CN113552392A - Temperature conduction device, crimping mechanism and test classification equipment thereof - Google Patents
Temperature conduction device, crimping mechanism and test classification equipment thereof Download PDFInfo
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- CN113552392A CN113552392A CN202010330074.7A CN202010330074A CN113552392A CN 113552392 A CN113552392 A CN 113552392A CN 202010330074 A CN202010330074 A CN 202010330074A CN 113552392 A CN113552392 A CN 113552392A
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- temperature
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- conduction device
- temperature conduction
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- 238000012360 testing method Methods 0.000 title claims abstract description 58
- 230000007246 mechanism Effects 0.000 title claims abstract description 34
- 238000002788 crimping Methods 0.000 title claims abstract description 19
- 239000012530 fluid Substances 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 description 19
- 238000001816 cooling Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 238000013021 overheating Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a temperature conduction device, a crimping mechanism and test classification equipment thereof. The butting surface of the base comprises a central area and an outer area, the guide block protrudes from the butting surface, wherein the height of the guide block protruding from the butting surface in the central area is greater than the height of the guide block protruding from the butting surface in the outer area, and an open area for flowing of the low-temperature conductor is formed above the guide block in the outer area, so that part of the low-temperature fluid can leave the accommodating groove through the open area, so that the conduction high heat at the central position of the temperature conduction device can be quickly taken away, the heat exchange at the peripheral position of the temperature conduction device is reduced, the energy waste is avoided, and the cost consumed for maintaining the low temperature of the fluid is further saved.
Description
Technical Field
The present invention relates to a temperature conduction device, and more particularly, to a temperature conduction device for conducting the temperature of a fluid medium to an electronic component.
Background
The test operation of the electronic component needs to be tested within a preset test temperature range, when the test operation is executed, a pressing mechanism above the test device is utilized to press the electronic component, so that the contact of the electronic component is really contacted with the test seat to execute the test operation, and because the temperature of the electronic component can be increased in the test process, in order to prevent the electronic component from overheating and influencing the test qualification rate, a presser capable of reducing the temperature of the electronic component is arranged on the pressing mechanism, and the high heat of the electronic component can be rapidly diffused to ensure the test quality of the electronic component.
Referring to fig. 1, which is a schematic diagram of a conventional hold-down mechanism 70 and a testing apparatus 80, the hold-down mechanism 70 is located above the testing apparatus 80, the hold-down mechanism 70 has a hold-down rod 71 and a hold-down device 72, the hold-down device 72 has a hold-down part 721, a cooling part 722 and a conductive part 723, the hold-down part 721 is convexly provided with a hold-down portion 7211, the cooling part 722 has a groove 7221, an input port for a cryogenic fluid is provided in the center of the top surface of the groove 7221, an output port for the cryogenic fluid is provided around the top surface of the groove 7221, the conductive part 723 has a base plate 7231 and a plurality of guide posts 7232, the plurality of guide posts 7232 are arranged at intervals on the base plate 7231, the groove 7221 of the hold-down part 722 receives the guide posts 7232 of the conductive part 723, and the guide posts 7232 are abutted upwards against the top surface of the groove 7221, the testing apparatus 80 has a tester, which includes an electrically connected circuit board 81 and a testing seat 82 for performing testing operation on an electronic device.
In view of the above, the pressing rod 71 of the pressing mechanism 70 drives the pressing member 72 to move downward in the Z direction, so that the pressing portion 7211 of the pressing member 72 presses against the electronic device 90, thereby ensuring that the electronic device 90 is electrically connected to the tester and facilitating the testing operation. In addition, the cryogenic fluid flows into the groove 7221 through the center of the top surface of the groove 7221, so that the cryogenic fluid flows among the plurality of guide posts 7232 of the conducting element 723 for heat exchange, and the cryogenic fluid after heat exchange can leave the groove 7221 through the output port of the top surface of the groove 7221.
As mentioned above, since the pressing member 721 directly presses the electronic element 90 with the protruded pressing portion 7211, and the high heat of the electronic element 90 is directly conducted to the central position of the conductive member 723 (i.e. the position of the conductive member 723 relative to the pressing portion 7211) through the pressing portion 7211 of the pressing member 721, so that the high heat conducted by the electronic element 90 is concentrated on the central position of the conductive member 723 instead of being uniformly dispersed on the whole conductive member 723, the central position of the conductive member 723 must have a good heat dissipation and temperature reduction effect to rapidly reduce the temperature of the electronic element 90, and the peripheral position of the conductive member 723 has a lower temperature than the central position, and the distance from the electronic element 90 is relatively long, so that the cooling effect on the electronic element 90 is limited, and the requirement for heat dissipation and temperature reduction is low.
In addition, the plurality of guide posts 7232 of the conducting member 723 have the same height (i.e., the length of the guide posts 7232 perpendicular to the base plate 7231), and the plurality of guide posts 7232 of the conducting member 723 are all abutted upward against the top surface of the groove 7221, so that all the cryogenic fluid flows in the gap between the guide posts 7232 in the whole process from flowing into the groove 7221 to leaving from the groove 7221, therefore, the central position of the conducting member 723 with high heat dissipation requirement can rapidly exchange heat and cold with the cryogenic fluid to rapidly reduce the temperature of the electronic element 90, however, when the cryogenic fluid flows through the peripheral position of the conducting member 723 with low heat dissipation requirement, the cryogenic fluid still needs to pass through the gap between the plurality of guide posts 7232 to leave the groove 7221, and the cooling effect of the electronic element 90 by the heat exchange is not great, which not only causes energy waste and increases the cost for maintaining the low temperature of the fluid, the life of the cooling device is more likely to be shortened, and improvements are sought to be solved.
Disclosure of Invention
One aspect of the present invention is to provide a pressing mechanism with a temperature conduction device and a test sorting apparatus using the same, wherein when high heat generated by an electronic component during a test is conducted to a central position of the temperature conduction device through the pressing mechanism, the central position of the temperature conduction device can rapidly exchange heat with low temperature fluid to rapidly cool the electronic component, and energy waste caused by unnecessary heat exchange at a peripheral position of the temperature conduction device is avoided.
To achieve the above and other objects, the present invention provides a temperature conduction device for conducting the temperature of a fluid medium to an electronic component, the temperature conduction device comprising a base, at least one guide block, the base having a contact surface, the contact surface comprising at least a central region and an outer region, the guide block protruding from the contact surface; wherein, the height of the guide block protruding from the abutting surface in the central region is greater than the height of the guide block protruding from the abutting surface in the outer region.
In some cases, the temperature conduction device includes a plurality of conductive blocks arranged at intervals.
In some cases, the plurality of guide blocks are arranged in a plurality of concentric cylinders or concentric corner posts.
In some cases, each of the guide shoes has a cylindrical, angular, lamellar or annular shape.
In some cases, the guide block is perpendicular to the abutment surface of the base.
In some cases, each of the guide blocks is in a shape of a sheet, and the plurality of guide blocks are disposed in pairs on the abutting surface of the base to guide the fluid medium from the central region to the outer region of the base.
In some cases, the guide block has at least one guide hole, and the guide hole transversely or obliquely penetrates through the guide block.
In order to achieve the above and other objects, the present invention further provides a pressing mechanism having the above temperature conduction device for pressing against an electronic component, the pressing mechanism includes a pressing device and a transmission rod. The crimping device comprises a crimping piece, a temperature control piece and the temperature conduction device, wherein the crimping piece can be pressed against the electronic element, the temperature control piece is provided with a containing groove, a first through hole and a second through hole, the containing groove is communicated with the first through hole and the second through hole, the temperature conduction device is contained in the containing groove, the containing groove is provided with a groove surface, the groove surface is far away from the abutting surface of the base, further, the groove surface of the containing groove abuts against the temperature conduction device, and the first through hole is opened in the center of the groove surface; the crimping device is arranged on the transmission rod, and the transmission rod drives the crimping device to move in a first direction relative to the electronic element.
In order to achieve the above and other objects, the present invention further provides a test sorting apparatus using the above pressing mechanism for testing and sorting electronic components, the test sorting apparatus includes a machine table, a feeding device, a receiving device, a testing device, the pressing mechanism, a conveying device and a central control device. The feeding device is arranged on the machine table and is provided with a feeding bearing device for accommodating the electronic element to be tested; the material receiving device is arranged on the machine table and is provided with a material receiving and bearing device for accommodating the tested electronic element; the testing device is arranged on the machine table and is provided with a tester for testing the electronic element; the press-connecting device is arranged on the machine table to press the electronic element; the conveying device is arranged on the machine table and is provided with a material moving device for moving and loading the electronic element; the central control device is used for controlling and integrating the actions of all devices so as to execute automatic operation.
Therefore, when high heat generated by the electronic element in the test process is conducted to the central position of the temperature conduction device, the electronic element can be quickly cooled through heat exchange between the low-temperature fluid and the plurality of guide blocks so as to effectively reduce the temperature of the electronic element and avoid the influence of overheating of the electronic element on the test quality.
Drawings
Fig. 1 is a cross-sectional view of a conventional hold-down mechanism and a test apparatus.
Fig. 2 is a cross-sectional view of the temperature conduction device mounted on the crimping mechanism according to the first embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a temperature conduction device according to a first embodiment of the present invention.
Fig. 4 is a perspective view of a temperature conduction device according to a first embodiment of the present invention.
Fig. 5 is a partial plan view of a temperature conduction device according to a first embodiment of the present invention.
Fig. 6 is a schematic diagram of a crimping mechanism with a temperature conduction device and a testing device according to the present invention.
FIG. 7 is a schematic diagram of the crimping mechanism with temperature conducting device and the testing device according to the present invention.
Fig. 8 is a partially enlarged view of fig. 7.
Fig. 9 is a schematic use view of fig. 5.
Fig. 10 is a plan view of a temperature conduction device according to a second embodiment of the present invention.
Fig. 11 is a plan view of a temperature conduction device according to a third embodiment of the present invention.
Fig. 12 is a plan view of a temperature conduction device according to a fourth embodiment of the present invention.
Fig. 13 is a schematic view of the crimping mechanism of the present invention applied to a test sorting apparatus.
Description of reference numerals: a crimping mechanism 1; a crimper 10; a crimp member 11; a crimping part 111; a temperature conducting means 12; a base 121; an abutting surface 1211; a guide block 122; a diversion hole 123; a temperature control member 13; a receiving groove 131; a groove surface 1311; a first through-hole 132; a second through hole 133; an open area 134; a transmission rod 20; a side edge line X; a machine table 30; a supply device 40; a supply receiver 41; the material receiving device 50 receives the material receiver 51; a conveying device 60; a first transfer device 61; a second transfer device 62; a third transfer feeder 63; a first transfer stage 64; a second transfer stage 65; a pressing mechanism 70; a lower press lever 71; a depressor 72; a push-down member 721; a hold-down portion 7211; a temperature reducing member 722; a groove 7221; a conductive member 723; a base plate 7231; a guide post 7232; a testing device 80; a circuit board 81; a test socket 82; and an electronic component 90.
Detailed Description
Referring to fig. 2, a first embodiment of the present invention discloses a temperature conduction device for conducting the temperature of a fluid medium to an electronic component, in this embodiment, a temperature conduction device 12 is installed with a pressing mechanism 1, the pressing mechanism 1 can press against the electronic component, and the pressing mechanism 1 includes a pressing device 10 and a transmission rod 20. The crimper 10 has a crimper 11, a temperature conducting device 12 and a temperature control element 13, the crimper 10 is disposed at a lower end of the transmission rod 20, the transmission rod 20 is connected to a driving source (not shown), so that the transmission rod 20 drives the crimper 10 to move back relative to the electronic component in a first direction, which is a Z direction in this embodiment, and in other possible embodiments of the present invention, the first direction may be X, Y or other directions, which is not mandatory.
The pressing member 11 is provided with a pressing portion 111 protruding downward to press against the electronic component.
Referring to fig. 2 to 5, the temperature conducting device 12 is sandwiched between the temperature control member 13 and the pressing member 11, the temperature conducting device 12 includes a base 121 and a plurality of guide blocks 122, the base 121 has a contact surface 1211, the contact surface 1211 includes a central region and an outer region, the plurality of guide blocks 122 protrude from the contact surface 1211 and are arranged at intervals, and each of the plurality of guide blocks 122 is perpendicular to the contact surface 1211. It should be noted that, the height of the guide blocks protruding from the abutting surface 1211 in the central area is greater than the height of the guide blocks protruding from the abutting surface 1211 in the outer area, as shown in fig. 3, in other words, one end of the plurality of guide blocks 122 away from the abutting surface 1211 defines a side edge line X, and the side edge line X extends to both sides and approaches the abutting surface 1211. In the present embodiment, the plurality of guide blocks 122 are arranged in a plurality of concentric cylinders, as shown in fig. 4, in other possible embodiments of the present invention, the plurality of guide blocks 122 may be arranged in a plurality of concentric angle cylinders, or not. In addition, in the present embodiment, each guide block 122 is in the shape of an angular column, and in other possible embodiments of the present invention, each guide block may be in the shape of a cylinder or a sheet, and it is not necessary.
As shown in fig. 2, the temperature controlling element 13 has a receiving cavity 131, a first through hole 132 and a second through hole 133, the base 121 of the temperature conduction device 12 is abutted to the temperature controlling element 13 and closes the opening of the receiving cavity 131, in this embodiment, the receiving cavity 131 receives a plurality of guide blocks 122 of the temperature conduction device 12, and in other possible embodiments of the present invention, the receiving cavity may receive the entire temperature conduction device, or may not receive the entire temperature conduction device. The receiving cavity 131 has a cavity surface 1311, the cavity surface 1311 is far away from the abutting surface 1211 of the base 121, the first through hole 132 and the second through hole 133 are disposed above the receiving cavity 131, the receiving cavity 131 is communicated with the first through hole 132 and the second through hole 133, the first through hole 132 is opened at the center of the cavity surface 1311, and the second through hole 133 is opened at the periphery of the cavity surface 1311. In the present embodiment, the groove surface 1311 abuts against a portion of the plurality of guide blocks 122 of the temperature conduction device 12, in other words, the groove surface 1311 abuts against only a few guide blocks, however, in other possible embodiments of the present invention, the groove surface may not abut against the guide blocks, and may not abut against the guide blocks.
Referring to fig. 6 to 9, which are schematic views of the pressing mechanism 1 and the testing device 80, the testing device 80 has a tester, and the tester includes a circuit board 81 and a testing seat 82 electrically connected to the circuit board for performing a testing operation on an electronic component. The driving rod 20 of the pressing mechanism 1 drives the pressing device 10 to move downward in the Z direction, so that the pressing portion 111 protruded from the pressing member 11 is pressed against the electronic component 90, thereby ensuring the electrical connection between the electronic component 90 and the tester and performing the testing operation. In addition, as shown in fig. 8 and 9, the temperature control element 13 is connected to a low-temperature fluid source (not shown), so that the low-temperature fluid is input into the containing groove 131 from the center of the groove surface 1311 through the first through hole 132 and flows into the gaps between the plurality of guide blocks 122 of the temperature conduction device for heat exchange, thereby rapidly diffusing the high heat generated by the electronic device during the testing process, and the low-temperature fluid after heat exchange leaves the containing groove 131 through the second through hole 133.
It should be noted that, as shown in fig. 3, the height of the guide block protruding from the abutting surface 1211 in the central region is greater than the height of the guide block protruding from the abutting surface 1211 in the outer region, so that when the guide block in the central region abuts against the groove surface 1311 of the receiving groove 131, the guide block in the outer region does not abut against the groove surface 1311, and an open area 134 for flowing the low-temperature conductor is formed between the guide block in the outer region and the groove surface 1311, as shown in fig. 8, so that a part of the low-temperature fluid can flow in the open area 134 without meandering and flowing in the gaps between the conductors, and further the high heat conducted by the temperature conduction device 12 can be quickly brought away from the receiving groove 131, thereby preventing the heat energy from reversely returning to the temperature conduction device 12, and reducing the heat and heat exchange between the low-temperature fluid and the guide blocks in other positions, and further reducing unnecessary energy waste.
As mentioned above, referring to fig. 7 and 8, when the protruding press-connecting part 111 of the press-connecting member 11 presses against the electronic component 90, the high heat generated by the electronic component 90 during the testing process is conducted to the temperature conduction device 12, at this time, the central position of the temperature conduction device 12 with higher heat dissipation and cooling requirements (i.e. the position of the temperature conduction device 12 relative to the press-connecting part 111) can rapidly exchange heat with the low temperature fluid by means of the guide block located in the central area, and further rapidly perform heat dissipation and cooling on the electronic component 90 to avoid the over-high temperature of the electronic component, and at the peripheral position of the temperature conduction device 12 with lower heat dissipation and cooling requirements, a part of the low temperature fluid can rapidly flow to the second through hole 133 and leave the receiving groove 131 through the open area 134, as shown in fig. 8, to rapidly carry away the high heat from the receiving groove 131, and prevent the heat energy from being reversely returned to the temperature conduction device 12, and reduce the heat exchange between the surrounding position of the temperature conduction device 12 and the cryogenic fluid, and further reduce the unnecessary energy consumption, and because the surrounding position of the temperature conduction device 12 still has the guide block capable of performing heat exchange, the surrounding position of the temperature conduction device 12 still can keep the effect of partial heat dissipation and temperature reduction.
The temperature conduction device of the second embodiment of the present invention is substantially the same as the first embodiment shown in fig. 2 to 9, but the number of the guide blocks is smaller, and the arrangement of the guide blocks is slightly different, referring to fig. 10, the plurality of guide blocks 122 are arranged in a plurality of concentric circles, in other words, the radial gap between the plurality of guide blocks of the second embodiment is larger than that of the first embodiment. However, in other possible embodiments of the present invention, the plurality of guide blocks may be arranged in a plurality of concentric polygons, which is not limited by the present invention.
Referring to fig. 11, the guide blocks 122 of the temperature conduction device according to the third embodiment of the present invention are arc-shaped, the plurality of guide blocks are disposed in pairs on the abutting surface of the base, and the two guide blocks in pairs are respectively located at two sides of the opening of the first through hole, so that the guide blocks disposed in pairs can guide the cryogenic fluid from the central area to the outer area of the base after the cryogenic fluid is input into the receiving tank through the first through hole.
Referring to fig. 12, each guide block 122 of the temperature conduction device according to the fourth embodiment of the present invention is in a ring-column shape, and each guide block 122 has a plurality of flow guiding holes 123 penetrating transversely therethrough, however, in other possible embodiments of the present invention, the flow guiding holes may be inclined to penetrate the guide blocks, as long as the fluid medium can be guided from the central region to the outer region of the base, which is not limited by the present invention. In addition, in other possible embodiments of the present invention, each guide block may be in a hollow corner column shape or other hollow column shape, as long as the guide block has a flow guiding hole, and the height of the guide block protruding from the abutting surface in the central region is greater than the height of the guide block protruding from the abutting surface in the outer region, and the present invention has a similar heat dissipation and cooling effect as the above embodiments, and the present invention is not limited thereto.
Please refer to fig. 13, which is a schematic diagram of the pressing mechanism 1 applied to a test sorting apparatus, the test sorting apparatus is configured with a feeding device 40, a receiving device 50, a conveying device 60, the pressing mechanism 1, a testing device 80 and a central control device (not shown) on a machine 30; the feeding device 40 is assembled on the machine 30 and has a feeding holder 41 for accommodating the electronic device to be tested; the material receiving device 50 is mounted on the machine 30 and has a material receiving and placing device 51 for receiving the tested electronic device; the testing device 80 is assembled on the machine 30 and has a tester having a circuit board 81 and a testing seat 82 electrically connected to perform testing operation on the electronic device; the conveying device 60 is mounted on the machine 30, the conveying device 60 has a first material shifter 61, a second material shifter 62 and a third material shifter 63 capable of performing displacement in first, second and third directions (in this embodiment, referred to as X, Y, Z direction), the conveying device 60 further has a first transfer stage 64 and a second transfer stage 65, the first material shifter 61 of the conveying device 60 takes out the electronic component to be tested at the material supply carrier 41 of the material supply device 40 and transfers the electronic component to the first transfer stage 64 and the second transfer stage 65 for the second material shifter 62 and the third transfer stage 63 to take out, the second material shifter 62 and the third material shifter 63 respectively transfer the electronic component to be tested to the testing device 80 to perform testing operation, after the testing is completed, the second material shifter 62 and the third material shifter 63 transfer the tested electronic component of the testing device 80 to the first transfer stage 64 and the second transfer stage 65, the first transfer device 61 takes out the tested electronic components from the first transfer platform 64 and the second transfer platform 65, and transfers the tested electronic components to the receiving device 50 for sorting and storage according to the test result. Further, in other possible embodiments of the present invention, the temperature conduction device may be installed not only in the pressing mechanism, but also in other devices of the testing and sorting equipment to conduct the temperature of the fluid medium to the electronic component thereon.
Claims (10)
1. A temperature conducting device for conducting a temperature of a fluid medium to an electronic component, the temperature conducting device comprising:
a base having a contact surface, the contact surface including at least a central region and an outer region;
at least one guide block protruding from the abutting surface;
wherein, the height of the guide block protruding from the abutting surface in the central region is greater than the height of the guide block protruding from the abutting surface in the outer region.
2. The temperature conduction device according to claim 1, wherein: comprises a plurality of guide blocks which are arranged at intervals.
3. The temperature conduction device according to claim 2, wherein: the plurality of guide blocks are arranged into a plurality of concentric cylinders or concentric angle columns.
4. The temperature conduction device according to claim 2, wherein: each guide block is in a cylindrical shape, an angular column shape, a sheet shape or an annular column shape.
5. The temperature conduction device according to claim 1, wherein: the guide block is perpendicular to the abutting surface of the base.
6. The temperature conduction device according to claim 2, wherein: each guide block is sheet-shaped, and the plurality of guide blocks are arranged on the abutting surface of the base in pairs so as to guide the fluid medium from the central area to the outer area of the base.
7. The temperature conduction device according to claim 1, wherein: the guide block is provided with at least one guide hole which transversely or obliquely penetrates through the guide block.
8. A press-connecting mechanism for pressing against an electronic component, the press-connecting mechanism comprising:
a crimping device, comprising a crimping member, a temperature control member and the temperature conduction device according to any one of claims 1 to 7, wherein the crimping member can press against the electronic component, the temperature control member has a receiving groove, a first through hole and a second through hole, the receiving groove is communicated with the first through hole and the second through hole, the receiving groove receives the temperature conduction device, the receiving groove has a groove surface, the groove surface is far away from the abutting surface of the base, and the first through hole is opened at the center of the groove surface;
the pressure welding device is arranged on the transmission rod, and the transmission rod drives the pressure welding device to move in a first direction relative to the electronic element.
9. The crimping mechanism of claim 8, wherein: the groove surface of the accommodating groove is abutted against the temperature conduction device.
10. A test sorting apparatus for testing and sorting electronic components, the test sorting apparatus comprising:
a machine platform;
a feeding device: a feeding and bearing device which is arranged on the machine table and is used for accommodating the electronic element to be tested;
the material receiving device comprises: a material receiving and placing device arranged on the machine table and used for accommodating the tested electronic element;
the testing device comprises: a tester arranged on the machine table and used for testing the electronic element;
the crimping mechanism of claim 8: is arranged on the machine table to press the electronic element;
a conveying device: a material moving device arranged on the machine table and used for moving the electronic element;
the central control device: used to control and integrate the actions of each device to execute the automation operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010330074.7A CN113552392A (en) | 2020-04-24 | 2020-04-24 | Temperature conduction device, crimping mechanism and test classification equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010330074.7A CN113552392A (en) | 2020-04-24 | 2020-04-24 | Temperature conduction device, crimping mechanism and test classification equipment thereof |
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| Publication Number | Publication Date |
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| CN113552392A true CN113552392A (en) | 2021-10-26 |
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| CN202010330074.7A Pending CN113552392A (en) | 2020-04-24 | 2020-04-24 | Temperature conduction device, crimping mechanism and test classification equipment thereof |
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| CN208044515U (en) * | 2018-01-26 | 2018-11-02 | 深圳比特微电子科技有限公司 | A kind of gradient type radiator |
| CN113552391A (en) * | 2020-04-24 | 2021-10-26 | 鸿劲精密股份有限公司 | Temperature conduction device and crimping mechanism, precooler and test classification equipment thereof |
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