CN201345362Y - Lead wire frame - Google Patents
Lead wire frame Download PDFInfo
- Publication number
- CN201345362Y CN201345362Y CN 200820236955 CN200820236955U CN201345362Y CN 201345362 Y CN201345362 Y CN 201345362Y CN 200820236955 CN200820236955 CN 200820236955 CN 200820236955 U CN200820236955 U CN 200820236955U CN 201345362 Y CN201345362 Y CN 201345362Y
- Authority
- CN
- China
- Prior art keywords
- slide holder
- pin
- lead frame
- resin
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a lead wire frame, which comprises a frame body. The frame body is formed by at least one unit, each frame body unit is equipped with a slide holder, the slide holder is engaged with a pin, one end of the pin is equipped with a welding portion, the pin is connected with the slide holder and the adjacent unit respectively via connecting structures. The lead wire frame is characterized in that double-V-shaped groove structures are arranged surrounding the slide holder. The double-V-shaped groove structures are arranged surrounding the slide holders, thereby enlarging binding area of the resin with the lead frame when packaging, increasing binding property, avoids the problem of resin falling due to insufficient binding, and guaranteeing the quality of semi-conductor elements.
Description
Technical field
The utility model relates to a kind of parts that are used for semiconductor element, is specifically related to a kind of lead frame that is used for the semiconductor element encapsulation.
Background technology
In the last few years, the integrated level of semiconductor device was more and more higher, and its memory space, conversion speed and power increases rapidly, but volume is more and more littler.This trend has been quickened the development of semiconductor device packaging technique, and therefore, the importance of semiconductor device packaging technique has been subjected to people's attention.The high integration of semiconductor device and the increase of memory also make the quantity of input and output binding post also correspondingly increase, and make also that then the number of lead-in wire increases accordingly, and this layout that just requires to go between also must be meticulous.
Lead frame be in the semiconductor packages skeleton, it mainly is made up of two parts: slide holder and pin.Wherein for chip provides mechanical support, pin then is to connect chip to the outer electric path of encapsulation to slide holder in encapsulation process.The function of framework is conspicuous, and at first it has played the supporting role of encasing electronic components, prevent simultaneously resin the lead-in wire between gush out suddenly, for plastics provide support; Secondly it makes chip be connected to substrate, and the electricity and the passage of heat of chip to wiring board is provided.
At present the packaged type of the semiconductor device that generally adopts is, the semiconductor element that integrates with circuitous pattern is bonded on the slide holder of the lead frame of being made by iron-nickel alloy by bonding agent, Here it is so-called chip bonding process; The bonding weld part of semiconductor element and the lead of lead frame are coupled together Here it is wire bonding technique with bonding line; Having lead frame utilization such as the epoxy resin mould of semiconductor element to annotate insulator die the compound to joint then annotates compound and carries out resin-encapsulated, lead and semiconductor element are sealed.Use this method for packing, have only the outer lead of lead frame to reach the outside that mould is annotated resin.Yet in the process of implementing resin-encapsulated, because the generation of the heat of resin-encapsulated, and the thermal contraction that partly produces at certain thickness, thereby cause between lead frame and the resin combine abundant inadequately, make resin get loose easily, reduce the quality of semiconductor element encapsulation, finally influenced the normal use of semiconductor element.
In order to solve the above problems, lead frame structure is improved.By offering single V-type groove along the slide holder periphery of lead frame, thereby by increasing the bonded area increase adhesion between the two of lead frame and resin, yet find in actual applications, though by the V-type groove is set, increased between resin and lead frame skew resistance in the relative translation direction, but little with the directive effect of Surface Vertical, thus the improvement of this structure can not fine solution between the two in conjunction with inadequate problem.
Summary of the invention
The utility model purpose provides a kind of lead frame, by the improvement of structure, has improved the adhesion between lead frame and the resin, has guaranteed the package quality of semiconductor element.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead frame, comprise a frame body, described frame body is made of at least 1 unit, each frame body unit is provided with slide holder, cooperates with described slide holder to be provided with pin, and described pin one end is provided with weld part, between pin and slide holder, be connected through syndeton respectively between adjacent cells, offer double V-shaped groove structure around the described slide holder.
During encapsulation, earlier bond to semiconductor element on the slide holder of lead frame by bonding agent, with bonding line the weld part of the bonding weld part of semiconductor element and lead frame is come, there is the lead frame of semiconductor element to utilize epoxy resin to carry out resin-encapsulated to joint then, lead and semiconductor element are sealed.Because slide holder is offering of double V-shaped groove structure all around, increased the bonded area between resin and the slide holder, improved the adhesion between resin and the lead frame, avoided because of occurring in conjunction with insufficient situation of resin wear that causes.
Optimized technical scheme is that in the cross section of described double V-shaped groove structure, in the adjacent portions of two grooves, the sidewall sections of a groove is positioned at the flute profile of another groove, constitutes overhead structure.
Because the existence of overhead structure, the part of this groove is low wide and up narrow shape, and the resistance with the mating surface vertical direction is provided thus, has avoided getting loose between resin and the lead frame better.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, because the utility model offers double V-shaped groove structure all around by the slide holder at lead frame, increased the bonded area between potting resin and the lead frame, improved the adhesion between resin and the lead frame, avoided having guaranteed the quality of semiconductor element because of in conjunction with insufficient problem that causes resin wear.
2, the utility model is simple in structure, and is with low cost, is fit to promote the use of.
Description of drawings
Accompanying drawing 1 is the structural representation of a unit of the utility model embodiment one middle frame body;
Accompanying drawing 2 is the local cross-sectional schematic in A-A place among Fig. 1.
Wherein: 1, frame body; 2, slide holder; 3, pin; 4, weld part; 5, double V-shaped groove structure; 6, overhead structure.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: shown in accompanying drawing 1,2, a kind of lead frame, comprise a frame body 1, described frame body 1 is made of 8 unit, each frame body unit is provided with slide holder 2, cooperates with described slide holder 2 to be provided with pin 3, and described pin 3 one ends are provided with weld part 4, be connected through syndeton respectively between pin 3 and 2 of slide holders, adjacent cells, offer double V-shaped groove structure 5 around the described slide holder 2; In the cross section of described double V-shaped groove structure 5, in the adjacent portions of two grooves, the sidewall sections of a groove is positioned at the flute profile of another groove, constitutes overhead structure 6.
In the encapsulation process, earlier semiconductor element is bonded on the slide holder of lead frame, with gold thread the weld part of the bonding weld part of semiconductor element and lead frame is come, there is the lead frame of semiconductor element to utilize resin to carry out resin-encapsulated to joint then, because double V-shaped groove structure offers around the slide holder, resin can enter in the double V-shaped groove when encapsulation, increased the bonded area of resin and lead frame, add the setting of overhead structure, the resistance of translation direction both was provided, resistance with the Surface Vertical direction is provided again, thereby realized combining of resin and lead frame and semiconductor element better.
Embodiment two: a kind of lead frame, comprise a frame body, described frame body is made of 10 unit, each frame body unit is provided with slide holder, cooperate with described slide holder and to be provided with pin, described pin one end is provided with weld part, between pin and slide holder, be connected through syndeton respectively between adjacent cells, offers double V-shaped groove structure around the described slide holder.
Claims (2)
1. lead frame, comprise a frame body (1), described frame body (1) is made of at least 1 unit, each frame body unit is provided with slide holder (2), cooperate with described slide holder (2) and to be provided with pin (3), described pin (3) one ends are provided with weld part (4), and between pin (3) and slide holder (2), be connected through syndeton respectively between adjacent cells, it is characterized in that: described slide holder (2) offers double V-shaped groove structure (5) all around.
2. lead frame according to claim 1 is characterized in that: in the cross section of described double V-shaped groove structure (5), in the adjacent portions of two grooves, the sidewall sections of a groove is positioned at the flute profile of another groove, constitutes overhead structure (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820236955 CN201345362Y (en) | 2008-12-31 | 2008-12-31 | Lead wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820236955 CN201345362Y (en) | 2008-12-31 | 2008-12-31 | Lead wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201345362Y true CN201345362Y (en) | 2009-11-11 |
Family
ID=41276948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820236955 Expired - Fee Related CN201345362Y (en) | 2008-12-31 | 2008-12-31 | Lead wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201345362Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368492A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Triode lead frame with lead hole |
| CN102610585A (en) * | 2011-12-19 | 2012-07-25 | 佛山市蓝箭电子有限公司 | Lead frame for silicon chip encapsulation, encapsulation method and formed electronic element |
-
2008
- 2008-12-31 CN CN 200820236955 patent/CN201345362Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368492A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Triode lead frame with lead hole |
| CN102610585A (en) * | 2011-12-19 | 2012-07-25 | 佛山市蓝箭电子有限公司 | Lead frame for silicon chip encapsulation, encapsulation method and formed electronic element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091111 Termination date: 20171231 |