CN208634886U - Light emitting diode with the heat dissipation of full structure - Google Patents
Light emitting diode with the heat dissipation of full structure Download PDFInfo
- Publication number
- CN208634886U CN208634886U CN201821319355.7U CN201821319355U CN208634886U CN 208634886 U CN208634886 U CN 208634886U CN 201821319355 U CN201821319355 U CN 201821319355U CN 208634886 U CN208634886 U CN 208634886U
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- China
- Prior art keywords
- emitting diode
- shell
- heat dissipation
- light emitting
- lid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses the light emitting diodes to radiate with full structure, including shell, the enclosure interior is fixedly installed with dimensional packaged circuit board, the dimensional packaged circuit board bottom package has multiple light-emitting diode chip for backlight unit items, the dimensional packaged circuit board upper surface is bonded with heat sink, the heat dissipation plate surface offers multiple first heat release holes, the shell upper end is equipped with lid, lock-screw is threaded between the both ends and shell of the lid, there are two radiator fans for the lid bottom symmetrical fixed installation, the top surface is also provided with multiple second heat release holes, the housing bottom is also equipped with transparent cover, clamping mechanism is installed between the transparent cover and shell.The utility model is preferable by making the air circulation inside device, and prevents dust accretions, to reduce the operating temperature of light-emitting diode chip for backlight unit item, structure heat dissipation effect is more preferable, and carry out maintenance and repair easy to disassemble, more convenient to use.
Description
Technical field
The utility model relates to LED technology fields, more particularly to the light emitting diode with the heat dissipation of full structure.
Background technique
Light emitting diode (LED) is a kind of semiconductor electronic component that can convert electrical energy into luminous energy, because of its luminous efficiency
Incandescent lamp is had been over, the lamps and lanterns using light emitting diode as light source nowadays occurs.
Due to light emitting diode using when be usually that multiple light-emitting diode chip for backlight unit connect to form lamp bar and illuminate, because
The heat dissipation capacity that this also results in light emitting diode is higher, if not being aerated cooling to it, light emitting diode is easy to burn.
For this purpose, we have proposed the light emitting diodes to radiate with full structure.
Utility model content
Purpose of the utility model is to solve the problems in background techniques, and the hair with the heat dissipation of full structure proposed
Optical diode.
To achieve the goals above, the utility model adopts the technical scheme that luminous two with the heat dissipation of full structure
Pole pipe, including shell, the enclosure interior are fixedly installed with dimensional packaged circuit board, and the dimensional packaged circuit board bottom package has multiple hairs
Luminous diode chip item, the dimensional packaged circuit board upper surface are bonded with heat sink, and the heat dissipation plate surface offers multiple first
Heat release hole, the shell upper end are equipped with lid, lock-screw, the lid are threaded between the both ends and shell of the lid
Body bottom symmetrical is fixedly mounted there are two radiator fan, and the top surface is also provided with multiple second heat release holes, the shell
Bottom is also equipped with transparent cover, is equipped with clamping mechanism between the transparent cover and shell.
In the above-mentioned light emitting diode with the heat dissipation of full structure, the clamping mechanism includes that housing bottom symmetrically opens up
Two card slots, each card slot inner wall symmetrically opens up there are two groove, is fixedly connected in each groove more
A spring, is fixedly connected with support block jointly on the spring of the same inside grooves, on the both ends of the transparent cover
Surface is connected with fixture block, and fixture block is corresponding inside card slot.
In the above-mentioned light emitting diode with the heat dissipation of full structure, symmetrically open up that there are two arcs on each fixture block
Shape slot, and support block corresponding support is located inside arc groove.
In the above-mentioned light emitting diode with the heat dissipation of full structure, the lid upper surface above the second heat release hole is also
It is fixedly installed with Air Filter.
In the above-mentioned light emitting diode with the heat dissipation of full structure, positioned at the two neighboring of the dimensional packaged circuit board bottom
Heat gap is equipped between light-emitting diode chip for backlight unit item.
In the above-mentioned light emitting diode with the heat dissipation of full structure, the heat sink is made of copper material.
Utility model has the advantages that
1, the heat absorption distributed dimensional packaged circuit board and light-emitting diode chip for backlight unit item by the way that copper heat sink is arranged, then by
Heat is dispelled and the air for carrying heat is discharged by the second heat release hole by radiator fan, by make device inner air circulation compared with
Good, to reduce the operating temperature of light-emitting diode chip for backlight unit item, structure heat dissipation effect is more preferable；
2, by the way that easy-to-mount transparent cover is arranged, the maintenance to dimensional packaged circuit board and light-emitting diode chip for backlight unit item can be made
It is more convenient to repair, more convenient to use；
3, by the Air Filter above the second heat release hole of setting, it can prevent extraneous dust from entering shell by the second heat release hole
Inside forms dust accumulation, so that causing overheat causes to burn, it is safer.
Detailed description of the invention
Fig. 1 be the utility model proposes with full structure heat dissipation light emitting diode structural schematic diagram；
Fig. 2 is the structural side view of dimensional packaged circuit board part in Fig. 1；
Fig. 3 is the structure enlargement diagram of part A in Fig. 1.
In figure: 1 shell, 2 dimensional packaged circuit boards, 3 light-emitting diode chip for backlight unit items, 4 heat sinks, 5 first heat release holes, 6 lids, 7
Lock-screw, 8 radiator fans, 9 second heat release holes, 10 Air Filters, 11 transparent covers, 12 grooves, 13 springs, 14 support blocks, 15 cards
Block.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
Referring to Fig.1-3, there is the light emitting diode of full structure heat dissipation, including shell 1, be fixedly installed with envelope inside shell 1
Device, circuit board 2,2 bottom package of dimensional packaged circuit board have multiple light-emitting diode chip for backlight unit items 3, the phase positioned at 2 bottom of dimensional packaged circuit board
It is equipped with heat gap between adjacent two light-emitting diode chip for backlight unit items 3, prevents heat from assembling, temperature increases too fast, dimensional packaged circuit board
2 upper surfaces are bonded with heat sink 4, and heat sink 4 is made of copper material, and the heat-conducting effect of copper material is more preferable, to encapsulation electricity
Faster, 4 surface of heat sink offers multiple first heat release holes 5 to the heat absorption that road plate 2 and light-emitting diode chip for backlight unit item 3 distribute,
1 upper end of shell is equipped with lid 6, and lock-screw 7 is threaded between the both ends and shell 1 of lid 6, and 6 bottom symmetrical of lid is solid
There are two radiator fans 8 for Dingan County's dress, and 6 surface of lid is also provided with multiple second heat release holes 9, above the second heat release hole 9
6 upper surface of lid is also fixedly installed with Air Filter 10, prevents extraneous dust from being entered inside shell 1 by the second heat release hole 9 and forms product
Dirt, so that making light-emitting diode chip for backlight unit item 3 be more easier overheat when working causes to burn.
In the utility model, the heat that dimensional packaged circuit board 2 and light-emitting diode chip for backlight unit item 3 distribute when working is by heat sink 4
It absorbing, then 4 top of heat sink is dispersed by the first heat release hole 5, two radiator fans 8 can dispel the heat on heat sink 4, and
The air for carrying heat is discharged by second heat release hole 9 on 6 surface of lid, to reduce dimensional packaged circuit board 2 and light emitting diode
The operating temperature of chip strip 3.
1 bottom of shell is also equipped with transparent cover 11, and clamping mechanism is equipped between transparent cover 11 and shell 1, engages machine
Structure includes two card slots that 1 bottom symmetrical of shell opens up, and each card slot inner wall symmetrically opens up that there are two groove 12, each grooves
It is fixedly connected to multiple springs 13 in 12, is fixedly connected with support block jointly on the spring 13 inside same groove 12
14, the both ends upper surface of transparent cover 11 is connected with fixture block 15, and fixture block 15 is corresponding inside card slot, each fixture block 15
On symmetrically open up there are two arc groove, and corresponding support of support block 14 is located in arc groove.
Pull transparent cover 11, make fixture block 15 be detached from support block 14 and spring 13 support set after be drawn out card slot, can will be saturating
Bright cover 11, which is removed, carries out maintenance and repair to dimensional packaged circuit board 2 and light-emitting diode chip for backlight unit item 3, again by fixture block 15 after the completion of repairing
Again transparent cover 11 can be installed back to 1 bottom of shell in corresponding insertion card slot, it is more convenient to use.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
1. the light emitting diode with the heat dissipation of full structure, including shell (1), the shell (1) is internal to be fixedly installed with encapsulation electricity
Road plate (2), dimensional packaged circuit board (2) bottom package have multiple light-emitting diode chip for backlight unit items (3), which is characterized in that the envelope
Device, circuit board (2) upper surface is bonded with heat sink (4), and heat sink (4) surface offers multiple first heat release holes (5), institute
Shell (1) upper end is stated equipped with lid (6), is threaded with lock-screw (7) between the both ends and shell (1) of the lid (6),
There are two radiator fan (8) for lid (6) the bottom symmetrical fixed installation, and lid (6) surface is also provided with multiple second
Heat release hole (9), shell (1) bottom are also equipped with transparent cover (11), install between the transparent cover (11) and shell (1)
There is clamping mechanism.
2. the light emitting diode according to claim 1 with the heat dissipation of full structure, which is characterized in that the clamping mechanism packet
Include two card slots that shell (1) bottom symmetrical opens up, each card slot inner wall symmetrically opens up that there are two groove (12), each
Multiple springs (13) are fixedly connected in the groove (12), are located on the internal spring (13) of the same groove (12)
It is fixedly connected with jointly support block (14), the both ends upper surface of the transparent cover (11) is connected with fixture block (15), and fixture block
(15) corresponding to be located inside card slot.
3. the light emitting diode according to claim 2 with the heat dissipation of full structure, which is characterized in that each fixture block
(15) arc groove there are two symmetrically being opened up on, and support block (14) corresponding support is located inside arc groove.
4. the light emitting diode according to claim 1 with the heat dissipation of full structure, which is characterized in that be located at the second heat release hole
(9) lid (6) upper surface above is also fixedly installed with Air Filter (10).
5. the light emitting diode according to claim 1 with the heat dissipation of full structure, which is characterized in that be located at the encapsulation electricity
Heat gap is equipped between the two neighboring light-emitting diode chip for backlight unit item (3) of road plate (2) bottom.
6. the light emitting diode according to claim 1 with the heat dissipation of full structure, which is characterized in that the heat sink (4)
It is made of copper material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821319355.7U CN208634886U (en) | 2018-08-16 | 2018-08-16 | Light emitting diode with the heat dissipation of full structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821319355.7U CN208634886U (en) | 2018-08-16 | 2018-08-16 | Light emitting diode with the heat dissipation of full structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208634886U true CN208634886U (en) | 2019-03-22 |
Family
ID=65742533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821319355.7U Expired - Fee Related CN208634886U (en) | 2018-08-16 | 2018-08-16 | Light emitting diode with the heat dissipation of full structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208634886U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110425435A (en) * | 2019-08-13 | 2019-11-08 | 吴有龙 | A kind of Novel LED light of high efficiency and heat radiation |
| CN113280272A (en) * | 2021-06-03 | 2021-08-20 | 深圳市昭祺科技有限公司 | Surface-mounted LED (light-emitting diode) pipe fitting |
-
2018
- 2018-08-16 CN CN201821319355.7U patent/CN208634886U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110425435A (en) * | 2019-08-13 | 2019-11-08 | 吴有龙 | A kind of Novel LED light of high efficiency and heat radiation |
| CN110425435B (en) * | 2019-08-13 | 2020-10-09 | 辽宁海浪防爆电器有限责任公司 | Novel LED lamp with high-efficiency heat dissipation |
| CN113280272A (en) * | 2021-06-03 | 2021-08-20 | 深圳市昭祺科技有限公司 | Surface-mounted LED (light-emitting diode) pipe fitting |
| CN113280272B (en) * | 2021-06-03 | 2022-01-11 | 深圳市昭祺科技有限公司 | Surface-mounted LED (light-emitting diode) pipe fitting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190322 Termination date: 20210816 |