CN207927116U - A kind of step type radiator - Google Patents
A kind of step type radiator Download PDFInfo
- Publication number
- CN207927116U CN207927116U CN201820132985.7U CN201820132985U CN207927116U CN 207927116 U CN207927116 U CN 207927116U CN 201820132985 U CN201820132985 U CN 201820132985U CN 207927116 U CN207927116 U CN 207927116U
- Authority
- CN
- China
- Prior art keywords
- cooling fin
- heat
- height
- conducting plate
- along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of stepped radiators, including:Heat-conducting plate, one side surface are bonded with heater element, and to absorb the heat of heater element, the shape of heat-conducting plate is corresponding with the shape of heater element;Multiple cooling fins are formed in another side surface of heat-conducting plate, and multiple cooling fins are arranged along first direction parallel interval, and each cooling fin extends along the second direction vertical with the first direction on another side surface of heat-conducting plate;Wherein, the height of each cooling fin is along second direction step variation.What the height of the cooling fin of the utility model was not constant between on the extending direction of cooling fin, but it is in step variation, it is variation that the difference of height at the different location of cooling fin, which leads to cooling fin area in their extension direction, the heat dissipation area (being realized by adjusting the height of cooling fin) for so corresponding to the variation adjustment cooling fin of the environment temperature in apparatus casing, to realize the effect of the environment temperature in equalizing equipment shell.
Description
Technical field
The utility model is related to technical field of heat dissipation, more particularly, to a kind of ladder for block chain server
Type radiator.
Background technology
The heat dissipation effect of block chain server depends greatly on the size and structure of radiator, with block
Youngster's chain server single machine calculates steeply rising for force and work consumption, and single machine size and weight are controlled again in more reasonable range,
The structure optimization of block chain server internal radiator is just important at one of the optimization of block chain server radiating performance
Direction.
The calculation power module of block chain server internal is made of the repetition parallel connection of a large amount of mutually isostructural element circuits
, only when all element circuits are all operated under optimal environment temperature, block chain server competence exertion goes out most
Big computing capability.But the heat spreader structures being distributed in current block chain server are identical, then lead to block chain
Temperature is low at the air intake vent of server, and temperature is high at air outlet, and bulk temperature is uneven to cause block chain server that can not send out
Wave maximum capacity.
Utility model content
The purpose of this utility model is to propose a kind of stepped radiator for block chain server, according to block
The Temperature Distribution feature of youngster's chain server internal takes ladder pattern distribution, to realize the temperature equalization of block chain server internal
Effect.
Embodiment according to the present utility model proposes a kind of stepped radiator, including:
Heat-conducting plate, one side surface are bonded with heater element, to absorb the heat of the heater element, the heat-conducting plate
Shape is corresponding with the shape of the heater element;
Multiple cooling fins, the multiple cooling fin are formed in another side surface of the heat-conducting plate, the multiple cooling fin
It is arranged along first direction parallel interval, each cooling fin is along the second direction vertical with the first direction in the heat-conducting plate
Extend on another side surface;
Wherein, the height of each cooling fin is along the second direction step variation.
Preferably, the heater element is located in a shell, and the shell has air intake vent and air outlet, the second party
To being cooling medium from the air intake vent towards the flow direction of the air outlet.
Preferably, the height of each cooling fin increases along the second direction staged.
Preferably, the height of each cooling fin has at least two-stage ladder along the second direction.
Preferably, the height of the two neighboring ladder of each cooling fin is identical or different.
Preferably, the length of the two neighboring ladder of each cooling fin in this second direction is identical or different.
Preferably, further comprise interconnecting piece, the interconnecting piece is bonded another side surface of the heat-conducting plate, the multiple
Cooling fin is formed on the interconnecting piece.
Preferably, the interconnecting piece along length and the heat-conducting plate of the second direction along the second direction
Length is identical, and the interconnecting piece is less than width of the heat-conducting plate along the first direction along the width of the first direction
Degree, the both ends along the first direction of the heat-conducting plate are respectively provided with the edge part at the both ends for protruding from the interconnecting piece.
Preferably, in this second direction, the front end of each cooling fin is concordant or uneven with the front end of the interconnecting piece
Together.
Preferably, the height of the interconnecting piece and the height of the heat-conducting plate are equal or unequal.
It can be seen from the above technical proposal that the height of the cooling fin in the present embodiment on the extending direction of cooling fin not
It is invariable, but is in step variation, the difference of the height at the different location of cooling fin causes cooling fin area to exist
It is variation on its extending direction, then the heat dissipation area of the variation adjustment cooling fin corresponding to the environment temperature in apparatus casing
(being realized by adjusting the height of cooling fin), to realize the effect of the environment temperature in equalizing equipment shell.
Specifically, for the lower region of coolant temperature, the height of cooling fin is smaller, the area of corresponding cooling fin
It is smaller, then cool down the speed that the temperature that the heat that medium is absorbed from cooling fin reduces, and then slows down heater element in the region declines
Degree;And for the higher region of coolant temperature, the height of cooling fin is larger, and the area of corresponding cooling fin is larger, then cold
But the heat that medium is absorbed from cooling fin increases, and then the speed that the temperature for accelerating heater element in the region declines.Pass through this
Sample, on the extending direction of cooling fin, that is, on the flow direction of cooling medium, the temperature changing speed of cooling medium is compared
It is substantially reduced for the cooling fin of constant height so that the Temperature Distribution equalization in apparatus casing so that heater element
Heat dissipation effect on the flow direction of cooling medium evenly, temperature difference smaller.
Description of the drawings
The following drawings only does schematic illustration and explanation to the utility model, does not limit the scope of the utility model.
Fig. 1 is the structural schematic diagram of the stepped radiator of the utility model embodiment.
Fig. 2 is the vertical view of the stepped radiator of the utility model embodiment.
Fig. 3 is the side view of the stepped radiator of the utility model embodiment.
Specific implementation mode
In order to which the technical features, objects and effects to utility model are more clearly understood, now control illustrates this
The specific implementation mode of utility model, in the various figures identical label indicate identical part.
It is succinct and intuitive in order to what is described, hereafter by describing several representative embodiments come to the utility model
Scheme be illustrated.A large amount of details is only used for helping to understand the embodiment of the utility model in embodiment.However, it will be apparent that
The technical solution of the utility model can be not limited to these details when realizing.It is new in order to avoid unnecessarily having obscured this practicality
The scheme of type, some embodiments are not described meticulously, but only give frame.Hereinafter, " comprising " refers to " packet
Include but be not limited to ", " according to ... " refer to " according at least to ..., but be not limited to according only to ... ".Since the language of Chinese is practised
It is used, when being hereinafter not specifically stated the quantity of an ingredient, it is meant that the ingredient is either one or more, or can
It is interpreted as at least one.
Fig. 1 is the structural schematic diagram of the stepped radiator of the utility model embodiment.As shown in Figure 1, the present embodiment
A kind of step type radiator, including:
Heat-conducting plate 10, one side surface are bonded with heater element (not shown), to absorb the heat of heater element, heat-conducting plate
10 shape is corresponding with the shape of heater element, fully absorbs heat so that heater element is completely covered, such as heat-conducting plate 10 can
It is bonded with heater element with lower surface shown in Fig. 1;With
Multiple cooling fins 20, cooling fin 20 are formed in another side surface of heat-conducting plate 10, the consistent multiple cooling fins of shape
20 arrange along first direction X parallel intervals, and each cooling fin 20 is along the second direction Y vertical with first direction X in heat conduction
Extend on another side surface of plate 10, which is the side surface relative to the surface being bonded with heater element;
Wherein, the height of each cooling fin 20 is in step variation along second direction Y.
In the present embodiment, the heat that 10 spontaneous thermal element of heat-conducting plate absorbs is distributed by cooling fin 20, multiple cooling fins
It is alternatively arranged on 20 first direction X shown in Fig. 1, cooling medium (for example, moving air in air cooling way) is along scattered
The extending direction Y-direction of backing 20, the gap between cooling fin 20 are passed through, and realize that heat is handed over by the contact with cooling fin 20
It changes.
Wherein, although the heating temperature of heater element is equally distributed, in the flow direction of cooling medium ---
In second direction Y-direction, Temperature Distribution is non-uniform, and in the upstream portion of second direction Y, i.e., cooling medium initial contact dissipates
When backing 20, the temperature of cooling medium is relatively low, and in the downstream part of second direction Y, with cooling medium and cooling fin
The heat of 20 contact area and the increase of time of contact, cooling Absorption of Medium increases, and causes the temperature of cooling medium higher.It is logical
In the case of often, heater element is located in the shell of equipment, and the non-uniform Temperature Distribution of cooling medium leads to the temperature of enclosure interior
Spend it is uneven, to which the operating ambient temperature for influencing heater element is uneven, so influence heater element operating temperature.
What the height of the cooling fin 20 in the present embodiment was not constant between in the extending direction Y-direction of cooling fin 20,
But be in step variation, the difference of the height at the different location of cooling fin 20 causes 20 area of cooling fin in its extending direction
It is variation in Y-direction, then (logical corresponding to the heat dissipation area of the variation adjustment cooling fin 20 of the environment temperature in apparatus casing
Cross the height of adjustment cooling fin 20 and realize), to realize the effect of the environment temperature in equalizing equipment shell.
Specifically, for the lower region of coolant temperature, the height of cooling fin 20 is smaller, corresponding cooling fin 20
Area is smaller, then cools down the heat that medium is absorbed from cooling fin 20 and reduce, and then slow down in the region at a temperature of heater element
The speed of drop;And for the higher region of coolant temperature, the height of cooling fin 20 is larger, the area of corresponding cooling fin 20
It is larger, then cool down what the temperature that the heat that medium is absorbed from cooling fin 20 increases, and then accelerates heater element in the region declined
Speed.In this way, in the extending direction of cooling fin 20 --- on second direction Y, that is, on the flow direction of cooling medium,
The temperature changing speed of cooling medium for the cooling fin of constant height compared to being substantially reduced so that the temperature in apparatus casing
Distributing equilibrium so that the heat dissipation effect of heater element on the flow direction of cooling medium evenly, temperature difference smaller.
The radiator of the present embodiment especially suitable for the data with high operational capability of such as block chain server at
Device is managed, in such a device, there is the densely arranged a large amount of operation chip being carried on printed circuit board (PCB), PCB
Plate is the heater element of an entirety, is evenly or unevenly distributed multiple small heater elements thereon, then uneven inside equipment
Even heat distribution can cause different operation chips that may be operated under different environment temperatures, and then lead to operation chip
Working performance it is inconsistent.And the radiator of the present embodiment passes through change cooling fin 20 on the flow direction of cooling medium
The heat dissipation area for highly changing cooling fin 20 and cooling media contact, to realize the heat to cooling fin and cooling Medium Exchange
The adjustment of amount and heat exchange speed.
Specifically, the lower region of coolant temperature by reduce cooling fin heat dissipation area by reduce cooling fin with
The heat of cooling Medium Exchange, the speed for reducing heat exchange, and radiated in the higher region of coolant temperature by increasing
The heat dissipation area of piece and increase the heat of cooling fin and cooling Medium Exchange, improve the speed of heat exchange so that be situated between cooling
In the heat exchanging process of matter and cooling fin, temperature change tends towards stability, and heat dissipation effect is more uniform, temperature difference smaller, to be more
The small heater element of a dispersion provides consistent working environment.
Specifically, as described above, heater element is located in a shell (not shown), which has air intake vent and outlet air
Mouthful, second direction Y is flow direction of the cooling medium from air intake vent towards air outlet.Correspondingly, as shown in figures 1 and 3, each
The height of cooling fin 20 increases along second direction Y stageds, i.e., cooling fin 20 is high at the position of the air intake vent of shell
Degree is smaller, highly larger at the position of the air outlet of shell.
According to the profiling temperatures of different heater elements, the height change of cooling fin 20 can carry out as the case may be
Adjustment.Specifically, in order to realize the higher adjusting of susceptibility, the height of each cooling fin 20 has at least along second direction Y
Two-stage ladder.Show that each cooling fin 20 has the case where three-level ladder on second direction Y in Fig. 1 to Fig. 3, but it can
With less or more grade of ladder.
Correspondingly, in order to realize the adjustment of the heat dissipation area to cooling fin 20, the two neighboring ladder of each cooling fin 20
Height it is identical or different, and length of the two neighboring ladder of each cooling fin 20 on second direction Y is identical or different.
Specifically, by taking the cooling fin 20 with three-level ladder shown in Fig. 3 as an example, the height of first order ladder 21 is
H1, the length on second direction Y are L1;The height of second level ladder 22 is H2, and the length on second direction Y is L2,
Here, the height of second level ladder 22 is the increased height on the basis of height of first order ladder 21;Third level ladder 23
Height is H3, and the length on second direction Y is L3, and herein, the height of third level ladder 23 is in second level ladder 22
Increased height on the basis of height.Wherein, H1, H2, H3 can mutually the same, different from each other or a portion it is identical;It is similar
Ground, L1, L2, L3 can mutually the same, different from each other or a portion it is identical, to obtain different on second direction Y dissipate
Hot area distributions.
Further, as depicted in figs. 1 and 2, the stepped radiator of the present embodiment further comprises interconnecting piece 30, connection
Portion 30 is bonded another side surface of heat-conducting plate 10, and multiple cooling fins 20 are formed on interconnecting piece 30.
Further, interconnecting piece 30 along second direction Y length L ' and heat-conducting plate 10 along second direction Y length L
Identical, the width W ' of the X along a first direction of interconnecting piece 30 is less than the width W of the X along a first direction of heat-conducting plate 10, heat-conducting plate 10
The both ends of X are respectively provided with the edge part 11 at the both ends for protruding from interconnecting piece 30 along a first direction.
Interconnecting piece 30 formed cooling fin 20 support platform, one of cooling fin 20 may be formed at interconnecting piece 30 along
The edge of first direction X, and due to the presence of edge part 11, the cooling fin 20 and be not formed in heat-conducting plate 10 along first
The edge of direction X, so that there are cooling in the cooling fin both sides for being formed in the edge of the X along a first direction of interconnecting piece 30
Medium passes through, and influences its performance to radiate to avoid due to being formed in marginal position, and simplification is formed in interconnecting piece 30
The positioning difficulty of the cooling fin of the edge of X in process along a first direction.
Wherein, on second direction Y, the front end of each cooling fin 20 is concordant with the front end of interconnecting piece 30 or not concordant.This
In so-called front end be close to equipment air intake vent one end.When the front end of cooling fin 20 and the not concordant front end of interconnecting piece 30,
The front end of situation i.e. as shown in figures 1 and 3, interconnecting piece 30 is formed as the step that height is less than cooling fin 20, leads to
Heat exchange is realized with media contact is cooled down in the upper surface for crossing interconnecting piece 30.Although being not shown in figure front end and the company of cooling fin 20
The concordant situation in the front end of socket part 30, but its effect is similar with Fig. 1 and situation shown in Fig. 3.Specifically, the height of interconnecting piece 30
Degree is equal or unequal with the height of heat-conducting plate 10.
The height of the cooling fin of the utility model be can be seen that by above-mentioned specific embodiment in the extension side of cooling fin
It is not constant between upwards, but is in step variation, the difference of the height at the different location of cooling fin leads to cooling fin
Area is variation in their extension direction, then the variation corresponding to the environment temperature in apparatus casing adjusts dissipating for cooling fin
Hot area (being realized by adjusting the height of cooling fin), to realize the effect of the environment temperature in equalizing equipment shell.
Specifically, for the lower region of coolant temperature, the height of cooling fin is smaller, the area of corresponding cooling fin
It is smaller, then cool down the speed that the temperature that the heat that medium is absorbed from cooling fin reduces, and then slows down heater element in the region declines
Degree;And for the higher region of coolant temperature, the height of cooling fin is larger, and the area of corresponding cooling fin is larger, then cold
But the heat that medium is absorbed from cooling fin increases, and then the speed that the temperature for accelerating heater element in the region declines.Pass through this
Sample, on the extending direction of cooling fin, that is, on the flow direction of cooling medium, the temperature changing speed of cooling medium is compared
It is substantially reduced for the cooling fin of constant height so that the Temperature Distribution equalization in apparatus casing so that heater element
Heat dissipation effect on the flow direction of cooling medium evenly, temperature difference smaller.
Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model
Body explanation, and not to limit the scope of protection of the utility model, it is all without departing from made by the utility model skill spirit etc.
Effect embodiment or change should be included within the scope of protection of this utility model such as the combination, segmentation or repetition of feature.
Claims (10)
1. a kind of step type radiator, which is characterized in that including:
Heat-conducting plate (10), one side surface are bonded with heater element, to absorb the heat of the heater element, the heat-conducting plate
(10) shape is corresponding with the shape of the heater element;
Multiple cooling fins (20), the multiple cooling fin (20) is formed in another side surface of the heat-conducting plate (10), described more
A cooling fin (20) arranges along first direction (X) parallel interval, and each cooling fin (20) is along vertical with first direction (X)
Second direction (Y) extends on another side surface of the heat-conducting plate (10);
Wherein, the height of each cooling fin is along the second direction (Y) step variation.
2. step type radiator as described in claim 1, which is characterized in that the heater element is located in a shell, described
It is to cool down medium from the air intake vent towards the air outlet that shell, which has air intake vent and air outlet, the second direction (Y),
Flow direction.
3. step type radiator as claimed in claim 2, which is characterized in that the height of each cooling fin (20) is along described the
Two directions (Y) staged increases.
4. the stepped radiator as described in any claim in claims 1 to 3, which is characterized in that each cooling fin
(20) height has at least two-stage ladder along the second direction (Y).
5. step type radiator as claimed in claim 4, which is characterized in that the two neighboring ladder of each cooling fin (20)
It is highly identical or different.
6. step type radiator as claimed in claim 4, which is characterized in that the two neighboring ladder of each cooling fin (20) exists
Length on the second direction (Y) is identical or different.
7. the stepped radiator as described in any claim in claims 1 to 3, which is characterized in that further comprise connecting
Socket part (30), the interconnecting piece (30) are bonded another side surface of the heat-conducting plate (10), and the multiple cooling fin (20) is formed
On the interconnecting piece (30).
8. step type radiator as claimed in claim 7, which is characterized in that the interconnecting piece (30) is along the second direction
(Y) length is identical along the length of the second direction (Y) as the heat-conducting plate (10), and the interconnecting piece (30) is along described
The width of first direction (X) is less than width of the heat-conducting plate (10) along the first direction (X), the heat-conducting plate (10)
The edge part (11) at the both ends for protruding from the interconnecting piece (30) is respectively provided with along the both ends of the first direction (X).
9. step type radiator as claimed in claim 8, which is characterized in that in the second direction (Y), each cooling fin
(20) front end is concordant with the front end of the interconnecting piece (30) or not concordant.
10. step type radiator as claimed in claim 7, which is characterized in that the height of the interconnecting piece (30) is led with described
The height of hot plate (10) is equal or unequal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820132985.7U CN207927116U (en) | 2018-01-26 | 2018-01-26 | A kind of step type radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820132985.7U CN207927116U (en) | 2018-01-26 | 2018-01-26 | A kind of step type radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207927116U true CN207927116U (en) | 2018-09-28 |
Family
ID=63605343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820132985.7U Active CN207927116U (en) | 2018-01-26 | 2018-01-26 | A kind of step type radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207927116U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110536588A (en) * | 2019-08-20 | 2019-12-03 | 东软医疗***股份有限公司 | Detector and medical scanning equipment |
CN111578757A (en) * | 2020-04-15 | 2020-08-25 | 奥格生物技术(六安)有限公司 | Hot and humid waste gas heat recovery circulating device of complete feed production unit |
US20210127524A1 (en) * | 2019-10-23 | 2021-04-29 | Lumentum Operations Llc | Progressive heatsink |
CN113552392A (en) * | 2020-04-24 | 2021-10-26 | 鸿劲精密股份有限公司 | Temperature conduction device, crimping mechanism and test classification equipment thereof |
CN113552391A (en) * | 2020-04-24 | 2021-10-26 | 鸿劲精密股份有限公司 | Temperature conduction device and crimping mechanism, precooler and test classification equipment thereof |
WO2024077761A1 (en) * | 2022-10-10 | 2024-04-18 | 南方电网科学研究院有限责任公司 | Heat dissipation apparatus used in gas-liquid mixed medium and preparation method therefor |
-
2018
- 2018-01-26 CN CN201820132985.7U patent/CN207927116U/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110536588A (en) * | 2019-08-20 | 2019-12-03 | 东软医疗***股份有限公司 | Detector and medical scanning equipment |
CN110536588B (en) * | 2019-08-20 | 2022-05-06 | 东软医疗***股份有限公司 | Detector and medical scanning equipment |
US20210127524A1 (en) * | 2019-10-23 | 2021-04-29 | Lumentum Operations Llc | Progressive heatsink |
US11937403B2 (en) * | 2019-10-23 | 2024-03-19 | Lumentum Operations Llc | Progressive heatsink |
CN111578757A (en) * | 2020-04-15 | 2020-08-25 | 奥格生物技术(六安)有限公司 | Hot and humid waste gas heat recovery circulating device of complete feed production unit |
CN113552392A (en) * | 2020-04-24 | 2021-10-26 | 鸿劲精密股份有限公司 | Temperature conduction device, crimping mechanism and test classification equipment thereof |
CN113552391A (en) * | 2020-04-24 | 2021-10-26 | 鸿劲精密股份有限公司 | Temperature conduction device and crimping mechanism, precooler and test classification equipment thereof |
WO2024077761A1 (en) * | 2022-10-10 | 2024-04-18 | 南方电网科学研究院有限责任公司 | Heat dissipation apparatus used in gas-liquid mixed medium and preparation method therefor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207927116U (en) | A kind of step type radiator | |
CN208044515U (en) | A kind of gradient type radiator | |
US8154869B2 (en) | Method and device for cooling heat-generating computer components | |
CN2696124Y (en) | Heat sink | |
TW201143590A (en) | Heat dissipation device | |
WO2020062253A1 (en) | Circuit board, computing device and cooling case | |
CN108153401A (en) | A kind of computer server radiator | |
US7248479B2 (en) | Thermal management for hot-swappable module | |
CN100499977C (en) | Heat sink | |
US20050063159A1 (en) | Heat-dissipating fin module | |
CN207674759U (en) | A kind of semiconductor cooling device | |
KR100908333B1 (en) | Heat radiation device using foamed metal | |
CN106371535B (en) | Parallel CPU heat dissipation cooling device | |
CN209626206U (en) | A kind of semiconductor chip radiator | |
JP2004537869A (en) | Heat dissipation system | |
CN113892307A (en) | Decoupled conduction/convection dual heat sink for on-board memory microcontroller | |
KR101880478B1 (en) | Radiating apparatus | |
CN209879240U (en) | Heat dissipation mechanism of projector | |
CN204390151U (en) | A kind of air-cooled heat-pipe radiator | |
CN207909067U (en) | A kind of computer server radiator | |
CN205750682U (en) | Server | |
JPH0412559A (en) | Cooling structure of electronic device | |
CN105676976A (en) | High-performance radiator | |
CN211827152U (en) | CPU installation module and active and passive integrated heat dissipation structure of CPU | |
CN209030504U (en) | A kind of convex type fin radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |