CN207250550U - A kind of LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling - Google Patents
A kind of LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling Download PDFInfo
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- CN207250550U CN207250550U CN201720813652.6U CN201720813652U CN207250550U CN 207250550 U CN207250550 U CN 207250550U CN 201720813652 U CN201720813652 U CN 201720813652U CN 207250550 U CN207250550 U CN 207250550U
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- metal base
- thermally isolated
- lamp bead
- plate
- phosphor powder
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Abstract
The utility model discloses a kind of LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling,Including metal base and heat sink,The metal base lower surface is installed with heat sink,The metal base upper surface is equipped with insulating layer,The upper surface of the insulating layer is installed with package floor,The upper surface of the package floor is provided with is thermally isolated plate with reeded,So that the heat dissipation channel of chip and phosphor powder layer realizes independently of each other substantially,So as to which the heat dissipation problem of chip and phosphor powder layer be separated,The upper surface that plate is thermally isolated is installed with LED array,Both the mutual heating problems of the two had been avoided,Also increase the free degree of lamp bead optical design,The outer surface of the LED array is equipped with packaging plastic,The packaging plastic is arranged on the outer surface that plate and metal base is thermally isolated,The outer surface gluing of the packaging plastic has phosphor powder layer,It is highly practical,And whole device is simple in structure,Cost is relatively low.
Description
Technical field
LED lamp bead encapsulating structure technical field is the utility model is related to, is specially a kind of LED light of fluorescent powder photo-thermal coupling
Pearl encapsulating structure.
Background technology
With the fast development of large power white light LED, at present LED have been widely used for indoor and outdoor lighting, display backlight,
The fields such as indicator light, auto lamp, occupy more and more important effect in daily life.LED is compared with conventional light source
Not only there is higher photoelectric conversion efficiency, quick response speed and good colour developing domestic animal, also have pollute small, long lifespan,
The advantages that easy to control, market penetration rate in recent years oneself reach 20-30%.But as a kind of new lighting source, big work(
If rate LED lamp is prepared into encapsulation from piece and lamps and lanterns manufacture still suffers from many problems.
First in manufacture cost, the price of high-power LED lamp remains above traditional energy-saving lamp, limits market penetration rate
Lifting, although LED light has the advantages that energy-efficient, the light conversion efficiency of LED chip is remained in 20%-30% or so
Complementary energy, which is converted to interior energy, causes chip temperature to raise.Temperature is excessive to aggravate lamps and lanterns light decay, so that lamp life is influenced, with
A large amount of commercial applications of white light LEDs, the power of LED chip have also been stepped up to more than watt level, LED chip heat dissipation technology into
In order to restrict the key of great power LED lamp application.
Utility model content
To achieve the above object, the utility model provides following technical solution：A kind of LED lamp bead of fluorescent powder photo-thermal coupling
Encapsulating structure, including metal base and heat sink, the metal base lower surface are installed with heat sink, the metal base
Upper surface is equipped with insulating layer, and the upper surface of the insulating layer is installed with package floor, the upper surface of the package floor
It is provided with and plate is thermally isolated with reeded, the upper surface that plate is thermally isolated is installed with LED array, the LED array
Outer surface is equipped with packaging plastic, and the packaging plastic is arranged on the outer surface that plate and metal base is thermally isolated, the packaging plastic
Outer surface gluing has phosphor powder layer, and the both ends of the phosphor powder layer are connected with the groove that plate carries is thermally isolated, the fluorescent powder
The outer surface of layer is also installed with silicone material, and the outer surface of the silicone material is provided with total reflection lens.
As a kind of preferable technical solution of the utility model, the surrounding of the heat sink is provided with multiple heat emission holes, and
Multiple heat emission holes are symmetrically distributed on the upper surface of heat sink.
As a kind of preferable technical solution of the utility model, plate is being thermally isolated in 3*5 array distributions in the LED array
Upper surface, and have thermal conductive material layer in the outer surface of LED array also gluing.
As a kind of preferable technical solution of the utility model, the package floor is provided at both ends with two grooves, and
Two arc-shaped structure designs of groove.
Compared with prior art, the beneficial effects of the utility model are：The LED lamp beads encapsulation of fluorescent powder photo-thermal coupling
Structure, by setting metal base, is equipped with heat sink in the outer surface of metal base, passes through metal base, thermal interfacial material
Conduction of heat conduct heat to radiator and shed, the main heat sink path of fluorescent powder is included upwardly through lens to environment
Heat transfer and pass downwardly through two approach of heat transfer that LED chip reaches heat sink, due to chip and phosphor powder layer share it is scattered
Hot radical seat, in order to reduce influencing each other for the two, adds on pedestal and groove is thermally isolated so that chip and phosphor powder layer dissipate
The passage of heat realizes independently of each other substantially, so that the heat dissipation problem of chip and phosphor powder layer be separated, is set plate is thermally isolated
LED array is put, has both avoided the mutual heating problems of the two, also increases the free degree of lamp bead optical design, it is highly practical, and
Whole device is simple in structure, and cost is relatively low.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model LED array structure diagram.
In figure：1- metal bases；2- heat sinks；3- insulating layers；4- package floors；5-LED arrays；6- packaging plastics；7- is glimmering
Light bisque；8- silicone materials；9- total reflection lens；Plate is thermally isolated in 10-；11- heat emission holes；12- thermal conductive material layers；13- is recessed
Groove.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
Embodiment：
Please refer to Fig.1 and Fig. 2, the utility model provide a kind of technical solution：A kind of LED lamp bead of fluorescent powder photo-thermal coupling
Encapsulating structure, including metal base 1 and heat sink 2, the metal base 1 are embedded in the inside of heat sink 2, the metal base
1 upper surface is equipped with insulating layer 3, and the upper surface of the insulating layer 3 is installed with package floor 4, the package floor 4 it is upper
Surface is provided with is thermally isolated plate 10 with reeded, and the upper surface that plate 10 is thermally isolated is installed with LED array 5, described
The outer surface of LED array 5 is equipped with packaging plastic 6, and the packaging plastic 6 is arranged on the appearance that plate 10 and metal base 1 is thermally isolated
Face, the outer surface gluing of the packaging plastic 6 have a phosphor powder layer 7, the both ends of the phosphor powder layer 7 be thermally isolated plate 10 carry it is recessed
Groove is connected, and the outer surface of the phosphor powder layer 7 is also installed with silicone material 8, the silicone material 8 it is outer
Surface is provided with total reflection lens 9.
Preferably, the surrounding of the heat sink 2 is provided with multiple heat emission holes 11, and symmetrical point of multiple heat emission holes 11
Cloth is on the upper surface of heat sink 2；The upper surface of plate 10 is being thermally isolated in 3*5 array distributions in the LED array 5, and at LED gusts
The outer surface of row 5 also gluing has thermal conductive material layer 12；The package floor 4 is provided at both ends with two grooves 13, and two recessed
13 arc-shaped structure of groove is connected with phosphor powder layer 7.
Specifically used mode and advantage：The LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling, by setting Metal Substrate
Seat, is equipped with heat sink in the outer surface of metal base, is passed heat by the conduction of heat of metal base, thermal interfacial material
It is directed at radiator to shed, the main heat sink path of fluorescent powder upwardly through lens including to the heat transfer of environment and passing downwardly through
LED chip reaches two approach of heat transfer of heat sink, since chip and phosphor powder layer share cooling base, in order to reduce the two
Influence each other, added on pedestal and groove be thermally isolated so that the heat dissipation channel of chip and phosphor powder layer realizes phase substantially
It is mutually independent, so that the heat dissipation problem of chip and phosphor powder layer be separated, LED array is set plate is thermally isolated, was both avoided
The mutual heating problems of the two, also increase the free degree of lamp bead optical design, highly practical, and whole device is simple in structure,
Cost is relatively low.
Problem is thermally isolated in chip and phosphor powder layer for the utility model, is mainly filled therebetween by control
Silica gel thickness is realized.Under normal conditions, the silica gel between phosphor powder layer and chip is sphere, due to the heat transfer system of material
Number is to determine, what the minimum diameter of silica gel was also to determine, if so want to increase thermal resistance, must increase the outside diameter of layer of silica gel,
Increase the thickness of layer of silica gel.
The heat dissipation design of the phosphor powder layer includes two aspects：First, the heat conduction heat between increase phosphor powder layer and chip
Resistance, to reduce the mutual heat effect of chip and phosphor powder layer；Second, designing special heat dissipation path for phosphor powder layer, effectively dissipate
Go out phosphor powder layer heat.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The scope of type is indicated by the appended claims rather than the foregoing description, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
Claims (4)
- A kind of 1. LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling, it is characterised in that：Including metal base (1) and heat sink (2), the metal base (1) is embedded in the inside of heat sink (2), and metal base (1) upper surface is equipped with insulating layer (3), the upper surface of the insulating layer (3) is installed with package floor (4), and the upper surface of the package floor (4) is provided with Plate (10) is thermally isolated with reeded, the upper surface that plate (10) is thermally isolated is installed with LED array (5), LED gusts described The outer surface of row (5) is equipped with packaging plastic (6), and the packaging plastic (6), which is arranged on, is thermally isolated plate (10) and metal base (1) Outer surface, the outer surface gluing of the packaging plastic (6) have phosphor powder layer (7), and the both ends of the phosphor powder layer (7) are with being thermally isolated plate (10) groove carried is connected, and the outer surface of the phosphor powder layer (7) is also installed with silicone material (8), described The outer surface of silicone material (8) is provided with total reflection lens (9).
- A kind of 2. LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling according to claim 1, it is characterised in that：It is described The surrounding of heat sink (2) is provided with multiple heat emission holes (11), and multiple heat emission holes (11) are symmetrically distributed in the upper of heat sink (2) On surface.
- A kind of 3. LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling according to claim 1, it is characterised in that：It is described The upper surface of plate (10) is being thermally isolated in 3*5 array distributions in LED array (5), and has in the outer surface also gluing of LED array (5) Thermal conductive material layer (12).
- A kind of 4. LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling according to claim 1, it is characterised in that：It is described Package floor (4) is provided at both ends with two grooves (13), and two arc-shaped structures of groove (13) are connected with phosphor powder layer (7) Connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720813652.6U CN207250550U (en) | 2017-07-06 | 2017-07-06 | A kind of LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720813652.6U CN207250550U (en) | 2017-07-06 | 2017-07-06 | A kind of LED lamp bead encapsulating structure of fluorescent powder photo-thermal coupling |
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| CN207250550U true CN207250550U (en) | 2018-04-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585632A (en) * | 2019-02-14 | 2019-04-05 | 旭宇光电（深圳）股份有限公司 | High-power long-distance fluorescent powder type white light LEDs cooling encapsulation |
| CN116877943A (en) * | 2023-09-06 | 2023-10-13 | 山西星心半导体科技有限公司 | Lamp bead encapsulation processing device |
-
2017
- 2017-07-06 CN CN201720813652.6U patent/CN207250550U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585632A (en) * | 2019-02-14 | 2019-04-05 | 旭宇光电（深圳）股份有限公司 | High-power long-distance fluorescent powder type white light LEDs cooling encapsulation |
| US10418537B1 (en) * | 2019-02-14 | 2019-09-17 | Xuyu Optoelectronics (Shenzhen) Co., Ltd. | High-power remote phosphor white LED heat-dissipation package |
| CN116877943A (en) * | 2023-09-06 | 2023-10-13 | 山西星心半导体科技有限公司 | Lamp bead encapsulation processing device |
| CN116877943B (en) * | 2023-09-06 | 2023-12-01 | 山西星心半导体科技有限公司 | Lamp bead encapsulation processing device |
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Effective date of registration: 20190506 Address after: 523710 No. 3 Yinyuan Street, Xiangwang Industrial Zone, Jiaoyitang Community, Tangxia Town, Dongguan City, Guangdong Province Patentee after: Dongguan Jingji Industrial Co., Ltd. Address before: 518109 4th Floor, Building B, Colente Low Carbon Industrial Park, Dalang Street Peak Community, Longhua New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Crystal Photoelectric Technology Co., Ltd. |