CN201364894Y - Heat-dissipating module backplane - Google Patents
Heat-dissipating module backplane Download PDFInfo
- Publication number
- CN201364894Y CN201364894Y CNU2008201402204U CN200820140220U CN201364894Y CN 201364894 Y CN201364894 Y CN 201364894Y CN U2008201402204 U CNU2008201402204 U CN U2008201402204U CN 200820140220 U CN200820140220 U CN 200820140220U CN 201364894 Y CN201364894 Y CN 201364894Y
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- substrate
- chip
- radiating module
- base plate
- heat
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Abstract
The utility model discloses a heat-dissipating module backplane, which is characterized in that a contact surface is arranged at the center of the bottom surface of a substrate in a protruding way, and inclined planes which becomes obliquely thin toward the peripheral edge of the substrate are arranged at the side of the contact surface; the substrate is propped against a chip by the contact surface, and more than one heat sink is arranged at the other side of the substrate opposite to the contact surface, so that the heat energy generated by the chip can be conducted to more than one heat sink through the substrate to be dissipated; and the heat density of the current chip becomes high, so quite great conduction-impedance is caused when the heat energy is transferred to the outer sides from the center. The experience and experiment show that the substrate thickness farther away from the chip has less impact on performance, and the substrate thickness closer to the chip has greater impact on performance, thereby, through the inclined planes, the substrate farther away from the chip is thinner, and the substrate closer to the chip is thicker so as to substantially reduce the conduction-impedance of the substrate around the chip, so that the substrate has better uniform temperature so as to reduce the weight and improve the heat dissipating effect.
Description
Technical field
The present invention relates to a kind of radiating module base plate, belong to electronic information technology product heat radiation field, belong to the electronic information technology product specifically, especially the central processing unit chip cooling of computer and the technical field of heat spreader structures.
Background technology
By computer and electronics technology fast development now, and computer, the development trend of electronic product also strides forward towards the powerful and fireballing direction of calculation function, and the central processing unit of computer can produce heat energy when running, and the heat energy that speed is more then produced is higher, if can't in time distribute heat energy, will cause central processing unit to burn or situation when machine takes place, reduce or heat energy that the central processing unit that leaves is produced when running and be generally, the upper surface that lies in central processing unit is equiped with fin, and the heat energy that central processing unit is produced can conduct on each fin, by fan blow cold air is dispelled the heat to the gap of adjacent fin again, yet the principal element that influences radiating efficiency is an area of dissipation, so the gap length of fin promptly can change the formed area of dissipation number of fin.
There is manufacturer to do research and development at highdensity fin, see also shown in Figure 10, it is the three-dimensional exploded view of commonly using, this kind high density radiation fins A is the storage tank B1 upper surface that is welded in holder B indent, and be outward extended with a fin B2 towards both sides in holder B end face, and offer plural fixing hole B21 in fin B2 surface, fan C screws togather the location with fixing hole B21 formation after utilizing fixation kit D to pass perforation C1, to constitute a kind of heat abstractor, but manufacturer is for making radiating efficiency better now, facility is made holder B with copper material, to improve the heat conduction benefit.
This holder B utilizes the copper material of full wafer directly to carry out the cutting moulding mostly, in order to save processing cost, the sectional area of copper material is rectangular mostly, just need carry out processed once more if will change cross sectional shape, will cause processing cost to go up significantly, yet, along with the copper valency goes up, the weight of holder B will become the key factor that influences product cost, thick and entire area is big because of holder B sectional area, just can significantly improve cost of goods manufactured, and holder B is for being installed in the central processing unit top, will be if the weight of holder B is excessive in shock-testing, when vibration-testing or computer carrying vibrations, cause central processing unit to damage easily.
Along with manufacturer constantly researches and develops improvement to central processing unit, the area of its central processing unit is dwindling gradually just, can produce thermal resistance during because of thermal energy conduction, and along with the increase temperature of conduction distance can continue to reduce, when thicker and entire area is big when holder B sectional area, heat energy just can increase through the path that holder B conducts to fin A thereupon, and holder B owner will utilize centre and central processing unit joint to carry out heat conduction, because of holder B centre thin thickness, its heat energy just can have big impedance by centre when outer side edges is conducted, in the central processing unit position outside and in addition the temperature of the fin A that side surface connected and the temperature difference of room temperature diminish to cause holder B, but because of body surface more little with the outside temperature difference, its radiating rate also will be more little, to cause fin A only to have the part to dispel the heat, and more can reduce radiating effect.
By on learn, produce radiator as how cheap cost, easy technology, and, how reduce material cost and problem how to simplify processing procedure, just be the direction place of relevant improvement that the dealer studies in response to the high heat that central processing unit produced.
Summary of the invention
The invention provides a kind of radiating module base plate, with the purpose that realizes having reduction volume, saving cost and promote the radiating effect advantage.
The technical solution adopted in the present invention is in order to achieve the above object:
A kind of radiating module base plate refers to utilize chip on the bottom surface contact preinstalled circuit plate carrying out the radiating module of thermal energy conduction and heat radiation especially, and it is to comprise that substrate, more than one fin form, wherein:
This substrate convexes with to the contact-making surface that pastes default chip in the bottom surface centre, and the contact-making surface side is provided with towards the inclined-plane of substrate outer peripheral edges inclination attenuation;
This more than one fin is for being fixedly arranged on substrate top surface.
This substrate is provided with for locked assembly in each corner and wears the plural lockhole that is locked in the preinstalled circuit plate.
Two ends of this substrate one sidewall are provided with the plural location division of tool location hole, and substrate and the protuberance that extends thereof are provided with the inclination angle of relative positioning portion in two sides.
The contact-making surface of this substrate is rectangular, circular, rhombus or other shape.
This substrate is to utilize metal material made in the mode of squeezing type, die casting or forging.
This metal material can be metal, the alloy of copper, aluminium or other kind.
This more than one fin is equiped with fan in the top.
But this more than one fin is equiped with fan in the mobile side that is blown into of air feed.
Adopt technical scheme of the present invention:
Because, this substrate convexes with contact-making surface in the centre of bottom surface, and the contact-making surface side is provided with towards the inclined-plane of substrate outer peripheral edges inclination attenuation, when making substrate increase the thickness of contact-making surface, can utilize the cumulative volume and the weight of inclined-plane reduction substrate, because the substrate decentre is far away more, thickness is more little for performance impact, decentre is near more, thickness is big more to performance impact, and through the contact-making surface lifting heat conduction usefulness that thickens, make substrate be unlikely too big temperature drop, and allow substrate 1 that better uniform temperature is arranged away from the position of chip, then substrate in addition the more than one fin of side surface just can produce and the temperature of the big temperature difference of space outerpace tool, more than one fin is dispelled the heat to the effect of space outerpace promoted, and then make substrate have the reduction volume and promote the characteristic of radiating effect.
Because, this substrate is for utilizing metal material made to squeeze type, die casting or forging mode, make the centre of substrate bottom surface form contact-making surface, and the contact-making surface side has towards the inclined-plane of substrate outer peripheral edges inclination attenuation, just general rectangular metal material can be saved and the cost that expends that cuts and cut clout need be processed, and the expense of manufactured materials can be saved in the inclined-plane of attenuation, not only can reduce the manufacturing cost of product really, the weight that more can alleviate substrate weight when avoiding shock-testing, vibration test or computer carrying vibrations causes chip to damage.
Description of drawings
Fig. 1 is the stereo appearance figure of substrate of the present invention.
Fig. 2 is the side cutaway view of substrate of the present invention.
Fig. 3 is the stereo appearance figure of preferred embodiment of the present invention.
Fig. 4 is the side cutaway view of another embodiment of the present invention.
Fig. 5 is the stereo appearance figure of further embodiment of this invention substrate.
Fig. 6 is the temperature profile of substrate of the present invention.
Fig. 7 is that the present invention is with the temperature of commonly using and apart from comparison diagram.
Fig. 8 is the comparison diagram of test performance of the present invention.
Fig. 9 is the comparison diagram of test performance of the present invention and weight.
Figure 10 is the three-dimensional exploded view of commonly using.
The main element symbol description
1, substrate
11, contact-making surface 15, location division
12, inclined-plane 151, location hole
13, lockhole 16, inclination angle
14, protuberance
2, fin
3, circuit board
31, chip
4, locked assembly
5, fan
A, fin
B, holder
B1, storage tank B21, fixing hole
B2, fin
C, fan
C1, perforation
D, fixation kit
Embodiment
For reaching above-mentioned purpose and effect, the technology used in the present invention means and structure thereof, drawing now illustrates in detail that with regard to preferred embodiment of the present invention its feature and function are as follows.
See also Fig. 1, shown in Figure 2, it is the stereo appearance figure of substrate of the present invention, side cutaway view, find out that by knowing shown in the figure this radiating module base plate lies in substrate 1 bottom surface central authorities and convexes with contact-making surface 11, and contact-making surface 11 sides are provided with towards the inclined-plane 12 of substrate 1 outer peripheral edges inclination attenuation, and be provided with plural lockhole 13 in each corner of substrate 1, its substrate 1 extends the protuberance 14 of the less thickness of tool again in a sidewall, relatively 14 of protuberances in substrate 1 in addition the contiguous corner of side be provided with the plural location division 15 of tool location hole 151, and substrate 1 and the protuberance 14 that extends thereof are provided with the inclination angle 16 of relative positioning portion 15 again in two sides.
This substrate 1 is for utilizing metal material to squeeze type, die casting or forging mode are made, its metal material can be copper, the metal of aluminium or other kind, alloy, just general rectangular metal material can be saved and the cost that cuts need be processed, and substrate 1 utilizes inclined-plane 12 just can save volume, not only saved the expense of manufactured materials, more can alleviate the weight of substrate 1, see also annex one, two content, because when heat energy is done the side direction transmission, thickness is thick more, and conduction resistance is more little, when substrate 1 makes by central authorities' oblique attenuation of inclination outwardly, because of the center thickness thickening, so Chuan Dao speed just can promote laterally, and attenuation substrate 1 reason central authorities make that towards outside attenuation the comparable again rectangular base of its weight is light, because former material price sharp rises now, and then can reach weight reduction, reduce the purpose of manufacturing cost and lifting heat dissipation.
Above-mentioned inclined-plane 12 can be by contact-making surface 11 each side linearly outwardly or curve-like tilt, and inclined-plane 12 can be connected to form plural number by plural face and connect the angle or be single even surface, its only tool substrate 1 is got final product by the function of central authorities' attenuation outwardly, non-so promptly limit to claim of the present invention, as utilize other modification and equivalent structure to change, all should in like manner be contained in the claim of the present invention, close and give Chen Ming.
See also Fig. 1, Fig. 3, shown in Figure 4, it is the stereo appearance figure of substrate of the present invention, the stereo appearance figure of preferred embodiment, the side cutaway view of another embodiment, by knowing shown in the figure when finding out that this substrate 1 uses, the welding of side surface in addition that lies in substrate 1 relative contact 11 is installed with more than one fin 2, and the contact-making surface 11 of substrate 1 is aligned chip 31 on the preinstalled circuit plate 3, and on the plural lockhole 13 of substrate 1, be equipped with locked assembly 4, seeing through plural locked assembly 4 makes substrate 1 be locked in formation location on the circuit board 3, then the contact-making surface 11 of substrate 1 just can support and be affixed on the surface of chip 31 away from circuit board 3, when chip 31 runnings, the heat energy that chip 31 is produced just can conduct on the more than one fin 2 of other side surface via substrate 1.
Moreover, more than one fin 2 also can be in the top or the air feed side that is blown into that flows be equiped with more than one fan 5, utilize fan 5 that cool exterior air is blown to fin 2, make the fin 2 and the advection heat of extraneous air pass the coefficient increasing, radiating rate can promote more, also can utilize fan 5 that the hot-air around the above fin 2 is extracted out, cool exterior air can be flowed into around the fin 2, just can promote radiating rate.
This substrate 1 can be prior to contact-making surface 11 coating heat-conducting creams, again contact-making surface 11 is supported and be affixed on the chip 31, utilize heat-conducting cream just can make between chip 31 and the contact-making surface 11 and do not have the space, heat energy gets final product certain conducting on the substrate 1, preventing the situation that heat is hoarded, and can be equiped with outer cover for more than one fin 2 or fan 5 location, the assembly of above-mentioned outer cover, heat-conducting cream and other heat radiation, location is known technology, and this thin portion constitutes non-this case creation main points, repeats no more now.
See also Fig. 1, shown in Figure 5, be the stereo appearance figure of substrate of the present invention, the stereo appearance figure of another embodiment substrate, find out by knowing shown in the figure, this substrate 1 and contact-making surface 11 can be rectangle, circle, rhombus or other shape, its contact-making surface 11 only tool can completely get final product the function that its heat energy on average conducts to pasting chip 31, non-so promptly limit to claim of the present invention, as utilize other modification and equivalent structure to change, all should in like manner be contained in the claim of the present invention, close and give Chen Ming.
See also Fig. 6, Fig. 7, Fig. 8, shown in Figure 9, it is the temperature profile of substrate of the present invention, the present invention is with the temperature of commonly using and apart from comparison diagram, the comparison diagram of the comparison diagram of test performance and test performance and weight, find out by knowing shown in the figure, along with the dealer constantly researches and develops, the function of chip 31 is more and more stronger but its volume is done more little more, make that chip 31 heat densities are more and more higher, and substrate 1 diminishes with the contact area of chip 31, and make substrate 1 produce the situation that heat is concentrated, when heat is transmitted by the center outward side, can cause sizable conduction resistance, the temperature of each position just can increase along with the distance with chip 31 and reduce on the substrate 1, and variations in temperature is curved shape, be with, utilize the contact-making surface 11 of substrate 1 bottom surface central authorities to be provided with the inclined-plane 12 of inclination attenuation towards outer peripheral edges, make from chip 31 substrate 1 more at a distance thin more, near more place is thick more, significantly to reduce the conduction resistance of chip 31 location about substrates 1, allow substrate 1 that better uniform temperature is arranged, can reach the purpose that promotes heat-transfer effect.
Moreover, thin substrate 1 also can reduce fin 2 quantity that end face connects, as shown in Figure 8, when installing 35 fin 2 on the thin substrate 1, its radiating effect is identical with the square type base of 48 fin 2 of installing, just can reduce quantity and the weight that fin 2 is installed, and then can reduce production costs.
If the center thickness of 2.5mm thin substrate 1 is increased to 3.5mm, and when thin substrate 1 outer side edges attenuation becomes 1mm, the descending slope of temperature drop curve then is lower than the square type base of 2.5mm, as shown in Figure 7, the dark line of tool diamond block is a square type base, and the light color line of tool square is a thin substrate 1, but the thin substrate 1 of inference root thickening thus, performance can significantly promote and surmount traditional square type base, yet weight but can reduce by 17%.
Moreover, utilize the traditional rectangular base and the more than one fin 2 of plural substrate of the present invention 1 installing of plural number, and with substrate 1 with experimentize after chip 31 on the preinstalled circuit plate 3 contacts, just can learn after substrate 1 utilizes inclined-plane 12 attenuation reduces volume outwardly by central authorities, because of the weight of base plate accounts for 30%～50% of overall weight usually, just can reach the target of saving material weight 15%.
The radiating module base plate of the invention described above when reality is used, for can having following advantage, as:
When (one) this substrate 1 increases the thickness of contact-making surface 11, because of inclined-plane 12 has reduced substrate 1 volume, the cumulative volume of substrate 1 just can be reduced, the thickness of its contact-making surface 11 can promote heat conduction usefulness after increasing, make substrate 1 not have too big temperature drop away from the position of chip 31, and allow substrate 1 that better uniform temperature is arranged, then substrate 1 other the set more than one fin 2 of side surface will have with the bigger temperature difference of air, because more than one fin 2 is good more with the big more radiating effect of the temperature difference of space outerpace, just can reach the purpose of reduction volume and lifting radiating effect simultaneously.
(2) centre of this substrate 1 in the bottom surface convexes with contact-making surface 11, and contact-making surface 11 sides are provided with towards the inclined-plane 12 of substrate 1 outer peripheral edges inclination attenuation, because substrate 1 is for utilizing metal material made to squeeze type, die casting or forging mode, just can save the cost that expends that general rectangular metal material need be processed the cost that cuts and be cut clout, and substrate 1 is provided with inclined-plane 12 parts can reduce volume, just can save the expense of manufactured materials, and then reach the purpose of certain reduction cost of goods manufactured.
(3) this substrate 1 utilizes 12 places, inclined-plane to reduce volume, and then can alleviate the weight of substrate 1, because of chip is done littler and littler, it is also more and more littler that it bears weight, when suffering oppression, move carrying or be subjected to clashing into, chip also more is easy to generate damage, after alleviating substrate 1 weight, just can avoid substrate 1 to do shock-testing, vibration test or computer carrying vibrations constantly, weight causes chip 31 to damage.
The present invention is for being primarily aimed at the radiating module base plate; and can convex with contact-making surface 11 in the centre of substrate 1 bottom surface; and contact-making surface 11 sides are provided with towards the inclined-plane 12 of substrate 1 outer peripheral edges inclination attenuation; make substrate 1 when contact-making surface 11 increases thickness; also can utilize inclined-plane 12 to reduce the cumulative volume of substrate 1; cost with the manufacturing of reduction product is main key protection point; be that the contact-making surface 11 that substrate 1 can be utilized thicken and the inclined-plane 12 of attenuation outwardly carry out heat conduction; allow substrate 1 that better uniform temperature is arranged; and has an advantage that promotes radiating effect; only; the above only is preferred embodiment of the present invention, and is non-so promptly limit to claim of the present invention, so the simple and easy modification and the equivalent structure that use specification of the present invention and graphic content to do such as change; all should in like manner be contained in the claim of the present invention, close and give Chen Ming.
Claims (8)
1, a kind of radiating module base plate refers to utilize chip on the bottom surface contact preinstalled circuit plate carrying out the radiating module of thermal energy conduction and heat radiation especially, and it is to comprise that substrate, more than one fin form, and it is characterized in that:
This substrate convexes with to the contact-making surface that pastes default chip in the bottom surface centre, and the contact-making surface side is provided with towards the inclined-plane of substrate outer peripheral edges inclination attenuation;
This more than one fin is for being fixedly arranged on substrate top surface.
2, radiating module base plate as claimed in claim 1 is characterized in that this substrate is provided with the confession locked assembly in each corner and wears the plural lockhole that is locked in the preinstalled circuit plate.
3, radiating module base plate as claimed in claim 1 is characterized in that two ends of this substrate one sidewall are provided with the plural location division of tool location hole, and substrate and the protuberance that extends thereof are provided with the inclination angle of relative positioning portion in two sides.
4, radiating module base plate as claimed in claim 1 is characterized in that the contact-making surface of this substrate is rectangular, circle or diamond shape.
5, radiating module base plate as claimed in claim 1 is characterized in that this substrate is to utilize metal material made in the mode of squeezing type, die casting or forging.
6, radiating module base plate as claimed in claim 5 is characterized in that this metal material is copper, aluminium or alloy.
7, radiating module base plate as claimed in claim 1 is characterized in that this more than one fin is equiped with fan in the top.
8, radiating module base plate as claimed in claim 1, but it is characterized in that this more than one fin is equiped with fan in the mobile side that is blown into of air feed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201402204U CN201364894Y (en) | 2008-10-16 | 2008-10-16 | Heat-dissipating module backplane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201402204U CN201364894Y (en) | 2008-10-16 | 2008-10-16 | Heat-dissipating module backplane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201364894Y true CN201364894Y (en) | 2009-12-16 |
Family
ID=41475565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201402204U Expired - Fee Related CN201364894Y (en) | 2008-10-16 | 2008-10-16 | Heat-dissipating module backplane |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201364894Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11410905B2 (en) | 2019-03-18 | 2022-08-09 | International Business Machines Corporation | Optimized weight heat spreader for an electronic package |
| WO2023133930A1 (en) * | 2022-01-13 | 2023-07-20 | 北京市鑫全盛科技有限公司 | Radiator base and radiator |
-
2008
- 2008-10-16 CN CNU2008201402204U patent/CN201364894Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11410905B2 (en) | 2019-03-18 | 2022-08-09 | International Business Machines Corporation | Optimized weight heat spreader for an electronic package |
| WO2023133930A1 (en) * | 2022-01-13 | 2023-07-20 | 北京市鑫全盛科技有限公司 | Radiator base and radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN YONGTENG ELECTRONIC PRODUCTS CO., LTD. Free format text: FORMER OWNER: KWO GER METAL TECHNOLOGY CO., LTD. Effective date: 20100610 Free format text: FORMER OWNER: SUZHOU YONGTENG ELECTRONIC PRODUCT CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NO.5-3, WULIN STREET, SHULIN CITY, TAIPEI COUNTY, TAIWAN PROVINCE, CHINA TO: 523690 NO.5, YIFA ROAD, ZHUWEITIAN VILLAGE, FENGGANG TOWN, DONGGUAN CITY, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100610 Address after: 523690, No. 5, Yi Fa Road, bamboo village, Fenggang Town, Guangdong, Dongguan Patentee after: Dongguan Yongteng Electronic Product Co., Ltd. Address before: China Taiwan Taipei County Forest City, Wulin Street No. 3, No. 5 Co-patentee before: Suzhou Yongteng Electronic Product Co., Ltd. Patentee before: Kwo Ger Metal Technology, Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091216 Termination date: 20141016 |
|
| EXPY | Termination of patent right or utility model |