CN205356936U - Box heat radiation structure and emergency command case - Google Patents
Box heat radiation structure and emergency command case Download PDFInfo
- Publication number
- CN205356936U CN205356936U CN201620065226.4U CN201620065226U CN205356936U CN 205356936 U CN205356936 U CN 205356936U CN 201620065226 U CN201620065226 U CN 201620065226U CN 205356936 U CN205356936 U CN 205356936U
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- heat
- conducting layer
- box
- pcb
- casing
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- 230000005855 radiation Effects 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000005439 thermosphere Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 21
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 244000052769 pathogen Species 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
Abstract
The utility model discloses a box heat radiation structure, including box and function components and parts, its characterized in that, first heat -conducting layer has been laid to the box inner wall, be fixed with the installing support on the first heat -conducting layer, be fixed with PCB circuit board on the installing support, the function components and parts are laid on PCB circuit board. The utility model discloses a lay heat dissipation layer at the box internal surface, the endotherm area of increase box internal surface because the inside heat of box can be absorbed fast in the heat dissipation layer, makes the temperature of self rise fast, because the heat dissipation layer is hugged closely together with the box inner wall, can form great temperature difference between heat dissipation layer and box again, can know according to the heat -conduction principle that the temperature difference that carries on between two heat conducting objects is big more, and the heat -conduction speed between the two will be faster. Consequently, the box surface can be passed to with the heat fast in heat dissipation layer, then in passing to the air with the heat to realize quick radiating effect.
Description
Technical field
This utility model relates to a kind of radiator structure, particularly relates to a kind of box radiating structure.
Background technology
Traditional electronic product radiating form has air-cooled, water-cooled and semiconductor-type.Wherein air-cooled be most widely used general be also the most ripe, please be less costly, single shortcoming runs seasonal epidemic pathogens stream when being run can produce eddy current; casing has shadow effect; taking volume big, select region to need to protect at fan, when rotation speed of the fan is big, noise also can be very big.By the impact of fin material, shape, surface area and radiator fan etc., even if using the material that the heat conductivilitys such as copper are good, it still can not meet the cooling requirements of modern high heat flux.Although water-cooled effect is satisfactory, but the complexity of system, potential safety hazard and fancy price allow again people keep someone at a respectful distance.Semiconductor-type can realize accurate temperature control cooling, and reliability is high, and work does not produce noise, but the operating temperature that can bear is too low, and it also requires external power supply, improper in industrial environment use.Fan-free heat sink conception by contrast with low cost, save the many advantages such as space, noiselessness and make it use under severe rugged environment to be possibly realized.
Difference according to concrete application scenarios in prior art, can select different radiator structures to adapt to different application scene.Emergency electronic case is that electronic devices and components are put into portability casing, and the one used in urgent or field situation should acute equipment.Due to emergent box house limited space, therefore complex water-cooled power converter cannot be used.Air-cooled radiating device can produce noise in radiation processes, and work process can cause casing shake, adopting air-cooled radiating device to need to offer the space of supplied gas flowing on casing, thus casing cannot be made sealing structure, the emergent casing of impact is for the subject range of environment.Adopting semiconductor heat dissipation device to there is also bigger problem as the thermal component of emergency box, semiconductor heat-dissipating structure self is higher for the requirement of working environment first, and limiting emergent casing cannot be operated under hot environment again；Its two semiconductor heat dissipation device needs to insert power supply and could work, but the power supply capacity in emergency box body is limited, the flying power of emergency box certainly will be caused to reduce if being used for a part of electricity dispelling the heat, losing more than gain.And adopt conduction of heat to dispel the heat, really inefficiency again.
Utility model content
This utility model, mainly solving the technical problems that provide a kind of box radiating structure, by laying heat-conducting layer on cabinet wall, increases the heat transfer area of interior, improves heat conduction efficiency.
For solving above-mentioned technical problem, the technical scheme that this utility model adopts is: provide a kind of box radiating structure, including casing and Functional Unit device, described cabinet wall is equipped with the first heat-conducting layer, described first heat-conducting layer is fixed with mounting bracket, being fixed with PCB in described mounting bracket, described Functional Unit device is laid in PCB.
Further, being filled with the second heat-conducting layer between described first heat-conducting layer and casing, described second heat-conducting layer realizes seamless conduction of heat between the first heat-conducting layer and casing.
Further, being provided with the 3rd heat-conducting layer between described PCB and the first heat-conducting layer, described 3rd heat-conducting layer side is positioned at above the first heat-conducting layer, and opposite side is near PCB.
Further, being equipped with the 4th heat-conducting layer between described 3rd heat-conducting layer and the first heat-conducting layer, the cross-sectional area of described 4th heat-conducting layer and the 3rd heat-conducting layer is consistent.
Further, being provided with the 5th heat-conducting layer between described PCB and the 3rd heat-conducting layer, described 5th heat-conducting layer is discontinuous to be distributed between PCB and the 3rd heat-conducting layer.
Further, the pin of Functional Unit device or the Functional Unit device being arranged in PCB is close in the side of described 5th heat-conducting layer.
Further, described first heat-conducting layer and the 3rd heat-conducting layer are metal guide thermosphere.
Further, described second heat-conducting layer, the 4th heat-conducting layer and the 5th heat-conducting layer are heat conductive pad.
Further, described cabinet exterior is provided with projection, and described projection forms the space that air easily circulates with casing between the face that casing contacts.
Also providing for a kind of emergency command case for solving above-mentioned technical problem this utility model, the heat radiation structure design of described emergency command case becomes above-mentioned box radiating structure.
The beneficial effects of the utility model are: this utility model is by laying heat dissipating layer in interior, increase the endotherm area of interior, owing to heat dissipating layer can quickly absorb the heat of box house, make the temperature rapid increase of self, again owing to heat dissipating layer and cabinet wall are close together, bigger temperature difference can be formed between heat dissipating layer and casing, according to heat-conduction principle, carrying out the temperature difference between two objects of conduction of heat more big, thermal conduction rate therebetween will be faster.Therefore, heat can quickly be passed to tank surface by heat dissipating layer, is then passed in air by heat, thus realizing the effect of quick heat radiating.
Accompanying drawing explanation
Fig. 1 is this utility model casing cross section view；
Fig. 2 is this utility model emergency command box structure schematic diagram.
Description of reference numerals: 1, casing；11, the first heat-conducting layer；12, the second heat-conducting layer；13, the 3rd heat-conducting layer；14, the 4th heat-conducting layer；15, the 5th heat-conducting layer；2, PCB；21, copper post；3, emergency command case.
Detailed description of the invention
For the ease of understanding this utility model, below in conjunction with the drawings and specific embodiments, this utility model is described in detail.It should be noted that be expressed " being fixed on " another element when element, it can directly on another element or can there is one or more element placed in the middle therebetween.When an element is expressed " connection " another element, it can be directly to another element or can there is one or more element placed in the middle therebetween.Term " vertical ", " level ", "left", "right" and similar statement that this specification uses are for illustrative purposes only.
Unless otherwise defined, all of technology that this specification uses and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model are generally understood that.This specification is intended merely at term used in the description of the present utility model the purpose describing specific embodiment, is not intended to restriction this utility model.The term "and/or" that this specification uses includes the arbitrary and all of combination of one or more relevant Listed Items.
Below in conjunction with drawings and embodiments, this utility model is described in detail.
Embodiment 1
Refer to Fig. 1, a kind of casing 1 radiator structure, including casing 1 and Functional Unit device (not shown), casing 1 inwall is equipped with the first heat-conducting layer 11, first heat-conducting layer 11 is fixed with mounting bracket, being fixed with PCB 2 in mounting bracket, Functional Unit device is laid in PCB 2.Specifically, the first heat-conducting layer 11 is identical with casing 1 inner wall shape, and is attached on casing 1 inwall.First heat-conducting layer 11 is made up of the good metal material of heat-conductive characteristic, composition material according to different application scenarios the first heat-conducting layers 11 is including but not limited to: the alloy of silver, copper, aluminum or above-mentioned metal material, wherein alloy refers to silver alloy, copper alloy or aluminium alloy.
Wherein, Functional Unit device is mounted in casing 1 inside, it is possible to realize the Electrical and Electronic components and parts of difference in functionality.Being directed to the functional components and parts of the present invention is be arranged on the heating original paper within casing 1.According to the difference realizing function, it is arranged on the Functional Unit device within casing 1 also different, substantially can be divided into following a few major part (but be not limited to this, the difference according to realizing function can also have other devices): battery, such as rechargeable battery；Central processing unit (CPU)；Information transceiving device, such as antenna；Voice components and parts, such as mike and microphone；Electric tool, such as electric saw, electric drill；Display device, such as LCDs, LED display or LCD display；Peripheral hardware controls element, such as keyboard, mouse.According to the difference realizing function, carry one or more above-mentioned functional components and parts in casing 1, it is achieved different functions.
Wherein, part functionalities components and parts are arranged on the support within casing 1, support includes: copper post 21, many arrangements in regular shape with copper post 21, as 4 copper posts 21 be arranged into rectangle, the arrangement of 6 copper posts 21 is hexagon (being not limited to, be required to arrangement for any regular shape according to difference).Copper post 21 one end is fixed by screws on the first heat-conducting layer 11 bottom casing 1, and other end carrying PCB 2, PCB 2 is fixed on copper post 21 also by screw.PCB 2 is etched with functional circuit, after being laid in PCB 2 by different functionalities components and parts according to functional circuit, it is achieved the carrier of complete circuit function.
In some embodiments, being filled with the second heat-conducting layer 12 between the first heat-conducting layer 11 and casing 1 inwall, the second heat-conducting layer 12 realizes seamless conduction of heat between the first heat-conducting layer 11 and casing 1.Owing to the first heat-conducting layer 11 is made up of metal, although the first heat-conducting layer 11 shape is identical with the shape of casing 1 inwall, but it is difficult to accomplish that a kind of metallic article can be seamless applying with casing 1.Certainly exist airspace between first heat-conducting layer 11 local location and casing 1, owing to air is not the good conductor of heat, therefore there is airspace and the heat transference efficiency between the first heat-conducting layer 11 and casing 1 can be made to reduce.For solving the airspace existed between the first heat-conducting layer 11 and casing 1, present embodiment is filled with the second heat-conducting layer 12 between the first heat-conducting layer 11 and casing 1 inwall, and the second heat-conducting layer 12 is the heat conductive pad that quality is soft.
Heat conductive pad is that Heat Conduction Material is filled in high-performance gap, is mainly used in the transmission interface between electronic equipment and fin or product casing.There is good viscosity, flexibility, good compression performance and there is excellent pyroconductivity.Making it that the air between electronic original part and fin in use can be made completely to discharge, to reach contact fully, radiating effect substantially increases.Heat conductive pad is that silica gel product has good insulating properties.
In some embodiments, being provided with the 3rd heat-conducting layer 13 between PCB 2 and the first heat-conducting layer 11, the 3rd heat-conducting layer 13 side is positioned at above the first heat-conducting layer 11, and opposite side is near PCB 2.It is connected by copper post 21 between first heat-conducting layer 11 and PCB 2, therefore define not attaching space between the first heat-conducting layer 11 and PCB, attaching space is not occupied by air, it it not the good conductor of heat due to air, and know according to gas flow principles, hot-air rising cold air declines, so the heat that functional components and parts produce in PCB 2 to pass to needs the longer time on the first heat-conducting layer 11, and major part heat can be gathered in above PCB, heat is made to be difficult to quickly pass on the first heat-conducting layer 11.Arranging the 3rd heat-conducting layer 13 for this between the first heat-conducting layer 11 and PCB 2, the 3rd heat-conducting layer 13 is made up of the good metal of heat conductivility, therefore the 3rd heat-conducting layer 13 opposite side near pcb board but does not contact (conduction) with PCB 2.Composition material according to different application scenarios the 3rd heat-conducting layers 13 is including but not limited to: the alloy of silver, copper, aluminum or above-mentioned metal material, wherein alloy refers to silver alloy, copper alloy or aluminium alloy.
In some embodiments, being equipped with the 4th heat-conducting layer 14 between the 3rd heat-conducting layer 13 and the first heat-conducting layer 11, the 4th heat-conducting layer 14 is consistent with the cross-sectional area of the 3rd heat-conducting layer 13.First heat-conducting layer 11 and the 3rd heat-conducting layer 13 are metal guide thermosphere, can not completely fit and there is the air gap in its contact surface, the air gap makes the heat conduction efficiency between heat-conducting layer reduce, between the 3rd heat-conducting layer 13 and the first heat-conducting layer 11, it is equipped with the 4th heat-conducting layer 14 for this, 4th heat-conducting layer 14 is the heat conductive pad that quality is soft, and the cross-sectional area of the cross-sectional area of the 4th heat-conducting layer 14 and the 3rd heat-conducting layer 13 is consistent.
In something real mode, being provided with the 5th heat-conducting layer 15 between PCB 2 and the 3rd heat-conducting layer 13, the 5th heat-conducting layer 15 is discontinuous to be distributed between PCB 2 and the 3rd heat-conducting layer 13.Owing to the 3rd heat-conducting layer 13 is metallic article, can not directly directly contact with the functional components and parts in PCB 2, but do not contact and the heat conduction efficiency between PCB 2 and the 3rd heat-conducting layer 13 can be affected, therefore it is provided with the 5th heat-conducting layer 15 between PCB 2 and the 3rd heat-conducting layer 13,4th heat-conducting layer 14 is the heat conductive pad that quality is soft, and heat conductive pad is silica gel product is a kind of insulated product.PCB 2 entirety is not generated heat, only it is arranged in the functional components and parts heating in PCB 2, therefore the 5th heat-conducting layer 15 is discontinuously arranged and separate conducting strip, the functional components and parts below PCB 2 are close to by conducting strip, and are arranged on the pin of functional components and parts above PCB 2.
In some embodiments, casing 1 outer wall is provided with projection, the protruding space that formation air easily circulates between the face that casing 1 contacts with casing 1.When being placed on bottom casing 1 on desktop or other carriers, the heat bottom casing 1 cannot be diffused in air in time, causes and heats up bottom casing 1, and casing 1 conductive structure heat conduction efficiency reduces.For this, be provided with projection on casing 1 surface, convex shape is including but not limited to: graininess, spherical or strip.Space between projection and projection becomes the space easily circulated for air, is diffused rapidly in air by the heat bottom casing 1.
Embodiment 2
Referring to Fig. 2, a kind of emergency command case 3, described emergency command case 3 cabinet design becomes the box radiating structure described in embodiment 1.
It should be noted that, description of the present utility model and accompanying drawing thereof give preferably embodiment of the present utility model, but, this utility model can be realized by many different forms, it is not limited to the embodiment described by this specification, these embodiments are not as the extra restriction to this utility model content, it is provided that the purpose of these embodiments is to make the understanding to disclosure of the present utility model more thorough comprehensively.Further, above-mentioned each technical characteristic continues to be mutually combined, and forms various embodiments not enumerated above, is accordingly to be regarded as the scope that this utility model description is recorded；Further, for those of ordinary skills, it is possible to improved according to the above description or convert, and all these improve and conversion all should belong to the protection domain of this utility model claims.
Claims (10)
1. a box radiating structure, including casing and Functional Unit device, it is characterised in that, described cabinet wall is equipped with the first heat-conducting layer, being fixed with mounting bracket on described first heat-conducting layer, described mounting bracket is fixed with PCB, described Functional Unit device is laid in PCB.
2. box radiating structure according to claim 1, it is characterised in that being filled with the second heat-conducting layer between described first heat-conducting layer and casing, described second heat-conducting layer realizes seamless conduction of heat between the first heat-conducting layer and casing.
3. box radiating structure according to claim 2, it is characterised in that being provided with the 3rd heat-conducting layer between described PCB and the first heat-conducting layer, described 3rd heat-conducting layer side is positioned at above the first heat-conducting layer, and opposite side is near PCB.
4. box radiating structure according to claim 3, it is characterised in that being equipped with the 4th heat-conducting layer between described 3rd heat-conducting layer and the first heat-conducting layer, the cross-sectional area of described 4th heat-conducting layer and the 3rd heat-conducting layer is consistent.
5. box radiating structure according to claim 4, it is characterised in that being provided with the 5th heat-conducting layer between described PCB and the 3rd heat-conducting layer, described 5th heat-conducting layer is discontinuous to be distributed between PCB and the 3rd heat-conducting layer.
6. box radiating structure according to claim 5, it is characterised in that the pin of Functional Unit device or the Functional Unit device being arranged in PCB is close in the side of described 5th heat-conducting layer.
7. box radiating structure according to claim 6, it is characterised in that described first heat-conducting layer and the 3rd heat-conducting layer are metal guide thermosphere.
8. box radiating structure according to claim 7, it is characterised in that described second heat-conducting layer, the 4th heat-conducting layer and the 5th heat-conducting layer are heat conductive pad.
9. box radiating structure according to claim 1～8 any one, it is characterised in that described cabinet exterior is provided with projection, described projection forms the space that air easily circulates with casing between the face that casing contacts.
10. an emergency command case, it is characterised in that described emergency command box body is designed to the box radiating structure described in claim 1～9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620065226.4U CN205356936U (en) | 2016-01-22 | 2016-01-22 | Box heat radiation structure and emergency command case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620065226.4U CN205356936U (en) | 2016-01-22 | 2016-01-22 | Box heat radiation structure and emergency command case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205356936U true CN205356936U (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620065226.4U Active CN205356936U (en) | 2016-01-22 | 2016-01-22 | Box heat radiation structure and emergency command case |
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| Country | Link |
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| CN (1) | CN205356936U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509363A (en) * | 2017-08-16 | 2017-12-22 | 珠海格力电器股份有限公司 | A kind of heat abstractor and its control method, storage medium and terminal |
-
2016
- 2016-01-22 CN CN201620065226.4U patent/CN205356936U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509363A (en) * | 2017-08-16 | 2017-12-22 | 珠海格力电器股份有限公司 | A kind of heat abstractor and its control method, storage medium and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170907 Address after: 518052 Guangdong city of Shenzhen province Nanshan District Guangdong streets south road seven Shenzhen Software Park building 406 T3 Patentee after: Shenzhen City Star Network Communication Technology Co.,Ltd. Address before: 518131 Guangdong city of Shenzhen province Longhua new city streets Hyphalosaurus Xinmao garden B District 2 Building 1 unit 13E Patentee before: SHENZHEN HUASEALTEK TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 Building A, Hongrongyuan North Station Center, Minzhi Street North Station Community, Longhua District, Shenzhen City, Guangdong Province, China, 2002-2005, 2007-2011 Patentee after: Shenzhen Star Network Communication Technology Co.,Ltd. Country or region after: China Address before: 518052 406, Building T3, Shenzhen Software Park, Gaoxin South 7th Road, Yuehai Street, Nanshan District, Shenzhen, Guangdong Province Patentee before: Shenzhen City Star Network Communication Technology Co.,Ltd. Country or region before: China |