CN207854267U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN207854267U CN207854267U CN201820097534.4U CN201820097534U CN207854267U CN 207854267 U CN207854267 U CN 207854267U CN 201820097534 U CN201820097534 U CN 201820097534U CN 207854267 U CN207854267 U CN 207854267U
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- Prior art keywords
- printed circuit
- circuit board
- heat
- base
- conductive structure
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- 239000010410 layer Substances 0.000 claims description 66
- 239000000463 material Substances 0.000 claims description 28
- 238000010276 construction Methods 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 229910002804 graphite Inorganic materials 0.000 claims description 19
- 239000010439 graphite Substances 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 230000009467 reduction Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 12
- 238000012546 transfer Methods 0.000 description 10
- 239000003292 glue Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
A kind of printed circuit board, including：Base, the base have high-temperature region；Conductive structure, the conductive structure are located in the high-temperature region of the base, and the conductive structure exposes from the side of the base and thermally contacted with heat sink.By in the setting of the high-temperature region of the base and the heat sink conductive structure being connected directly, shorten the high-temperature region heat dissipation path, the reduction high-temperature region heat dissipation thermal resistance to reach, improve the purpose of the heat-sinking capability of the high-temperature region, the temperature of high-temperature region when so as to reduce work, the appearance for advantageously reducing the excessively high problem of device temperature on printed circuit board and printed circuit board is conducive to the reliability for improving device work.
Description
Technical field
The utility model is related to field of semiconductor manufacture, more particularly to a kind of printed circuit board.
Background technology
Low temperature reduces the operating temperature of the use environment temperature and itself of device using the importance for being device reliability
The working life that device can effectively be promoted, to extend the service life and reliability of entire product.In laser radar field,
The use environment temperature of device and the operating temperature of itself can effectively ensure that entire laser radar service life and reliability
It improves.
It is welded on printed circuit board (Printed Circuit Board, printed circuit board) in laser radar luminous
Device, in order to which luminescent device is adjusted to suitable launch angle and direction and is finally fastened to the direction and angle, printing
Circuit board must be can be movable.After being adjusted to suitable direction and angle, by printed circuit board and branch is fixed with glue
Frame is bonded together, to obtain best laser emitting angle.
In current laser radar, printed circuit board has no special heat dissipation and considers, so printed circuit board is not any
The measure of heat dissipation.The heat of printed circuit board is emitted to air China and foreign countries except through convection current, is just only transmitted to by glue solid
On fixed rack.
In order to build thermal dissipating path, a kind of method be heat conductive pad will be filled up between printed circuit board and fixing bracket, or
Thermally conductive gel or other heat-conducting mediums, in this way, the heat of printed circuit board can be transmitted to fixing bracket by heat-conducting medium
On, reduce the own temperature and device temperature of printed circuit board.It, can be in adjacent printing electricity if it is multiple printed circuit boards
Heat eliminating medium is filled between the plate of road, printed circuit board outermost in this way can transfer heat to fixed branch by multistage transmission
On frame.
But the heat dissipation effect of the above-mentioned printed circuit board for being provided with thermal dissipating path is not still good enough, exist thermo-contact it is bad,
Thermal resistance is excessive, excessively high to be susceptible to device temperature on printed circuit board and printed circuit board, under device functional reliability
The problem of drop.
Utility model content
The utility model solves the problems, such as to be to provide a kind of printed circuit board, to improve the heat of printed circuit board radiating access
Contact reduces thermal resistance, heat dissipation effect is improved, to reduce the excessively high problem of device temperature on printed circuit board and printed circuit board
Appearance, improve device functional reliability.
To solve the above problems, the utility model provides a kind of printed circuit board, including：
Base, the base have high-temperature region；Conductive structure, the conductive structure are located in the high-temperature region of the base,
The conductive structure exposes from the side of the base and is thermally contacted with heat sink.
Optionally, the base has at one or more empty avoidings, and the conductive structure is set at least partly described base
In at the empty avoiding of floor height warm area.
Optionally, in the conductive structure is detachably arranged at the empty avoiding；Alternatively, the conductive structure also wraps
It includes：Heat-conducting layer and the adhesive layer between the heat-conducting layer and the base.
Optionally, the base includes at least one laminated construction, and the laminated construction includes insulating layer and is located at described
The articulamentum of surface of insulating layer；The articulamentum includes circuit pattern, and the gap between adjacent circuit patterns is as the empty avoiding
Place.
Optionally, it is also extended in the insulating layer of same laminated construction at the empty avoiding, and runs through the insulating layer.
Optionally, two or more laminated construction are run through at the empty avoiding.
Optionally, the conductive structure is heat pipe.
Optionally, the conductive structure includes heat-conducting layer, and the thermal conductivity of the heat conduction layer material is more than 6W/ (mK).
Optionally, the material of the heat-conducting layer is graphite.
Optionally, the printed circuit board is set on fixing bracket；The fixing bracket is described heat sink.
Compared with prior art, the technical solution of the utility model has the following advantages：
The conductive structure is located in the base of the high-temperature region, and exposes from the side of the base and connect with heat sink heat
It touches.Since the heat sink temperature is relatively low, the temperature of high-temperature region when being less than work, the setting of the conductive structure can be real
The existing high-temperature region and it is described it is heat sink between be directly thermally connected, when work the heat of the high-temperature region can pass through shorter road
Diameter conduct to it is described it is heat sink on realize dissipation, so the setting of the conductive structure can effectively reduce the high-temperature region and heat
The length of heat dissipation path, reduces the heat dissipation thermal resistance of the high-temperature region between heavy, and base's height can be effectively improved to improve
The heat-sinking capability of warm area effectively reduces the temperature of high-temperature region when work, advantageously reduces printed circuit board and printing electricity
The appearance of the excessively high problem of device temperature on the plate of road is conducive to the reliability for improving device work；And the conductive structure is only set
It is placed in the high-temperature region, therefore the heat of the high-temperature region will not be spread in entire printed circuit board, so as to effectively anti-
Only influence of the heat produced by the high-temperature region to base's other parts, to effectively improve the printed circuit board and
The stability and reliability of device on the printed circuit board.
In the utility model alternative, the conductive structure includes heat-conducting layer, and the material of the heat-conducting layer is graphite.Stone
The thermal conductivity of ink is quite high, and up to 1600W/ (mK) therefore sets the material of the heat-conducting layer to the way of graphite, energy
It is enough substantially improved the heat transfer efficiency of the conductive structure, the thermal resistance of the conductive structure is made to be greatly reduced, to improve heat dissipation
Effect advantageously reduces the appearance of the excessively high problem of device temperature on printed circuit board and printed circuit board, is conducive to improve device
The reliability of part work；And graphite is in the form of sheets, and graphite flake has certain flexibility, and the shape of graphite flake can be to a certain degree
In be arbitrarily bent, length can according to technology require and choose, therefore use graphite flake as the heat-conducting layer, institute can be reduced
State conductive structure position and size to the technology restriction of heat-conducting layer, can effectively expand the design of the printed circuit board from
By spending.
Description of the drawings
Fig. 1 is the overlooking structure diagram of one embodiment of the utility model printed circuit board；
Fig. 2 is the cross-sectional view along A1A2 lines in printed circuit board embodiment shown in Fig. 1.
Specific implementation mode
By background technology, it is found that printed circuit board in the prior art exists, thermo-contact is bad, thermal resistance is excessive, heat dissipation effect
Bad problem.The reason of its heat dissipation problem being analyzed in conjunction with the radiating treatment of printed circuit board in the prior art：
In current laser radar, printed circuit board and without special radiating treatment, printed circuit board can only by with
Cross-ventilation radiates and is radiated by way of transferring heat to glue and being transmitted to again on holder.It is empty in confined space
The convection current of gas is very small, thus convection current heat output is also very small.As for heat conduction, because of the thermal coefficient of glue
Less than 1W/ (mK), and contact area is less than 5mm2, therefore by the heat that glue conducts be also limited.Thus,
The printed circuit board and extraneous heat transfer resistance that do not do radiating treatment are larger, heat dissipation effect is not good enough, are susceptible to printed circuit board
The excessively high problem of temperature.
The way that Heat Conduction Material is filled between printed circuit board and fixing bracket, can be greatly lowered printed circuit board
Heat transfer resistance between fixing bracket.Because the thermal coefficient of Heat Conduction Material itself is more than 2W/ (mK), and heat transfer area
It increases considerably, more than 4cm2, therefore heat output can increase considerably, the temperature of printed circuit board can then decrease.
However, this heat conduction measure still has a prodigious disadvantage, first, although the thermal coefficient of the heat-conducting medium of filling than
Glue is high, but highest does not exceed 6W/ (mK), so promoting printed circuit board radiating by way of filling Heat Conduction Material
The effect of ability is limited；Second, printed circuit board needs reserved certain position to be thermally contacted with the realization of the heat-conducting medium of filling, because
This can occupy the surface area of printed circuit board, to will appear the problem of occupying printed circuit board cloth plate suqare；Third, device
Heat dissipation is needed by transferring heat to printed circuit board, then passes to heat-conducting medium, and heat transfer path is longer, heat dissipation effect
It is not still especially desirable；4th, it radiates simultaneously if it is multiple printed circuit boards, the heat of outermost layer printed circuit board needs
It can be just transmitted on fixing bracket by multilayered thermally-conductive medium, heat-transfer effect is poor；5th, heat-conducting medium is filled in temperature change
Stress will produce to printed circuit board when change, the long-term running reliability of product can be had an impact.
To solve the technical problem, the utility model provides a kind of printed circuit board, passes through the high temperature in the base
Area is arranged and the heat sink conductive structure being connected directly, and shortens the high-temperature region heat dissipation path, the reduction high temperature to reach
Radiate thermal resistance in area, improves the purpose of the heat-sinking capability of the high-temperature region, the temperature of high-temperature region when so as to reduce work,
The appearance for advantageously reducing the excessively high problem of device temperature on printed circuit board and printed circuit board is conducive to improve device work
Reliability.
It is understandable to enable the above objects, features, and advantages of the utility model to become apparent, below in conjunction with the accompanying drawings to this
The specific embodiment of utility model is described in detail.
With reference to figure 1 and Fig. 2, the structural schematic diagram of one embodiment of the utility model printed circuit board is shown.Wherein, Fig. 1
For the overlooking structure diagram of printed circuit board embodiment；Fig. 2 is cuing open along A1A2 lines in printed circuit board embodiment shown in Fig. 1
Face structural schematic diagram.
The printed circuit board includes：Base 110, the base 110 have high-temperature region 111；Conductive structure 120, it is described
Conductive structure 120 is located in the base 110 of the high-temperature region 111, and the conductive structure 120 is from the side of the base 110 113
Expose and is thermally contacted with heat sink 130.
The conductive structure 120 is located in the base 110 of the high-temperature region 111, and from the side of the base 110 113
Exposing is thermally contacted with heat sink, therefore the setting of the conductive structure 120 can be quickly by the base 110 of the high-temperature region 111
Heat derives effectively reduce the high-temperature region so the heat-sinking capability of the base 110 of the high-temperature region 111 can be effectively improved
The temperature of 111 base 110 is conducive to the thermo-contact for improving the printed circuit board radiating access, reduces thermal resistance, improves heat dissipation
Effect advantageously reduces the appearance of the excessively high problem of device temperature on printed circuit board and printed circuit board, is conducive to improve device
The reliability of part work.
Electric connection of the base 110 between the setting and semiconductor devices of semiconductor devices provides base
Plinth.
As shown in Figure 1, the base 110 includes high-temperature region 111, it is provided in the base 110 of the high-temperature region 111 multiple
Generated heat is more at work by high heating device 111H, the high heating device 111H, therefore the high heating device
The use environment temperature and device of the 111H operating temperature of itself are with regard to relatively high.
In addition, in the present embodiment, the base 110 further includes low-temperature space 112, is set in the base 110 of the low-temperature space 112
Multiple low heating device 112L are equipped with, generated heat is less therefore described low at work by the low heating device 112L
The operating temperature of the use environment temperature and device of heating device 112L itself is relatively low.
It should be noted that in the present embodiment, the shape and the height of the high-temperature region 111 and the low-temperature space 112
The quantity of heating device 111H and the low heating device 112L and setting layout are only an example.Other implementations of the utility model
In example, the shape and the quantity of the high heating device and the low heating device of the high-temperature region and the low-temperature space and set
Set layout or other forms.
Specifically, in the present embodiment, in laser radar, the high heating device 111H is the printed circuit board applications
Luminescent device.But the printed circuit board applications, in laser radar, the high heating device 111H is set as luminescent device
Way be only an example, the utility model is to the purposes of the printed circuit board and the specific type of the high heating device
It does not limit.
As illustrated in figs. 1 and 2, the base 110 includes the first face 117 being oppositely arranged and the second face (not indicated in figure)
And the side in connection first face 117 and second face.The semiconductor of electrical connection is realized by the printed circuit board
Device is respectively arranged on first face 117 or second face.Specifically, in the present embodiment, the high heating device
111H and the low heating device 112L may be contained on the first face 117 of the base.In the utility model other embodiment,
The high heating device and the low heating device can also be set at least one face in first face and second face
On.
In the present embodiment, the base 110 has a 110a at one or more empty avoidings, and 110a can be institute at the empty avoiding
The setting for stating conductive structure 120 provides space.
In conjunction with reference to figure 2, the base 110 includes at least one laminated construction 114, and the laminated construction 114 includes exhausted
Edge layer 115 and articulamentum 116 positioned at 115 surface of the insulating layer, wherein the articulamentum 116 includes circuit pattern 116a,
Gap between adjacent circuit patterns 116a is as 110a at the empty avoiding.
The material of circuit pattern 160a in the articulamentum 116 is conductive material, for realizing the printing is set to
The electrical functions of circuit board；The insulating layer 115 is for realizing the electrical isolation between connected articulamentum 116.
It is used as 110a at the empty avoiding by the gap between adjacent circuit patterns 160a, is the conductive structure 120
Setting provides space can be effectively ensured the printed circuit board without making additional processing to the printed circuit board
The stability and reliability of electrical functions, additionally it is possible to realize the setting of the conductive structure 120 to improve the high-temperature region 111
The heat-sinking capability of base 110 reduces the temperature of the base 110 of the high-temperature region 111, to realize heat-sinking capability raising and electricity
What performance was stablized takes into account.But in the utility model other embodiment, can also by the base carry out empty avoiding processing,
It is formed at the empty avoiding in the base.The utility model does not limit the forming method at the empty avoiding.
In the present embodiment, the material of circuit pattern 160a is copper, the material of the insulating layer 115 in the articulamentum 116
For epoxide resin material (such as FR4).In the utility model other embodiment, the material of circuit pattern also may be used in the articulamentum
Think other conductive materials；The material of the insulating layer may be other insulating materials, and the utility model does not limit this.
As shown in Fig. 2, in the present embodiment, 110a also extends to the insulating layer 115 of same laminated construction 114 at the empty avoiding
It is interior, and run through the insulating layer 115, i.e., on the direction on 110 surface of the vertical base, 110a is through described folded at the empty avoiding
Layer structure 114, this way can increase the inner space of 110a at the empty avoiding, to setting for the conductive structure 120
The space that bigger is provided is set, the volume for increasing the conductive structure 120 is conducive to, improves the heat transfer effect of the conductive structure 120
Rate.
It should be noted that in the present embodiment, 110a runs through a laminated construction 114 at the empty avoiding, i.e., vertically
On the direction on 110 surface of the base, 110a runs through adjacent an insulating layer 115 and a conductive layer 116 at the empty avoiding.
But this way is only an example.
In the utility model other embodiment, two or more lamination knots are may also extend through at the empty avoiding
Structure.Run through laminated construction quantity is more at the empty avoiding, in 110 surface direction of the vertical base, the ruler at the empty avoiding
Very little bigger, the inner space at the empty avoiding is bigger, so as to be increase 120 volume of conductive structure, the raising base
The offer of floor height warm area heat-sinking capability is possible, to adapt to the requirement of different high heating devices, different operating temperature.
It should also be noted that, in the present embodiment, 110a is located at the inside of the base 110 at the empty avoiding, i.e., described
110a is not showed out from the first face 117 of the base 110 or described second at empty avoiding, so passing through the printed circuit board
Realizing also has at least one laminated construction or at least one between 110a at the semiconductor devices and the empty avoiding of electrical connection
Insulating layer.Specifically, as shown in Fig. 2, 110 high generating heat with the multiple on 110 high-temperature region 111 of the base at the empty avoiding
Laminated construction 114 and an insulating layer 116 there are one being also set up between device 111H.
The conductive structure 120 is set in the high-temperature region 111 of the base 110, by the high-temperature region of the base 110
111 heat derives；As shown in Figure 1, the conductive structure 120 also from the side of the base 110 113 and with it is heat sink 130 heat
Contact, heat derived from the high-temperature region 111 from the base 110 is conducted to described heat sink 130.
Since heat sink 130 temperature will not change with the size for being transmitted to its thermal energy, and heat sink temperature phase
To relatively low, less than the temperature of the high-temperature region 111, therefore the setting of the conductive structure 120 can realize the high-temperature region 111
And be directly thermally connected between described heat sink 130, when work the heat of the high-temperature region 111 can pass through shorter path
To realize dissipation on to described heat sink 130.So the setting of the conductive structure 120 can effectively reduce the high-temperature region 111
With the length of heat sink 130 direct heat dissipation paths, the heat dissipation thermal resistance of the high-temperature region 111 is reduced, can be effectively improved to improve
The heat-sinking capability of the high-temperature region 111 effectively reduces the temperature of the high-temperature region 111 when work, advantageously reduces printed circuit
The appearance of the excessively high problem of device temperature on plate and printed circuit board is conducive to the reliability for improving device work.
And the conductive structure 120 is only arranged at the high-temperature region 111, and the low-temperature space 111 of the base 110 is not set
It is equipped with the conductive structure 120.The only way of the conductive structure 120 described in local setting can be avoided effectively from the high temperature
Heat derived from area 111 is spread in the entire printed circuit board, can effectively prevent heat produced by the high-temperature region 111
Influence to 110 other parts of the base, prevent the low-temperature space 112 of the base 110 influenced by the high-temperature region 111 and
There is the problem of temperature rise.To be conducive to improve the stabilization of device on the printed circuit board and the printed circuit board
Property and reliability.
And since heat sink 130 temperature remains unchanged, 110 high-temperature region 111 of the base with described heat sink 130 it
Between the temperature difference it is relatively large, therefore the conductive structure 120 is only arranged to the way of the high-temperature region 111, can made described
The high-temperature region 111 of base 110 is directly connected with described heat sink 130, to be conducive to improve the heat dissipation speed of the conductive structure 120
Rate is conducive to the thermo-contact for improving the printed circuit board radiating access, reduces thermal resistance, improves heat dissipation effect.
As shown in Figure 1, shortening the heat conduction path between the high-temperature region 111 and described heat sink 130 as possible, parallel
In the plane on 110 surface of the base, the conductive structure 120 extends towards described heat sink 130, and from towards described heat sink
130 side 113 is exposed, and is directly thermally contacted with described heat sink 130.
In the present embodiment, in order to improve the heat-sinking capability of the conductive structure 120, in the present embodiment, conductive structure 120 from
It is in contact with described heat sink 130 after exposing in the base 110, that is to say, that between described heat sink 130 and the base 110
With gap, conductive structure 120 described in the gap exposed portion.Therefore gap between the base 110 and described heat sink 130
The conductive structure 120 exposed can also realize the dissipation of heat.And by the increase of 120 area of exposed conductive structure,
120 heat-sinking capability of the conductive structure can be effectively improved, temperature, the raising device for advantageously reducing the high-temperature region 111 are steady
It is qualitative.
It should be noted that in the present embodiment, the printed circuit board applications are in laser radar, the printed circuit board
It is set on fixing bracket；The fixing bracket is described heat sink 130.But the utility model is to the use of the printed circuit board
Way and the heat sink type do not limit, described heat sink to can also be other temperature in the utility model other embodiment
Stable and temperature is less than the device or modular construction of the high-temperature region.
In the present embodiment, there is 110a at one or more empty avoidings, the conductive structure 120 to be set to for the base 110
In at the empty avoiding of at least partly described base high-temperature region.
Specifically, 110a is located at the inside of the base 110 at the empty avoiding, i.e., 110a is not from described at the described empty avoiding
First face 117 of base 110 described second is showed out, therefore the conductive structure 120 is located inside the base 110, and
Not from first face 117 and second face is any one shows out.
As shown in Fig. 2, the conductive structure 120 is located at the high-temperature region 111 of the base 110, the conductive structure 120 with
Laminated construction 114 and an insulating layer 116 there are one being also set up between high heating device 111H on the high-temperature region 111.This
In utility model other embodiment, the conductive structure can also fit in the surface of the base, i.e., the described conductive structure from
First face of the base or the second face is any one shows out.
In the present embodiment, in the articulamentum 116, gap between adjacent circuit patterns 116a as the empty avoiding at
110a, so the conductive structure 120 is between adjacent circuit patterns 116a；And 110a is also extended to together at the empty avoiding
In the insulating layer 115 of one laminated construction 114, and run through the insulating layer 115, therefore the conductive structure 120 also extends to together
In the insulating layer 115 of one laminated construction 114, and run through the insulating layer 115, so the direction on 110 surface of the vertical base
On, the conductive structure 120 runs through a laminated construction 114, i.e., described on the direction on 110 surface of the vertical base
Conductive structure 120 runs through adjacent an insulating layer 115 and a conductive layer 116.
In the utility model other embodiment, two or more lamination knots are may also extend through at the empty avoiding
Structure；Therefore the conductive structure can also run through two or more laminated construction, to increase volume, improve heat transfer
Efficiency improves the heat-sinking capability of the base high-temperature region.
As shown in Fig. 2, in the present embodiment, the conductive structure 120 includes heat-conducting layer 121, and the heat-conducting layer 121 rises mainly
Conduction of heat, the heat of the high-temperature region is fast and effectively conducted, to reduce the work of the high-temperature region 111
Temperature.So that the heat of the high-temperature region 111 is conducted as soon as possible, reduce the thermal resistance of the conductive structure 120, improves its heat conduction
Efficiency, in the present embodiment, the thermal conductivity of 121 material of the heat-conducting layer is more than 6W/ (mK).
Specifically, in the present embodiment, the material of the heat-conducting layer 121 is graphite.Since the thermal conductivity of graphite is up to
1600W/ (mK) therefore compared with using the technical solution of heat conductive silica gel, sets the material of the heat-conducting layer 121 to stone
The way of ink can make the heat transfer efficiency of the conductive structure 120 promote hundreds of times, keep the thermal resistance of the conductive structure 120 big
Width reduces, and to improve heat dissipation effect, advantageously reduces the excessively high problem of device temperature on printed circuit board and printed circuit board
Appearance, be conducive to improve device work reliability.
Since the material of the heat-conducting layer 121 is graphite, graphite is a kind of conductive material, i.e. the material of the heat-conducting layer 121
Material is conductive material；So the conductive structure further includes：The insulating film for covering 121 surface of the heat-conducting layer (does not show in figure
Go out).The insulating film wraps up all of the heat-conducting layer 121 and shows so as to effectively realize the heat-conducting layer 121 and described
The electric isolution of base 110, the electric isolution between the especially described heat-conducting layer 121 and the conductive layer 116, to be led described in reduction
Influence of the setting of heat structure 120 to the printed circuit board electrical functions.
Moreover, because graphite is in the form of sheets, graphite flake has certain flexibility, and the shape of graphite flake can be in a certain degree
Arbitrary bending, length can be required according to technology and be chosen, therefore for being selected with 120 position of the conductive structure and size
There is no larger technology restriction, the degree of freedom of the printed circuit board arrangement design to be promoted.
It should be noted that in the present embodiment, since the material of the heat-conducting layer 121 is graphite, the graphite of sheet is easy
There is fragment stripping, therefore covers the insulating film on 121 surface of heat-conducting layer, additionally it is possible to play the role of cladding to graphite, from
And prevent fragment from removing, to reduce assembly difficulty, improve manufacturing yield.
It should also be noted that, the way for setting the material of the heat-conducting layer 121 in graphite is only an example.This practicality
In novel other embodiment, the material of the heat-conducting layer 121 can be with the material with preferable heat conductivility such as metal or ceramics
Material.
In addition, as shown in Fig. 2, in the present embodiment, the conductive structure 120 further includes：Adhesive layer 122, the adhesive layer
122 between the heat-conducting layer 121 and the base 110.The adhesive layer 122 is for realizing the heat-conducting layer 121 and institute
The connection between base 110 is stated, to realize that the heat-conducting layer 121 is fixed in the position of the printed circuit intralamellar part.Specifically,
The material of the adhesive layer 122 can be heat-conducting glue, i.e., the gap between the described heat-conducting layer 121 and the base 110 uses can
Cured heat-conducting glue is filled, and after heat conduction adhesive curing, adhesion is realized between the base 110 and the heat-conducting layer 121.
In the present embodiment, the conductive structure 120 includes heat-conducting layer 121 and adhesive layer 122, and passes through the adhesive layer
122 are fixed in the base 110.But this way is only an example.In the utility model other embodiment, the heat conduction
Structure can also be detachably arranged in the base, i.e., the described conductive structure can also be detachably arranged in the empty avoiding
In place, to the conductive structure when something goes wrong, the radiator structure can be effectively replaced, to improve the high-temperature region
Heat-sinking capability reduces thermal resistance, so ensure on printed circuit board and printed circuit board device have lower operating temperature and
Environment temperature ensures the reliability of device work.
In addition, other than the selection higher material of thermal conductivity is as the heat-conducting layer, in the utility model alternative,
The conductive structure is also with for heat pipe.Heat pipe is a kind of quick thermal transport property that heat-conduction principle and phase change medium is utilized
Conductive structure.Since the capacity of heat transmission of heat pipe is better than most known metals, set the conductive structure to heat pipe
Way can effectively reduce the thermal resistance of the conductive structure, the conductive structure with higher thermal conduction efficiency is obtained, to protect
Demonstrate,prove the reliability of device work.
Although the utility model discloses as above, the utility model is not limited to this.Any those skilled in the art,
It does not depart from the spirit and scope of the utility model, can make various changes or modifications, therefore the scope of protection of the utility model
It should be subject to claim limited range.
Claims (10)
1. a kind of printed circuit board, which is characterized in that including：
Base, the base have high-temperature region；
Conductive structure, the conductive structure are located in the high-temperature region of the base, and the conductive structure is from the side of the base
Expose and is thermally contacted with heat sink.
2. printed circuit board as described in claim 1, which is characterized in that the base has at one or more empty avoidings, institute
It states in conductive structure is set at the empty avoiding of at least partly described base high-temperature region.
3. printed circuit board as claimed in claim 2, which is characterized in that the conductive structure is detachably arranged in described keep away
In vacancy；
Alternatively, the conductive structure further includes：Heat-conducting layer and the adhesive layer between the heat-conducting layer and the base.
4. printed circuit board as claimed in claim 2, which is characterized in that the base includes at least one laminated construction, institute
It includes insulating layer and the articulamentum positioned at the surface of insulating layer to state laminated construction；
The articulamentum includes circuit pattern, the gap between adjacent circuit patterns as the empty avoiding at.
5. printed circuit board as claimed in claim 4, which is characterized in that also extend to same laminated construction at the empty avoiding
In insulating layer, and run through the insulating layer.
6. printed circuit board as claimed in claim 4, which is characterized in that run through two or more institutes at the empty avoiding
State laminated construction.
7. the printed circuit board as described in claim 1 or 3, which is characterized in that the conductive structure is heat pipe.
8. printed circuit board as described in claim 1, which is characterized in that the conductive structure includes heat-conducting layer, the heat conduction
The thermal conductivity of layer material is more than 6W/ (mK).
9. printed circuit board as claimed in claim 8, which is characterized in that the material of the heat-conducting layer is graphite.
10. printed circuit board as described in claim 1, which is characterized in that the printed circuit board is set on fixing bracket；
The fixing bracket is described heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820097534.4U CN207854267U (en) | 2018-01-19 | 2018-01-19 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820097534.4U CN207854267U (en) | 2018-01-19 | 2018-01-19 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207854267U true CN207854267U (en) | 2018-09-11 |
Family
ID=63415655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820097534.4U Active CN207854267U (en) | 2018-01-19 | 2018-01-19 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207854267U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110780280A (en) * | 2019-11-07 | 2020-02-11 | 上海禾赛光电科技有限公司 | Laser radar |
-
2018
- 2018-01-19 CN CN201820097534.4U patent/CN207854267U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110780280A (en) * | 2019-11-07 | 2020-02-11 | 上海禾赛光电科技有限公司 | Laser radar |
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Address after: 201800 Building 2, no.468 xinlai Road, Jiading District, Shanghai Patentee after: Shanghai Hesai Technology Co., Ltd Address before: 201821 building A4, No. 925, Yecheng Road, Jiading District, Shanghai Patentee before: HESAI PHOTONICS TECHNOLOGY Co.,Ltd. |
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Address after: No.2 building, no.468 xinlai Road, Jiading District, Shanghai, 201821 Patentee after: Shanghai Hesai Technology Co.,Ltd. Address before: 201800 Building 2, no.468, xinlai Road, Jiading District, Shanghai Patentee before: Shanghai Hesai Technology Co.,Ltd. |
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