CN208548673U - A kind of heat dissipation bus duct - Google Patents
A kind of heat dissipation bus duct Download PDFInfo
- Publication number
- CN208548673U CN208548673U CN201821116860.1U CN201821116860U CN208548673U CN 208548673 U CN208548673 U CN 208548673U CN 201821116860 U CN201821116860 U CN 201821116860U CN 208548673 U CN208548673 U CN 208548673U
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- China
- Prior art keywords
- plate
- bus duct
- side plate
- heat dissipation
- cooling fin
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 238000001816 cooling Methods 0.000 claims abstract description 44
- 230000000694 effects Effects 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to field of electrical equipment, specifically a kind of heat dissipation bus duct.A kind of heat dissipation bus duct, including side plate and bottom plate, the bottom plate two sides are connect with side plate respectively, card slot is provided on the inner side and outer side of the side plate, top plate is connected between two card slots of the side plate interior sides, it is fixed with cooling fin in card slot on the outside of the side plate, there is mounting hole on cooling fin；Core is provided in the cavity that bottom plate, side plate and top plate surround, the outside of the core is coated with insulating sleeve, and the top and bottom of the insulating sleeve have thermally conductive film, the thermally conductive film connection top plate and bottom plate.This kind of bus duct has good heat dissipation effect, the fast effect of radiating rate.
Description
Technical field
The present invention relates to field of electrical equipment, specifically a kind of heat dissipation bus duct.
Background technique
Bus duct is a kind of closed metal device being made of copper, aluminium busbar column, is used to be each element of decentralized system
Distribute relatively high power.Indoors more and more instead of wire and cable in the power Transmission trunk project project of low pressure.It is female
Wire casing is developed by the U.S., new circuit mode that be referred to as " Bus-Way-System ", it is using copper or aluminium as leading
Body, with non-alkene insulating supporting, be then attached in metallic channel and the novel conductor that is formed.Japanese really practical application be
1954, bus duct was developed from then on.Nowadays build in high level, the electrical equipments such as factory, in electric system at not
The wiring mode that can lack.Due to building, factory etc. it is various building electric power needs, and it is this need year by year it is increased become
Gesture, using original circuit wiring pattern, i.e. poling mode, when construction, brings many difficulties, moreover, when to change distribution system
When, to make its become simple it is some be nearly impossible, however, if using bus duct, be very easy to reach
In addition purpose can also make building become more beautiful.For economic aspect, bus duct itself is compared with cable, price
It is some, but construction cost can be made just using bus duct compared with the various attachmentes comprising wiring and entire electric system
Cheaply mostly (looking at schematic diagram), especially current capacity it is big in the case where, such case is with regard to more obvious.
As modernization project facility is emerged in large numbers with what is equipped, the fast increasing of the electricity consumption of all trades and professions, especially numerous buildings
With the appearance in large-sized workshop workshop, the traditional cable as transmission pressure has been unable to meet requirement in high current transportation system,
The used in parallel of multiway cable brings inconvenience to in-site installation construction connection, and plug type bus duct is used as one kind is novel to match
Point conducting wire comes into being, and compared with traditional cable, its superiority is fully demonstrated in high current conveying, simultaneously because adopting
With new technology, new process, contact resistance and the temperature rise of the bus duct both ends junction and branching port splicing position that substantially reduce,
And the insulating materials of high quality has been used in bus duct, to improve the security reliability of bus duct.But for bus
For slot, good cooling effect is the important indicator for improving its service life and its service performance.
Summary of the invention
Problem to be solved by this invention is to overcome the deficiencies of the prior art and provide a kind of heat dissipation bus duct, this kind of bus
Slot has good heat dissipation effect, the fast effect of radiating rate.
The technical solution adopted by the present invention is that: a kind of heat dissipation bus duct, including side plate and bottom plate, the bottom plate two sides difference
It is connect with side plate, card slot is provided on the inner side and outer side of the side plate, is connected between two card slots of the side plate interior sides
There is top plate, cooling fin is fixed in the card slot on the outside of the side plate, there is mounting hole on cooling fin；In bottom plate, side plate and top plate
Core is provided in the cavity surrounded, the outside of the core is coated with insulating sleeve, the top and bottom of the insulating sleeve
With thermally conductive film, the thermally conductive film connection top plate and bottom plate.
Preferably, it is screwed between the card slot and top plate.
Preferably, the cooling fin bottom has several fins.
Preferably, it is screwed between the card slot and cooling fin.
Preferably, several heat release holes are provided on side plate.
Preferably, several grooves being recessed inwardly are provided on side plate and bottom plate.
The beneficial effects of the present invention are: it radiates in several ways, improves the radiating rate of bus duct, effectively extend it
Service life: 1, being arranged several grooves being recessed inwardly on side plate and bottom plate, can effectively increase heat dissipation area, improves heat dissipation speed
Degree；2, several heat release holes are set on side plate, by cross-ventilation, can in time be taken the heat in bus duct out of；3, in side
It is provided with cooling fin on plate, and fin is set in the bottom of cooling fin, substantially increases heat dissipation area, improves the heat dissipation of bus duct
Speed；4, thermally conductive film, thermally conductive film connecting bottom board and top plate are set on insulating sleeve, since core is main fever member
Part, after heat is spread on insulating sleeve by fuel factor, heat is smoothly transmitted to top from insulating sleeve by thermally conductive film
It on plate and bottom plate, and then is radiated again by top plate and bottom plate, therefore avoids and heat is locked in bottom plate, side plate and top plate
It in the cavity surrounded, is transmitted on bottom plate, side plate and top plate in time, makes the radiating rate of bus duct faster.
Card slot is provided on the inner side and outer side of side plate, and top plate and cooling fin are fixed on side plate by way of grafting
On, install it is more convenient, top plate and cooling fin be inserted intos in card slot, for guarantee be more firmly mounted, top plate with
Be respectively provided with mounting hole at the position that card slot is overlapped, at the position that cooling fin and card slot are overlapped, by screw by top plate and card slot, dissipate
Backing and card slot are fixed respectively.
Cooling fin is fixed in card slot on the outside of side plate, the bottom of cooling fin is provided with fin, and fin is vertical with cooling fin,
It can radiate to greatest extent.And cooling fin extends outwardly, and can also provide and block for the heat release hole on side plate, avoid rainwater
Deng intrusion, play the effect of waterproof.It is provided with mounting hole on cooling fin, when bus duct is installed, will can directly dissipate
Backing is fixed with equipment is connect, and to guarantee heat dissipation effect, directly cooling fin and a cooling device can also be fixed,
It is whole again that cooling fin, cooling device are installed along on wall or other positions.
Core is provided in the cavity that bottom plate, side plate and top plate surround, the outside of the core is coated with insulating sleeve, institute
The top and bottom for stating insulating sleeve have thermally conductive film, the thermally conductive film connection top plate and bottom plate.In general, bus duct
The interior multiple cores of setting, core give off heat when working, and insulating sleeve fever, heat is transmitted to top plate and bottom along thermally conductive film
Plate, so that the transmission of heat is carried out on side plate.It, can directly will be in bus duct by the way that thermally conductive film is arranged on insulating sleeve
In the heat transfer of core to bus duct shell, the heat for the core in the prior art of comparing slowly is transmitted to by medium of air
On bus duct shell, speed is faster.
Several heat release holes are set on side plate, can directly be dissipated the heat to the air, to guarantee heat dissipation to greatest extent
Speed, the position of heat release hole is corresponding relatively good on two opposite side plates.
Several grooves being recessed inwardly are provided on side plate and bottom plate, the structure that plate face indent is stretched out again can increase
Heat dissipation area improves radiating rate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the invention；
Fig. 2 is the diagrammatic cross-section in Fig. 1 along line A-A；
Fig. 3 is the structural schematic diagram of second embodiment of the invention.
Wherein appended drawing reference is as follows:
1, side plate；2, bottom plate；3, card slot；4, top plate；5, cooling fin；6, mounting hole；7, core；8, insulating sleeve；9, it leads
Hot glue piece；10, fin；11, heat release hole；12, groove；13, heat-dissipating pipe.
Specific embodiment
The present invention is described further with reference to the accompanying drawing:
Embodiment 1: such as Fig. 1,2, a kind of heat dissipation bus duct, including side plate 1 and bottom plate 2,2 two sides of bottom plate respectively with side
Plate 1 connects, and card slot 3 is provided on the inner side and outer side of the side plate 1, is connected between two card slots 3 of 1 inside of side plate
There is top plate 4, is fixed with cooling fin 5 in the card slot 3 in 1 outside of side plate, there is mounting hole 6 on cooling fin 5；In bottom plate 2, side plate
1 and the cavity that surrounds of top plate 4 in be provided with core 7, the outside of the core 7 is coated with insulating sleeve 8, the insulating sleeve 8
Top and bottom there is thermally conductive film 9, the thermally conductive film 9 connects top plate 4 and bottom plate 2.
It is screwed between card slot 3 and top plate 4,5 bottom of cooling fin has several fins 10, the card slot 3 and dissipates
It is screwed between backing 5.
It is provided with several heat release holes 11 on side plate 1, several grooves being recessed inwardly are provided on side plate 1 and bottom plate 2
12。
The beneficial effects of the present invention are: it radiates in several ways, improves the radiating rate of bus duct, effectively extend it
Service life: 1, being arranged several grooves 12 being recessed inwardly on side plate 1 and bottom plate 2, can effectively increase heat dissipation area, improves and dissipates
Thermal velocity；2, several heat release holes 11 are set on side plate 1, by cross-ventilation, can in time be taken the heat in bus duct out of；
3, it is provided with cooling fin 5 on side plate 1, and fin 10 is set in the bottom of cooling fin 5, substantially increases heat dissipation area, improves
The radiating rate of bus duct；4, thermally conductive film 9, thermally conductive 9 connecting bottom board 2 of film and top plate 4 are set on insulating sleeve 8, due to
Core 7 is main heater element, and after heat is spread on insulating sleeve 8 by fuel factor, thermally conductive film 9 is smooth by heat
Slave insulating sleeve 8 be transmitted on top plate 4 and bottom plate 2, and then radiated again by top plate 4 and bottom plate 2, thus avoid by
Heat is locked in the cavity that bottom plate 2, side plate 1 and top plate 4 surround, and is transmitted on bottom plate 2, side plate 1 and top plate 4 in time, is made mother
The radiating rate of wire casing is faster.
Card slot 3 is provided on the inner side and outer side of side plate 1, and top plate 4 and cooling fin 5 are fixed on by way of grafting
On side plate 1, it is more convenient to install, and top plate 4 and cooling fin 5 are inserted into card slot 3, to guarantee to be more firmly mounted,
It is respectively provided with mounting hole 6 at the position that top plate 4 and card slot 3 are overlapped, at the position that cooling fin 5 and card slot 3 are overlapped, it will by screw
Top plate 4 and card slot 3, cooling fin 5 and card slot 3 are fixed respectively.
It is fixed with cooling fin 5 in the card slot 3 in the outside of side plate 1, the bottom of cooling fin 5 is provided with fin 10, fin 10 and dissipates
Backing 5 is vertical, can radiate to greatest extent.And cooling fin 5 extends outwardly, and can also mention for the heat release hole 11 on side plate 1
For blocking, the intrusion of rainwater etc. is avoided, the effect of waterproof is played.Mounting hole 6 is provided on cooling fin 5, when bus duct is pacified
When dress, directly cooling fin 5 can be fixed with equipment is connect, for guarantee heat dissipation effect, can also directly by cooling fin 5 with
One cooling device is fixed, then cooling fin 5, cooling device are installed along on wall or other positions by entirety.
Core 7 is provided in the cavity that bottom plate 2, side plate 1 and top plate 4 surround, the outside of the core 7 is coated with insulation sleeve
Pipe 8, the top and bottom of the insulating sleeve 8 have thermally conductive film 9, and the thermally conductive film 9 connects top plate 4 and bottom plate 2.Generally
For, the multiple cores 7 of setting in bus duct, core 7 gives off heat when working, and insulating sleeve 8 generates heat, and heat is along thermally conductive film
9 are transmitted to top plate 4 and bottom plate 2, so that the transmission of heat is carried out on side plate 1.By the way that thermally conductive film is arranged on insulating sleeve 8
9, it can be directly by the heat for the core 7 in the prior art of in the heat transfer of core 7 in bus duct to bus duct shell, comparing
It is slowly transmitted on bus duct shell by medium of air, speed is faster.
Several heat release holes 11 are set on side plate 1, can directly be dissipated the heat to the air, to guarantee to dissipate to greatest extent
Thermal velocity, the position of heat release hole 11 is corresponding relatively good on two opposite side plates 1.
It is provided with several grooves 12 being recessed inwardly on side plate 1 and bottom plate 2, the structure that plate face indent is stretched out again can be with
Increase heat dissipation area, improves radiating rate.
Embodiment 2: such as Fig. 1,3, it is clear that, it, can also be in the groove of 2 bottom of bottom plate in order to further increase heat dissipation effect
Heat-dissipating pipe 13 is set at 12, fills refrigerant (such as water) in heat-dissipating pipe 13, the both ends of heat-dissipating pipe 13 be separately connected intake chamber and
Water pump is arranged in effluent trough at intake chamber, guarantees that heat-dissipating pipe 13 can suck cold water, and cold water can be transported in heat-dissipating pipe 13
It is dynamic.Obvious, after heat-dissipating pipe 13 are arranged in the bottom of bottom plate 2, structure is relative complex, and the sucking to heat-dissipating pipe 13 is needed to fill
It sets and carries out power supply connection.The specific structure of the part has example due in the prior art referring to various water pumps more, therefore herein not
It repeats.
The above is only presently preferred embodiments of the present invention, are not that the invention has other forms of limitations.It is any ripe
Know the equivalent reality that professional and technical personnel was changed or be modified as equivalent variations possibly also with the technology contents of the disclosure above
Apply example.But without departing from the technical solutions of the present invention, according to the present invention construction and working principle are to above embodiments
Made any simple modification, equivalent variations and remodeling, still fall within the protection scope of technical solution of the present invention.
Claims (6)
1. a kind of heat dissipation bus duct, including side plate and bottom plate, the bottom plate two sides are connect with side plate respectively, it is characterised in that: institute
It states and is provided with card slot on the inner side and outer side of side plate, be connected with top plate, the side between two card slots of the side plate interior sides
It is fixed with cooling fin in card slot on the outside of plate, there is mounting hole on cooling fin；It is set in the cavity that bottom plate, side plate and top plate surround
It is equipped with core, the outside of the core is coated with insulating sleeve, and the top and bottom of the insulating sleeve have thermally conductive film, institute
State thermally conductive film connection top plate and bottom plate.
2. a kind of heat dissipation bus duct according to claim 1, it is characterised in that: pass through screw between the card slot and top plate
It is fixed.
3. a kind of heat dissipation bus duct according to claim 2, it is characterised in that: the cooling fin bottom has several wings
Piece.
4. a kind of heat dissipation bus duct according to claim 1 or 3, it is characterised in that: lead between the card slot and cooling fin
Screw is crossed to fix.
5. a kind of heat dissipation bus duct according to claim 4, it is characterised in that: be provided with several heat release holes on side plate.
6. a kind of heat dissipation bus duct according to claim 5, it is characterised in that: be provided on side plate and bottom plate it is several to
The groove of sunken inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821116860.1U CN208548673U (en) | 2018-07-16 | 2018-07-16 | A kind of heat dissipation bus duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821116860.1U CN208548673U (en) | 2018-07-16 | 2018-07-16 | A kind of heat dissipation bus duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208548673U true CN208548673U (en) | 2019-02-26 |
Family
ID=65424697
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821116860.1U Expired - Fee Related CN208548673U (en) | 2018-07-16 | 2018-07-16 | A kind of heat dissipation bus duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208548673U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108808601A (en) * | 2018-07-16 | 2018-11-13 | 向荣集团有限公司 | A kind of heat dissipation bus duct |
-
2018
- 2018-07-16 CN CN201821116860.1U patent/CN208548673U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108808601A (en) * | 2018-07-16 | 2018-11-13 | 向荣集团有限公司 | A kind of heat dissipation bus duct |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190226 |