CN208336211U

CN208336211U - SMA lead frame

Info

Publication number: CN208336211U
Application number: CN201821152760.4U
Authority: CN
Inventors: 徐建仁
Original assignee: Kunshan Qun Yue Precision Die Co Ltd
Current assignee: Kunshan Qun Yue Precision Die Co Ltd
Priority date: 2018-07-20
Filing date: 2018-07-20
Publication date: 2019-01-04
Anticipated expiration: 2028-07-20

Abstract

The utility model discloses a kind of SMA lead frames, substrate including rectangle, and multiple encapsulation units on the substrate, encapsulation unit is in matrix arrangement, each encapsulation unit includes chip carrier, and is located at the first pin and second pin of chip carrier both lateral sides, and the first pin and second pin all extend transversely, first pin is connected with chip carrier, and there are spacing with chip carrier for second pin；Spacing between adjacent two horizontally-arranged chip carrier center line is 3.2 ~ 4.5mm, and it is 11.5mm ~ 12.8mm that adjacent two column chip, which does the spacing between center line,.The lead frame of the SMA lead frame area ratio prior art of the utility model is big, also more compact, the more SMA packaging bodies of punching press energy output quantity of encapsulation unit arrangement, the use of raw material are more saved, mitigate environmental pressure, while reducing enterprise's production cost.

Description

SMA lead frame

Technical field

The utility model relates to electronic component field, especially a kind of SMA lead frame.

Background technique

Chip carrier of the lead frame as integrated circuit is that one kind is drawn by means of bonding gold wire realization chip internal circuits The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead Effect.The SMA lead frame of the prior art, only 252 encapsulation units in single frame, and the area of single lead frame compared with Small (78mm × 246mm), utilization rate of equipment and installations and processing efficiency is low, high production cost.

Summary of the invention

The purpose of the utility model is to provide a kind of SMA lead frames, can be effectively reduced production cost, raising material makes With rate.

In order to achieve the above objectives, the technical solution adopted in the utility model is: a kind of SMA lead frame, including rectangle Substrate and multiple encapsulation units on the substrate, the encapsulation unit are in matrix arrangement, and each encapsulation is single Member all includes chip carrier, and is located at the first pin and second pin of the chip carrier both lateral sides, and described first draws Foot and second pin all extend transversely, and first pin is connected with the chip carrier, the second pin and the chip There are spacing for seat；Spacing between the adjacent two rows encapsulation unit is 1.7 ~ 2.3mm, between the adjacent two column encapsulation unit Spacing be 1.5mm ~ 4.5mm.

Preferably, a length of 262mm of the substrate, width 84mm are provided with 20 horizontally-arranged 20 files, altogether on the substrate 400 encapsulation units.

Preferably, the encapsulation unit being arranged every N on the substrate and being equipped with an interval trough group, wherein N is positive integer, and 1 ≤ N≤5, each interval trough group include several longitudinally spaced interval troughs for arranging and extending longitudinally.

It is further preferred that being located between the interval trough group and the lead frame transverse direction edge of lateral most avris extremely It is equipped with the encapsulation unit of a file less.

It is further preferred that the interval trough group includes five interval troughs equidistantly arranged along the vertical direction.

Preferably, multiple location holes are offered on the substrate, the location hole is in the two longitudinal of the lead frame Edge lines up two rows.

Preferably, the two sides edge of the first pin longitudinal direction is each provided with first dowel, first connection One end of muscle is connected on first pin, the other end is wholely set on the substrate；The two of the second pin longitudinal direction Side portion is each provided with second dowel, and one end of second dowel is connected in the second pin, the other end It is wholely set on the substrate.

Due to the application of the above technical scheme, the utility model has the advantage that this is practical new compared with prior art The lead frame of the SMA lead frame area ratio prior art of type is big, and encapsulation unit arrangement is also more compact, and a punching press can produce The use of more SMA packaging body out, raw material is more saved, and mitigates environmental pressure, while reducing enterprise's production cost.

Detailed description of the invention

Attached drawing 1 is the front view of the SMA lead frame of the utility model；

Attached drawing 2 is enlarged view of the Fig. 1 at A；

Attached drawing 3 is the front view after the encapsulation of single package unit injecting glue；

Attached drawing 4 is the front view of SMA encapsulating structure；

Wherein: 1, substrate；2, encapsulation unit；21, chip carrier；22, the first pin；23, second pin；3, interval trough；4, Location hole；5, the first dowel；6, the second dowel.

Specific embodiment

The technical solution of the utility model is further elaborated with specific embodiment with reference to the accompanying drawing.

Referring to Fig. 1 to SMA lead frame shown in Fig. 3, substrate 1 and multiple envelopes on substrate 1 including rectangle Unit 2 is filled, encapsulation unit 2 is in matrix arrangement, and there are spacing, each encapsulation units 2 for two longitudinally adjacent encapsulation units 2 It all include the chip carrier 21 for chip, and positioned at the first pin 22 and second pin of 21 both lateral sides of chip carrier 23, the first pin 22 and second pin 23 all extend transversely, wherein the first pin 22 is connected with chip carrier 21, second pin 23 With chip carrier 21 there are spacing, chip is connect in such a way that wire jumper welds with second pin 23.In adjacent two horizontally-arranged chip carrier Spacing between heart line is 3.2 ~ 4.5mm, chip described in adjacent two file do the spacing between center line be 11.5mm ~ 12.8mm。

It is equipped with an interval trough group every the encapsulation unit 2 of N file on substrate 1, wherein N is positive integer, and 1≤N≤5, Each interval trough group includes several longitudinally spaced interval troughs 3 for arranging and extending longitudinally.Wherein, it is located at laterally most avris Interval trough group and lead frame transverse direction edge between at least provided with a file encapsulation unit 2.As being preferable to provide mode, Each interval trough group includes five interval troughs equidistantly arranged along the vertical direction 3.There are two the purposes that interval trough is arranged: 1) being convenient for The cutting of first pin 22 and second pin 23；2) it prepares for subsequent technique.

Several location holes 3 are offered on substrate 1, these location holes 3 are circular hole or long hole, for lead frame processed The positioning of journey, location hole 3 are provided with two horizontally-arranged, this two rows of location hole 3 is located at longitudinal two edge of substrate 1, in this way The location hole 3 of setting makes the positioning of lead frame more accurate.

The longitudinal two sides edge of first pin 22 is each provided with first dowel 5, one end connection of the first dowel 5 On the first pin 22, the other end be wholely set on substrate 1, similarly, the longitudinal two sides edge of second pin 23 is respectively arranged There is second dowel 6, one end of the second dowel 6 is connected in second pin 23, the other end is integrally disposed upon substrate 1 On.Setting is because the first pin 22 and second pin 23 are longer in this way, and rigidity is poor, passes through the first dowel 5 of setting and the Two dowels 6 can decline to avoid yield caused by 23 overflexing of the first pin 22 and second pin, while reduce difficult processing Degree.

As mode is preferable to provide, as shown in Figure 1, being provided with 20 horizontally-arranged 20 files, totally 400 on each lead frame Encapsulation unit 2, a length of 262mm of substrate 1, width 84mm, 1.818/cm of encapsulation unit density².Compared with the prior art one 1.313 252 encapsulation units, encapsulation unit density/cm are arranged in piece lead frame², the yield of single piece leadframes increases 58.7%, encapsulation unit density improves 38.5% or so, effectively improves the utilization rate of blaster fuse frame material, reduces material Waste.The SMA lead frame of the utility model is that the good lead frame of plastic packaging is being formed after injecting glue encapsulates made of punching press Frame, as shown in figure 3, these packaged 2 die cuts of encapsulation unit are independent packaging body again, by the first pin 22 and After two pins, 23 bending, become final SMA product, as shown in Figure 4.

To sum up, the area of the area ratio prior art lead frame of the SMA lead frame of the utility model is big, encapsulates simultaneously The arrangement of unit 2 is more compact, and single piece leadframes can produce more packaging body, and a punching press energy output quantity is more The use of more SMA packaging bodies, raw material is more saved, and mitigates environmental pressure, while can shorten the process-cycle, reduces enterprise Production cost.

The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention. All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover the protection scope of the utility model it It is interior.

Claims

1. a kind of SMA lead frame, it is characterised in that: substrate and multiple encapsulation on the substrate including rectangle Unit, the encapsulation unit are in matrix arrangement, and each encapsulation unit includes chip carrier, and is located at the core The first pin and second pin of bar both lateral sides, first pin and second pin all extend transversely, and described first Pin is connected with the chip carrier, and there are spacing with the chip carrier for the second pin；In the adjacent two horizontally-arranged chip carrier Spacing between heart line is 3.2mm ~ 4.5mm, the adjacent two column chip do the spacing between center line be 11.5mm ~ 12.8mm。

2. a kind of SMA lead frame according to claim 1, it is characterised in that: a length of 262mm of the substrate, it is wide For 84mm, 20 horizontally-arranged 20 files, totally 400 encapsulation units are provided on the substrate.

3. a kind of SMA lead frame according to claim 1, it is characterised in that: arrange the envelope every N on the substrate Fill unit and be equipped with an interval trough group, wherein N is positive integer, and 1≤N≤5, each interval trough group include it is several along longitudinal direction The interval trough for being alternatively arranged and extending longitudinally.

4. a kind of SMA lead frame according to claim 3, it is characterised in that: between described in laterally most avris At least provided with the encapsulation unit of a file between separate slot group and the lead frame transverse direction edge.

5. a kind of SMA lead frame according to claim 3, it is characterised in that: the interval trough group includes five edges The interval trough that vertical direction is equidistantly arranged.

6. a kind of SMA lead frame according to claim 1, it is characterised in that: it is multiple fixed to offer on the substrate Position hole, the location hole line up two rows in longitudinal two edge of the lead frame.

7. a kind of SMA lead frame according to claim 1, it is characterised in that: the two sides of the first pin longitudinal direction Edge is each provided with first dowel, and one end of first dowel is connected on first pin, the other end one Body is arranged on the substrate；The two sides edge of the second pin longitudinal direction is each provided with second dowel, and described second One end of dowel is connected in the second pin, the other end is wholely set on the substrate.