CN208369929U

CN208369929U - A kind of aluminum substrate wiring board

Info

Publication number: CN208369929U
Application number: CN201820125157.0U
Authority: CN
Inventors: 涓ユ旦; 严浩
Original assignee: Boluo Delong Electronics Co Ltd
Current assignee: Boluo Delong Electronics Co Ltd
Priority date: 2018-01-24
Filing date: 2018-01-24
Publication date: 2019-01-11
Anticipated expiration: 2028-01-24

Abstract

The utility model discloses a kind of aluminum substrate wiring boards, including copper foil layer, it is installed in the insulating layer of the copper foil layer lower part, it is installed in the metal substrate of the insulating layer lower part, it is installed in the thermal interface material layer of the metal substrate lower part, it is installed in the radiator of the thermal interface material layer lower part, the metal substrate opens up out a plurality of cross one another convex stupefied, the intersection it is convex it is stupefied between form pit, the metal substrate includes symmetrical left region and right region, left region includes substrate first part, substrate second part and substrate Part III, the substrate first part forms the triangular depression that several angles are θ 1, the substrate second part forms the semicircle pit that several radiuses are R, the aluminum substrate wiring board can quickly minimize thermal resistance, with excellent thermal conductivity, good mechanical property, meet RoH S requirement, is adapted to SMT technique, can carry out extremely effective processing, good reliability to thermal diffusion in circuit design.

Description

A kind of aluminum substrate wiring board

Technical field

The utility model relates to technical field of electrical equipment more particularly to a kind of aluminum substrate wiring boards.

Background technique

Existing traditional aluminum substrate can minimize thermal resistance, have very poor heat-conductive characteristic, bad mechanical property, In addition, there are also following unique advantages for aluminum substrate, RoHs requirement is not met, SMT technique is not suitable for, in circuit design Extremely effective processing can not be carried out to thermal diffusion, module running temperature is difficult to reduce in time, and service life is short, power density Low, the assembly volume of poor reliability, radiating element and other hardware is big, and hardware and assembly cost are high, can not by power circuit with Control circuit carries out optimal combination.

Therefore, those skilled in the art have been devoted to research and develop it is a kind of quickly thermal resistance can be minimized, have excellent Thermal conductivity, good mechanical property, meet RoHs requirement, be adapted to SMT technique, can be to thermal diffusion in circuit design Extremely effective processing is carried out, module running temperature can reduce in time, long service life, and power density is high, the aluminium of good reliability Base plate line plate.

Utility model content

The technical problem to be solved by the present invention is to provide a kind of aluminum substrate wiring boards, which can be quickly Thermal resistance is minimized, there is excellent thermal conductivity, good mechanical property meets RoHs requirement, SMT technique is adapted to, in electricity Extremely effective processing can be carried out to thermal diffusion in the design scheme of road, module running temperature can reduce in time, long service life, function Rate density is high, good reliability.

In order to solve the above technical problems, a kind of aluminum substrate wiring board provided by the utility model, including copper foil layer, it is installed in The insulating layer of copper foil layer assembly lower part, is installed in the metal substrate at the metal substrate for being installed in the insulating layer lower part The thermal interface material layer of lower part, the radiator for being installed in the thermal interface material layer lower part, the metal substrate opens up out a plurality of It is cross one another convex stupefied, the intersection it is convex it is stupefied between form pit, the metal substrate include symmetrical left region with Right region, left region include substrate first part, substrate second part and substrate Part III, and the substrate first part is formed Several angles are the triangular depression of θ 1, and the substrate second part forms the semicircle pit that several radiuses are R, the substrate the Three parts shape is angled the pit of θ 2, and the length of the substrate first part is H1, and the length of the substrate second part is H2, the length of the substrate Part III are H3, wherein H1=1.8H2=3H3.

Preferably, the radius R of the substrate second part is 15mm to 25mm.

Preferably, the angle, θ 1 is 30 degree to 45 degree.

Preferably, the angle, θ 2 is 45 degree to 60 degree.

Preferably, the material of the insulating layer is high density HDPE.

Preferably, the constituent material of the thermal interface material layer is multi-walled carbon nanotube.

Preferably, the radiator includes several cooling fins, there is identical interval between every two panels cooling fin, and the interval is pressed According to the distance setting of the pit in the substrate first part, substrate second part and substrate Part III.

After using the above structure, a kind of aluminum substrate wiring board including copper foil layer 11, is installed in the exhausted of 11 lower part of copper foil layer Edge layer 12, the metal substrate 13 for being installed in 12 lower part of insulating layer, the thermal interface material layer 14 for being installed in 13 lower part of metal substrate, dress Radiator 15 set on 14 lower part of thermal interface material layer, metal substrate 13 open up out a plurality of cross one another convex stupefied, the intersection It is convex it is stupefied between form pit, the metal substrate includes symmetrical left region and right region, and left region includes substrate A part, substrate second part and substrate Part III, it is recessed that the substrate first part forms the triangle that several angles are θ 1 Hole, the substrate second part form the semicircle pit that several radiuses are R, and the substrate Part III shape is angled the recessed of θ 2 Hole, the length of the substrate first part are H1, and the length of the substrate second part is H2, the substrate Part III Length is H3, wherein H1=1.8H2=3H3, the aluminum substrate wiring board can quickly minimize thermal resistance, have excellent heat Performance is led, good mechanical property meets RoHs requirement, is adapted to SMT technique, can carry out pole to thermal diffusion in circuit design Effectively to handle, module running temperature can reduce in time, long service life, and power density is high, good reliability.

Detailed description of the invention

Fig. 1 is a kind of structure chart of aluminum substrate wiring board of the utility model；

Fig. 2 is a kind of perspective view of the metal substrate of aluminum substrate wiring board of the utility model；

Fig. 3 is a kind of front view of the metal substrate of aluminum substrate wiring board of the utility model.

Specific embodiment

In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is used only for explaining The utility model is not used to limit the utility model.

Fig. 1 and Fig. 2 is please referred to, Fig. 1 is a kind of structure chart of aluminum substrate wiring board of the utility model；Fig. 2 is that this is practical new A kind of perspective view of the metal substrate of aluminum substrate wiring board of type.

Embodiment 1

A kind of aluminum substrate wiring board 10 including copper foil layer 11, the insulating layer 12 that is installed in 11 lower part of copper foil layer, is installed in absolutely The metal substrate 13 of 12 lower part of edge layer, is installed in thermal interfacial material at the thermal interface material layer 14 for being installed in 13 lower part of metal substrate Layer 14 lower part radiator 15, metal substrate 13 open up out it is a plurality of cross one another convex stupefied, the intersection it is convex it is stupefied between formed Pit, the metal substrate include symmetrical left region and right region, and left region includes substrate first part, substrate second Part and substrate Part III, the substrate first part form the triangular depression that several angles are θ 1, the substrate second Part forms the semicircle pit that several radiuses are R,

Referring again to Fig. 3, the substrate Part III shape is angled the pit of θ 2, the length of the substrate first part For H1, the length of the substrate second part is H2, and the length of the substrate Part III is H3, wherein H1=1.8H2= 3H3。

In the present embodiment, the radius R of the preferred substrate second part is 15mm to 25mm, in other embodiments In, radius R may be other numerical value.

In the present embodiment, the preferred angle, θ 1 is 30 degree to 45 degree, and in other embodiments, angle, θ 1 can also be with For other numerical value.

In the present embodiment, the preferred angle, θ 2 is 45 degree to 60 degree, and in other embodiments, angle, θ 2 can also be with For other numerical value.

In the present embodiment, the material of the preferred insulating layer is high density HDPE, in other embodiments, described exhausted The constituent material of edge layer may be other kinds of material.

In the present embodiment, the constituent material of the preferred thermal interface material layer is multi-walled carbon nanotube, in other realities It applies in example, the constituent material of the thermal interface material layer may be other kinds of material.

In the present embodiment, the radiator includes several cooling fins, there is identical interval between every two panels cooling fin, described Interval is arranged according to the distance of the pit in the substrate first part, substrate second part and substrate Part III.

After using the above structure, a kind of aluminum substrate wiring board 10 including copper foil layer 11, is installed in 11 lower part of copper foil layer Insulating layer 12, the metal substrate 13 for being installed in 12 lower part of insulating layer, the thermal interface material layer for being installed in 13 lower part of metal substrate 14, be installed in the radiator 15 of 14 lower part of thermal interface material layer, metal substrate 13 open up out it is a plurality of cross one another convex stupefied, it is described Intersect it is convex it is stupefied between form pit, the metal substrate includes symmetrical left region and right region, and left region includes base Plate first part, substrate second part and substrate Part III, the substrate first part form the triangle that several angles are θ 1 Shape pit, the substrate second part form the semicircle pit that several radiuses are R, and the substrate Part III shape is angled θ 2 Pit, the length of the substrate first part is H1, and the length of the substrate second part is H2, the substrate Part III Length be H3, wherein H1=1.8H2=3H3, the aluminum substrate wiring board can quickly minimize thermal resistance, have it is excellent Thermal conductivity, good mechanical property meet RoHs requirement, are adapted to SMT technique, can carry out to thermal diffusion in circuit design Extremely effective processing, module running temperature can reduce in time, long service life, and power density is high, good reliability.

It should be understood that cannot therefore limit the utility model the above is only the preferred embodiment of the utility model The scope of the patents, equivalent structure or equivalent flow shift made by using the description of the utility model and the drawings, or it is straight It connects or is used in other related technical areas indirectly, be also included in the patent protection scope of the utility model.

Claims

1. a kind of aluminum substrate wiring board, which is characterized in that including copper foil layer, the insulating layer that is installed in the copper foil layer lower part, dress Set on the insulating layer lower part metal substrate, be installed in the metal substrate lower part thermal interface material layer, be installed in it is described The radiator of thermal interface material layer lower part, the metal substrate open up out it is a plurality of cross one another convex stupefied, the intersection it is convex stupefied Between form pit, the metal substrate includes symmetrical left region and right region, left region include substrate first part, Substrate second part and substrate Part III, the substrate first part forms the triangular depression that several angles are θ 1, described Substrate second part forms the semicircle pit that several radiuses are R, and the substrate Part III shape is angled the pit of θ 2, described The length of substrate first part is H1, and the length of the substrate second part is H2, and the length of the substrate Part III is H3, Wherein, H1=1.8H2=3H3.

2. aluminum substrate wiring board according to claim 1, it is characterised in that: the radius R of the substrate second part is 15mm to 25mm.

3. aluminum substrate wiring board according to claim 1, it is characterised in that: the angle, θ 1 is 30 degree to 45 degree.

4. aluminum substrate wiring board according to claim 1, it is characterised in that: the angle, θ 2 is 45 degree to 60 degree.

5. aluminum substrate wiring board according to claim 1, it is characterised in that: the material of the insulating layer is high density HDPE。

6. aluminum substrate wiring board according to claim 1, it is characterised in that: the constituent material of the thermal interface material layer is Multi-walled carbon nanotube.

7. aluminum substrate wiring board according to claim 1, it is characterised in that: the radiator includes several cooling fins, often There is identical interval between two panels cooling fin, the interval is according to the substrate first part, substrate second part and substrate third The distance of pit in part is arranged.