CN217004388U - Semiconductor light-emitting module with high heat dissipation performance - Google Patents
Semiconductor light-emitting module with high heat dissipation performance Download PDFInfo
- Publication number
- CN217004388U CN217004388U CN202123250834.2U CN202123250834U CN217004388U CN 217004388 U CN217004388 U CN 217004388U CN 202123250834 U CN202123250834 U CN 202123250834U CN 217004388 U CN217004388 U CN 217004388U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- semiconductor light
- emitting module
- baffle
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a semiconductor light-emitting module with high heat dissipation performance, which comprises a lamp panel, wherein semiconductor lamp beads are installed at the bottom of the lamp panel, a transparent cover is arranged at the bottom of the lamp panel, a plurality of heat dissipation plates are installed at the upper part of the lamp panel at intervals, a baffle is fixedly arranged on the upper part of the lamp panel along the periphery, and a radiator is detachably installed on the baffle. The upper portion of the lamp panel is provided with the plurality of heat dissipation plates at intervals, heat generated by the semiconductor lamp beads can be dissipated quickly, the upper portion of the lamp panel is fixedly provided with the baffle plate along the periphery, and the heat can be dissipated further by detachably arranging the heat dissipater on the baffle plate, so that the heat dissipation efficiency is improved, the heat dissipation effect is improved, and the service life of the LED lamp is prolonged.
Description
Technical Field
The utility model relates to the technical field of LED lighting lamps, in particular to a semiconductor light-emitting module with high heat dissipation performance.
Background
The semiconductor lighting module in the existing LED lighting lamp has long lighting time, the heat dissipation performance of the lighting module is poor, and accumulated heat cannot be dissipated, so that the temperature of the lighting module is too high, the heat resistance of the LED lamp is poor, and the service life of the LED lamp is greatly shortened due to the fact that the temperature of the lighting module is too high. In order to avoid the problem that the service life of the LED lamp is shortened due to the over-high temperature of the lighting module, a semiconductor light emitting module with high heat dissipation is proposed to solve the above technical problem.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a semiconductor light emitting module with high heat dissipation capability to solve the above problems.
In order to solve the technical problems, the utility model provides the following technical scheme: the utility model provides a semiconductor light emitting module that thermal diffusivity is high, includes the lamp plate, semiconductor lamp pearl is installed to the bottom of lamp plate, the bottom of lamp plate is equipped with the translucent cover, a plurality of heating panels are installed to the upper portion interval of lamp plate, the upper portion of lamp plate is along the fixed baffle that is equipped with in week, detachable installs the radiator on the baffle.
The baffle is provided with a plurality of radiating holes.
The radiator comprises a metal shell and a heat absorption module arranged in the metal shell, and a plurality of heat dissipation holes are formed in a bottom plate of the metal shell.
The horizontal fixed slide bar that is equipped with in top of heating panel, slidable mounting has a plurality of heat dissipation bosses on the slide bar, lamp plate upper portion left side is provided with micro motor, one side of micro motor is provided with temperature sensor, and is a plurality of connect through the stay cord between the heat dissipation boss, the left side end the heat dissipation boss passes through the stay cord and connects on micro motor's the rolling disc, the right side end the heat dissipation boss pass through the elastic component with the baffle is connected.
The sliding rod is provided with limiting blocks at intervals.
The number of the heat dissipation reinforcing blocks is consistent with that of the heat dissipation plates.
Compared with the prior art, the utility model has the following beneficial effects: according to the LED lamp, the plurality of heat dissipation plates are arranged at the upper part of the lamp panel at intervals, heat generated by the semiconductor lamp beads can be dissipated quickly, the baffle plate is fixedly arranged on the upper part of the lamp panel along the periphery, and the heat dissipater is detachably arranged on the baffle plate, so that the heat can be dissipated further, the heat dissipation efficiency is improved, the heat dissipation effect is improved, and the service life of the LED lamp is prolonged; according to the LED lamp, the heat dissipation reinforcing block is arranged above the heat dissipation plate, the pull rope is driven by the micro motor to pull the heat dissipation reinforcing block to be in contact with the top of the heat dissipation plate, the plurality of fins are arranged on the heat dissipation reinforcing block, the heat dissipation area is increased, the heat dissipation efficiency can be further improved, the heat dissipation effect is improved, the temperature of the light emitting module is reduced, and the service life of the LED lamp is prolonged.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model, and are incorporated into and constitute a part of this specification. In the drawings:
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of embodiment 2 of the present invention;
FIG. 3 is an enlarged view at A in FIG. 2;
FIG. 4 is a state diagram of embodiment 2 of the present invention;
in the figure: 1, a lamp panel; 2, a semiconductor lamp bead; 3, a transparent cover; 4 heat-dissipating plate; 5, a baffle plate; 6, a radiator; 61 a metal housing; 62 a heat absorption module; 7, a heat dissipation opening; 8, radiating holes; 9 sliding rods; 10 heat dissipation reinforcing blocks; 11 a micro motor; 12 a temperature sensor; 13 pulling a rope; 14 resilient member.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, the present invention provides the following technical solutions: the utility model provides a semiconductor light emitting module that thermal diffusivity is high, includes lamp plate 1, and semiconductor lamp pearl 2 is installed to the bottom of lamp plate 1, and the bottom of lamp plate 1 is equipped with translucent cover 3, and a plurality of heating panels 4 are installed to the upper portion interval of lamp plate 1, and the upper portion of lamp plate 1 is fixed along week and is equipped with baffle 5, and detachable installs radiator 6 on the baffle 5.
The baffle 5 is provided with a plurality of radiating holes 7, so that heat can be radiated out, and the accumulation of heat is avoided.
The heat sink 6 includes a metal casing 61 and a heat absorption module 62 disposed in the metal casing 61, the heat absorption module 62 has a strong heat absorption performance, and can absorb heat quickly, and a plurality of heat dissipation holes 8 are disposed on a bottom plate of the metal casing 61, so that heat can enter the metal casing 61 quickly and be absorbed by the heat absorption module 62.
Example 2
Referring to fig. 2-3, a sliding rod 9 is transversely and fixedly arranged above the heat dissipation plate 4, a plurality of heat dissipation reinforcing blocks 10 are slidably mounted on the sliding rod 9, a micro motor 11 is arranged on the left side of the upper portion of the lamp panel 1, a temperature sensor 12 is arranged on one side of the micro motor 11, the heat dissipation reinforcing blocks 10 are connected through a pull rope 13, the heat dissipation reinforcing block 10 on the left side end is connected to a rotating disc of the micro motor 11 through the pull rope 13, and the heat dissipation reinforcing block 10 on the right side end is connected with the baffle 5 through an elastic piece 14;
a microcontroller is arranged in the temperature sensor 12, the temperature sensor 12 is electrically connected to the micro motor 11 (the microcontroller is a market universal device, the specific structure and type thereof are common knowledge of those skilled in the art, and the mode of electrically connecting the temperature sensor 12 and the micro motor 11 can be selected by those skilled in the art according to actual conditions), when the temperature reaches the set value of the temperature sensor 12, the micro motor 11 starts the winding pull rope 13, the pull rope 13 pulls the heat dissipation reinforcing block 10 to move to the top of the heat dissipation plate 4, and the heat dissipation reinforcing block contacts with the top of the heat dissipation plate 4 (as shown in fig. 4), a plurality of fins are arranged on the heat dissipation reinforcing block 10, the heat dissipation area is increased, the heat dissipation efficiency can be further improved, and the heat dissipation effect is improved.
The slide bar 9 is provided with limiting blocks at intervals, when the stay cord 13 pulls the heat dissipation reinforcing block 10 to move, the heat dissipation reinforcing block 10 slides on the slide bar 9, the limiting blocks can limit the heat dissipation reinforcing block 10, and the heat dissipation reinforcing block 10 is guaranteed to move to the top of the heat dissipation plate 4 and contact with the top of the heat dissipation plate 4.
The number of the heat radiation reinforcing blocks 10 is the same as that of the heat radiation plates 4.
It is noted that relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor light emitting module of high heat dissipation, includes lamp plate (1), semiconductor lamp pearl (2) are installed to the bottom of lamp plate (1), the bottom of lamp plate (1) is equipped with translucent cover (3), its characterized in that: a plurality of heating panels (4) are installed at the upper portion interval of lamp plate (1), the upper portion of lamp plate (1) is along fixed baffle (5) that is equipped with all around, detachable installs radiator (6) on baffle (5).
2. The semiconductor light emitting module with high heat dissipation performance as set forth in claim 1, wherein: and a plurality of heat dissipation ports (7) are arranged on the baffle (5).
3. The semiconductor light emitting module with high heat dissipation performance as set forth in claim 1, wherein: the heat radiator (6) comprises a metal shell (61) and a heat absorption module (62) arranged in the metal shell (61), and a plurality of heat dissipation holes (8) are formed in a bottom plate of the metal shell (61).
4. The semiconductor light emitting module with high heat dissipation performance as set forth in claim 1, wherein: the top of heating panel (4) is horizontal to be fixed and is equipped with slide bar (9), slidable mounting has a plurality of heat dissipation bosses (10) on slide bar (9), lamp plate (1) upper portion left side is provided with micro motor (11), one side of micro motor (11) is provided with temperature sensor (12), and is a plurality of connect through stay cord (13) between heat dissipation boss (10), the left side end heat dissipation boss (10) are connected through stay cord (13) on the rolling disc of micro motor (11), the right side end heat dissipation boss (10) pass through elastic component (14) with baffle (5) are connected.
5. The semiconductor light emitting module with high heat dissipation performance as set forth in claim 4, wherein: the sliding rod (9) is provided with limiting blocks at intervals.
6. The semiconductor light emitting module with high heat dissipation performance as set forth in claim 4, wherein: the number of the heat dissipation reinforcing blocks (10) is consistent with that of the heat dissipation plates (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123250834.2U CN217004388U (en) | 2021-12-22 | 2021-12-22 | Semiconductor light-emitting module with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123250834.2U CN217004388U (en) | 2021-12-22 | 2021-12-22 | Semiconductor light-emitting module with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217004388U true CN217004388U (en) | 2022-07-19 |
Family
ID=82384776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123250834.2U Active CN217004388U (en) | 2021-12-22 | 2021-12-22 | Semiconductor light-emitting module with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217004388U (en) |
-
2021
- 2021-12-22 CN CN202123250834.2U patent/CN217004388U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208011607U (en) | A kind of LED automobile lamp of high-efficiency heat conduction | |
| CN210372939U (en) | Household LED illuminating lamp with lampshade for heat dissipation | |
| CN217004388U (en) | Semiconductor light-emitting module with high heat dissipation performance | |
| CN211399626U (en) | Car LED lamp that heat dispersion is good | |
| CN208634886U (en) | Light emitting diode with the heat dissipation of full structure | |
| CN215808376U (en) | Heat radiation structure of LED | |
| CN202216099U (en) | Large-power LED down lamp | |
| CN209782388U (en) | Down lamp capable of dissipating heat quickly | |
| CN210373125U (en) | Embedded LED type down lamp | |
| CN207471173U (en) | A kind of LED lamp of good heat dissipation effect | |
| CN207005763U (en) | LED with combination heat dissipation structure | |
| CN210319672U (en) | LED explosion-proof lamp | |
| CN216384108U (en) | High heat dissipation semiconductor lighting lamp | |
| CN215112351U (en) | LED street lamp with heat dissipation function | |
| CN214790784U (en) | Lamp convenient for heat dissipation | |
| CN210601275U (en) | High protection cold forging down lamp | |
| CN210891208U (en) | Pit wind LED lamp shell capable of efficiently dissipating heat | |
| CN221004994U (en) | Efficient heat dissipation lamp | |
| CN210035360U (en) | Heat dissipation car lamp | |
| CN214745048U (en) | LED lamp board that radiating efficiency is high | |
| CN210511544U (en) | Ceiling lamp base with high heat dissipation efficiency | |
| CN212691565U (en) | Novel LED projecting lamp | |
| CN217653824U (en) | LED down lamp convenient to heat dissipation | |
| CN220623971U (en) | Low-power consumption does not have stroboscopic response LED lamps and lanterns | |
| CN220707292U (en) | Street lamp with good heat dissipation effect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |