CN207753049U - A kind of ceramic substrate - Google Patents
A kind of ceramic substrate Download PDFInfo
- Publication number
- CN207753049U CN207753049U CN201720782828.6U CN201720782828U CN207753049U CN 207753049 U CN207753049 U CN 207753049U CN 201720782828 U CN201720782828 U CN 201720782828U CN 207753049 U CN207753049 U CN 207753049U
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- cutting
- seam
- cutting seam
- location hole
- blade
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Abstract
A kind of ceramic substrate, including base, in the obverse and reverse of base, at least one side is functional surfaces, and layers of copper and protective layer are equipped with successively on the functional surfaces；Edge in ceramic substrate is equipped with cutting seam and location hole, and the width of the cutting seam is 0.3 ~ 0.5mm, and the substrate corresponds to cutting seam position and is provided only with ceramic layer；Intersect with cutting seam at the edge of the location hole.The cutting seam of the utility model is widened, and removes protective layer and layers of copper at cutting line, prevents from contacting with metal layer in the long middle blade of cutting in this way, the service life of blade is improved while improving cutting efficiency；Location hole marginal position is in contact with cutting seam, blade can be prevented to be in contact with metal layer in cutting process in this way, further increase service life.
Description
Technical field
The utility model is related to LED field, especially a kind of ceramic substrate of easy cutting.
Background technology
Aluminium oxide ceramic substrate thickness 0.5/0.6mm is partially thick, substrate properties are partially hard, especially substrate frame simultaneously cupric and
Aluminum metal layer increases cutting difficulty, and it is more to generate loss for blade when making its cutting substrate frame blade, influences feed velocity reduction
Blade service life and cutting efficiency.
Invention content
The technical problem to be solved by the utility model is to provide a kind of aluminium oxide ceramic substrate, the cutting for reducing blade is difficult
Degree, the loss of blade when reducing production.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of ceramic substrate, including base, base
Obverse and reverse in, at least one side is functional surfaces, is equipped with layers of copper and protective layer on the functional surfaces successively；In ceramic substrate
Edge be equipped with cutting seam and location hole, the width of the cutting seam is 0.3 ~ 0.5mm, and the substrate corresponds to cutting seam position only
Equipped with ceramic layer；Intersect with cutting seam at the edge of the location hole.The cutting seam of the utility model is widened, and is gone at cutting line
Fall protective layer and layers of copper, prevents from contacting with metal layer in the long middle blade of cutting in this way, knife is improved while improving cutting efficiency
The service life of piece；Location hole marginal position with cutting seam be in contact, can prevent in this way blade in cutting process with metal layer
It is in contact, further increases service life.
As an improvement, the width of the cutting seam is 0.4mm.
As an improvement, the protective layer is silver layer or layer gold.
As an improvement, the base of cutting is aluminium oxide ceramics or aluminium nitride ceramics.
Caused advantageous effect is the utility model compared with prior art：
The cutting seam of the utility model is widened, and removes protective layer, metal layer and aluminium layer at cutting line, prevents in this way
It cuts long middle blade to contact with metal layer, the service life of blade is improved while improving cutting efficiency；Location hole margin location
It sets and is in contact with cutting seam, blade can be prevented to be in contact with metal layer in cutting process in this way, further increase service life.
Description of the drawings
Fig. 1 is substrate front side schematic diagram.
Fig. 2 is that embodiment 1 cuts partial sectional view at seam.
Fig. 3 is that embodiment 2 cuts partial sectional view at seam.
Specific implementation mode
The utility model is described in further detail with reference to the accompanying drawings of the specification.
As shown in Figure 1, 2, a kind of porcelain substrate, the ceramics of the present embodiment are essentially single sided board, are wrapped successively from bottom toward top
Include base 4, layers of copper 5 and protective layer 6.The material for cutting base 4 is aluminium oxide ceramics or aluminium nitride ceramics.The protective layer 6
For silver layer or layer gold, protection and reflex.Its bonding ceramics of the layers of copper 5 and electric action.The centre of substrate protective layer 6
The edge of LED support of the position equipped with several array distributions, substrate forms frame 1, and frame 1 is equipped with several cuttings seam 2 and determines
Position hole 3, the edge of location hole intersects with cutting seam, and location hole 3 is convenient accurately to cut for positioning substrate, when cutting, blade
It is cut along cutting seam 2, LED support is detached.The width of the cutting seam 2 is 0.3 ~ 0.5mm, the present embodiment cutting seam
2 width is 0.4mm, and the width of cutting seam 2 is made to be more than the thickness to cutting blade；Cutting seam 2 runs through frame 1, and length has
It is lengthened.The substrate corresponds to 2 positions of cutting seam and removes layers of copper 5 and protective layer 6, only retains base 46.On the frame 1 of substrate
The bottom of location hole 3 there are four setting altogether, location hole 3 is base 4, and the only marginal portion of location hole 3 connects with cutting seam 2
It touches, so as to make the bottom of location hole 3 and cutting seam 2 be in same layer, while location hole 3 only has marginal position to be stitched with cutting
2 are in contact, and blade can be prevented to be in contact with metal layer 5 in cutting process in this way, further increase service life.Change below
After good substantially compared with conventional substrate cutting technique effect：
；
；
；
The cutting seam 2 of the utility model is widened, and removes layers of copper 5 and protective layer 6 at cutting line, prevents from cutting in this way
Long middle blade is contacted with metal layer 5, and the service life of blade is improved while improving cutting efficiency.
Embodiment 2
As shown in figure 3, a kind of porcelain substrate, the ceramics of the present embodiment are essentially dual platen, include the base 4 positioned at centre,
The positive and negative of base 4 is equipped with layers of copper 5 and protective layer 6 successively.The material for cutting base 4 is that aluminium oxide ceramics or aluminium nitride are made pottery
Porcelain.The protective layer 6 be silver layer or layer gold, protection and reflex.Its bonding ceramics of the layers of copper 5 and electric action.Such as
Shown in Fig. 1, the centre position of substrate protective layer 6 is equipped with the LED support of several array distributions, and the edge of substrate forms frame 1, side
Frame 1 is equipped with several cuttings seam 2 and location hole 3, and the edge of location hole intersects with cutting seam, and location hole 3 is used to position substrate,
Convenient accurate cutting, when cutting, blade is cut along cutting seam 2, and LED support is detached.It is described cutting seam 2 width be
The width of 0.3 ~ 0.5mm, the present embodiment cutting seam 2 are 0.4mm, and the width of cutting seam 2 is made to be more than the thickness to cutting blade；It cuts
Slot 2 runs through frame 1, and length is lengthened.The substrate corresponds to 2 positions of cutting seam and removes layers of copper 5 and protective layer 6, only
Retain base 46.It being set there are four location hole 3 altogether on the frame 1 of substrate, the bottom of location hole 3 is base 4, and location hole 3
Only marginal portion is in contact with cutting seam 2, fixed simultaneously so as to make location hole 3 and the bottom of cutting seam 2 be in same layer
Position hole 3 only has marginal position to be in contact with cutting seam 2, blade can be prevented to be in contact with metal layer 5 in cutting process in this way, into
One step improves service life.
The cutting seam 2 of the utility model is widened, and removes layers of copper 5 and protective layer 6 at cutting line, prevents from cutting in this way
Long middle blade is contacted with metal layer 5, and the service life of blade is improved while improving cutting efficiency.
Claims (4)
1. a kind of ceramic substrate, including base, in the obverse and reverse of base, at least one side is functional surfaces, the functional surfaces
On successively be equipped with layers of copper and protective layer；Edge in ceramic substrate is equipped with cutting seam and location hole, it is characterised in that：The cutting
The width of seam is 0.3 ~ 0.5mm, and the substrate corresponds to cutting seam position and is provided only with ceramic layer；The edge of the location hole and cutting
Seam intersection.
2. a kind of ceramic substrate according to claim 1, it is characterised in that：The width of the cutting seam is 0.4mm.
3. a kind of ceramic substrate according to claim 1, it is characterised in that：The protective layer is silver layer or layer gold.
4. a kind of ceramic substrate according to claim 1, it is characterised in that：The base is aluminium oxide ceramics or aluminium nitride
Ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720782828.6U CN207753049U (en) | 2017-06-30 | 2017-06-30 | A kind of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720782828.6U CN207753049U (en) | 2017-06-30 | 2017-06-30 | A kind of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207753049U true CN207753049U (en) | 2018-08-21 |
Family
ID=63146582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720782828.6U Active CN207753049U (en) | 2017-06-30 | 2017-06-30 | A kind of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207753049U (en) |
-
2017
- 2017-06-30 CN CN201720782828.6U patent/CN207753049U/en active Active
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