CN207998640U - A kind of pcb board plating microetch device - Google Patents
A kind of pcb board plating microetch device Download PDFInfo
- Publication number
- CN207998640U CN207998640U CN201820229393.7U CN201820229393U CN207998640U CN 207998640 U CN207998640 U CN 207998640U CN 201820229393 U CN201820229393 U CN 201820229393U CN 207998640 U CN207998640 U CN 207998640U
- Authority
- CN
- China
- Prior art keywords
- liquid medicine
- microetch
- tank
- pcb board
- medicine tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title description 6
- 239000007788 liquid Substances 0.000 claims abstract description 108
- 239000003814 drug Substances 0.000 claims abstract description 105
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 19
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 30
- 238000001914 filtration Methods 0.000 claims description 13
- 230000008929 regeneration Effects 0.000 claims description 5
- 238000011069 regeneration method Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 101100372509 Mus musculus Vat1 gene Proteins 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- MMBMIVSDYYPRHH-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO.OO MMBMIVSDYYPRHH-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Abstract
The utility model discloses a kind of pcb boards, and microetch device is electroplated, including a microetch liquid medicine tank, further include the microetch pump being set on microetch liquid medicine tank, the liquid medicine adding trough for being connected to microetch liquid medicine tank side and the overflow launder for being connected to the microetch liquid medicine tank other side, wherein, it is connected by a liquid medicine adding tube between the liquid medicine adding trough and microetch liquid medicine tank, one first water pump is provided in the liquid medicine adding tube.Microetch device is electroplated in pcb board provided by the utility model, and when the content of copper ion in the liquid medicine needed for microetch generates variation, useless liquid medicine is overflowed in realization when new liquid medicine is added, so that the content of copper ion in liquid medicine meets the requirement of liquid medicine needed for microetch always.
Description
Technical field
The utility model is related to electroplating technologies more particularly to a kind of pcb board, and microetch device is electroplated.
Background technology
Plating is made to be thickeied the layers of copper in plate face and hole using electro-plating method, and is electroplated one layer in circuit patterned surface and resists
Layer is lost with the process of protection circuit.In electroplating technology, the effect of microetch process is to form the table of micro-rough on layers of copper surface
Face, to enhance the binding force with copper coating.
Microetch in electroplating technology, which relies primarily on, is dipped in pcb board in liquid medicine, so that liquid medicine is generated chemical reaction with pcb board and comes
It completes.In this process, after liquid medicine is used for a long time, internal content of copper ion will produce variation, become too high or too low,
Liquid medicine is set to be unable to reach desired effect.
Utility model content
Against the above deficiency, the purpose of this utility model is to provide a kind of pcb boards, and microetch device is electroplated, needed for microetch
When content of copper ion in liquid medicine generates variation, useless liquid medicine is overflowed when new liquid medicine is added, so that the copper ion in liquid medicine contains
Amount meets the requirement of liquid medicine needed for microetch always.
Used technical solution is the utility model in order to achieve the above objectives:
A kind of pcb board plating microetch device, including a microetch liquid medicine tank, which is characterized in that further include being set to microetch medicine
A microetch on water vat pumps, is connected to a liquid medicine adding trough of microetch liquid medicine tank side and is connected to the microetch liquid medicine tank other side
An overflow launder, wherein between the liquid medicine adding trough and microetch liquid medicine tank by a liquid medicine adding tube connect, the liquid medicine add
One first water pump is provided on pipe.
A copper ion tester is provided on the microetch liquid medicine tank as a further improvement of the utility model,.
Further include being connected to an electrolytic cell of overflow launder and being connected to electrolysis as a further improvement of the utility model,
A liquid medicine regeneration tank between slot and liquid medicine adding trough.
Further include as a further improvement of the utility model, be connected to a hydrogen peroxide adding trough of microetch liquid medicine tank, and
It is connected by a hydrogen peroxide adding tube between the hydrogen peroxide adding trough and microetch liquid medicine tank, is provided in the hydrogen peroxide adding tube
One second water pump.
Hydrogen peroxide removing is connected between the overflow launder and electrolytic cell as a further improvement of the utility model,
Slot.
Further include the filter pump being set on microetch liquid medicine tank as a further improvement of the utility model, be connected to
One filtered water inlet manifold of microetch liquid medicine tank and the filtering outfall sewer above filtered water inlet manifold, wherein the filtering
Pump is connected to filtered water inlet manifold by a filtered water inlet branch pipe, while the filter pump was connected to by a filtering exit branch
Supply mains is filtered out, and a ball valve is respectively arranged with on filtering exit branch in the filtered water inlet branch pipe.
The beneficial effects of the utility model are:
(1) obtain in microetch liquid medicine tank content of copper ion in liquid medicine by copper ion tester or other modes, when copper from
It when sub- content is too low or excessively high, is combined with the first water pump by liquid medicine adding trough, liquid medicine is added in microetch liquid medicine tank, and will surpass
The liquid medicine for crossing initial liquid level is spilled over in overflow launder, i.e., it is undesirable to replace original content of copper ion by the liquid medicine being newly added
Useless liquid medicine, so that liquid level in microetch liquid medicine tank is remained stable, and the content of copper ion of internal liquid medicine meets the requirements always.
(2) high-purity copper in useless liquid medicine is extracted by electrolysis principle by electrolytic cell, and is matched again by liquid medicine regeneration tank
Satisfactory liquid medicine is set out, to realize the recycling of whole system liquid medicine, reduces cost, energy-saving and emission-reduction.
Above-mentioned is the general introduction of utility model technical solution, below in conjunction with attached drawing and specific implementation mode, to the utility model
It is described further.
Description of the drawings
Fig. 1 is a part of structural schematic diagram of the utility model;
Fig. 2 is another part structural schematic diagram of the utility model.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose is taken, below in conjunction with
Specific embodiment of the present utility model is described in detail in attached drawing and preferred embodiment.
Fig. 1 and Fig. 2 are please referred to, the utility model embodiment provides a kind of pcb board plating microetch device, including a microetch medicine
Water vat 1, the microetch being set on microetch liquid medicine tank 1 pump 2, be connected to 1 side of microetch liquid medicine tank a liquid medicine adding trough 3 and
It is connected to an overflow launder 4 of 1 other side of microetch liquid medicine tank, wherein pass through one between the liquid medicine adding trough 3 and microetch liquid medicine tank 1
Liquid medicine adding tube 31 connects, and one first water pump 311 is provided in the liquid medicine adding tube 31.
In the present embodiment, a copper ion tester is provided on the microetch liquid medicine tank 1.By copper ion tester or
Content of copper ion is added when content of copper ion is too low or excessively high by liquid medicine in liquid medicine in other modes acquisition microetch liquid medicine tank 1
Slot 3 is combined with the first water pump 311, and liquid medicine is added in the microetch liquid medicine tank 1, makes in microetch liquid medicine tank 1 content of copper ion always
It is maintained at specific range, in the present embodiment, the general microetch that is electroplated needs content of copper ion within the scope of 35 ɡ/L-40 ɡ/L.
Meanwhile while liquid medicine is added in microetch liquid medicine tank 1, the amount of liquid in microetch liquid medicine tank 1 is excessive, then liquid is spilled over to excessive
In chute 4, i.e., the undesirable liquid of original content of copper ion is replaced by the liquid medicine being newly added, made in microetch liquid medicine tank 1
Liquid level remains stable, and the content of copper ion of internal liquid medicine meets the requirements always.
As further improvement of this embodiment, it further includes the electrolysis for being connected to overflow launder 4 that microetch device, which is electroplated, in pcb board
Slot 5 and the liquid medicine regeneration tank 6 being connected between electrolytic cell 5 and liquid medicine adding trough 1.It is extracted by electrolysis principle by electrolytic cell 5
Go out the high-purity copper in useless liquid medicine, and satisfactory liquid medicine is reconfigured out by liquid medicine regeneration tank 6, to realize that recycling is sharp again
With, reduction cost, energy-saving and emission-reduction.
Meanwhile pcb board plating microetch device further includes being connected to a hydrogen peroxide adding trough 7 of microetch liquid medicine tank 1, and this pair
It is connected by a hydrogen peroxide adding tube 71 between oxygen water adding trough 7 and microetch liquid medicine tank 1, is arranged in the hydrogen peroxide adding tube 71
There is one second water pump 711;Meanwhile it being connected with a hydrogen peroxide between the overflow launder 4 and electrolytic cell 5 and removes slot 8.Pass through addition
Hydrogen peroxide and stabilizer ensure that other components have defined content, and before electrolysis, slot 8 is removed by useless medicine by hydrogen peroxide
Hydrogen peroxide removal in water, when convenient for electrolysis, useless liquid medicine will not be attacked and etch the cathode plate in electrolytic cell.
As further improvement of this embodiment, it further includes being set on microetch liquid medicine tank 1 that microetch device, which is electroplated, in pcb board
One filter pump 9, the filtered water inlet manifold 91 for being connected to microetch liquid medicine tank 1 and the mistake above filtered water inlet manifold 91
Filter out supply mains 92, wherein the filter pump 9 is connected to filtered water inlet manifold 91, while the mistake by a filtered water inlet branch pipe 93
Filter pump 9 is connected to filtering outfall sewer 92 by a filtering exit branch 94, and is discharged in the filtered water inlet branch pipe 93 and filtering
A ball valve (931,941) is respectively arranged on branch pipe 94.By the filter pump 9 added, after to use in microetch liquid medicine tank 1
Useless liquid medicine is filtered, and is discharged again after filtering or recycling, and useless liquid medicine direct emission is prevented, and reduces blowdown flow rate, environmental protection section
Energy.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore identical as the utility model above-described embodiment or approximate technical characteristic is used, and obtained other structures,
It is within the protection scope of the utility model.
Claims (6)
1. microetch device, including a microetch liquid medicine tank is electroplated in a kind of pcb board, which is characterized in that further include being set to microetch liquid medicine
A microetch on cylinder pumps, is connected to a liquid medicine adding trough of microetch liquid medicine tank side and is connected to the microetch liquid medicine tank other side
One overflow launder, wherein connected by a liquid medicine adding tube between the liquid medicine adding trough and microetch liquid medicine tank, in the liquid medicine adding tube
On be provided with one first water pump.
2. microetch device is electroplated in pcb board according to claim 1, which is characterized in that be arranged on the microetch liquid medicine tank
There is a copper ion tester.
3. microetch device is electroplated in pcb board according to claim 1, which is characterized in that further include be connected to overflow launder one
Electrolytic cell and the liquid medicine regeneration tank being connected between electrolytic cell and liquid medicine adding trough.
4. microetch device is electroplated in pcb board according to claim 3, which is characterized in that further include being connected to microetch liquid medicine tank
A hydrogen peroxide adding trough, and between the hydrogen peroxide adding trough and microetch liquid medicine tank by a hydrogen peroxide adding tube connect, at this
One second water pump is provided in hydrogen peroxide adding tube.
5. microetch device is electroplated in pcb board according to claim 4, which is characterized in that the overflow launder and electrolytic cell it
Between be connected with a hydrogen peroxide remove slot.
6. microetch device is electroplated according to any pcb board in claim 1 to 5, which is characterized in that further include be set to it is micro-
It loses the filter pump on liquid medicine tank, be connected to a filtered water inlet manifold of microetch liquid medicine tank and above filtered water inlet manifold
One filtering outfall sewer, wherein the filter pump is connected to filtered water inlet manifold, while the filtering by a filtered water inlet branch pipe
Pump is connected to filtering outfall sewer by a filtering exit branch, and distinguishes on filtering exit branch in the filtered water inlet branch pipe
It is provided with a ball valve.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820229393.7U CN207998640U (en) | 2018-02-09 | 2018-02-09 | A kind of pcb board plating microetch device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820229393.7U CN207998640U (en) | 2018-02-09 | 2018-02-09 | A kind of pcb board plating microetch device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207998640U true CN207998640U (en) | 2018-10-23 |
Family
ID=63837381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820229393.7U Expired - Fee Related CN207998640U (en) | 2018-02-09 | 2018-02-09 | A kind of pcb board plating microetch device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207998640U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110528042A (en) * | 2019-08-28 | 2019-12-03 | 深圳赛意法微电子有限公司 | A kind of semiconductor devices electro-plating method and the activated bath for plating |
-
2018
- 2018-02-09 CN CN201820229393.7U patent/CN207998640U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110528042A (en) * | 2019-08-28 | 2019-12-03 | 深圳赛意法微电子有限公司 | A kind of semiconductor devices electro-plating method and the activated bath for plating |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101830587B (en) | Process and device for processing heavy metal wastewater | |
CN103288172B (en) | PCB etches the recoverying and utilizing method washing plate waste water that workshop section produces | |
CN202499915U (en) | Acid etching waste liquid copper recovery system | |
CN104630825A (en) | Device and process for electrolytically extracting copper in acidic etching liquid | |
CN104080278B (en) | The production technology of wiring board conductive polymer fenestra technique and its collocation graphic plating | |
CN109252168A (en) | A kind of devices and methods therefor of efficient activated acid etching solution | |
CN1869289B (en) | Zero drainage circulation ultilization process and equipment of electroplate waste water | |
CN207998640U (en) | A kind of pcb board plating microetch device | |
CN202440550U (en) | Alkaline etching liquid recycling and regenerating system | |
CN204151415U (en) | A kind of regenerating alkaline etching liquid circulating production line | |
CN203307132U (en) | System capable of realizing electroplating rinsing zero emission and electroplating liquid recovery | |
CN103628064A (en) | Recycling system of acid etching liquid | |
CN201704154U (en) | Integrated PCB cupric waste liquid treatment system | |
CN110029373A (en) | A kind of compound additive for eliminating the unusual coarsening crystallization of electrolytic copper foil | |
CN103436916B (en) | A kind of technique and device reclaiming smart copper from Low copper content wastewater | |
CN110093606A (en) | A kind of etching solution and preparation method thereof for pcb board | |
CN104862769A (en) | Electroplate liquid circulating filtration system | |
CN211339693U (en) | Alkaline copper-containing etching waste liquid regeneration and ammonia nitrogen wastewater circulation system | |
CN104120428A (en) | Recyclable micro etching chemical treatment agent on surface of copper/copper alloy | |
CN204417260U (en) | A kind for the treatment of system of lower concentration copper-containing wastewater | |
JP3301341B2 (en) | Surface roughening equipment | |
CN207391167U (en) | A kind of alkali etching line washing section waste water reclamation system | |
CN113373484A (en) | Manufacturing method for solving problem of uneven inflation of copper groove of vertical plating line | |
EP1165861A1 (en) | Copper recovery process | |
CN203923436U (en) | Processing circuitry board industry plate is worn out online cyclic electrolysis and the water washing device of plating solution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181023 |
|
CF01 | Termination of patent right due to non-payment of annual fee |