CN101846299A - Heat radiator of LED lamp fitting, heat radiation method thereof and LED lamp fitting - Google Patents
Heat radiator of LED lamp fitting, heat radiation method thereof and LED lamp fitting Download PDFInfo
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- CN101846299A CN101846299A CN201010148141A CN201010148141A CN101846299A CN 101846299 A CN101846299 A CN 101846299A CN 201010148141 A CN201010148141 A CN 201010148141A CN 201010148141 A CN201010148141 A CN 201010148141A CN 101846299 A CN101846299 A CN 101846299A
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Abstract
The invention discloses a heat radiator of an LED lamp fitting, which comprises a ceramic base plate, a heat radiation pipe, a heat radiation fin and an installing base, wherein a heat conductive layer is sintered on the bottom of the ceramic base plate, at least partial of the heat radiation pipe is in contact with the base plate, the heat radiation fin is in contact with the heat radiation pipe, and the installing base is partially in contact with the base plate and is used for fixing the heat radiation pipe. The base plate is provided with a plurality of LED light emitting diodes, and a plurality of heat conductive posts are arranged inside the base plate at the lower part of the LED light emitting diodes and are used for conducting the heat of the LED light emitting diodes, wherein one end of the heat conductive posts is in contact with the LED light emitting diodes, and the other end is in contact with the heat conductive layer. The invention also relates to a heat radiation method of the LED lamp fitting and the LED lamp fitting. The heat radiation effect can be greatly improved. In addition, the invention also discloses the LED lamp fitting.
Description
Technical field
The present invention relates to LED led lighting technical field, relate in particular to a kind of heat abstractor of novel large-power LED light fixture, and relate to the heat dissipating method of this kind heat abstractor, the present invention has also disclosed a kind of LED light fixture.
Background technology
Under the background that the worry of current global energy shortage raises once again, energy savings is the important problem that we shall face future, at lighting field, the application of LED luminous product is just attracting common people's sight, LED is as a kind of novel green light source product, it must be developing tendency in future, therefore LED be called as the 4th generation lighting source or green light source, have characteristics such as energy-saving and environmental protection, the life-span is long, volume is little, can be widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.
In recent years, some developed countries have launched fierce technology contest around the development of LED in the world.The U.S. was from investment 500,000,000 dollars of enforcements " national semiconductor lighting plan " in 2000, and European Union also announces to start similarly " rainbow plan " in July, 2000.China has formed certain characteristic at the LED lighting field, and wherein outdoor lighting is with fastest developing speed, and existing last hundred tame LED street lamp enterprises have also built tens model paths.The 2008 Beijing Olympic Games allows people that LED has been had brand-new understanding to the concentrated displaying of LED illumination, has promoted the development of Chinese semiconductor lighting industry effectively.
In addition, by the research to countries in the world LED lighting engineering, high light efficiency, Highgrade integration will become the developing direction of following LED lighting engineering.LED integrated optical source is because a heat radiation difficult problem can only accomplish generally below the 200W that even relevant great power LED integrated optical source is arranged, also the reason because of its radiating effect difference causes product low service life in the industry at present, and the market competitiveness is not strong.Therefore in the prior art, the technology enlightenment that solves the LED lighting heat dissipation problem more than the high-power 500W by good heat abstractor is not arranged, and in actual applications, have the market demand of high-power LED lighting fixture heat abstractor really yet.
Summary of the invention
The object of the present invention is to provide a kind of heat abstractor of LED light fixture, this heat abstractor can adapt to the common LED lamp tool, has better heat radiating effect simultaneously, and then has fundamentally solved because product is short service life the defective of market competitiveness difference.
Technical scheme of the present invention is: a kind of heat abstractor of LED light fixture, comprise the bottom sintering ceramic substrate of heat-conducting layer, the radiating tube that contacts with substrate to small part are arranged, with the contacted radiating fin of radiating tube and comprise that also one contacts the mounting base that is used for fixing radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer.
A kind of heat abstractor of LED light fixture comprises that the bottom sintering has the ceramic substrate of heat-conducting layer, the installing plate that contacts with substrate to small part, the radiating tube that contacts with installing plate to small part, also comprises that one contacts the mounting base that is used for fixing radiating tube and further comprises and the contacted radiating fin of radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer.
In a preferred embodiment of the present invention, described radiating fin is located at the radiating end of radiating tube.
In a preferred embodiment of the present invention, the heat absorbing end of described radiating tube contacts with mounting base.
In a preferred embodiment of the present invention, described radiating fin is provided with through hole, is used for the convection current of cold and hot air.
In a preferred embodiment of the present invention, heating column and heat-conducting layer adopt fine silver to make.
Another object of the present invention is to provide a kind of heat dissipating method of LED light fixture, annotate silver-colored mode, can derive the heat at the LED light emitting diode back side rapidly, greatly improved radiating effect by hacking pore on ceramic substrate.
A kind of heat dissipating method of LED light fixture is characterized in that, this method comprises the steps:
A, the heat of each LED light emitting diode is passed to heat-conducting layer by heating column, pass to radiating tube by heat-conducting layer again;
B, by radiating tube with the heat transferred radiating fin;
C, heat is passed to space outerpace vertically upward by radiating fin.
The present invention is also disclosing a kind of LED light fixture, and this kind LED light fixture has better heat radiating effect, and single led light source power is reached more than 500W～1000W, and the logical total amount of light reaches 50000～100000LM.
A kind of LED light fixture comprises that a lampshade, is positioned at the LED light-emitting device of lampshade inside, and a heat abstractor; This heat abstractor comprise a bottom sintering ceramic substrate of heat-conducting layer, the radiating tube that contacts with substrate to small part are arranged, with the contacted radiating fin of radiating tube and comprise that also one contacts the mounting base that is used for fixing radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer; Described LED light-emitting device comprises by organic silica gel fills some LED light emitting diodes, the phosphor powder layer of fixing that is coated on the LED LED surface, the connection guiding element that is communicated with the LED light emitting diode.
A kind of LED light fixture comprises that a lampshade, is positioned at the LED light-emitting device of lampshade inside, and a heat abstractor; This heat abstractor comprises that a bottom sintering has the ceramic substrate of heat-conducting layer, the installing plate that contacts with substrate to small part, the radiating tube that contacts with installing plate to small part, also comprises that one contacts the mounting base that is used for fixing radiating tube and further comprises and the contacted radiating fin of radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer; Described LED light-emitting device comprises by organic silica gel fills some LED light emitting diodes, the phosphor powder layer of fixing that is coated on the LED LED surface, the connection guiding element that is communicated with the LED light emitting diode.
In a preferred embodiment of the present invention, described LED light emitting diode and pit bottom are provided with elargol.
The present invention is directed to the heat abstractor and the heat dissipating method thereof of LED light fixture, a kind of brand-new technology scheme has been proposed, annotate silver-colored mode by hacking pore on ceramic substrate, the heat at the LED light emitting diode back side is derived rapidly, thereby greatly improved radiating effect; And disclosed LED light fixture can make single led light source power reach more than 500W～1000W, and the logical total amount of light reaches 50000～100000LM, and the product Highgrade integration, has the advantage that volume is little, the life-span is long.
Description of drawings
Fig. 1 a is the schematic perspective view of an embodiment of LED light fixture of the present invention;
Fig. 1 b is the schematic perspective view of another embodiment of LED light fixture of the present invention;
Fig. 2 a is an embodiment planar structure of a LED light fixture of the present invention schematic diagram;
Fig. 2 b is another embodiment planar structure schematic diagram of LED light fixture of the present invention;
Fig. 3 is the structure chart of LED light-emitting device of the present invention;
Fig. 4 is the schematic flow sheet of LED light fixture heat dissipating method of the present invention.
1 is heat abstractor among the figure, and 2 is ceramic substrate, and 3 is radiating tube, and 4 is radiating fin, and 5 is silver-colored heating column, 6 is elargol, and 7 is the LED light emitting diode, and 8 is phosphor powder layer, and 9 is organic silica gel, and 10 is mounting base, 11 is copper installing plate, and 12 is conduit, and 13 is through hole, and 14 is heat-conducting layer.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby protection scope of the present invention is made more explicit defining so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that.
Embodiment 1
Shown in Fig. 1 a and Fig. 2 a, LED light fixture of the present invention comprises a lampshade (not shown), be arranged at the LED light-emitting device in the lampshade, and with the contacted heat abstractor 1 of LED light-emitting device, in order to prevent that dust, insect etc. from influencing the service life of LED light-emitting device, the LED light-emitting device can be contained in the lampshade, this lampshade is made by transparent plastics, glass or other material usually.
In embodiments of the present invention, this heat abstractor 1 comprise a bottom sintering ceramic substrate 2 of fine silver heat-conducting layer, the radiating tube 3 that contacts with substrate to small part are arranged, with radiating tube 3 contacted radiating fins 4 and comprise that also one contacts the mounting base 10 that is used for fixing radiating tube 3 with substrate to small part; This is located described heat-conducting layer 14 and adopts the mode of sintering to be fixed in base plate bottom, why the applicant adopts the mode of sintering to fix, be because both thermal coefficient of expansions of ceramic substrate 2 and fine silver heat-conducting layer 14 are different, difference is bigger in other words, thereby it is bigger to cause meeting both thermal stress of heat back, if adopt the method for general processing technology as coating, when temperature is too high, may cause peeling off of heat-conducting layer 14, therefore, the applicant think adopt sintering mode fixedly heat-conducting layer 14 also be innovation part of the present invention.
As a preferential embodiment of the present invention, offer several pits on the ceramic substrate 2, the effect of this pit is to install and fix LED light emitting diode 7, the quantity of concrete pit, power according to the LED light fixture changes, power with 500W light fixture, a LED light emitting diode 7 is that 1W is an example, ceramic substrate 2 will be offered 500 pits so, certainly, several LED light emitting diodes 7 also can be set, the quantity of LED light emitting diode 7 in the pit that is not limited in the preferred embodiment of the present invention to be disclosed in each pit.
Each pit bottom also is provided with silver-colored heating column 5, specifically, silver heating column 5 is arranged at the below of LED light emitting diode 7, wherein, one end of heating column contacts with LED light emitting diode 7, and the other end contacts with heat-conducting layer, is used for the heat transferred heat-conducting layer with LED light emitting diode 7, more particularly, heating column is to adopt the mode manufacturing of hacking pore notes silver on ceramic substrate 2 to form.As everyone knows, silver is the highest material of thermal conductivity factor, adopt fine silver can lead substrate back to the heat at LED light emitting diode 7 back sides rapidly as the raw material of heating column, and, the ceramic material thermal coefficient of expansion with LED light emitting diode 7 itself again is close, after 7 heatings of luminous two pipes of LED, can make substrate and LED light emitting diode 7 thermal stress between the two reach minimizes, thereby guaranteed the break-off that peels off that LED light emitting diode 7 and substrate can not cause because of thermal stress, fundamentally avoided the radiating effect difference to produce big thermal stress and cause light emitting diode and the substrate to come off and the big light decay that causes or lamp phenomenon extremely.One end of this radiating tube 3 (also being called heat absorbing end) contacts with substrate portion on the one hand, be fixed on the other hand in the mounting base 10 of copper or aluminium matter, on the one hand this mounting base 10 and substrate contacts again, in other words, the heat that heating column is derived is directly passed to the heat absorbing end of radiating tube 3 on the one hand, and another side passes to aluminium matter mounting base 10, again by heat absorbing end copper or that radiating tube 3 is given in 10 conduction of aluminium matter mounting base, its purpose is, increases area of dissipation, makes radiating effect more even.In embodiments of the present invention, the other end of radiating tube 3 (also being called radiating end), this radiating end contacts with radiating fin 4, last heat passes to space outerpace by radiating fin 4, need to prove, be packaged with liquid in the radiating tube 3, as a preferential embodiment of the present invention, enclosing liquid is a distilled water in the radiating tube 3, because this kind radiating mode is a hot pipe technique, it has made full use of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, passes to rapidly outside the thermal source through the heat of heat pipe with thermal objects, and its capacity of heat transmission surpasses the capacity of heat transmission of any known metal.In addition, offer the corresponding through hole 13 of mutual coupling on the radiating fin 4, help the convection current of cold and hot air.
In embodiments of the present invention, the LED light-emitting device comprises some LED light emitting diodes 7, the phosphor powder layer 8 that is coated on LED light emitting diode 7 surfaces that is fixed in the pit, the connection guiding element that is communicated with LED light emitting diode 7.This LED light emitting diode 7 is filled by organic silica gel 9 and is fixed in the pit.Phosphor powder layer 8 can change the colour temperature of the light wave that LED light emitting diode 7 sends, and its colour temperature is greatly in 500k to 1000k scope.Each LED light emitting diode 7 directly adopts gold thread to make it interconnect conducting.In addition, the applicant is coating one deck elargol 6 between LED light emitting diode 7 back sides and pit bottom also, its role is to, and on the one hand further fixed L ED light emitting diode 7 provides its heat-conducting effect on the other hand.
In addition, also offer wire guide on the mounting base 10, correspondingly, wire guide is provided with conduit 12, and this conduit 12 is arranged in radiating fin 4 simultaneously, is used to the lead of arranging, and this lead connects external power supply and LED light emitting diode 7.
Shown in Fig. 1 b and 2b, in embodiments of the present invention, between mounting base 10 and substrate, increase by a copper installing plate 11, all the other are identical with embodiment 1, this copper installing plate 11 both can be used for fixing the LED light-emitting device, can also improve the heat radiation uniformity, heat is conducted equably to heat abstractor 1.
The heat dissipating method of LED light fixture of the present invention may further comprise the steps as shown in Figure 4:
S01, the heat of each LED light emitting diode is passed to heat-conducting layer by heating column, pass to radiating tube by heat-conducting layer again.
Specifically, the LED light emitting diode conducts the heat transferred elargol to heating column by elargol then, again by heating column the heat transferred heat-conducting layer, pass to radiating tube by heat-conducting layer at last.
S02, by radiating tube with the heat transferred radiating fin.
Specifically, radiating tube is given radiating fin by liquid transfer again by inner liquid
S03, heat is passed to space outerpace vertically upward by radiating fin.
Specifically, radiating fin 4 makes the hot and cold air convection current by its through hole 13, reaches the purpose of heat radiation.
By foregoing description as can be seen, the present invention is directed to the heat abstractor and the heat dissipating method thereof of LED light fixture, a kind of brand-new technology scheme has been proposed, annotate the mode of silver by hacking pore on ceramic substrate 2, the heat at LED light emitting diode 7 back sides is derived rapidly, thereby greatly improved radiating effect; And disclosed LED light fixture can make single led light source power reach more than 500W～1000W, and the logical total amount of light reaches 50000～100000LM, and the product Highgrade integration, has the advantage that volume is little, the life-span is long.
The above; it only is the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; for example mentioned " contact " of the present invention comprises direct contact and mediate contact; therefore any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (10)
1. the heat abstractor of a LED light fixture, it is characterized in that, comprise the bottom sintering ceramic substrate of heat-conducting layer, the radiating tube that contacts with substrate to small part are arranged, with the contacted radiating fin of radiating tube and comprise that also one contacts the mounting base that is used for fixing radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer.
2. the heat abstractor of a LED light fixture, it is characterized in that, comprise that the bottom sintering has the ceramic substrate of heat-conducting layer, the installing plate that contacts with substrate to small part, the radiating tube that contacts with installing plate to small part, also comprises that one contacts the mounting base that is used for fixing radiating tube and further comprises and the contacted radiating fin of radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer.
3. the heat abstractor of LED light fixture according to claim 1 and 2 is characterized in that, described radiating fin is located at the radiating end of radiating tube.
4. the heat abstractor of LED light fixture according to claim 1 and 2 is characterized in that, the heat absorbing end of described radiating tube contacts with mounting base.
5. the heat abstractor of LED light fixture according to claim 1 and 2 is characterized in that, described radiating fin is provided with through hole, is used for the convection current of cold and hot air.
6. the heat abstractor of LED light fixture according to claim 1 and 2 is characterized in that, described heating column and heat-conducting layer adopt fine silver to make.
7. the heat dissipating method of a LED light fixture is characterized in that, this method comprises the steps:
A, the heat of each LED light emitting diode is passed to heat-conducting layer by heating column, pass to radiating tube by heat-conducting layer again;
B, by radiating tube with the heat transferred radiating fin;
C, heat is passed to space outerpace vertically upward by radiating fin.
8. a LED light fixture is characterized in that, comprises that a lampshade, is positioned at the LED light-emitting device of lampshade inside, and a heat abstractor; This heat abstractor comprise a bottom sintering ceramic substrate of heat-conducting layer, the radiating tube that contacts with substrate to small part are arranged, with the contacted radiating fin of radiating tube and comprise that also one contacts the mounting base that is used for fixing radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer; Described LED light-emitting device comprises by organic silica gel fills some LED light emitting diodes, the phosphor powder layer of fixing that is coated on the LED LED surface, the connection guiding element that is communicated with the LED light emitting diode.
9. a LED light fixture is characterized in that, comprises that a lampshade, is positioned at the LED light-emitting device of lampshade inside, and a heat abstractor; This heat abstractor comprises that a bottom sintering has the ceramic substrate of heat-conducting layer, the installing plate that contacts with substrate to small part, the radiating tube that contacts with installing plate to small part, also comprises that one contacts the mounting base that is used for fixing radiating tube and further comprises and the contacted radiating fin of radiating tube with substrate to small part; Described substrate is provided with some LED light emitting diodes, have some heating columns in the substrate of described LED light emitting diode bottom, be used to conduct the heat of LED light emitting diode, wherein, heating column one end contacts with the LED light emitting diode, and the other end contacts with heat-conducting layer; Described LED light-emitting device comprises by organic silica gel fills some LED light emitting diodes, the phosphor powder layer of fixing that is coated on the LED LED surface, the connection guiding element that is communicated with the LED light emitting diode.
10. according to Claim 8 or 9 described LED light fixtures, it is characterized in that described LED light emitting diode and pit bottom are provided with elargol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010148141A CN101846299A (en) | 2010-04-16 | 2010-04-16 | Heat radiator of LED lamp fitting, heat radiation method thereof and LED lamp fitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010148141A CN101846299A (en) | 2010-04-16 | 2010-04-16 | Heat radiator of LED lamp fitting, heat radiation method thereof and LED lamp fitting |
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| CN101846299A true CN101846299A (en) | 2010-09-29 |
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| CN201010148141A Pending CN101846299A (en) | 2010-04-16 | 2010-04-16 | Heat radiator of LED lamp fitting, heat radiation method thereof and LED lamp fitting |
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| CN102927484A (en) * | 2012-11-26 | 2013-02-13 | 殷逢宝 | High-power LED lamp |
| CN102956761A (en) * | 2011-08-25 | 2013-03-06 | 展晶科技(深圳)有限公司 | Method for packaging light emitting diode |
| CN103148470A (en) * | 2013-03-07 | 2013-06-12 | 江苏尚恩合同能源管理有限公司 | Radiating device for LED lamp |
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| CN201050722Y (en) * | 2007-06-28 | 2008-04-23 | 鸿坤科技股份有限公司 | Vehicular LED lamp set heat dissipation structure |
| CN101368714A (en) * | 2007-08-16 | 2009-02-18 | 大亿交通工业制造股份有限公司 | Heat radiating device for LED vehicle lamp |
| CN101424395A (en) * | 2007-10-29 | 2009-05-06 | 齐瀚光电股份有限公司 | LED lamp |
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| CN101140057A (en) * | 2006-09-06 | 2008-03-12 | 建准电机工业股份有限公司 | Back light source of planar display heat radiating device |
| CN201050722Y (en) * | 2007-06-28 | 2008-04-23 | 鸿坤科技股份有限公司 | Vehicular LED lamp set heat dissipation structure |
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| CN102956761A (en) * | 2011-08-25 | 2013-03-06 | 展晶科技(深圳)有限公司 | Method for packaging light emitting diode |
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Open date: 20100929 |