CN209796797U - Carrying system in IC firing equipment - Google Patents
Carrying system in IC firing equipment Download PDFInfo
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- CN209796797U CN209796797U CN201920417179.9U CN201920417179U CN209796797U CN 209796797 U CN209796797 U CN 209796797U CN 201920417179 U CN201920417179 U CN 201920417179U CN 209796797 U CN209796797 U CN 209796797U
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- firing apparatus
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Abstract
The utility model discloses a delivery system in IC fires equipment, including bed frame, sucking disc mechanism and lift actuating mechanism, lift actuating mechanism includes slide and lift driving source, and sucking disc mechanism is including sliding the tubulose main part that sets up on the slide, and the one end of tubulose main part is connected with the suction head, the air supply is connected to the other end, is equipped with unsteady elastic component in the tubulose main part, and the one end of unsteady elastic component is fixed in the tubulose main part, and the other end is fixed in the bottom of slide, and the fixed ring that detects that is equipped with in the tubulose main part is equipped with on the slide and detects. The utility model discloses can detect and fold the material phenomenon, prevent that the invalid condition of firing and detecting of IC chip from appearing. Through the cooperation of the floating displacement and the detection ring with the proximity sensor, the initial position measurement function can be realized, manual initial quantity setting is not required according to various IC chips, and the automation degree is high. The lifting displacement of the sucker mechanism is limited in a multiple mode, and hard collision between the sucker and the IC chip is effectively avoided.
Description
Technical Field
The utility model relates to a delivery system in equipment is fired to IC belongs to the IC chip and picks up the technical field of running gear.
background
The IC firing equipment needs to pick up a single IC chip in a carrying disc to a firing area for operation, the operation mechanism for picking up the IC chip comprises an operation platform which moves in a horizontal plane and a picking sucking disc mechanism with lifting displacement, in the specific operation process, the picking sucking disc mechanism is firstly operated to the top of the IC chip through the operation platform, the picking sucking disc mechanism is driven to a sucking disc to be in butt joint with the IC chip through lifting, then the IC chip is picked up through negative pressure in the sucking disc, and turnover is carried out after picking up.
Conventionally pick up the sucking disc and need be according to IC chip ground concrete thickness, set for accurate lift displacement through the procedure, ensure sucking disc and IC chip position degree phase-match, prevent between sucking disc and the IC chip rigid collision or adsorb between and pick up the too big condition in clearance and take place, consequently need carry out stroke setting alone to different IC chips, very loaded down with trivial details, in addition, carry and possess more IC chip in the dish, because carry the dish itself and have certain holding error, can't ensure that the top surface position degree of each IC chip is accurate, inevitably can have stroke error, the phenomenon that IC chip impaired and the too big unable pick up in clearance often appears.
In order to avoid the situation, an elastic mechanism is arranged in the picking sucker mechanism, certain tolerance is provided, and the alignment requirement is met, however, the elastic mechanism is additionally arranged, so that a serious problem is brought, when IC chips are retained in the firing area, the situation of material stacking occurs, only the retained IC chips are repeatedly fired and detected, the IC chips stacked on the retained IC chips cannot be fired and detected, and the IC chips are operated to a finished product area as qualified products, so that a large number of unfired IC chips are generated in the finished product area.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the not enough of above-mentioned prior art, easily appearing the problem of folding the material to traditional sucking disc mechanism, provide the delivery system in the IC fires equipment.
In order to achieve the above purpose, the utility model discloses the technical scheme who adopts is:
The carrying system in the IC firing equipment is arranged on an operation platform of the IC firing equipment and comprises a pedestal, a sucker mechanism and a lifting driving mechanism arranged on the pedestal,
Wherein the lifting driving mechanism comprises a sliding seat with lifting displacement and a lifting driving source, the sucker mechanism comprises a tubular main body which is vertically and slidably arranged on the sliding seat, one end of the tubular main body is connected with a sucker for adsorbing an IC chip, the other end of the tubular main body is connected with an air source through a hose,
the tubular body is provided with a floating elastic piece, one end of the floating elastic piece is fixed on the tubular body, the other end of the floating elastic piece is fixed at the bottom of the sliding seat, the tubular body is fixedly provided with a detection ring, and the sliding seat is provided with a proximity sensor extending towards the detection ring.
Preferably, the lifting driving source includes a lifting slide rail disposed on the base frame, a slider slidably disposed on the lifting slide rail, and a power portion for driving the slider to move up and down, and the slider is fixedly connected to the slide base via an extension arm.
Preferably, the power part is a pulley transmission mechanism.
Preferably, the belt wheel transmission mechanism comprises two transmission wheels and a transmission belt connected with the two transmission wheels in a matching mode, the transmission belt is connected with the sliding block in a linkage mode, and any transmission wheel is connected with a transmission motor.
Preferably, the pulley transmission mechanism is further provided with an elastic body for limiting the descending stroke of the sliding block, one end of the elastic body is fixed, and the other end of the elastic body bypasses a transmission wheel to be fixedly connected with the sliding block.
Preferably, the base frame is further provided with a guide seat for vertically guiding the tubular main body, the tubular main body penetrates through the guide seat, and the suction head is located at the bottom of the guide seat.
Preferably, the tubular main body is further fixedly provided with a limiting ring, and the limiting ring is positioned at the top of the guide seat.
Preferably, the guide seat is detachably provided with a limiting member for interfering with the limiting ring.
Preferably, the limiting member is concave.
The beneficial effects of the utility model are mainly embodied in that:
1. the phenomenon of material stacking can be detected, and the situations of invalid burning and detection of the IC chip are prevented.
2. through the cooperation of the floating displacement and the detection ring with the proximity sensor, the initial position measurement function can be realized, manual initial quantity setting is not required according to various IC chips, and the automation degree is high.
3. The lifting displacement of the sucker mechanism is limited in a multiple mode, and hard collision between the sucker and the IC chip is effectively avoided.
4. The lifting driving source is reliable in design, small in occupied space and easy to carry.
Drawings
Fig. 1 is a schematic perspective view of a carrying system in the IC firing apparatus of the present invention.
Fig. 2 is a schematic side view of a carrier system in the IC firing apparatus of the present invention.
fig. 3 is another schematic view of the carrier system of the IC firing apparatus of the present invention.
Detailed Description
the utility model provides a delivery system in equipment is fired to IC. The technical solution of the present invention will be described in detail below with reference to the accompanying drawings so as to be easier to understand and grasp.
The carrying system in the IC burning equipment is arranged on a running platform of the IC burning equipment.
As shown in fig. 1 to 3, the present invention includes a base frame 1, a suction cup mechanism 2, and a lifting drive mechanism 3 provided on the base frame 1.
The lifting driving mechanism 3 comprises a slide seat 4 with lifting displacement and a lifting driving source, the sucker mechanism 2 comprises a tubular main body 21 which is arranged in the slide seat 4 in a vertical sliding mode, one end of the tubular main body 21 is connected with a sucker 22 used for adsorbing an IC chip, and the other end of the tubular main body is connected with an air source through a hose 23.
The tubular main body 21 is provided with a floating elastic piece 5, one end of the floating elastic piece 5 is fixed on the tubular main body 21, the other end of the floating elastic piece 5 is fixed at the bottom of the sliding seat 4, the tubular main body 21 is fixedly provided with a detection ring 6, and the sliding seat 4 is provided with a proximity sensor 7 extending towards the detection ring 6.
The implementation process and principle of the scheme are described in detail as follows:
when the sucking disc mechanism 2 picks up, firstly, the base frame 1 is moved to the position above the IC chip by the operation platform, so that the sucking head 22 is vertically opposite to the IC chip, at the moment, the sliding seat 4 of the lifting driving mechanism 3 descends and displaces, the tubular main body 21 also descends and displaces in the descending process of the sliding seat 4, when the sucking head 22 abuts against the IC chip, the sliding seat 4 continues to descend, at the moment, the floating elastic piece 5 is compressed, the tubular main body 21 is in a static state relative to the IC chip, therefore, the proximity sensor 7 on the sliding seat 4 generates a large gap with the detection ring 6, and when the detection range of the proximity sensor is exceeded, the optimal adsorption position is reached.
it should be noted that the pulse signal of the elevating drive source of the elevating drive mechanism 3 is matched with the detection signal of the proximity sensor, so that the driving amount of the elevating drive source can be determined, and the initial positioning function is realized, that is, the detection signal of the proximity sensor is collected by the picking-up operation of the suction cup mechanism 2 without setting the fixed displacement amount by a program, thereby determining the appropriate driving amount of the elevating drive source.
in addition, the IC chip is picked up to the burning area from the carrying disc, the sucking disc mechanism 2 firstly picks up the IC chip on the carrying disc, therefore, the driving amount of the current lifting driving source is recorded during picking up, when the IC chip is sent to the burning area to be burned and detected, the sucking disc mechanism 2 adopts the same driving amount to carry out lifting displacement to pick up the IC chip in the burning area, when the material overlapping occurs, a detection signal of the proximity sensor and a pulse signal of the real-time lifting driving source generate a large error, and at this time, the IC chip in the burning area is judged to be in the material overlapping state. To explain in more detail, when the lifting drive source has not completed the drive amount, the proximity sensor 7 and the detection ring 6 have already prematurely exceeded the gap, and the stack is determined.
In one embodiment, the lifting driving source includes a lifting slide rail 11 disposed on the base frame 1, a slide block 31 slidably disposed on the lifting slide rail 11, and a power portion 32 for driving the slide block 31 to move up and down, wherein the slide block 31 is fixedly connected to the slide base 4 by an extension arm 33.
Through the design of lift slide rail 11, can make the straightness that hangs down of slide 4 obtain the guarantee, simultaneously, the side linkage of slider 31 through extension arm 33 can avoid hose 23 position, need not direct perpendicular to the drive and connect.
In one embodiment, the power section 32 is a pulley drive.
Specifically, the pulley transmission mechanism includes two transmission wheels 321 and a transmission belt 322 coupled to the two transmission wheels 321, the transmission belt 322 is coupled to the slider 31, and any one of the transmission wheels 321 is connected to a transmission motor 323.
the accurate control of the lifting displacement of the sliding seat 4 can be realized through the belt wheel transmission mechanism, the mechanism space can be saved, and the carrying is easy.
the pulley transmission mechanism is further provided with an elastic body 324 for limiting the descending stroke of the slider 31, one end of the elastic body 324 is fixed, and the other end of the elastic body 324 bypasses a transmission wheel 321 to be fixedly connected with the slider 31.
Specifically, the elastic body 324 is a spring, and the transmission wheel 321 on the top is provided with two rows of grooves, one row of grooves is used for carrying the transmission belt 322, and the other row of grooves is used for carrying the elastic body 324, so that the elastic body 324 is stretched in the descending process of the slider 31, and when the elastic body 324 descends to a certain degree, the elastic body 324 generates great descending resistance to the slider 31, and the suction head 22 is prevented from colliding with the IC chip.
In a particular embodiment, the base frame 1 is further provided with a guide 12 for vertically guiding the tubular body 21, the tubular body 21 extends through the guide 12, and the suction head 22 is located at the bottom of the guide 12.
the guide seat 12 can ensure the reliable verticality of the lifting displacement of the tubular main body 21, improve the surface contact stability between the suction head 22 and the IC chip and ensure the realization of adsorption butt joint.
In one embodiment, the tubular body 21 is further fixedly provided with a limiting ring 8, and the limiting ring 8 is positioned on the top of the guide seat 12.
The limiting ring 8 is a rigid limiting structure, and when the tubular main body 21 exceeds the descending stroke, the limiting ring 8 is abutted against the top surface of the guide seat 12, so that the function of forced limiting is achieved.
In one embodiment, the guide seat 12 is detachably provided with a limiting member 9 for interfering with the limiting ring 8. The limiting member 9 is concave.
Through the design of the limiting part 9, the hard limiting travel can be flexibly set, hard interference is carried out on the limiting ring 8, and the concave design has double limiting functions of upper and lower limits.
can discover through the above description, the utility model discloses IC fires the delivery system in the equipment, can detect and fold the material phenomenon, prevents that the invalid condition of firing and detecting of IC chip from appearing. Through the cooperation of the floating displacement and the detection ring with the proximity sensor, the initial position measurement function can be realized, manual initial quantity setting is not required according to various IC chips, and the automation degree is high. The lifting displacement of the sucker mechanism is limited in a multiple mode, and hard collision between the sucker and the IC chip is effectively avoided. The lifting driving source is reliable in design, small in occupied space and easy to carry.
The above technical solutions of the present invention have been fully described, and it should be noted that the present invention is not limited by the above description, and all technical solutions formed by equivalent transformation or equivalent transformation adopted by the spirit of the present invention in the aspects of structure, method or function by those of ordinary skill in the art all fall within the protection scope of the present invention.
Claims (9)
- The carrying system in the IC burning equipment is arranged on a running platform of the IC burning equipment, and is characterized in that:Comprises a base frame, a sucker mechanism and a lifting driving mechanism arranged on the base frame,Wherein the lifting driving mechanism comprises a sliding seat with lifting displacement and a lifting driving source, the sucker mechanism comprises a tubular main body which is vertically and slidably arranged on the sliding seat, one end of the tubular main body is connected with a sucker for adsorbing an IC chip, the other end of the tubular main body is connected with an air source through a hose,The tubular body is provided with a floating elastic piece, one end of the floating elastic piece is fixed on the tubular body, the other end of the floating elastic piece is fixed at the bottom of the sliding seat, the tubular body is fixedly provided with a detection ring, and the sliding seat is provided with a proximity sensor extending towards the detection ring.
- 2. A carrier system in an IC firing apparatus according to claim 1, wherein:the lifting driving source comprises a lifting slide rail arranged on the base frame, a sliding block arranged on the lifting slide rail in a sliding mode, and a power portion for driving the sliding block to move up and down, and the sliding block is fixedly connected with the sliding seat through an extension arm.
- 3. A carrying system in an IC firing apparatus according to claim 2, wherein:The power part is a belt wheel transmission mechanism.
- 4. a carrying system in an IC firing apparatus according to claim 3, wherein:The belt wheel transmission mechanism comprises two transmission wheels and a transmission belt which is connected with the two transmission wheels in a matching mode, the transmission belt is connected with the sliding block in a linkage mode, and any transmission wheel is connected with a transmission motor.
- 5. A carrying system in an IC firing apparatus according to claim 4, wherein:The pulley transmission mechanism is also provided with an elastic body for limiting the descending stroke of the sliding block, one end of the elastic body is fixed, and the other end of the elastic body bypasses a transmission wheel and is fixedly connected with the sliding block.
- 6. A carrier system in an IC firing apparatus according to claim 1, wherein:The pedestal is also provided with a guide seat used for guiding the tubular main body in a perpendicularity manner, and the tubular main body penetrates through the guide seat and the suction head is positioned at the bottom of the guide seat.
- 7. A carrying system in an IC firing apparatus according to claim 6, wherein:The tubular main body is further fixedly provided with a limiting ring, and the limiting ring is positioned at the top of the guide seat.
- 8. A carrying system in an IC firing apparatus according to claim 7, wherein:The guide seat is detachably provided with a limiting part used for interfering with the limiting ring.
- 9. A carrier system in an IC firing apparatus as set forth in claim 8, wherein:the limiting piece is concave.
Priority Applications (1)
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CN201920417179.9U CN209796797U (en) | 2019-03-29 | 2019-03-29 | Carrying system in IC firing equipment |
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CN201920417179.9U CN209796797U (en) | 2019-03-29 | 2019-03-29 | Carrying system in IC firing equipment |
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CN209796797U true CN209796797U (en) | 2019-12-17 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109896276A (en) * | 2019-03-29 | 2019-06-18 | 昆山沃得福自动化设备有限公司 | Delivery system in IC burning equipment |
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2019
- 2019-03-29 CN CN201920417179.9U patent/CN209796797U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109896276A (en) * | 2019-03-29 | 2019-06-18 | 昆山沃得福自动化设备有限公司 | Delivery system in IC burning equipment |
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