CN207998640U - A kind of pcb board plating microetch device - Google Patents

A kind of pcb board plating microetch device Download PDF

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Publication number
CN207998640U
CN207998640U CN201820229393.7U CN201820229393U CN207998640U CN 207998640 U CN207998640 U CN 207998640U CN 201820229393 U CN201820229393 U CN 201820229393U CN 207998640 U CN207998640 U CN 207998640U
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CN
China
Prior art keywords
liquid medicine
microetch
tank
pcb board
medicine tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820229393.7U
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Chinese (zh)
Inventor
李健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Sai Fu Science And Technology Co Ltd
Original Assignee
Shenzhen Sai Fu Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Sai Fu Science And Technology Co Ltd filed Critical Shenzhen Sai Fu Science And Technology Co Ltd
Priority to CN201820229393.7U priority Critical patent/CN207998640U/en
Application granted granted Critical
Publication of CN207998640U publication Critical patent/CN207998640U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of pcb boards, and microetch device is electroplated, including a microetch liquid medicine tank, further include the microetch pump being set on microetch liquid medicine tank, the liquid medicine adding trough for being connected to microetch liquid medicine tank side and the overflow launder for being connected to the microetch liquid medicine tank other side, wherein, it is connected by a liquid medicine adding tube between the liquid medicine adding trough and microetch liquid medicine tank, one first water pump is provided in the liquid medicine adding tube.Microetch device is electroplated in pcb board provided by the utility model, and when the content of copper ion in the liquid medicine needed for microetch generates variation, useless liquid medicine is overflowed in realization when new liquid medicine is added, so that the content of copper ion in liquid medicine meets the requirement of liquid medicine needed for microetch always.

Description

A kind of pcb board plating microetch device
Technical field
The utility model is related to electroplating technologies more particularly to a kind of pcb board, and microetch device is electroplated.
Background technology
Plating is made to be thickeied the layers of copper in plate face and hole using electro-plating method, and is electroplated one layer in circuit patterned surface and resists Layer is lost with the process of protection circuit.In electroplating technology, the effect of microetch process is to form the table of micro-rough on layers of copper surface Face, to enhance the binding force with copper coating.
Microetch in electroplating technology, which relies primarily on, is dipped in pcb board in liquid medicine, so that liquid medicine is generated chemical reaction with pcb board and comes It completes.In this process, after liquid medicine is used for a long time, internal content of copper ion will produce variation, become too high or too low, Liquid medicine is set to be unable to reach desired effect.
Utility model content
Against the above deficiency, the purpose of this utility model is to provide a kind of pcb boards, and microetch device is electroplated, needed for microetch When content of copper ion in liquid medicine generates variation, useless liquid medicine is overflowed when new liquid medicine is added, so that the copper ion in liquid medicine contains Amount meets the requirement of liquid medicine needed for microetch always.
Used technical solution is the utility model in order to achieve the above objectives:
A kind of pcb board plating microetch device, including a microetch liquid medicine tank, which is characterized in that further include being set to microetch medicine A microetch on water vat pumps, is connected to a liquid medicine adding trough of microetch liquid medicine tank side and is connected to the microetch liquid medicine tank other side An overflow launder, wherein between the liquid medicine adding trough and microetch liquid medicine tank by a liquid medicine adding tube connect, the liquid medicine add One first water pump is provided on pipe.
A copper ion tester is provided on the microetch liquid medicine tank as a further improvement of the utility model,.
Further include being connected to an electrolytic cell of overflow launder and being connected to electrolysis as a further improvement of the utility model, A liquid medicine regeneration tank between slot and liquid medicine adding trough.
Further include as a further improvement of the utility model, be connected to a hydrogen peroxide adding trough of microetch liquid medicine tank, and It is connected by a hydrogen peroxide adding tube between the hydrogen peroxide adding trough and microetch liquid medicine tank, is provided in the hydrogen peroxide adding tube One second water pump.
Hydrogen peroxide removing is connected between the overflow launder and electrolytic cell as a further improvement of the utility model, Slot.
Further include the filter pump being set on microetch liquid medicine tank as a further improvement of the utility model, be connected to One filtered water inlet manifold of microetch liquid medicine tank and the filtering outfall sewer above filtered water inlet manifold, wherein the filtering Pump is connected to filtered water inlet manifold by a filtered water inlet branch pipe, while the filter pump was connected to by a filtering exit branch Supply mains is filtered out, and a ball valve is respectively arranged with on filtering exit branch in the filtered water inlet branch pipe.
The beneficial effects of the utility model are:
(1) obtain in microetch liquid medicine tank content of copper ion in liquid medicine by copper ion tester or other modes, when copper from It when sub- content is too low or excessively high, is combined with the first water pump by liquid medicine adding trough, liquid medicine is added in microetch liquid medicine tank, and will surpass The liquid medicine for crossing initial liquid level is spilled over in overflow launder, i.e., it is undesirable to replace original content of copper ion by the liquid medicine being newly added Useless liquid medicine, so that liquid level in microetch liquid medicine tank is remained stable, and the content of copper ion of internal liquid medicine meets the requirements always.
(2) high-purity copper in useless liquid medicine is extracted by electrolysis principle by electrolytic cell, and is matched again by liquid medicine regeneration tank Satisfactory liquid medicine is set out, to realize the recycling of whole system liquid medicine, reduces cost, energy-saving and emission-reduction.
Above-mentioned is the general introduction of utility model technical solution, below in conjunction with attached drawing and specific implementation mode, to the utility model It is described further.
Description of the drawings
Fig. 1 is a part of structural schematic diagram of the utility model;
Fig. 2 is another part structural schematic diagram of the utility model.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose is taken, below in conjunction with Specific embodiment of the present utility model is described in detail in attached drawing and preferred embodiment.
Fig. 1 and Fig. 2 are please referred to, the utility model embodiment provides a kind of pcb board plating microetch device, including a microetch medicine Water vat 1, the microetch being set on microetch liquid medicine tank 1 pump 2, be connected to 1 side of microetch liquid medicine tank a liquid medicine adding trough 3 and It is connected to an overflow launder 4 of 1 other side of microetch liquid medicine tank, wherein pass through one between the liquid medicine adding trough 3 and microetch liquid medicine tank 1 Liquid medicine adding tube 31 connects, and one first water pump 311 is provided in the liquid medicine adding tube 31.
In the present embodiment, a copper ion tester is provided on the microetch liquid medicine tank 1.By copper ion tester or Content of copper ion is added when content of copper ion is too low or excessively high by liquid medicine in liquid medicine in other modes acquisition microetch liquid medicine tank 1 Slot 3 is combined with the first water pump 311, and liquid medicine is added in the microetch liquid medicine tank 1, makes in microetch liquid medicine tank 1 content of copper ion always It is maintained at specific range, in the present embodiment, the general microetch that is electroplated needs content of copper ion within the scope of 35 ɡ/L-40 ɡ/L. Meanwhile while liquid medicine is added in microetch liquid medicine tank 1, the amount of liquid in microetch liquid medicine tank 1 is excessive, then liquid is spilled over to excessive In chute 4, i.e., the undesirable liquid of original content of copper ion is replaced by the liquid medicine being newly added, made in microetch liquid medicine tank 1 Liquid level remains stable, and the content of copper ion of internal liquid medicine meets the requirements always.
As further improvement of this embodiment, it further includes the electrolysis for being connected to overflow launder 4 that microetch device, which is electroplated, in pcb board Slot 5 and the liquid medicine regeneration tank 6 being connected between electrolytic cell 5 and liquid medicine adding trough 1.It is extracted by electrolysis principle by electrolytic cell 5 Go out the high-purity copper in useless liquid medicine, and satisfactory liquid medicine is reconfigured out by liquid medicine regeneration tank 6, to realize that recycling is sharp again With, reduction cost, energy-saving and emission-reduction.
Meanwhile pcb board plating microetch device further includes being connected to a hydrogen peroxide adding trough 7 of microetch liquid medicine tank 1, and this pair It is connected by a hydrogen peroxide adding tube 71 between oxygen water adding trough 7 and microetch liquid medicine tank 1, is arranged in the hydrogen peroxide adding tube 71 There is one second water pump 711;Meanwhile it being connected with a hydrogen peroxide between the overflow launder 4 and electrolytic cell 5 and removes slot 8.Pass through addition Hydrogen peroxide and stabilizer ensure that other components have defined content, and before electrolysis, slot 8 is removed by useless medicine by hydrogen peroxide Hydrogen peroxide removal in water, when convenient for electrolysis, useless liquid medicine will not be attacked and etch the cathode plate in electrolytic cell.
As further improvement of this embodiment, it further includes being set on microetch liquid medicine tank 1 that microetch device, which is electroplated, in pcb board One filter pump 9, the filtered water inlet manifold 91 for being connected to microetch liquid medicine tank 1 and the mistake above filtered water inlet manifold 91 Filter out supply mains 92, wherein the filter pump 9 is connected to filtered water inlet manifold 91, while the mistake by a filtered water inlet branch pipe 93 Filter pump 9 is connected to filtering outfall sewer 92 by a filtering exit branch 94, and is discharged in the filtered water inlet branch pipe 93 and filtering A ball valve (931,941) is respectively arranged on branch pipe 94.By the filter pump 9 added, after to use in microetch liquid medicine tank 1 Useless liquid medicine is filtered, and is discharged again after filtering or recycling, and useless liquid medicine direct emission is prevented, and reduces blowdown flow rate, environmental protection section Energy.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model Any restrictions, therefore identical as the utility model above-described embodiment or approximate technical characteristic is used, and obtained other structures, It is within the protection scope of the utility model.

Claims (6)

1. microetch device, including a microetch liquid medicine tank is electroplated in a kind of pcb board, which is characterized in that further include being set to microetch liquid medicine A microetch on cylinder pumps, is connected to a liquid medicine adding trough of microetch liquid medicine tank side and is connected to the microetch liquid medicine tank other side One overflow launder, wherein connected by a liquid medicine adding tube between the liquid medicine adding trough and microetch liquid medicine tank, in the liquid medicine adding tube On be provided with one first water pump.
2. microetch device is electroplated in pcb board according to claim 1, which is characterized in that be arranged on the microetch liquid medicine tank There is a copper ion tester.
3. microetch device is electroplated in pcb board according to claim 1, which is characterized in that further include be connected to overflow launder one Electrolytic cell and the liquid medicine regeneration tank being connected between electrolytic cell and liquid medicine adding trough.
4. microetch device is electroplated in pcb board according to claim 3, which is characterized in that further include being connected to microetch liquid medicine tank A hydrogen peroxide adding trough, and between the hydrogen peroxide adding trough and microetch liquid medicine tank by a hydrogen peroxide adding tube connect, at this One second water pump is provided in hydrogen peroxide adding tube.
5. microetch device is electroplated in pcb board according to claim 4, which is characterized in that the overflow launder and electrolytic cell it Between be connected with a hydrogen peroxide remove slot.
6. microetch device is electroplated according to any pcb board in claim 1 to 5, which is characterized in that further include be set to it is micro- It loses the filter pump on liquid medicine tank, be connected to a filtered water inlet manifold of microetch liquid medicine tank and above filtered water inlet manifold One filtering outfall sewer, wherein the filter pump is connected to filtered water inlet manifold, while the filtering by a filtered water inlet branch pipe Pump is connected to filtering outfall sewer by a filtering exit branch, and distinguishes on filtering exit branch in the filtered water inlet branch pipe It is provided with a ball valve.
CN201820229393.7U 2018-02-09 2018-02-09 A kind of pcb board plating microetch device Expired - Fee Related CN207998640U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820229393.7U CN207998640U (en) 2018-02-09 2018-02-09 A kind of pcb board plating microetch device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820229393.7U CN207998640U (en) 2018-02-09 2018-02-09 A kind of pcb board plating microetch device

Publications (1)

Publication Number Publication Date
CN207998640U true CN207998640U (en) 2018-10-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820229393.7U Expired - Fee Related CN207998640U (en) 2018-02-09 2018-02-09 A kind of pcb board plating microetch device

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110528042A (en) * 2019-08-28 2019-12-03 深圳赛意法微电子有限公司 A kind of semiconductor devices electro-plating method and the activated bath for plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110528042A (en) * 2019-08-28 2019-12-03 深圳赛意法微电子有限公司 A kind of semiconductor devices electro-plating method and the activated bath for plating

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20181023

CF01 Termination of patent right due to non-payment of annual fee