CN207283896U - A kind of multi-layer PCB board with radiator structure - Google Patents
A kind of multi-layer PCB board with radiator structure Download PDFInfo
- Publication number
- CN207283896U CN207283896U CN201721027873.7U CN201721027873U CN207283896U CN 207283896 U CN207283896 U CN 207283896U CN 201721027873 U CN201721027873 U CN 201721027873U CN 207283896 U CN207283896 U CN 207283896U
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- China
- Prior art keywords
- layer
- heat
- heat sink
- circuit plate
- pcb board
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Abstract
The utility model discloses a kind of multi-layer PCB board with radiator structure, its drip irrigation device includes internal layer circuit plate, the internal layer circuit plate is externally provided with inner insulating layer, the inner insulating layer is externally provided with heat dissipating layer, the heat dissipating layer is externally provided with external insulation layer, and the external insulation layer is externally provided with outer-layer circuit plate, and heat dissipating layer is made of multiple waveform heat sinks, for the heat sink using being made of high heat conductive material, the utility model has the function of that radiating rate is fast.
Description
Technical field
Pcb board field is the utility model is related to, more specifically it is related to a kind of multi-layer PCB board with radiator structure.
Background technology
Wiring board is important electronic unit, it is the supporter of electronic component, is that electronic component is electrically connected
Supplier.Multilayer circuit board is during energization use, and easily fever is burnt out multilayer circuit board, and positioned at more in multilayer circuit board
Heat on the internal layer circuit plate at sandwich circuit board center needs to radiate by reaching outer-layer circuit plate after multilayer circuit board, makes
It is slow to obtain internal layer circuit plate radiating rate, and then causes multilayer circuit board bulk temperature high, easily burns.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of multilayer with radiator structure
Pcb board, has the function of that radiating rate is fast.
To achieve the above object, the utility model provides following technical solution：A kind of multi-layer PCB with radiator structure
Plate, including internal layer circuit plate, the internal layer circuit plate are externally provided with inner insulating layer, and the inner insulating layer is externally provided with heat dissipating layer, described
Heat dissipating layer is externally provided with external insulation layer, and the external insulation layer is externally provided with outer-layer circuit plate, and heat dissipating layer is by multiple waveform heat sink structures
Into the heat sink is used and is made of high heat conductive material.
By using above-mentioned technical proposal, corrugated heat sink is supported between external insulation layer and inner insulating layer for empty
The space of flow of air causes the heat on inner insulating layer to accelerate to shed by air-cooled mode, so that on internal layer circuit plate
Heat only need to be delivered to inner insulating layer and can radiate, accelerate the radiating rate of internal layer circuit plate, and heat sink
Thermal conductivity factor it is high big with the area of air contact, heat sink can carry out the heat absorption of inner insulating layer and external insulation layer soon
Speed heat dissipation, so that the radiating rate of pcb board is further increased, and corrugated heat sink can improve the resistance to compression of pcb board
Ability, prevents pcb board to be destroyed.
The utility model is further arranged to：The heat sink is staggeredly placed, the one of heat dissipation of adjacent two blocks of heat sinks
Wave crest on plate is corresponding with the position of the trough on another block of plate.
By using above-mentioned technical proposal, heat dissipating layer is that Wave crest and wave trough is alternately present so as into one in machine and transverse direction
Step improves the anti-pressure ability of pcb board.
The utility model is further arranged to：The heat sink is equipped with external insulation layer towards one end of external insulation layer and extends simultaneously
The outer heat sink being embedded into external insulation layer and outer-layer circuit plate.
By using above-mentioned technical proposal, with outer heat sink by the heat inside external insulation layer and outer-layer circuit plate
Heat is quickly oriented to heat sink, and the heat on heat sink is shed the heat on heat sink by air-cooled mode, so as to improve
The radiating rate of external insulation layer.
The utility model is further arranged to：The one side that the heat sink is bonded with inner insulating layer is equipped with inside sandwich circuit board
The interior heat sink of extension, the interior heat sink are embedded in inside inner insulating layer.
By using above-mentioned technical proposal, the heat inside inner insulating layer is oriented to heat sink, heat dissipation using interior heat sink
Heat on plate would spill out by air-cooled mode, so as to improve the radiating rate of inner insulating layer.
The utility model is further arranged to：The internal layer circuit plate is equipped with heat emission hole, and heat dissipation is equipped with the heat emission hole
Ring, the interior heat sink extend to the middle part of heat dissipating ring and are fixedly connected with heat dissipating ring, and the heat dissipating ring uses high thermal conductivity coefficient
Material is made.
By using above-mentioned technical proposal, the heat on internal layer circuit plate is focused on the heat dissipating ring of heat emission hole, and is dissipated
Heat on hot ring is connected by interior heat sink with heat sink so that the heat on internal layer circuit plate can be by being directly directed to dissipate
Hot plate needs not move through inner insulating layer, so as to improve the radiating rate on internal layer circuit plate.
The utility model is further arranged to：The outer-layer circuit edges of boards are along chafing strip is fixed with, and the chafing strip is by resistance to
Mill material is made.
By using above-mentioned technical proposal, chafing strip can prevent outer-layer circuit plate and ground or other asperity contacts,
So that outer-layer circuit plate is not easy to wear to be easily installed electronic component.
In conclusion the utility model has the following advantages：
1. the space for air circulation is propped up in pcb board by waveform heat sink so that layer within the circuit only need by
One layer insulating can carry out air-cooled heat dissipation, and then improve the radiating rate of layer within the circuit.
Brief description of the drawings
Fig. 1 is the structure diagram of the present embodiment；
Fig. 2 is the internal structure schematic diagram of the present embodiment；
Fig. 3 is that the explosion for highlighting heat sink in the present embodiment, interior scattered silver, heat dissipating ring and internal layer circuit plate connection relation is shown
It is intended to.
Description of reference numerals：1st, internal layer circuit plate；2nd, inner insulating layer；3rd, heat sink；4th, external insulation layer；5th, outer-layer circuit
Plate；6th, outer heat sink；7th, interior heat sink；8th, heat emission hole；9th, heat dissipating ring；10th, chafing strip.
Embodiment
The utility model is described in further detail below in conjunction with attached drawing.
The present embodiment discloses a kind of multi-layer PCB board with radiator structure, as shown in Figure 1 and Figure 2 including internal layer circuit plate
1, inner insulating layer 2 is covered outside interior sandwich circuit board 1, the heat sink 3 that inner insulating layer 2 is externally provided with, external insulation is externally provided with heat sink 3
Layer 4, outer-layer circuit plate 5 is externally provided with external insulation layer 4.Heat sink 3 is made of high heat conduction material, and heat sink 3 can will be outer exhausted
The heat absorption of edge layer 4 and inner insulating layer 2, sheds from the edge of pcb board.The edge of outer-layer circuit plate 5 is fixed with chafing strip 10,
Chafing strip 10 is made to prevent outer-layer circuit plate 5 and ground or other asperity contacts by wear-resistant material so that outer-layer circuit
Plate 5 is not easy to wear to be easily installed electronic component.
As shown in Figure 1 and Figure 2, heat sink 3 can be supported for air for waveform between inner insulating layer 2 and external insulation layer 4
The space of circulation, is quickly shed the heat on heat sink 3, inner insulating layer 2 and external insulation layer 4 by air-cooled mode, and
Waveform heat sink 3 can improve the anti-pressure ability of pcb board.
As shown in Figure 1 and Figure 2, the heat sink 3 of heat dissipating layer is staggeredly placed, adjacent two pieces of 3 one of heat sink of heat sink
Wave crest on 3 is corresponding with the wave trough position on another block of heat sink 3 so that heat dissipating layer is wave crest ripple in machine and transverse direction
Paddy is alternately present so as to further improve the anti-pressure ability of pcb board.
As shown in Figure 1 and Figure 2, the outer of outside sandwich circuit board 5 extension is equipped with close to the side of external insulation layer 4 in heat sink 3 to dissipate
Backing 6, outer heat sink 6 is embedded in external insulation layer 4 and outer-layer circuit plate 5, and heat sink 3 and outer heat sink 6 are by heat conduction system
The high material of number is made, and the heat on outer-layer circuit plate 5 can be oriented to heat sink 3 rapidly and radiated by outer heat sink 6, so that
Improve the heat-sinking capability of pcb board.
As shown in Figure 2 and Figure 3, heat emission hole 8 is equipped with interior sandwich circuit board 1, heat dissipating ring 9 is equipped with heat emission hole 8, is radiating
Plate 3 is equipped with the interior heat sink 7 of inside sandwich circuit board 1 extension close to the side of inner insulating layer 2, and interior heat sink 7 is extended to and radiated
The middle part of ring 9 is simultaneously fixedly connected with heat dissipating ring 9, and interior heat sink 7 and heat dissipating ring 9 have highly heat-conductive material to be made, internal layer circuit plate 1
Heat can be quickly oriented to by interior heat sink 7 and heat dissipating ring 9 by heat sink 3, and the heat on heat sink 3 passes through air-cooled side
Formula quickly exports, so as to accelerate the radiating rate of internal layer circuit plate 1.
Specific radiation processes：Heat on internal layer circuit plate 1 is focused on heat dissipating ring 9 by interior heat sink 7 and heat sink 3
It is directly connected to so that the radiating rate of interior heat sink 3 improves, outer-layer circuit plate 5 is unnecessary while heat dissipation is contacted with the external world
Heat is transferred on heat sink 3 by outer heat sink 6 to radiate, so that the heat of internal layer circuit plate 1 and outer-layer circuit plate 5
The quick export of amount so that PCB is not easy to burn.
The above is only the preferred embodiment of the present invention, is not intended to limit the present invention, all in this practicality
Within new design concept, any modification, equivalent replacement, improvement and so on, should be included in the protection of the utility model
Within the scope of.
Claims (6)
1. a kind of multi-layer PCB board with radiator structure, including internal layer circuit plate (1), the internal layer circuit plate (1) is externally provided with interior
Insulating layer (2), the inner insulating layer (2) are externally provided with heat dissipating layer, and the heat dissipating layer is externally provided with external insulation layer (4), the external insulation
Layer (4) is externally provided with outer-layer circuit plate (5), it is characterised in that：The heat dissipating layer is made of multiple waveform heat sinks (3), described
Heat sink (3) is used and is made of high heat conductive material.
A kind of 2. multi-layer PCB board with radiator structure according to claim 1, it is characterised in that：The heat sink (3)
It is staggeredly placed, the position phase of the wave crest on the one of heat sink of adjacent two blocks of heat sinks (3) (3) and the trough on another block of plate
It is corresponding.
A kind of 3. multi-layer PCB board with radiator structure according to claim 2, it is characterised in that：The heat sink (3)
External insulation layer (4) extension is equipped with towards one end of external insulation layer (4) and is embedded into external insulation layer (4) and outer-layer circuit plate (5)
Outer heat sink (6).
A kind of 4. multi-layer PCB board with radiator structure according to claim 3, it is characterised in that：The heat sink (3)
The one side being bonded with inner insulating layer (2) is equipped with the interior heat sink (7) of inside sandwich circuit board (1) extension, and the interior heat sink (7) is embedding
It is internal to enter inner insulating layer (2).
A kind of 5. multi-layer PCB board with radiator structure according to claim 4, it is characterised in that：The internal layer circuit
Plate (1) is equipped with heat emission hole (8), is equipped with heat dissipating ring (9) in the heat emission hole (8), the interior heat sink (7) extends to heat dissipating ring
(9) middle part is simultaneously fixedly connected with heat dissipating ring (9), and the heat dissipating ring (9) is made of high heat conductive material.
A kind of 6. multi-layer PCB board with radiator structure according to claim 5, it is characterised in that：The outer-layer circuit
Plate (5) edge is fixed with chafing strip (10), and the chafing strip (10) is made of wear-resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721027873.7U CN207283896U (en) | 2017-08-16 | 2017-08-16 | A kind of multi-layer PCB board with radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721027873.7U CN207283896U (en) | 2017-08-16 | 2017-08-16 | A kind of multi-layer PCB board with radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207283896U true CN207283896U (en) | 2018-04-27 |
Family
ID=61983458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721027873.7U Expired - Fee Related CN207283896U (en) | 2017-08-16 | 2017-08-16 | A kind of multi-layer PCB board with radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207283896U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
| CN111885814A (en) * | 2020-07-31 | 2020-11-03 | 深圳市兴达线路板有限公司 | Composite heat-conducting PCB |
-
2017
- 2017-08-16 CN CN201721027873.7U patent/CN207283896U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
| CN108633238B (en) * | 2018-08-03 | 2020-11-27 | 中国航空工业集团公司雷华电子技术研究所 | Heat dissipation device for two oppositely-inserted printed boards |
| CN111885814A (en) * | 2020-07-31 | 2020-11-03 | 深圳市兴达线路板有限公司 | Composite heat-conducting PCB |
| CN111885814B (en) * | 2020-07-31 | 2024-03-22 | 深圳市盈辉达光电有限公司 | Composite heat conduction PCB circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180427 Termination date: 20200816 |