CN205665646U - Notebook computer that heat dissipation is good - Google Patents
Notebook computer that heat dissipation is good Download PDFInfo
- Publication number
- CN205665646U CN205665646U CN201620003167.8U CN201620003167U CN205665646U CN 205665646 U CN205665646 U CN 205665646U CN 201620003167 U CN201620003167 U CN 201620003167U CN 205665646 U CN205665646 U CN 205665646U
- Authority
- CN
- China
- Prior art keywords
- cpu
- nacelle
- computer
- power
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a notebook computer that heat dissipation is good relates to the computer realm, including computer bottom plate, screen, the computer bottom plate is inside still to include miniature semiconductor refrigeration piece, temperature controller, CPU heat conduction structure including power groove, power, CPU, integrated circuit, miniature semiconductor refrigeration piece is fixed at the power inslot, the refrigeration face and computer power contact of miniature semiconductor refrigeration piece, and the face of heating of miniature semiconductor refrigeration piece meets with the bottom shell of computer bottom plate, temperature controller has two temperature sensor that link to each other with power, CPU last the company, and temperature controller passes through wire control miniature semiconductor refrigeration piece, fan work when the high temperature, can in time cool off the power, avoids the power to be burnt out, improves power life, effectively avoids water, dust, impurity etc. To get into the internal circuit board and damages CPU.
Description
Technical field
This utility model relates to a kind of radiating structure of computer, particularly relates to the notebook computer of a kind of good heat dissipation.
Background technology
Notebook operationally power supply and CPU often produce bigger heat, if can not dispel the heat in time, will directly affect
Operating rate and power supply and the service life of CPU.Computer volume and inner space are less, and heater element produces because of integrated distribution
Raw heat dissipation problem is more prominent.In existing radiation processes, the conduction of heat between heat conduction original paper and heater element is relatively slow, high
Warm amount is easily accumulated in conducting-heat elements, is difficult to fin conductive, causes radiating efficiency extremely low.Existing notebook does not all have
Power supply is done radiating treatment, furthermore, existing solution CPU heat dissipation problem is usually and uses temperature-controlled fan to dispel the heat, i.e. installing dissipates
Backing and fan, in this kind of radiator structure, fin, CPU, fan all with extraneous contact be in unified atmospheric environment
In, when cpu temperature is too high, fan absorbs cold air and easily causes the water in the external world, dust, sandy soil etc. to enter internal electricity from the external world
Road plate damages CPU.
Utility model content
In order to solve, the radiating effect of existing notebook is the best and fin, CPU, fan are all easily caused with extraneous contact
The defect that internal circuit damages, this utility model spy provides the notebook computer of a kind of good heat dissipation.
The technical solution of the utility model is as follows:
A kind of notebook computer of good heat dissipation, including computer base plate, screen, described computer base plate interior include power slot,
Power supply, CPU, integrated circuit, also include micro semiconductor cooling piece, temperature controller, CPU conductive structure, described miniature partly leads
Body cooling piece is fixed in power slot, and the chill surface of micro semiconductor cooling piece contacts with computer power, and micro semiconductor freezes
The face that heats of sheet connects with the bottom shell of computer base plate；Described CPU conductive structure includes the first conductive sole plate, is arranged on CPU
The second conductive sole plate and two ends on upper surface connect the first conductive sole plate, the heat pipe of the second conductive sole plate respectively；Also wrap
Include the nacelle being arranged on bottom cabinet, the fin being arranged on the first conductive sole plate lower surface and be fixed on fin side
Fan on face；Nacelle is the cavity structure of upper end open, and described first conductive sole plate and nacelle upper end open are connected to form one
Sealed compartment, fin and fan are arranged in sealed compartment.In this programme, the second conductive sole plate being arranged on CPU upper surface
By heat pipe, the CPU heat absorbed is delivered to the first conductive sole plate, and the first conductive sole plate transfers heat to heat radiation again
On sheet, in this programme, some fin are uniformly arranged in the first conductive sole plate so that area of dissipation is bigger.Furthermore, at the bottom of nacelle
Portion offers air inlet and air outlet relative to the position of fan and the sidewall of nacelle respectively relative to the position of fin, dissipates
Gap between backing forms vent passages, and when CPU runs overheated, fan will absorb the cold sky outside cabinet bottom nacelle
Gas also delivers to fin, and after cold air passes through fin, hot-air will be discharged from air outlet.Traditional CPU heat radiation is usually
Being dispelled the heat by installing fin and fan on CPU, in this kind of radiator structure, fin, CPU, fan are all with outer
Boundary contacts and is in unified atmospheric environment, and when cpu temperature is too high, fan absorbs cold air and easily causes the external world from the external world
Water, dust, sandy soil etc. enter internal circuit board and damage CPU.For solving this defect, inventor is by by fan and fin
It is arranged in sealed compartment, by completely isolated to CPU, internal circuit board and fan, fin so that in radiation processes, fan is from cabin
The cold air sucked bottom body and the hot-air of discharge can only circulate in sealed compartment, efficiently avoid water, dust, impurity
CPU is damaged Deng entering internal circuit board；Two temperature sensors being connected with power supply, CPU it are connected with on described temperature controller, when
When temperature is too high, temperature controller passes through polygon control survey micro semiconductor cooling piece, fan work.
Further, bottom described computer base plate, four corners are additionally provided with base plate protection turning, prop up notebook, make
Obtain and between notebook computer bottom surface and desktop, form certain space, it is to avoid the water droplet on table enters notebook, concurrently facilitates pen
Remember this ventilation and heat, it is ensured that computer base plate is difficult to be worn.
Further, four corners of described screen are additionally provided with screen protection turning, it is ensured that screen is difficult to be worn.
Further, the bottom of described computer base plate is provided with ventilative with the relevant position, the face that heats of micro semiconductor cooling piece
Hole, distributes the heat of micro semiconductor cooling piece self, it is to avoid aggravate power source temperature in turn in time.
Further, described heat pipe is hollow structure inside, and the inwall of heat pipe is evenly arranged with heat-conducting medium.Lead
Heat pipe is that metal material is made, it is preferable that the heat pipe in this programme uses copper pipe.It is uniformly arranged on leading on heat pipe inwall
Thermal medium makes heat pipe can quickly absorb the heat that CPU module sends, and heat is the quickest through the first conductive sole plate
Conduction to fin so that heat be difficult to accumulation, be effectively improved heat transfer efficiency, improve CPU module heat radiation effect
Really.
Further, described heat-conducting medium is powdery metal particles.Metal heat-conducting energy force rate nonmetallic heat conductive ability is strong,
The powdery metal particles being uniformly arranged on heat pipe inwall further increases heat-conducting area, it is ensured that the heat on CPU
Absorbed in time and transmitted.
Further, described nacelle upper surface offering seal groove, seal washer is arranged in seal groove, the first heat conduction
Base plate is connected with nacelle by seal washer.The setting of seal washer ensure that to be formed between the first conductive sole plate and nacelle and seals
Cabin, it is to avoid inadequate because sealing dynamics, the cold air that fan sucks from cabinet outside is from the junction of the first conductive sole plate Yu nacelle
Exit into internal circuit board and damage CPU.
Further, also include that the position being fixed on the hangers on the first conductive sole plate side and corresponding hangers is arranged on
Screwed hole on nacelle sidewall, the first conductive sole plate runs through hangers with nacelle by bolt is simultaneously attached with screwed hole.?
In this programme, the first conductive sole plate is bolted with nacelle so that readily accessible between the first conductive sole plate and nacelle, is dissipating
When heat goes wrong, it is simple to the fan in sealed compartment is overhauled with fin.
In sum, Advantageous Effects of the present utility model is as follows:
(1) setting of temperature controller, it is ensured that laptop and cpu temperature reach the timely of cooling mechanism during certain value
Work, avoid simultaneously temperature relatively low time idle running；
(2) it is specially provided with micro semiconductor cooling piece on power supply, cools down power supply in time, it is to avoid power supply is burned, improve
Power supply service life；
(3) fan and fin are arranged in sealed compartment, it is ensured that in radiation processes, fan sucks bottom nacelle
Cold air and the hot-air of discharge can only circulate in sealed compartment, efficiently avoid water, dust, impurity etc. and enter internal
Circuit board damage CPU；
(4) heat pipe is that the heat-conducting medium being uniformly arranged on the inwall of hollow structure inside and heat pipe makes on CPU
Heat is difficult to accumulation, is effectively improved heat transfer efficiency, enhances radiating effect；
(5) heat conductivility of powdery metal particles is relatively strong, and heat-conducting medium uses powdery metal particles to further enhance
The heat transfer efficiency of heat pipe；
(6) notebook is propped up at base plate protection turning so that forms certain space between notebook computer bottom surface and desktop, keeps away
Exempt from the water droplet on table and enter notebook, concurrently facilitate notebook ventilation and heat, it is ensured that computer base plate is difficult to be worn, and arranges screen
Curtain protection turning, it is ensured that screen is difficult to be worn；
(7) first conductive sole plate are sealed by seal washer with nacelle, it is to avoid inadequate because sealing dynamics, and cabinet is outside to be sucked
Cold air exit into from the junction of the first conductive sole plate Yu nacelle internal circuit board damage CPU；
(8) first conductive sole plate connect by tethering with nacelle so that readily accessible between the first conductive sole plate and nacelle, are dissipating
When heat goes wrong, it is simple to the fan in sealed compartment is overhauled with fin.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the schematic diagram of laptop heat-dissipation structure；
Fig. 3 is the schematic diagram of CPU conductive structure；
Fig. 4 is the schematic diagram of nacelle；
Fig. 5 is the partial schematic diagram in Fig. 3 at A；
Wherein the parts title corresponding to reference is as follows:
1, computer base plate；12, micro semiconductor cooling piece；13, power slot；14, temperature controller；141, temperature sensing
Device；15, CPU conductive structure；151, the first conductive sole plate；152, the second conductive sole plate；153, heat pipe；154, nacelle；155、
Fin；156, fan；157, heat-conducting medium；158, seal groove；59, hangers；1510, screwed hole；1511, air-vent；16, the end
Plate protection turning；2, screen；21, screen protection turning.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is described in more detail by specific embodiment, but of the present utility model
Embodiment is not limited to this.
Embodiment 1
As Figure 1-Figure 5, the notebook computer of a kind of good heat dissipation, including computer base plate 1, screen 2, described computer base plate
1 inside includes power slot 13, power supply, CPU, integrated circuit, also includes micro semiconductor cooling piece 12, temperature controller 14, CPU
Conductive structure 15, the chill surface of micro semiconductor cooling piece 12 contacts with computer power, heating of micro semiconductor cooling piece 12
Face connects with the bottom shell of computer base plate 11；Described CPU conductive structure 15 includes the first conductive sole plate 151, is arranged on CPU
The second conductive sole plate 152 on surface and two ends connect the heat conduction of first conductive sole plate the 151, second conductive sole plate 152 respectively
Pipe 153；Also include the nacelle 154 being arranged on bottom cabinet, the fin being arranged on the first conductive sole plate 151 lower surface
155 and be fixed on the fan 156 on fin 155 side；Nacelle 154 is the cavity structure of upper end open, and described first leads
Hot base plate 151 and nacelle 154 upper end open are connected to form a sealed compartment, and fin 155 and fan 156 are arranged in sealed compartment；
Be connected with two temperature sensors 141 being connected with power supply, CPU on described temperature controller 14, temperature controller 4 by wire with
Micro semiconductor cooling piece 12, fan 156 are connected.
The radiating principle of the present embodiment is as follows: the temperature recorded is conveyed to temperature controller 14 by temperature sensor 141, with
Writing the work of notebook, power supply and cpu temperature raise gradually, and when temperature reaches higher than 30 DEG C, temperature controller 14 controls micro-
Type semiconductor chilling plate 12, fan 156 work, and micro semiconductor cooling piece 12 helps power supply to lower the temperature, and CPU given in time by fan 156
Heat radiation；Wherein, the heat conduction principle of CPU conductive structure 15 is: the second conductive sole plate 152 being arranged on CPU upper surface will absorb
To CPU heat be delivered to the first conductive sole plate 151 by heat pipe 153, the first conductive sole plate 151 transfers heat to dissipate again
On backing 155, relative to the position of fan 156 and the sidewall of nacelle 154 relative to the position of fin 155 bottom nacelle 154
Offering air inlet and air outlet respectively, the gap between fin 155 forms vent passages, when CPU runs overheated, and wind
Fan 156, by absorbing the cold air outside cabinet bottom nacelle 154 and delivering to fin 155, treats that cold air passes through fin 155
After, hot-air will be discharged from air outlet.The present embodiment is by being arranged in sealed compartment avoid fan 156 and fin 155
In radiation processes, bottom nacelle 154, the cold air of suction, dust etc. enter internal circuit board and damage CPU.
Embodiment 2
The present embodiment optimizes on the basis of embodiment 1 further, and bottom described computer base plate 1, four corners also set up
Having base plate protection turning 16,2 four corners of described screen to be additionally provided with screen protection turning 21, base plate protection turning 16 is propped up
Notebook so that form certain space between notebook computer bottom surface and desktop, it is to avoid the water droplet on table enters notebook, simultaneously
Contribute to notebook ventilation and heat, it is ensured that computer base plate 1 is difficult to be worn, screen protection turning 21 is set, it is ensured that screen 2 is difficult to
It is worn.
Embodiment 3
The present embodiment on the basis of embodiment 1, the bottom of described computer base plate 1 and the system of micro semiconductor cooling piece 12
Hot side relevant position is provided with air-vent, is distributed by the heat of micro semiconductor cooling piece self in time, it is to avoid add in turn
Acute power source temperature, improves radiating efficiency further.
Embodiment 4
The present embodiment is on the basis of embodiment 1, and described heat pipe 153 is hollow structure inside, the inwall of heat pipe 153
On be evenly arranged with heat-conducting medium 157.Described heat-conducting medium 157 is powdery metal particles.
Metal heat-conducting energy force rate nonmetallic heat conductive ability is strong, the powdery metal being uniformly arranged on heat pipe 153 inwall
Granule is effectively improved heat transfer efficiency, enhances radiating effect, it is ensured that the heat on CPU is absorbed in time and transmits.
Embodiment 5
The present embodiment, on the basis of embodiment 1 or embodiment 2, described nacelle 154 upper surface offers seal groove
158, seal washer is arranged in seal groove 158, and the first conductive sole plate 151 is connected with nacelle 154 by seal washer.
The setting of seal washer ensure that formation sealed compartment between the first conductive sole plate 151 and nacelle 154, it is to avoid because sealing
Dynamics causes fan 156 from the outside cold air sucked of cabinet from the junction of the first conductive sole plate 151 with nacelle 154 not
Exit into internal circuit board and damage CPU.
Embodiment 6
The present embodiment, on the basis of embodiment 1 or embodiment 2 or embodiment 3, also includes being fixed on the first conductive sole plate
Hangers 159 and the position of corresponding hangers 159 on 151 sides are arranged on the screwed hole 1510 on nacelle 154 sidewall, and first leads
Hot base plate 151 runs through hangers 159 with nacelle 154 by bolt is simultaneously connected with screwed hole 1510.
First conductive sole plate 151 is bolted with nacelle 154 so that between the first conductive sole plate 151 and nacelle 54 just
In dismounting, when heat radiation goes wrong, it is simple to the fan 156 in sealed compartment is overhauled with fin 155.
It is embodiments of the invention as mentioned above.The present invention is not limited to above-mentioned embodiment, and anyone should learn
The structure change made under the enlightenment of the present invention, every have same or like technical scheme with the present invention, each falls within this
Within the protection domain of invention.
Claims (6)
1. a notebook computer for good heat dissipation, including computer base plate (1), screen (2), described computer base plate (1) is internal to be included
Power slot (13), power supply, CPU, integrated circuit, it is characterised in that: also include micro semiconductor cooling piece (12), temperature controller
(14), CPU conductive structure (15), in described micro semiconductor cooling piece (12) is fixed on power slot (13), micro semiconductor system
The chill surface of cold (12) and electrical power contacts, outside the face that heats of micro semiconductor cooling piece (12) is with the bottom of computer base plate (1)
Shell connects；At the bottom of the second heat conduction that described CPU conductive structure (15) includes the first conductive sole plate (151), be arranged on CPU upper surface
Plate (152) and two ends connect the heat pipe (153) of the first conductive sole plate (151), the second conductive sole plate (152) respectively；Also wrap
The fin (155) include the nacelle (154) being arranged on bottom cabinet, being arranged on the first conductive sole plate (151) lower surface with
And the fan (156) being fixed on fin (155) side；Nacelle (154) is the cavity structure of upper end open, and described first leads
Hot base plate (151) and nacelle (154) upper end open are connected to form a sealed compartment, and fin (155) is arranged on close with fan (156)
In batten down；Two temperature sensors (141) being connected with power supply, CPU, temperature controller it is connected with on described temperature controller (14)
(14) it is connected with micro semiconductor cooling piece (12), fan (156) by wire；Four turnings, described computer base plate (1) bottom
Place is additionally provided with base plate protection turning (16)；(2) four corners of described screen are additionally provided with screen protection turning (21).
The notebook computer of a kind of good heat dissipation the most according to claim 1, it is characterised in that: described computer base plate (1)
Bottom is provided with air-vent with the relevant position, the face that heats of micro semiconductor cooling piece (12).
The notebook computer of a kind of good heat dissipation the most according to claim 1, it is characterised in that: described heat pipe (53) is interior
Portion's hollow structure, the inwall of heat pipe (153) is evenly arranged with heat-conducting medium (157).
The notebook computer of a kind of good heat dissipation the most according to claim 3, it is characterised in that: described heat-conducting medium (157)
For powdery metal particles.
The notebook computer of a kind of good heat dissipation the most according to claim 1, it is characterised in that: the upper table of described nacelle (154)
Offering seal groove (158) on face, seal washer is arranged in seal groove (158), and the first conductive sole plate (151) passes through sealing gasket
Circle is connected with nacelle (154).
The notebook computer of a kind of good heat dissipation the most according to claim 1, it is characterised in that: also include that being fixed on first leads
Hangers (159) and the position of corresponding hangers (159) on hot base plate (151) side are arranged on the spiral shell on nacelle (154) sidewall
Pit (1510), the first conductive sole plate (151) runs through hangers (159) and screwed hole with nacelle (154) by bolt simultaneously
(1510) it is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620003167.8U CN205665646U (en) | 2016-01-05 | 2016-01-05 | Notebook computer that heat dissipation is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620003167.8U CN205665646U (en) | 2016-01-05 | 2016-01-05 | Notebook computer that heat dissipation is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205665646U true CN205665646U (en) | 2016-10-26 |
Family
ID=57163913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620003167.8U Expired - Fee Related CN205665646U (en) | 2016-01-05 | 2016-01-05 | Notebook computer that heat dissipation is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205665646U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108508992A (en) * | 2018-05-22 | 2018-09-07 | 苏州特鑫精密电子有限公司 | A kind of computer cabinet |
| CN108551753A (en) * | 2018-06-19 | 2018-09-18 | 广州开能电气实业有限公司 | A kind of totally-enclosed Power Quality Comprehensive Treatment Device |
-
2016
- 2016-01-05 CN CN201620003167.8U patent/CN205665646U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108508992A (en) * | 2018-05-22 | 2018-09-07 | 苏州特鑫精密电子有限公司 | A kind of computer cabinet |
| CN108551753A (en) * | 2018-06-19 | 2018-09-18 | 广州开能电气实业有限公司 | A kind of totally-enclosed Power Quality Comprehensive Treatment Device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201654658U (en) | Dustproof and waterproof closed cabinet radiating device | |
| CN106445037B (en) | Partial immersion type liquid cooling server cooling system | |
| CN202058088U (en) | Water-cooled computer case | |
| CN202512500U (en) | Refrigeration-type heat radiation base for notebook computer | |
| CN204086779U (en) | A kind of video camera sunshading-radiating device and sunshade heat radiation video camera | |
| CN203630714U (en) | Notebook computer radiator | |
| CN205665646U (en) | Notebook computer that heat dissipation is good | |
| CN203433456U (en) | Water-cooling heat dissipation device for notebook computer | |
| CN104679175A (en) | Dustproof radiating machine case | |
| CN108227883A (en) | A kind of huge computer servers radiator | |
| CN204923550U (en) | Semiconductor air conditioner card and cushion, seat, mattress | |
| CN205091693U (en) | Heat radiator for can improve router data -handling capacity | |
| CN207216547U (en) | A kind of computer radiator | |
| CN107203253A (en) | A kind of contact active Phase cooling structure and passive Phase cooling structure | |
| CN201571152U (en) | Radiating structure of liquid crystal display television | |
| CN103699196B (en) | A kind of chamber type heat preservation/radiator towards blade server | |
| CN207301943U (en) | A kind of novel computer radiator fan | |
| CN206863682U (en) | A kind of contact active Phase cooling structure and passive Phase cooling structure | |
| CN205665647U (en) | Notebook heat radiation structure | |
| CN204613835U (en) | A kind of dustproof heat dissipation cabinet | |
| CN205581761U (en) | A heat conduction structure for computer CPU | |
| CN201166825Y (en) | Water-cooled notebook computer radiator | |
| CN2850217Y (en) | Air heat radiator for electronic-like products | |
| CN106125855A (en) | Refrigeration dustproof case | |
| CN208314698U (en) | Twin automatic cycle cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161026 Termination date: 20180105 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |