CN207802502U - Height heat dissipation graphene wiring board - Google Patents
Height heat dissipation graphene wiring board Download PDFInfo
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- CN207802502U CN207802502U CN201721851976.5U CN201721851976U CN207802502U CN 207802502 U CN207802502 U CN 207802502U CN 201721851976 U CN201721851976 U CN 201721851976U CN 207802502 U CN207802502 U CN 207802502U
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Abstract
The utility model discloses a kind of high heat dissipation graphene wiring boards, the wiring board includes at least first line layer and the second line layer, it is equipped with the first insulating layer and second insulating layer between the first line layer and second line layer, graphene layer is equipped between first insulating layer and the second insulating layer；Multiple through holes are filled through first insulating layer and the graphene layer and the second insulating layer, the multiple through hole by insulating heat-conduction material；Also there is at least one via hole across at least one through hole, the aperture of the via hole to be less than the through hole, the via hole has the metallization hole wall for connecting the first line layer and second line layer on the wiring board.The utility model embodiment has the following advantages：On the one hand, quick, high efficiency and heat radiation is realized using the excellent performance of graphene；On the other hand, by setting via hole in the through hole filled by insulating heat-conduction material, the interlayer conduction across graphene layer is realized.
Description
Technical field
The utility model is related to wiring board technology fields, and in particular to a kind of high heat dissipation graphene wiring board.
Background technology
With the rapid development of electronics industry, the volume of electronic product is smaller and smaller, and power density is increasing, improves electricity
The heat dissipation performance of sub- product becomes the problem of becoming more and more important.
Wiring board is one of critical piece of electronic product, and the electronic component installing largely generated heat in the circuit board, improves
The heat dissipation performance of wiring board is the technical issues of being badly in need of solving.
Metal base circuit board has good heat conductivility, but metal base circuit board can only do one-sided circuit board.
Utility model content
The utility model embodiment provides a kind of high heat dissipation graphene wiring board, the heat dissipation performance for improving wiring board.
To solve the above problems, the technical solution adopted in the utility model is：
A kind of high heat dissipation graphene wiring board, the wiring board includes at least first line layer and the second line layer, described
The first insulating layer and second insulating layer, first insulating layer and described are equipped between first line layer and second line layer
Graphene layer is equipped between second insulating layer；Multiple through holes are through first insulating layer and the graphene layer and described
Second insulating layer, the multiple through hole are filled by insulating heat-conduction material；Via hole is offered at least one through hole,
The aperture of the via hole is less than the through hole, and the via hole has for connecting the first line layer and described second
The metallization hole wall of line layer.
As can be seen from the above technical solutions, the utility model embodiment has the following advantages：
On the one hand, a layer graphene layer is added in assist side, and graphene layer passes through insulating heat-conduction material and line layer
Connection, can be transmitted to graphene layer by the heat transmission of line layer, realized using the excellent performance of graphene and quickly, efficiently dissipated
Heat；
On the other hand, it by setting via hole in the through hole filled by insulating heat-conduction material, realizes across graphene
The interlayer conduction of layer so that graphene layer can be arranged on wiring board random layer, to meet the needs of different type wiring board.
Description of the drawings
It, below will be to embodiment and description of the prior art in order to illustrate more clearly of the utility model embodiment technical solution
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is a kind of structural schematic diagram for high heat dissipation graphene wiring board that the utility model embodiment provides.
Specific implementation mode
In order to make those skilled in the art more fully understand the utility model, below in conjunction with the utility model reality
The attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described
Embodiment is only the embodiment of the utility model part, instead of all the embodiments.Based on the reality in the utility model
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts is all answered
When the range for belonging to the utility model protection.
Term " first " in the specification and claims of the utility model and above-mentioned attached drawing, " second ", " third "
Etc. being for distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they
Any deformation, it is intended that cover and non-exclusive include.Such as contain the process of series of steps or unit, method, system,
The step of product or equipment are not limited to list or unit, but further include the steps that optionally not listing or unit,
Or optionally further include for these processes, method, product or equipment intrinsic other steps or unit.
Below by specific embodiment, it is described in detail respectively.
Referring to FIG. 1, one embodiment of the utility model, provides a kind of high heat dissipation graphene wiring board.
The wiring board 10 includes at least first line layer 11 and the second line layer 12, the first line layer 11 and described
The first insulating layer 13 and second insulating layer 14, first insulating layer 13 and second insulation are equipped between second line layer 12
Graphene layer 15 is equipped between layer 14；Multiple through holes 16 are through first insulating layer 13 and the graphene layer 15 and institute
Second insulating layer 14 is stated, the multiple through hole 16 is filled by insulating heat-conduction material；
Also there is at least one via hole 17 across at least one through hole 16 on the wiring board 10, it is described to lead
The aperture of through-hole 17 is less than the through hole 16, and the via hole 17 has for connecting the first line layer 11 and described the
The metallization hole wall 18 of two line layers 12.
Herein, hole mesoporous will be known as across the via hole 17 of through hole 16, which is passed through with graphene layer 15
The insulating heat-conduction material filled in perforation 16 is dielectrically separated from so that first line layer 11 and the second line layer 12 can be switched on hole
17 electrical connections, while not influenced by graphene layer 15.
In some feasible realization methods, at least one electronic component 19 is installed on the first line layer 11, it is described
At least one electronic component 19 is located at the top of at least one through hole 16.The electronic component 19 for example can be half
Conductor chip, LED lamp bead etc..Wherein, via hole is not set in the through hole 17 of 19 lower section of the electronic component.
In the present embodiment, the quantity of through hole 16 is more than the quantity of via hole 17, wherein a part of through hole 16 is located at electricity
The lower section of subcomponent 19, for realizing heat transfer, using the insulating heat-conduction material of inside filling by the heat transfer of electronic component
To graphene layer 15；Another part through hole 16, inside also have hole mesoporous --- via hole 17, to realize interlayer conduction,
The insulating heat-conduction material of inside filling has been additionally operable to be dielectrically separated from effect, and graphene layer 15 is prevented to be electrically connected with via hole 17.
In the present embodiment, the insulating heat-conduction material concretely heat-conducting silicone grease, or other thermal conductivity can also be used
The good insulating materials of energy herein not limits this.
To sum up, the utility model embodiment discloses a kind of high heat dissipation graphene wiring board, can be with from above technical scheme
Find out, the utility model embodiment has the following advantages：
On the one hand, a layer graphene layer is added in assist side, and graphene layer passes through insulating heat-conduction material and line layer
Connection, can be transmitted to graphene layer by the heat transmission of line layer, realized using the excellent performance of graphene and quickly, efficiently dissipated
Heat；
On the other hand, it by setting via hole in the through hole filled by insulating heat-conduction material, realizes across graphene
The interlayer conduction of layer so that graphene layer can be arranged on wiring board random layer, to meet the needs of different type wiring board.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
Above-described embodiment is only to illustrate the technical solution of the utility model, rather than its limitations；The common skill of this field
Art personnel should understand that：It can still modify to the technical solution recorded in the various embodiments described above, or to its middle part
Technical characteristic is divided to carry out equivalent replacement；And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution
The spirit and scope of novel each embodiment technical solution.
Claims (4)
1. a kind of high heat dissipation graphene wiring board, which is characterized in that
The wiring board includes at least first line layer and the second line layer, the first line layer and second line layer it
Between be equipped with the first insulating layer and second insulating layer, between first insulating layer and the second insulating layer be equipped with graphene layer；
Multiple through holes are through first insulating layer and the graphene layer and the second insulating layer, the multiple through hole quilt
Insulating heat-conduction material is filled；
Also there is at least one via hole across at least one through hole, the aperture of the via hole on the wiring board
Less than the through hole, the via hole has the plated through-hole for connecting the first line layer and second line layer
Wall.
2. high heat dissipation graphene wiring board according to claim 1, which is characterized in that
At least one electronic component is installed, at least one electronic component is located at least one institute on the first line layer
State the top of through hole.
3. high heat dissipation graphene wiring board according to claim 2, which is characterized in that
Via hole is not set in through hole below the electronic component.
4. high heat dissipation graphene wiring board according to claim 1, which is characterized in that
The insulating heat-conduction material is specially heat-conducting silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721851976.5U CN207802502U (en) | 2017-12-26 | 2017-12-26 | Height heat dissipation graphene wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721851976.5U CN207802502U (en) | 2017-12-26 | 2017-12-26 | Height heat dissipation graphene wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207802502U true CN207802502U (en) | 2018-08-31 |
Family
ID=63279062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721851976.5U Active CN207802502U (en) | 2017-12-26 | 2017-12-26 | Height heat dissipation graphene wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207802502U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257868A (en) * | 2018-09-30 | 2019-01-22 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN109787084A (en) * | 2019-03-18 | 2019-05-21 | 长春理工大学 | A kind of the semiconductor laser array encapsulating structure and production method of high efficiency and heat radiation |
| CN110602871A (en) * | 2019-09-16 | 2019-12-20 | 沪士电子股份有限公司 | Graphene heat-conducting PCB and preparation method thereof |
-
2017
- 2017-12-26 CN CN201721851976.5U patent/CN207802502U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257868A (en) * | 2018-09-30 | 2019-01-22 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN109257868B (en) * | 2018-09-30 | 2020-08-25 | 联想(北京)有限公司 | Electronic equipment |
| CN109787084A (en) * | 2019-03-18 | 2019-05-21 | 长春理工大学 | A kind of the semiconductor laser array encapsulating structure and production method of high efficiency and heat radiation |
| CN110602871A (en) * | 2019-09-16 | 2019-12-20 | 沪士电子股份有限公司 | Graphene heat-conducting PCB and preparation method thereof |
| CN110602871B (en) * | 2019-09-16 | 2021-10-01 | 沪士电子股份有限公司 | Graphene heat-conducting PCB and preparation method thereof |
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