CN207922160U - A kind of LED radiator - Google Patents
A kind of LED radiator Download PDFInfo
- Publication number
- CN207922160U CN207922160U CN201820061311.2U CN201820061311U CN207922160U CN 207922160 U CN207922160 U CN 207922160U CN 201820061311 U CN201820061311 U CN 201820061311U CN 207922160 U CN207922160 U CN 207922160U
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- heating column
- heat
- radiator
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a kind of LED radiator, and the radiator includes the heat conduction chip of square, and the surface and side of the heat conduction chip are equipped with multiple thermal holes, the adjacent thermal hole equidistantly distributed；The heat conduction core on piece is additionally provided with multiple heating columns, the adjacent heating column is equally distributed in the heat conduction core on piece, the radiator has enough heat dissipation areas, it also increases the thermal capacitance of radiator while improving the radiating efficiency of heat transfer and heat convection, to make radiating efficiency increase substantially.
Description
Technical field
The utility model is related to LED field more particularly to a kind of LED radiators.
Background technology
With the optimization and development of LED core chip technology, high-powered LED lamp occurs in more and more cities, however wants
By high-powered LED lamp industrialization production, many challenges are also faced, wherein just spreading heat problem including LED light.
Can be substantially divided by improving the approach of the radiating efficiency of high-powered LED lamp by two.A kind of method is to improve LED chip
Photoelectric conversion efficiency, so that more electric energy is converted to luminous energy rather than is shed in the form of heat, thus can be fundamentally
The quantity of heat production for reducing heat production source, to reduce temperature.Requirement of this method to technology is relatively high.Another method is to improve
The sinking path of LED chip improves radiating efficiency so that the heat that heat production source generates can run through rational sinking path and release
It puts, to reduce temperature.
The heat dissipation performance of stage radiator such as beehive-type radiator or pole-shaped radiator is poor now, and heat convection area is not
It is enough, and thermal resistance is big, is unfavorable for heat transfer.
Utility model content
The purpose of this utility model is that in view of the above shortcomings of the prior art, providing a kind of LED radiator, increasing
The heat convection of radiator and air increases the area that radiator is contacted with air.
To achieve the above object, the utility model uses following technical solution：
The utility model provides a kind of LED radiator, and the radiator includes the heat conduction chip of square, the heat conduction
The surface and side of chip are equipped with multiple thermal holes, the adjacent thermal hole equidistantly distributed；
The heat conduction core on piece is additionally provided with multiple heating columns, and the adjacent heating column is equally distributed in the heat conduction core
On piece.
Further, the outer surface of the heating column is equipped with multiple rectangle cooling fins, and the rectangle cooling fin is equidistant
Around the outer surface of the heating column.
Further, the long side of rectangle cooling fin side is connected with the heating column, the rectangle cooling fin
Length direction along the heating column is arranged.
Further, through-hole is equipped at the center of the heating column.
Further, the heating column is integrally formed with the heat conduction chip.
Further, the heating column is integrally formed with the rectangle cooling fin.
Further, gap filling heat-conducting cream between the radiator and LED core plate base.
The beneficial effects of the utility model are：The radiator has enough heat dissipation areas, also increases the heat of radiator
The radiating efficiency for holding while improving heat transfer and heat convection, to make radiating efficiency increase substantially.
1) surface and side of heat conduction chip are equipped with thermal hole, increase the area of radiator, are conducive to radiate；
2) outer surface of heating column is equipped with multiple rectangle cooling fins, can further increase the radiating efficiency of radiator,
Further increase the heat convection surface area of radiator.
Description of the drawings
Fig. 1 is a kind of overlooking structure diagram of LED radiator；
Fig. 2 is the structural schematic diagram of heating column.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with the accompanying drawings and implement
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only explaining this
Utility model is not used to limit the utility model.
As shown in Figure 1, a kind of LED radiator, the radiator includes the heat conduction chip 1 of square, the heat conduction chip 1
Surface and side be equipped with multiple thermal holes 101, adjacent 101 equidistantly distributed of the thermal hole；Wherein, heat conduction chip 1
The thermal hole 101 of side is not shown in figure.
Multiple heating columns 102 are additionally provided on the heat conduction chip 1, the adjacent heating column 102 is equally distributed in institute
It states on heat conduction chip 1.Wherein, heating column 102 is column, and vertical heat transfer chip 1 is arranged.
Heating column 102 and thermal hole 101 can overlap, and can not also overlap.
The outer surface of the heating column 102 is equipped with multiple rectangle cooling fins 1021, described rectangle cooling fin 1021 etc.
Spacer ring is around the outer surface of the heating column 102.
The long side of 1021 side of rectangle cooling fin is connected with the heating column 102, the rectangle cooling fin
1021 along the heating column 102 length direction be arranged.
Through-hole 1022 is equipped at the center of the heating column 102.
The heating column 102 is integrally formed with the heat conduction chip 1.
The heating column 102 is integrally formed with the rectangle cooling fin 1021.
At this stage, be between heating column and heat conduction chip by screw connection together, increase prodigious thermal resistance, one
Body formed design can largely reduce the thermal resistance of material.
Gap filling heat-conducting cream between 1 substrate of the radiator and LED chip.
Wherein, through-hole 1022 is equipped at the center of heating column 102, i.e. heating column 102 is hollow form, the heating column of hollow form
102 can increase the heat convection surface area of radiator.The number of rectangle cooling fin 1021 is 10~15, rectangle heat dissipation
The number of piece 1021 is very little, and heat convection surface area is inadequate, and the number of rectangle cooling fin 1021 is too many, heat convection surface area
Because gap is smaller, it is difficult to radiate.
At this stage, LED lamp bead, heat passage are detached with electric pathway, are thermally conductive insulating layer between chip and copper base, are connect to reduce
It touches thermal resistance and copper base and radiator is passed through into heat conduction glue connection.Chip is heat production source, and heat first passes through heat transfer and reached by chip
Radiator, then be lost in ambient enviroment by the free convection of air.In heat conduction conduction, path that heat passes sequentially through
For chip, thermally conductive insulating layer, copper base, heat-conducting glue and radiator, therefore the thermal resistance of each part in heat transfer approach
The efficiency of heat transfer may all be influenced.
The embodiment of the utility model above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the utility model patent range therefore be interpreted as.It should be pointed out that for the ordinary skill of this field
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this
The protection domain of utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (7)
1. a kind of LED radiator, it is characterised in that：The radiator includes the heat conduction chip (1) of square, the heat conduction chip
(1) surface and side is equipped with multiple thermal holes (101), the adjacent thermal hole (101) equidistantly distributed；
Multiple heating columns (102) are additionally provided on the heat conduction chip (1), the adjacent heating column (102) is equally distributed in
On the heat conduction chip (1).
2. a kind of LED radiator according to claim 1, it is characterised in that：The outer surface of the heating column (102) is equipped with
Multiple rectangle cooling fins (1021), the rectangle cooling fin (1021) are equally spaced around the appearance of the heating column (102)
Face.
3. a kind of LED radiator according to claim 2, it is characterised in that：Rectangle cooling fin (1021) side
Long side be connected with the heating column (102), length side of the rectangle cooling fin (1021) along the heating column (102)
To setting.
4. a kind of LED radiator according to claim 2, it is characterised in that：It is equipped at the center of the heating column (102)
Through-hole (1022).
5. a kind of LED radiator according to claim 1, it is characterised in that：The heating column (102) and the heat conduction core
Piece (1) is integrally formed.
6. a kind of LED radiator according to claim 2, it is characterised in that：The heating column (102) and the rectangle
Cooling fin (1021) is integrally formed.
7. a kind of LED radiator according to claim 1, it is characterised in that：The radiator and heat conduction chip (1) substrate
Between gap filling heat-conducting cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820061311.2U CN207922160U (en) | 2018-01-15 | 2018-01-15 | A kind of LED radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820061311.2U CN207922160U (en) | 2018-01-15 | 2018-01-15 | A kind of LED radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207922160U true CN207922160U (en) | 2018-09-28 |
Family
ID=63604240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820061311.2U Expired - Fee Related CN207922160U (en) | 2018-01-15 | 2018-01-15 | A kind of LED radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207922160U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111779992A (en) * | 2020-07-24 | 2020-10-16 | 绍兴上虞欧迪电器有限公司 | Intelligent LED bulb lamp |
| CN114199062A (en) * | 2020-09-02 | 2022-03-18 | 西门子(深圳)磁共振有限公司 | Heat exchange piece and heat exchange assembly |
-
2018
- 2018-01-15 CN CN201820061311.2U patent/CN207922160U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111779992A (en) * | 2020-07-24 | 2020-10-16 | 绍兴上虞欧迪电器有限公司 | Intelligent LED bulb lamp |
| CN114199062A (en) * | 2020-09-02 | 2022-03-18 | 西门子(深圳)磁共振有限公司 | Heat exchange piece and heat exchange assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103398358B (en) | A kind of low light attenuation high-power LED street lamp and preparation method thereof | |
| CN207922160U (en) | A kind of LED radiator | |
| CN104100888A (en) | Radiating type LED mining lamp | |
| CN106879230A (en) | A kind of cooling system of three-dimensional power amplifier | |
| CN100552287C (en) | High power semiconductor lighting lamp | |
| CN201232984Y (en) | Radiating module for LED lamp | |
| CN203336367U (en) | Low-light-failure and high-power LED street lamp | |
| CN201615463U (en) | Novel LED light source heat-conduction structure | |
| CN204216071U (en) | A kind of LED-COB base plate for packaging of high heat conduction | |
| CN204403875U (en) | A kind of be furnished with the fixing integrated module of LED of screw | |
| CN103062736A (en) | High-power LED streetlamp cooling method and LED streetlamp cooled by same | |
| CN103411192A (en) | Solar light-emitting diode (LED) lamp combination heat dissipation device | |
| CN202835281U (en) | Radiator for light-emitting diode (LED) bulb lamp | |
| CN203223887U (en) | Array type LED heat sink | |
| CN207250550U (en) | A kind of LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling | |
| CN204403877U (en) | The integrated module of a kind of LED with radiator | |
| CN204946942U (en) | A kind of high radiance, the high infrared LED encapsulating structure exported | |
| CN101846299A (en) | Heat radiator of LED lamp fitting, heat radiation method thereof and LED lamp fitting | |
| CN201892189U (en) | High-power LED (light-emitting diode) radiator | |
| CN202835286U (en) | Light-emitting diode (LED) lamp radiator | |
| CN102777776A (en) | Aluminum oxide ceramic LED (light emitting diode) bulb lamp and manufacture method thereof | |
| CN206236665U (en) | A kind of great power LED heat sink structure | |
| CN203099379U (en) | Straight-tube type LED (light emitting diode) lamp | |
| CN205717115U (en) | A kind of LED street lamp lamp holder employment shape Radiator | |
| CN203351657U (en) | Aluminum base plate achieving high thermal conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 523000 2nd, 3rd and 5th floors of Building E, Xinmusheng Low Carbon Science Park, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xinguangtai Electronic Technology Co.,Ltd. Address before: 518111 Building E of Xinmusheng Low Carbon Industrial Park, Pinghu Town, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN KN-LIGHT ELECTRONIC TECHNOLOGY CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180928 Termination date: 20220115 |