CN204005849U - The integrated module of a kind of LED integrated form - Google Patents
The integrated module of a kind of LED integrated form Download PDFInfo
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- CN204005849U CN204005849U CN201420358999.2U CN201420358999U CN204005849U CN 204005849 U CN204005849 U CN 204005849U CN 201420358999 U CN201420358999 U CN 201420358999U CN 204005849 U CN204005849 U CN 204005849U
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- thermal insulation
- insulation layer
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- radiator
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Abstract
The utility model relates to the integrated module of a kind of LED integrated form, comprises conductive metal layer, thermal insulation layer and radiator, and described thermal insulation layer is by extruding or laminating at radiator upper surface, and described conductive metal layer overlays on the upper surface of thermal insulation layer.The beneficial effects of the utility model are: this utility model has substituted with radiator the aluminium base that traditional LED light fixture needs, the utility model directly pushes and laminating thermal insulation layer in spreader surface, on thermal insulation layer, directly push and laminating conductive metal layer, make the utility model simple in structure, reduced production cost, because radiator is directly with thermal insulation layer contact, good heat conduction effect, excellent heat dissipation performance.
Description
Technical field
The utility model relates to a kind of LED module, particularly the integrated module of a kind of LED integrated form.
Background technology
The existing LED light fixture with radiator, on its aluminium base, there is successively thermal insulation layer, copper foil layer, anticorrosive coat, under its aluminium base, by heat-conducting silicone grease, be connected with radiator, the surface contacting with aluminium base due to radiator all cannot be polished to very smooth, even if the contact-making surface of radiator and substrate has heat-conducting silicone grease, heat-conducting silicone grease also cannot floating radiator and the concave point of substrate contacts face, therefore cause radiator can not contact completely with substrate contacts face, between aluminium base and radiator, there is the air gap, cause radiating effect poor, simultaneously, silicone grease heat conduction heat conductivility is not as good as metal itself, and it is also high to relate to formation aluminium base multilayer cost of manufacture.
Utility model content
Goal of the invention of the present utility model is: the problem existing for prior art, provides the better LED integrated form of a kind of heat dispersion integrated module.
To achieve these goals, the technical solution adopted in the utility model is:
The integrated module of LED integrated form, comprises conductive metal layer, thermal insulation layer and radiator, and described thermal insulation layer is by extruding or laminating at radiator upper surface, and described conductive metal layer overlays on the upper surface of thermal insulation layer.
As preferred version of the present utility model, described conductive metal layer is copper foil layer or silver foil layer.
As preferred version of the present utility model, described conductive metal layer is by extruding or laminatingly have an anticorrosive coat.
As preferred version of the present utility model, the length of single module is 6 meters, for the environment for use different, cuts the applicable module of size as required install from module.
In sum, owing to having adopted technique scheme, the beneficial effects of the utility model are: this utility model has substituted with radiator the aluminium base that traditional LED light fixture needs, the utility model directly pushes and laminating thermal insulation layer in spreader surface, on thermal insulation layer, directly pushes and laminating conductive metal layer, makes the utility model simple in structure, reduced production cost, because radiator is directly with thermal insulation layer contact, good heat conduction effect, excellent heat dissipation performance.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the A-A cutaway view of Fig. 1.
Mark in figure: 1-conductive metal layer, 2-thermal insulation layer, 3-radiator.
The specific embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail.
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
embodiment 1:the integrated module of LED integrated form, comprises conductive metal layer 1, thermal insulation layer 2 and radiator 3, and described thermal insulation layer 2 is by extruding or laminating at radiator 3 upper surfaces, the laminating upper surface at thermal insulation layer 2 of described conductive metal layer 1.Described conductive metal layer 1 is copper foil layer or silver foil layer or other conductive metallic material.Described thermal insulation layer 2 is ceramics polymer layer or polymer material layer or other insulating heat-conduction material.The length of single module (each module) is 6 meters or cuts applicable big or small module according to required environment.Described conductive metal layer 1 is by extruding or laminatingly have an anticorrosive coat.At module upper epidermis, arrange anticorrosive coat, according to required environment, cut applicable big or small module, then on copper foil layer and anticorrosive coat, arrange LED lamp.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (5)
1. the integrated module of LED integrated form, it is characterized in that, comprise conductive metal layer (1), thermal insulation layer (2) and radiator (3), described thermal insulation layer (2) is by extruding or laminating at radiator (3) upper surface, and described conductive metal layer (1) is by extruding or the laminating upper surface in thermal insulation layer (2).
2. the integrated module of a kind of LED integrated form according to claim 1, is characterized in that, described conductive metal layer (1) is copper foil layer or silver foil layer.
3. the integrated module of a kind of LED integrated form according to claim 1, is characterized in that, described thermal insulation layer (2) is ceramics polymer layer or polymer material layer.
4. the integrated module of a kind of LED integrated form according to claim 1, is characterized in that, the length of single module is 6 meters.
5. the integrated module of a kind of LED integrated form according to claim 1, is characterized in that, described conductive metal layer (1) is by extruding or laminatingly have an anticorrosive coat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420358999.2U CN204005849U (en) | 2014-07-01 | 2014-07-01 | The integrated module of a kind of LED integrated form |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420358999.2U CN204005849U (en) | 2014-07-01 | 2014-07-01 | The integrated module of a kind of LED integrated form |
Publications (1)
Publication Number | Publication Date |
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CN204005849U true CN204005849U (en) | 2014-12-10 |
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Family Applications (1)
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CN201420358999.2U Expired - Fee Related CN204005849U (en) | 2014-07-01 | 2014-07-01 | The integrated module of a kind of LED integrated form |
Country Status (1)
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CN (1) | CN204005849U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104791734A (en) * | 2015-04-21 | 2015-07-22 | 乐健科技(珠海)有限公司 | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof |
-
2014
- 2014-07-01 CN CN201420358999.2U patent/CN204005849U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104791734A (en) * | 2015-04-21 | 2015-07-22 | 乐健科技(珠海)有限公司 | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20170701 |
|
CF01 | Termination of patent right due to non-payment of annual fee |