconductor refrigeration chip promptly is sealed on the hole.
In the utility model, adopted the cooling method that the semiconductor-assisted cooling chip is set or heat radiation (wing) sheet is set on the liquid circulation groove, cooperate the cooling fluid forced circulation, circulation fluid is lowered the temperature rapidly, thereby reach the effect that reduces semiconductor heat sink cryogenic temperature.Its cooling rate is fast, cryogenic temperature is low, be subjected to the influence of environment temperature little and simple in structure, cost is low, is specially adapted to the semiconductor heat sink of larger capacity.
Description of drawings
Fig. 1 is structural representation of the present utility model (embodiment 1 overlook partial sectional view);
Fig. 2 is that the A-A of Fig. 1 is to view;
Fig. 3 is the schematic diagram (vertical view of embodiment 2) of the another kind of structure of the utility model.
The specific embodiment
Referring to Fig. 1 Fig. 2, it is embodiment 1 of the present utility model.Its main member comprises working box 7, main semiconductor cooling chip 5, cooling fluid (for example water or other can use the liquid of working media as) circulating slot 4, semiconductor-assisted cooling chip 1 etc.The alleged working box implication of the utility model is wider, and it may be household freezer, the refrigerating box of refrigerator, also may be the work housing that some instrument or equipment need be lowered the temperature.The cold junction of main semiconductor cooling chip and metal cold-storage thermal-arrest plate 6 amplexiform, and two amplexiform the surface is provided with heat-conducting silicone grease layer 3, and main semiconductor cooling chip and cold-storage thermal-arrest plate are inlaid on the work box body wall of refrigerator.The hot junction of main semiconductor cooling chip and liquid circulation groove amplexiform, and the liquid circulation groove adopts fine aluminium to make, and its outer surface is done anodized to form the electric-insulation heat-conduction layer.
Key of the present utility model is the improvement to cooling bath, cooling bath is designed to three-back-shaped, forms the cool cycles groove.Shown in Figure 1ly on the liquid circulation groove, be provided with a semiconductor-assisted cooling chip 1 again, this chip is positioned at the top of liquid circulation groove, the outer wall of its cold junction and liquid circulation groove amplexiforms, and its role is to make the fluid temperature in the liquid circulation groove to reduce rapidly.Hot junction and fin 2 amplexiform, and the cooling in hot junction relies on the air cooling of fin 2 to dispel the heat and finishes.Be to improve heat-sinking capability, two amplexiform and are provided with heat-conducting silicone grease layer 3 between the surface.Referring to Fig. 2, in the liquid circulation groove, also be provided with a liquid circulation pump 8, its mounting means should make the flow direction of liquid consistent with the Natural Circulation direction.When the main semiconductor cooling chip is worked, its hot junction liberated heat raises the fluid temperature in the liquid circulation groove, and hot water is up, when flowing through the pairing position of semiconductor-assisted cooling chip, fluid temperature reduces rapidly under the effect of companion chip cold junction, and cold water is descending.According to Fig. 1, the main and auxiliary position that is provided with that helps the conductor refrigeration chip shown in Figure 2, the liquid in the liquid circulation groove can form circulation naturally.After having set up liquid circulation pump, circulation rate is accelerated, and the liquid cooling-down effect is better.
Cooling fluid in the utility model can resemble the liquid circulation cell wall that passes through mentioned above and realize cooling with contacting of semiconductor refrigeration chip, also can directly contact by the hole on the circulating slot with semiconductor refrigeration chip, under latter event, the effect that its heat is transmitted can be more better.
Fig. 3, Figure 4 shows that the utility model embodiment 2.Be not use in this mode the semiconductor-assisted cooling chip with the difference of embodiment 1, but be provided with radiating fin 9 around the outer wall of liquid circulation groove in the top loop of liquid circulation groove.Described radiating fin is made through the machinery chucking by heat conductivility good metal aluminium flake, and the one side that it and liquid circulation groove amplexiform will be finish-machined to the plane, realizes the heat exchange of liquid in the groove by radiating fin.Compare with embodiment 1, embodiment 2 is simple in structure, and manufacturing cost is lower, but refrigeration is inferior slightly.
Two kinds of embodiments shown in the utility model all can form constant temperature or heating cabinet with the electric current reversal connection.At this moment, also can adjust the main and auxiliary relative position that helps conductor refrigeration chip (or radiating fin), make the Natural Circulation of its suitable liquid.
Claims (6)
1. high efficiency semiconductor heat sink, it comprises working box, be inlaid in the main semiconductor cooling chip on the working box inwall and be arranged near another surperficial cooling bath of main semiconductor refrigerating chip, it is characterized in that: described cooling bath is the liquid circulation groove, be provided with semiconductor-assisted cooling chip (1) on the top of liquid circulation groove, the outer wall of the cold junction of described semiconductor-assisted cooling chip and liquid circulation groove (4) amplexiforms, and its hot junction and fin (2) amplexiform.
2. high efficiency semiconductor heat sink, it comprises working box, be inlaid in the main semiconductor cooling chip on the working box inwall and be arranged near another surperficial cooling bath of main semiconductor refrigerating chip, it is characterized in that: described cooling bath is the liquid circulation groove, top in liquid circulation groove (4) is provided with radiating fin (9) around the outer wall of liquid circulation groove.
3. high efficiency semiconductor heat sink according to claim 1 and 2 is characterized in that: be provided with liquid circulation pump (8) in the described liquid circulation groove.
4. high efficiency semiconductor heat sink according to claim 3 is characterized in that: the cold junction of described main semiconductor refrigerating chip and metal cold-storage thermal-arrest plate (6) amplexiform.
5. high efficiency semiconductor heat sink according to claim 4 is characterized in that: be provided with heat-conducting silicone grease layer (3) between the surface that described conductor refrigeration chip and fin or metal cold-storage thermal-arrest plate (6) amplexiform.
6. high efficiency semiconductor heat sink according to claim 5 is characterized in that: be provided with hole in the described liquid circulation groove, semiconductor refrigeration chip promptly is sealed on the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02293820 CN2593130Y (en) | 2002-12-28 | 2002-12-28 | Efficient semiconductor temperature-reducing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02293820 CN2593130Y (en) | 2002-12-28 | 2002-12-28 | Efficient semiconductor temperature-reducing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2593130Y true CN2593130Y (en) | 2003-12-17 |
Family
ID=33751597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02293820 Expired - Fee Related CN2593130Y (en) | 2002-12-28 | 2002-12-28 | Efficient semiconductor temperature-reducing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2593130Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101936615A (en) * | 2010-09-13 | 2011-01-05 | 青岛海信电器股份有限公司 | Semiconductor refrigerating chip temperature control device and laser |
| CN101947403A (en) * | 2010-10-08 | 2011-01-19 | 杭州科林爱尔气源设备有限公司 | Semiconductor refrigeration dryer and refrigeration drying method |
| CN103398494A (en) * | 2008-03-05 | 2013-11-20 | 史泰克公司 | Cooling system and method for operating thermoelectric cooling system |
| CN106379986A (en) * | 2016-11-22 | 2017-02-08 | 镇江市和云工业废水处置有限公司 | Waste liquid disposal tank heat radiation structure |
| CN107940799A (en) * | 2017-10-28 | 2018-04-20 | 东台市凯润精密机械股份有限公司 | A kind of high-effect radiating refrigerator |
| CN108800655A (en) * | 2017-04-28 | 2018-11-13 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device |
| CN118066792A (en) * | 2024-04-16 | 2024-05-24 | 中国科学技术大学 | Intelligent cold storage temperature control method and device based on chip refrigeration |
-
2002
- 2002-12-28 CN CN 02293820 patent/CN2593130Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103398494A (en) * | 2008-03-05 | 2013-11-20 | 史泰克公司 | Cooling system and method for operating thermoelectric cooling system |
| US9435571B2 (en) | 2008-03-05 | 2016-09-06 | Sheetak Inc. | Method and apparatus for switched thermoelectric cooling of fluids |
| CN103398494B (en) * | 2008-03-05 | 2017-03-01 | 史泰克公司 | Cooling system and the method for operation thermoelectric cooling system |
| CN101936615A (en) * | 2010-09-13 | 2011-01-05 | 青岛海信电器股份有限公司 | Semiconductor refrigerating chip temperature control device and laser |
| CN101947403A (en) * | 2010-10-08 | 2011-01-19 | 杭州科林爱尔气源设备有限公司 | Semiconductor refrigeration dryer and refrigeration drying method |
| CN101947403B (en) * | 2010-10-08 | 2012-12-19 | 杭州科林爱尔气源设备有限公司 | Semiconductor refrigeration dryer and refrigeration drying method |
| CN106379986A (en) * | 2016-11-22 | 2017-02-08 | 镇江市和云工业废水处置有限公司 | Waste liquid disposal tank heat radiation structure |
| CN108800655A (en) * | 2017-04-28 | 2018-11-13 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device |
| CN108800655B (en) * | 2017-04-28 | 2020-09-04 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating device |
| CN107940799A (en) * | 2017-10-28 | 2018-04-20 | 东台市凯润精密机械股份有限公司 | A kind of high-effect radiating refrigerator |
| CN118066792A (en) * | 2024-04-16 | 2024-05-24 | 中国科学技术大学 | Intelligent cold storage temperature control method and device based on chip refrigeration |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |