CN209606890U - A kind of dustproof cooling device of electronic computer - Google Patents

A kind of dustproof cooling device of electronic computer Download PDF

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Publication number
CN209606890U
CN209606890U CN201920135190.6U CN201920135190U CN209606890U CN 209606890 U CN209606890 U CN 209606890U CN 201920135190 U CN201920135190 U CN 201920135190U CN 209606890 U CN209606890 U CN 209606890U
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CN
China
Prior art keywords
box
box body
refrigerating chamber
mainframe box
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920135190.6U
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Chinese (zh)
Inventor
郭彩萍
翟丽红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyuan Institute of Technology
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Taiyuan Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyuan Institute of Technology filed Critical Taiyuan Institute of Technology
Priority to CN201920135190.6U priority Critical patent/CN209606890U/en
Application granted granted Critical
Publication of CN209606890U publication Critical patent/CN209606890U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

A kind of dustproof cooling device of electronic computer, including mainframe box and the vertical box body of cuboid that mainframe box side is arranged in, the outlet side of fan is then connected to the refrigerating chamber of box body below, the side wall of drawer box is provided with filter screen, the surface of filter screen is then covered with one layer of filtering sponge, the other end of exhaust pipe, which is then respectively communicated with, is fixed with a plurality of upward gooseneck, and rubber-covered pipe is cased on every gooseneck respectively, the inner sidewall of helical cavity is provided with the spiral stream guidance blade of downward spiral, the semiconductor chilling plate of chill surface inwardly is then embedded in the side wall of refrigerating chamber, the heat emission fan of oriented metal fin blowing is fixed on box body lateral wall at metallic heat radiating plate.The air themperature that the utility model flows through refrigerating chamber reduces to form cold air, and cold air eventually passes through filtering and blows to from the sites of heat generation of mainboard from exhaust pipe, every gooseneck, carries out more effective more direct heat dissipation.

Description

A kind of dustproof cooling device of electronic computer
Technical field
The utility model relates to a kind of computer cooling device, the dust-proof cooling dress of specifically a kind of electronic computer It sets.
Background technique
Current computer all has radiator, which generally installs concentratedly on the CPU of mainboard.Computer is dead Machine, blue screen are restarted etc., and many computer problems are all since CPU overheat causes, and certainly, CPU overheat can't damage CPU, and It is the associated components influenced whether around CPU.The thing of any energization has resistance, only superconductor, has electric current to pass through It will be generated on resistance heat (W=I^2*R).The heat that will be generated when electric current is by connecting the original part inside CPU, this It kind is Joule heat, with the square directly proportional of electric current;It is for second the heat by being generated when capacitive reactances or emotional resistance, This heat is fewer, but CPU is the great a pile transistor of the order of magnitude that monocrystalline silicon is made into, therefore also has relatively high heat Amount;The third heat is " electric leakage " between transistor, also square directly proportional with electric current, to reduce electric leakage and test very much CPU's Designed capacity, current technology are also difficult to be truly realized zero electric leakage;4th kind, it is also the largest fever source, is that electric current passes through The heat and frequency discharged when PN junction (i.e. countless semiconductor transistors) be directly proportional and electric current it is square directly proportional, The faster calorific value of cpu frequency will be bigger, and present CPU has overclocking capabilities, and overclocking is even more that CPU fever can be allowed serious.
Depend single heat dissipation or inadequate alone, the heat that CPU is distributed still can gradually accumulate in mainframe box, make host Case internal temperature gradually rises, even if the heat dissipation at such CPU is good again, the heat dissipation after also will affect, in order to give cabinet inside Heat dissipation, general cabinet are also in communication with the outside by heat emission fan, have to a certain extent been dispersed into the heat in mainframe box outer Boundary, but often contain more dust with the air of stylish entrance, dust can be accumulated on the components such as mainboard over time, product On the one hand tired dust will form heat-insulated relatively good " cotton dress ", reduce mainboard and the heat dissipation effect of its electronic component, separately The electrostatic that one side dust generates may finally will lead to fault.
Utility model content
To solve the above problems, the purpose of the utility model is to provide a kind of dustproof cooling devices of electronic computer.
The utility model to achieve the above object, a kind of dustproof cooling device of electronic computer, including mainframe box and set The vertical box body of cuboid in mainframe box side is set, mainframe box and box body form closed connectivity structure, so on the one hand can So that extraneous dust is difficult to enter, the air after being on the other hand also convenient for refrigeration is directly blown onto inside, makes temperature inside mainframe box Degree lower than the external world, box body inner top be provided with the fan that is connected at the top of mainframe box, the outlet side of fan then with box body below Refrigerating chamber connection, the lower end of refrigerating chamber be connected to the helical cavity of cylinder type, and the lower end of helical cavity is cuboid, and under End is inserted with telescopic drawer box, and the side wall of drawer box is provided with filter screen, and the surface of filter screen is then covered with one layer of filtering sea Silk floss, filter screen, filtering sponge are used for dust in filtered host case air etc.;
Helical cavity is connected to by the filter screen of drawer box, filtering sponge with exhaust pipe one end of bottom in mainframe box, exhaust The other end of pipe, which is then respectively communicated with, is fixed with a plurality of upward gooseneck, and is cased with rubber-covered pipe on every gooseneck respectively, Rubber-covered pipe is important to encase the end of gooseneck, prevents gooseneck from exposing, the welcome bending of gooseneck, to will go out Gas end is more directly directed at heating position, and the rubber-covered pipe of jacket can gooseneck to avoid metal material and mainboard or master Pin, the contact of component conducting position on plate, avoid the generation of short circuit phenomenon, the inner sidewall of helical cavity is provided with downward spiral Spiral stream guidance blade, spiral stream guidance blade horizontal width can be helical cavity radius, it is therefore an objective to flow through the wind of helical cavity Downward spiral wind is formed, is accumulated in drawer box convenient for the dust granule etc. in air;
The semiconductor chilling plate of chill surface inwardly is then embedded in the side wall of refrigerating chamber, the lateral surface of semiconductor chilling plate then covers It is stamped the metallic heat radiating plate being in communication with the outside, and fixes oriented metal fin blowing on the box body lateral wall at metallic heat radiating plate Heat emission fan, semiconductor chilling plate energization can be realized medial surface refrigeration, thus will flow through refrigerating chamber air themperature reduce shape At cold air, cold air eventually passes through filtering and blows to from the sites of heat generation of mainboard from exhaust pipe, every gooseneck, carries out more effective More direct heat dissipation.
Detailed description of the invention
Fig. 1 is the main view of the utility model.
Specific embodiment
As shown in Figure 1, a kind of dustproof cooling device of electronic computer, including mainframe box 1 and setting are in 1 side of mainframe box The vertical box body 2 of cuboid, 2 inner top of box body is provided with the fan 3 being connected to at the top of mainframe box 1, and the outlet side of fan 3 is then It is connected to the refrigerating chamber 4 of box body 2 below, the lower end of refrigerating chamber 4 is connected to the helical cavity 5 of cylinder type, the lower end of helical cavity 5 For cuboid, and it is inserted with telescopic drawer box 6 in lower end, the side wall of drawer box 6 is provided with filter screen 7, the table of filter screen 7 Face is then covered with one layer of filtering sponge 8, and helical cavity 5 passes through bottom in the filter screen 7 of drawer box 6, filtering sponge 8 and mainframe box 1 9 one end of exhaust pipe connection, the other end of exhaust pipe 9, which is then respectively communicated with, is fixed with a plurality of upward gooseneck 10, and every goose Rubber-covered pipe is cased on neck tube 10 respectively, the inner sidewall of helical cavity 5 is provided with the spiral stream guidance blade 11 of downward spiral, refrigeration In the side wall of chamber 4 then be embedded with the semiconductor chilling plate 12 of chill surface inwardly, the lateral surface of semiconductor chilling plate 12 be then covered with The metallic heat radiating plate 13 of external world's connection, and fix oriented metal fin 13 on 2 lateral wall of box body at metallic heat radiating plate 13 and blow The heat emission fan 14 of wind.
In order to increase incoming air area, the inlet end of fan 3 is located in mainframe box 1, and is communicated with a funnel shaped collection wind Cover 15.
In order to keep entire 1 sealing effect of mainframe box more preferable, the inside for the baffle that drawer box 6 is contacted with 1 lateral wall of mainframe box Face be additionally provided with a circle for sealing rubber ring 16.
In order to which preferably cold air is transported to inside mainframe box 1,2 internal fan 3 of box body, refrigerating chamber 4,5 periphery of helical cavity Filled with heat preserving and insulating material.
In order to reduce the vibration of mainframe box 1,1 bottom of mainframe box is also lined with rubber cushion blocks 17.
The standardized element that the utility model uses can commercially, shaped piece according to specification and attached drawing Record can carry out customized, the specific connection type of each part is all made of in the prior art mature bolt, rivet, weldering Equal conventional means are connect, this will not be detailed here.
Certainly, the above description is not intended to limit the present invention, and the utility model is also not limited to the example above, this The those of ordinary skill of technical field, in the essential scope of the utility model, variation, change, addition or the replacement made, all It should belong to the protection scope of utility model.

Claims (5)

1. a kind of dustproof cooling device of electronic computer, it is characterised in that: including mainframe box (1) and be arranged in mainframe box (1) The vertical box body of the cuboid of side (2), box body (2) inner top are provided with the fan (3) being connected to mainframe box (1) top, wind The outlet side of fan (3) is then connected to the refrigerating chamber (4) of box body below (2), the lower end of refrigerating chamber (4) and the spiral of cylinder type The lower end of chamber (5) connection, helical cavity (5) is cuboid, and is inserted with telescopic drawer box (6) in lower end, drawer box (6) Side wall is provided with filter screen (7), and the surface of filter screen (7) is then covered with one layer of filtering sponge (8), and helical cavity (5) passes through drawer The filter screen (7) of box (6), filtering sponge (8) are connected to exhaust pipe (9) one end of mainframe box (1) interior bottom, exhaust pipe (9) The other end, which is then respectively communicated with, is fixed with a plurality of upward gooseneck (10), and is cased with rubber-covered respectively on every gooseneck (10) Pipe, the inner sidewall of helical cavity (5) are provided with the spiral stream guidance blade (11) of downward spiral, are then embedded in the side wall of refrigerating chamber (4) The semiconductor chilling plate (12) of chill surface inwardly, the lateral surface of semiconductor chilling plate (12) are then covered with the metal being in communication with the outside Heat sink (13), and dissipating for oriented metal fin (13) blowing is fixed on box body (2) lateral wall at metallic heat radiating plate (13) Heat fan (14).
2. a kind of dustproof cooling device of electronic computer according to claim 1, it is characterised in that: fan (3) into Gas end is located in mainframe box (1), and is communicated with a funnel shaped wind-collecting cover (15).
3. a kind of dustproof cooling device of electronic computer according to claim 1, it is characterised in that: drawer box (6) with Mainframe box (1) lateral wall contact baffle medial surface be additionally provided with a circle for sealing rubber ring (16).
4. a kind of dustproof cooling device of electronic computer according to claim 1, it is characterised in that: box body (2) interior wind (3), refrigerating chamber (4), helical cavity (5) periphery are fanned filled with heat preserving and insulating material.
5. a kind of dustproof cooling device of electronic computer according to claim 1, it is characterised in that: mainframe box (1) bottom Portion is also lined with rubber cushion blocks (17).
CN201920135190.6U 2019-01-26 2019-01-26 A kind of dustproof cooling device of electronic computer Expired - Fee Related CN209606890U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920135190.6U CN209606890U (en) 2019-01-26 2019-01-26 A kind of dustproof cooling device of electronic computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920135190.6U CN209606890U (en) 2019-01-26 2019-01-26 A kind of dustproof cooling device of electronic computer

Publications (1)

Publication Number Publication Date
CN209606890U true CN209606890U (en) 2019-11-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920135190.6U Expired - Fee Related CN209606890U (en) 2019-01-26 2019-01-26 A kind of dustproof cooling device of electronic computer

Country Status (1)

Country Link
CN (1) CN209606890U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112930085A (en) * 2021-01-25 2021-06-08 驻马店职业技术学院 English teaching material cloud storage server rack

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112930085A (en) * 2021-01-25 2021-06-08 驻马店职业技术学院 English teaching material cloud storage server rack

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191108