TW201513982A - Multiple half cut cutter and circuit cutting method using multiple half cut cutter - Google Patents
Multiple half cut cutter and circuit cutting method using multiple half cut cutter Download PDFInfo
- Publication number
- TW201513982A TW201513982A TW102136883A TW102136883A TW201513982A TW 201513982 A TW201513982 A TW 201513982A TW 102136883 A TW102136883 A TW 102136883A TW 102136883 A TW102136883 A TW 102136883A TW 201513982 A TW201513982 A TW 201513982A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- circuit board
- multiple half
- edge
- tool
- Prior art date
Links
Landscapes
- Milling Processes (AREA)
Abstract
Description
本發明係有關於一種半切割電路板的刀具，尤指一種多重半切割刀具，其係能對一電路板進行多重半切割，從而縮短製作時間及節省成本。The present invention relates to a tool for a half-cut circuit board, and more particularly to a multiple half-cutting tool capable of performing multiple half-cutting of a circuit board, thereby reducing production time and cost.
習知的一電路板係藉由壓合的方式來組裝，更具體而言，使用者會將一銅箔、一基板與另一銅箔依序層疊，且於該基板與各該銅箔之間加入樹脂後，進行壓合。A conventional circuit board is assembled by press-fitting. More specifically, a user sequentially stacks a copper foil, a substrate and another copper foil, and the substrate and each of the copper foils After the resin was added, press-bonding was carried out.
然而，壓合形成後的該電路板會有多餘的樹脂溢出於該電路板外，故使用者會對該電路板進行裁切，以去除多餘的樹脂，並對裁切後的該電路板之邊緣進行磨邊。其中，上述之「裁切」係指對該電路板的上下方分別進行半切割。However, the circuit board after the press forming has excess resin overflowing the circuit board, so the user will cut the circuit board to remove excess resin, and the cut circuit board The edges are edging. The above-mentioned "cutting" means that the upper and lower sides of the circuit board are each half-cut.
上述的裁切與磨邊處理，通常為兩個機台，故對使用者而言，所花費的製作時間較長。The above-mentioned cutting and edging treatment is usually two machines, so the production time taken by the user is long.
此外，當使用者以兩個薄片狀的滾刀來作為裁切工具的話，該等滾刀會以迫剪的方式裁切該電路板；然而，所屬技術領域具通常知識者知道該等薄片狀的滾刀僅能應用於一定厚度的該電路板，若該電路板過薄或過厚的話，該等滾刀難以裁切該電路板，且該等滾刀容易壞損。In addition, when the user uses two flake-shaped hobs as the cutting tool, the hobs cut the circuit board in an oblique manner; however, those skilled in the art are aware of the flakes. The hob can only be applied to the board of a certain thickness. If the board is too thin or too thick, the hobs are difficult to cut the board, and the hobs are easily damaged.
再者，當使用者以銑刀來作為裁切工具的話，雖然可應用於過厚的該電路板，但該銑刀的壞損率非常高，故使用者必須一直更換該銑刀，從而會提高裁切該電路板的成本。Furthermore, when the user uses the milling cutter as the cutting tool, although it can be applied to the circuit board which is too thick, the damage rate of the milling cutter is very high, so the user must always replace the milling cutter, and thus Increase the cost of cutting the board.
因此，如何發明出一種裁切工具，能縮短製作時間及節省成本，將是本發明所欲積極揭露之處。Therefore, how to invent a cutting tool, which can shorten the production time and save the cost, will be actively exposed by the present invention.
為解決上述現有技術的缺失，本發明之目的在於提供一種多重半切割工具，能多重半切割一電路板，多重半切割後的該電路板不需進行磨邊的處理，故能縮短製作時間及節省成本。In order to solve the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a multi-semi-cutting tool capable of multiple half-cutting a circuit board, and the multi-semi-cutting circuit board does not need to be edge-finished, thereby shortening the production time and cut costs.
為達上述目的及其他目的，本發明係提供一種多重半切割刀具，用於多重半切割一電路板，包含：一圓形刀具本體；複數第一刀刃，依序設於該圓形刀具本體的邊緣，各該第一刀刃的刀緣與該圓形刀具本體的中心具有一第一距離，且各該第一刀刃分別具有一第一刀刃角度；複數第二刀刃，依序設於該圓形刀具本體的邊緣，各該第二刀刃的刀緣與該圓形刀具本體的中心具有一第二距離，且各該第二刀刃分別具有一第二刀刃角度；其中，該等第一刀刃與該等第二刀刃間隔排列，各該第一距離大於各該第二距離，各該第一刀刃角度小於各該第二刀刃角度。To achieve the above and other objects, the present invention provides a multiple half-cutting tool for multiple half-cutting a circuit board, comprising: a circular tool body; a plurality of first cutting edges, sequentially disposed on the circular tool body An edge, a cutting edge of each of the first cutting edges and a center of the circular cutter body have a first distance, and each of the first cutting edges respectively has a first cutting edge angle; and a plurality of second cutting edges are sequentially disposed on the circular shape An edge of the tool body, a cutting edge of each of the second cutting edges and a center of the circular tool body having a second distance, and each of the second cutting edges respectively has a second cutting edge angle; wherein the first cutting edges and the first cutting edge The second cutting edges are spaced apart, and each of the first distances is greater than each of the second distances, and each of the first cutting edge angles is smaller than each of the second cutting edge angles.
於上述之多重半切割刀具中，更包含複數第三刀刃，依序設於該圓形刀具本體的邊緣，各該第三刀刃的刀緣與該圓形刀具本體的中心具有一第三距離，且各該第三刀刃分別具有一第三刀刃角度；其中，該等第一刀刃、該等第二刀刃與該等第三刀刃間隔排列，各該第三距離介於各該第一距離與各該第二距離之間，各該第三刀刃角度介於各該第一刀刃角度與各該第二刀刃角度之間。In the above multiple half-cutting tool, a plurality of third cutting edges are further disposed on the edge of the circular cutter body, and a cutting edge of each of the third cutting edges has a third distance from a center of the circular cutter body. Each of the third cutting edges has a third cutting edge angle; wherein the first cutting edges and the second cutting edges are spaced apart from the third cutting edges, and each of the third distances is between the first distance and each Between the second distances, each of the third cutting edge angles is between each of the first cutting edge angles and each of the second cutting edge angles.
此外，本發明之另一目的在於提供一種裁切電路板方法，用於多重半切割一電路板，多重半切割後的電路板不需進行磨邊的處理，故能縮短製作時間及節省成本。In addition, another object of the present invention is to provide a method for cutting a circuit board for multiple half-cutting a circuit board, and the circuit board after multiple half-cutting does not need to be edge-finished, so that the manufacturing time and cost can be shortened.
為達上述目的及其他目的，本發明係提供一種裁切電路板方法，其係使用兩個上述之多重半切割刀具，該等多重半切割刀具分別為一第一多重半切割刀具與一第二多重半切割刀具，該裁切電路板方法包含以下步驟：(S1)提供一電路板；(S3)藉由該第一多重半切割刀具切割該電路板的上方；及(S5)藉由該第二多重半切割刀具切割該電路板的下方。To achieve the above and other objects, the present invention provides a method of cutting a circuit board using two of the above-described multiple half-cutting tools, each of which is a first multiple half-cutting tool and a first a multiple multi-cutting tool, the method of cutting a circuit board comprising the steps of: (S1) providing a circuit board; (S3) cutting the upper portion of the circuit board by the first multiple half-cutting tool; and (S5) The lower side of the board is cut by the second multiple half-cutting tool.
於上述之裁切電路板方法中，其中，該第一多重半切割刀具與該第二多重半切割刀具係錯開設置於該電路板的上方與下方。In the above method for cutting a circuit board, the first multiple half-cutting tool and the second multiple-cutting tool are arranged to be placed above and below the circuit board.
於上述之裁切電路板方法中，其中，該步驟S3與該步驟S5的順序顛倒。In the above cutting circuit board method, the order of the step S3 and the step S5 is reversed.
綜上所述，本發明之多重半切割刀具藉由複數不同尺寸刀刃的設計，能於一次裁切處理中，對該電路板進行多重半切割，多重半切割後的該電路板不需進行磨邊的處理，故能縮短製作時間及節省成本。In summary, the multiple half-cutting tool of the present invention can perform multiple half-cutting on the circuit board in one cutting process by multiple designs of different size cutting edges, and the circuit board after multiple half-cutting does not need to be ground. The processing on the side can shorten the production time and save costs.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.
如第1圖至第5圖所示，其係說明本發明多重半切割刀具100。該多重半切割刀具100用於多重半切割一電路板(圖未示)的上方或下方，該多重半切割刀具100包含一圓形刀具本體10、複數第一刀刃20及複數第二刀刃30。As shown in Figs. 1 to 5, the multiple half cutting tool 100 of the present invention will be described. The multiple half-cutting tool 100 is used for multiple half-cutting of a circuit board (not shown) above or below. The multiple-cutting tool 100 includes a circular tool body 10, a plurality of first cutting edges 20, and a plurality of second cutting edges 30.
該等第一刀刃20依序設於該圓形刀具本體10的邊緣，各該第一刀刃20的刀緣與該圓形刀具本體10的中心具有一第一距離D1(如第2圖至第4圖所示)，且各該第一刀刃20分別具有一第一刀刃角度θ1(如第5圖所示)。The first cutting edges 20 are sequentially disposed on the edge of the circular cutter body 10, and the cutting edges of the first cutting edges 20 and the center of the circular cutter body 10 have a first distance D1 (as shown in FIG. 2 to FIG. 4 is shown), and each of the first cutting edges 20 has a first cutting edge angle θ1 (as shown in FIG. 5).
該等第二刀刃30依序設於該圓形刀具本體10的邊緣，各該第二刀刃30的刀緣與該圓形刀具本體10的中心具有一第二距離D2(如第2圖至第4圖所示)，且各該第二刀刃30分別具有一第二刀刃角度θ2(如第5圖所示)。The second cutting edges 30 are sequentially disposed on the edge of the circular cutter body 10, and the cutting edges of the second cutting edges 30 and the center of the circular cutter body 10 have a second distance D2 (as shown in FIG. 2 to FIG. 4 is shown), and each of the second cutting edges 30 has a second cutting edge angle θ2 (as shown in FIG. 5).
請再次參照第2圖，該等第一刀刃20與該等第二刀刃30間隔排列；請再次參照第3圖與第4圖，各該第一距離D1大於各該第二距離D2；請再次參照第5圖，各該第一刀刃角度θ1小於各該第二刀刃角度θ2。舉例來說，當各該第一刀刃角度θ1為35∘時，各該第二刀刃角度θ2為90∘。Referring again to FIG. 2, the first cutting edges 20 are spaced apart from the second cutting edges 30. Referring again to FIGS. 3 and 4, each of the first distances D1 is greater than each of the second distances D2; Referring to Fig. 5, each of the first cutting edge angles θ1 is smaller than each of the second cutting edge angles θ2. For example, when each of the first cutting edge angles θ1 is 35 ,, each of the second cutting edge angles θ2 is 90 ∘.
接著，將藉由第6圖至第7F圖及以下說明來敘述本發明之多重半切割刀具如何多重半切割一電路板1000，藉由此設計，多重半切割後的該電路板1000不需進行磨邊的處理，故能縮短製作時間及節省成本。Next, how the multiple half-cutting tool of the present invention multiplexes a plurality of semi-cutting boards 1000 by means of FIGS. 6 to 7F and the following description, by which the multiple-cut half-cut circuit board 1000 does not need to be performed. The processing of the edging can shorten the production time and save costs.
如第6圖所示，本發明之裁切電路板方法係使用兩個上述之多重半切割刀具100，該等多重半切割刀具100於第7圖中分別以一第一多重半切割刀具200與一第二多重半切割刀具300來表示，該裁切電路板方法包含以下三個步驟。As shown in FIG. 6, the cutting circuit board method of the present invention uses two of the above-described multiple half-cutting tools 100, which are respectively a first multiple half-cutting tool 200 in FIG. In conjunction with a second multiple half-cutting tool 300, the cutting circuit board method includes the following three steps.
首先進行步驟S100，使用者提供一電路板1000，如第7A圖所示。First, in step S100, the user provides a circuit board 1000 as shown in FIG. 7A.
接著進行步驟S300，使用者藉由該第一多重半切割刀具200半切割該電路板1000的上方，該第一多重半切割刀具200會逐漸下降來半切割該電路板1000的上方；如第7B圖所示，該第一多重半切割刀具200的複數第一刀刃20會先對該電路板1000的上方進行半切割，該等第一刀刃20會使該電路板1000的半切割處形成一第一切面1，該第一切面1與該電路板1000的上側面夾有一第一切角α1；如第7C圖所示，該第一多重半切割刀具200逐漸下降後，該第一多重半切割刀具200的複數第二刀刃30亦會接著對該電路板1000的上方進行半切割，該等第二刀刃30會使該電路板1000的半切割處形成一第二切面2，該第二切面2與該電路板1000的上側面夾有一第二切角α2，該第一切面1與該第二切面2相連，且該第一切角α1小於該第二切角α2。Next, in step S300, the user half-cuts the upper surface of the circuit board 1000 by the first multiple half-cutting tool 200, and the first multiple-cutting tool 200 is gradually lowered to half-cut the upper side of the circuit board 1000; As shown in FIG. 7B, the plurality of first cutting edges 20 of the first multiple half-cutting tool 200 first half-cut the upper portion of the circuit board 1000, and the first cutting edges 20 cause the half-cut of the circuit board 1000. Forming a first cut surface 1 having a first cut angle α1 with the upper side of the circuit board 1000; as shown in FIG. 7C, after the first multiple half cut tool 200 is gradually lowered, The plurality of second cutting edges 30 of the first multiple half-cutting tool 200 will also be subjected to half-cutting on the upper side of the circuit board 1000, and the second cutting edges 30 will form a second cut surface at the half-cut portion of the circuit board 1000. 2, the second cut surface 2 and the upper side of the circuit board 1000 are sandwiched by a second cut angle α2, the first cut surface 1 is connected to the second cut surface 2, and the first cut angle α1 is smaller than the second cut angle 22.
最後進行步驟S500，使用者藉由該第二多重半切割刀具300半切割該電路板1000的下方，該第二多重半切割刀具300會逐漸上升來半切割該電路板1000的下方；如第7D圖所示，該第二多重半切割刀具300的複數第一刀刃20會先對該電路板1000的下方進行半切割，該等第一刀刃20會使該電路板1000的半切割處形成一第三切面3，該第一切面3與該電路板1000的下側面夾有一第三切角α3；如第7C圖所示，該第二多重半切割刀具300逐漸上升後，該第二多重半切割刀具300的複數第二刀刃30亦會接著對該電路板1000的下方進行半切割，該等第二刀刃30會使該電路板1000的半切割處形成一第四切面4，該第四切面4與該電路板1000的下側面夾有一第四切角α4，該第三切面3的兩側分別與該第一切面1及該第四切面4相連，且該第三切角α3小於該第四切角α4。Finally, in step S500, the user half-cuts the lower side of the circuit board 1000 by the second multiple half-cutting tool 300, and the second multiple-cutting tool 300 is gradually raised to half-cut the lower side of the circuit board 1000; As shown in FIG. 7D, the plurality of first cutting edges 20 of the second multiple half-cutting tool 300 will first perform a half-cutting of the lower side of the circuit board 1000, and the first cutting edges 20 will cause a half-cut of the circuit board 1000. Forming a third cut surface 3, the first cut surface 3 and the lower side of the circuit board 1000 sandwiching a third cut angle α3; as shown in FIG. 7C, after the second multiple half cut tool 300 is gradually raised, the The plurality of second cutting edges 30 of the second multiple half-cutting tool 300 will also be half-cut under the circuit board 1000, and the second cutting edges 30 will form a fourth cutting surface 4 at the half-cut of the circuit board 1000. The fourth cutting surface 4 and the lower side of the circuit board 1000 have a fourth cutting angle α4, and the two sides of the third cutting surface 3 are respectively connected to the first cutting surface 1 and the fourth cutting surface 4, and the third surface The cut angle α3 is smaller than the fourth cut angle α4.
經上述三個步驟後，如第7F圖所示，經半切割後的該電路板1000之邊緣形狀如同圓弧狀，故使用者不需進行磨邊的處理，從而能縮短製作時間及節省成本。After the above three steps, as shown in FIG. 7F, the edge of the circuit board 1000 after the half-cutting is shaped like an arc, so the user does not need to perform the edging process, thereby shortening the production time and saving cost. .
雖然圖未示，使用者亦可將該步驟S300與該步驟S500顛倒，更具體而言，使用者亦可先藉由該第二多重半切割刀具300半切割該電路板1000的下方後，再藉由該第一多重半切割刀具200半切割該電路板1000的上方，其所製作出的電路板1000亦會如第7F圖所示。Although not shown, the user may reverse the step S300 and the step S500. More specifically, the user may first half cut the lower surface of the circuit board 1000 by the second multiple half-cutting tool 300. Then, the first multi-cutting tool 200 is half-cut above the circuit board 1000, and the circuit board 1000 produced by the first multi-cutting tool 200 is also shown in FIG.
此外，所屬技術領域具通常知識者應了解到，由於該第一多重半切割刀具200與該第二多重半切割刀具300在半切割該電路板1000時，其半切割的程度會超過該電路板1000的厚度之一半，故該第一多重半切割刀具200與該第二多重半切割刀具300的設置位置較佳如第8圖所示，該第一多重半切割刀具200與該第二多重半切割刀具300係錯開設置於該電路板1000的上方與下方。Moreover, those of ordinary skill in the art will appreciate that since the first multiple half-cutting tool 200 and the second multiple-cutting tool 300 are half-cut the circuit board 1000, the degree of half-cutting thereof will exceed that. One half of the thickness of the circuit board 1000, so that the first multiple half-cutting tool 200 and the second multiple-cutting tool 300 are disposed at a position as shown in FIG. 8, the first multiple-cutting tool 200 and The second multiple half-cutting tool 300 is placed above and below the circuit board 1000 in a wrong manner.
綜上所述，本發明之多重半切割刀具藉由複數不同尺寸刀刃的設計，能於一次裁切處理中，對該電路板的上下方進行多重半切割，多重半切割後的該電路板不需進行磨邊的處理，故能縮短製作時間及節省成本。In summary, the multiple half-cutting tool of the present invention can perform multiple half-cutting on the upper and lower sides of the circuit board in one cutting process by the design of a plurality of different-sized cutting edges, and the circuit board after multiple half-cutting is not The edging process is required, so the production time and cost can be shortened.
接著，如第9圖至第12圖所示，其係說明本發明多重半切割刀具400。該多重半切割刀具400的設計大致上與該多重半切割刀具100的設計相同，其更包含複數第三刀刃40，依序設於該圓形刀具本體10的邊緣，各該第三刀刃40的刀緣與該圓形刀具本體10的中心具有一第三距離D3(如第9圖至第11圖所示)，且各該第三刀刃40分別具有一第三刀刃角度θ3(如第12圖所示)。Next, as shown in Figs. 9 to 12, the multiple half cutting tool 400 of the present invention will be described. The design of the multiple half-cutting tool 400 is substantially the same as that of the multiple-cutting tool 100, and further includes a plurality of third cutting edges 40, which are sequentially disposed on the edge of the circular cutting tool body 10, and each of the third cutting edges 40 The blade edge and the center of the circular cutter body 10 have a third distance D3 (as shown in FIGS. 9 to 11), and each of the third blades 40 has a third blade angle θ3 (FIG. 12). Shown).
請再次參照第9圖，該等第一刀刃20、該等第二刀刃30與該等第三刀刃40間隔排列；請再次參照第10圖與第11圖，各該第三距離D3介於各該第一距離D1與各該第二距離D2之間；請再次參照第12圖，各該第三刀刃角度θ3介於各該第一刀刃角度θ1與各該第二刀刃角度θ2之間。舉例來說，當各該第一刀刃角度θ1為35∘，且各該第二刀刃角度θ2為90∘時，各該第三刀刃角度θ3為60∘。Referring again to FIG. 9, the first cutting edges 20 and the second cutting edges 30 are spaced apart from the third cutting edges 40. Referring again to FIGS. 10 and 11, each of the third distances D3 is interposed. The first distance D1 is between the second distance D2 and the second distance D2. Referring to FIG. 12 again, each of the third cutting edge angles θ3 is between the first cutting edge angle θ1 and each of the second cutting edge angles θ2. For example, when each of the first cutting edge angles θ1 is 35 ∘ and each of the second cutting edge angles θ2 is 90 ,, each of the third cutting edge angles θ3 is 60 ∘.
當本發明裁切電路板方法中所使用的多重半切割刀具為上述之多重半切割刀具400時，如第13圖所示，經半切割後的該電路板1000之邊緣形狀會更接近圓弧狀，故使用者不需進行磨邊的處理，從而能縮短製作時間及節省成本。When the multiple half-cutting tool used in the method of cutting a circuit board of the present invention is the multiple half-cutting tool 400 described above, as shown in FIG. 13, the edge shape of the circuit board 1000 after the half-cutting is closer to the circular arc. Therefore, the user does not need to perform the edging process, thereby shortening the production time and saving the cost.
更具體而言，當該多重半切割刀具(圖未示)的刀刃角度越多，會使經半切割後的該電路板1000之邊緣形狀越接近圓弧狀。More specifically, the more the blade angle of the multiple half-cutting tool (not shown), the closer the edge shape of the half-cut board 1000 is to the arc shape.
綜上所述，本發明之多重半切割刀具藉由複數不同尺寸刀刃的設計，能讓使用者於裁切電路板方法中，僅進行一次裁切處理，該裁切處理分別對該電路板的上下方進行多重半切割，多重半切割後的該電路板不需進行磨邊的處理，故能縮短製作時間及節省成本。In summary, the multiple half-cutting tool of the present invention allows the user to perform only one cutting process in the cutting circuit board method by the design of a plurality of different-sized cutting edges, and the cutting process is respectively performed on the circuit board. Multiple half-cutting is performed on the upper and lower sides, and the circuit board after multiple half-cutting does not need to be edging, so the production time and cost can be shortened.
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
1‧‧‧第一切面
2‧‧‧第二切面
3‧‧‧第三切面
4‧‧‧第四切面
10‧‧‧圓形刀具本體
20‧‧‧第一刀刃
30‧‧‧第二刀刃
40‧‧‧第三刀刃
100, 400‧‧‧多重半切割刀具
200‧‧‧第一多重半切割刀具
300‧‧‧第二多重半切割刀具
1000‧‧‧電路板
D1‧‧‧第一距離
D2‧‧‧第二距離
D3‧‧‧第三距離
α1‧‧‧第一切角
α2‧‧‧第二切角
α3‧‧‧第三切角
α4‧‧‧第四切角
θ1‧‧‧第一刀刃角度
θ2‧‧‧第二刀刃角度
θ3‧‧‧第三刀刃角度1‧‧‧ first section
2‧‧‧Second section
3‧‧‧ Third section
4‧‧‧ fourth section
10‧‧‧Circular tool body
20‧‧‧ first blade
30‧‧‧second blade
40‧‧‧ third blade
100, 400‧‧‧Multiple half-cutting tools
200‧‧‧First multiple half-cutting tool
300‧‧‧Second multiple half-cutting tool
1000‧‧‧circuit board
D1‧‧‧First distance
D2‧‧‧Second distance
D3‧‧‧ Third distance α1‧‧‧First cut angle α2‧‧‧Second cut angle α3‧‧‧ Third cut angle α4‧‧‧ Fourth cut angle θ1‧‧‧ First cutting edge angle θ2‧‧ ‧Second cutting edge angle θ3‧‧‧third blade angle
第1圖係為本發明多重半切割刀具的第一具體實施例之立體圖。 第2圖係為本發明多重半切割刀具的第一具體實施例之前視圖。 第3圖係為本發明多重半切割刀具的第一具體實施例之局部剖面圖。 第4圖係為第2圖中A1處之放大圖。 第5圖係為第3圖中B1處之放大圖。 第6圖係為本發明裁切電路板方法之流程圖。 第7A圖至第7F圖係為一電路板經裁切電路板方法中的該第一多重半切割刀具與該第二多重半切割刀具進行半切割之流程示意圖。 第8圖係為本發明裁切電路板方法中的一第一多重半切割刀具與一第二多重半切割刀具之設置位置示意圖。 第9圖係為本發明多重半切割刀具的第二具體實施例之前視圖。 第10圖係為本發明多重半切割刀具的第二具體實施例之局部剖面圖。 第11圖係為第9圖中A2處之放大圖。 第12圖係為第10圖中B2處之放大圖。 第13圖係為該電路板經裁切電路板方法中的該第一多重半切割刀具與該第二多重半切割刀具進行半切割後之示意圖。Figure 1 is a perspective view of a first embodiment of a multiple half-cutting tool of the present invention. Figure 2 is a front elevational view of a first embodiment of a multiple half-cutting tool of the present invention. Figure 3 is a partial cross-sectional view showing a first embodiment of the multiple half-cutting tool of the present invention. Figure 4 is an enlarged view of A1 in Figure 2. Figure 5 is an enlarged view of B1 in Figure 3. Figure 6 is a flow chart of the method of cutting a circuit board of the present invention. 7A to 7F are schematic diagrams showing a process of semi-cutting the first multiple half-cutting tool and the second multiple-cutting cutting tool in a method of cutting a circuit board by a circuit board. Figure 8 is a schematic view showing the arrangement position of a first multiple half-cutting tool and a second multiple-cutting cutting tool in the method for cutting a circuit board according to the present invention. Figure 9 is a front elevational view of a second embodiment of a multiple half-cutting tool of the present invention. Figure 10 is a partial cross-sectional view showing a second embodiment of the multiple half-cutting tool of the present invention. Figure 11 is an enlarged view of A2 in Figure 9. Figure 12 is an enlarged view of B2 in Figure 10. Figure 13 is a schematic diagram of the first multi-cut tool and the second multi-cut tool in the method of cutting a circuit board.
10‧‧‧圓形刀具本體 10‧‧‧Circular tool body
20‧‧‧第一刀刃 20‧‧‧ first blade
30‧‧‧第二刀刃 30‧‧‧second blade
100‧‧‧多重半切割刀具 100‧‧‧Multiple half cutting tools
D1‧‧‧第一距離 D1‧‧‧First distance
D2‧‧‧第二距離 D2‧‧‧Second distance
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102136883A TWI530378B (en) | 2013-10-11 | 2013-10-11 | Multiple half-cutting tools and methods of cutting boards using multiple half-cutting tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102136883A TWI530378B (en) | 2013-10-11 | 2013-10-11 | Multiple half-cutting tools and methods of cutting boards using multiple half-cutting tools |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201513982A true TW201513982A (en) | 2015-04-16 |
| TWI530378B TWI530378B (en) | 2016-04-21 |
Family
ID=53437422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102136883A TWI530378B (en) | 2013-10-11 | 2013-10-11 | Multiple half-cutting tools and methods of cutting boards using multiple half-cutting tools |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI530378B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105751263A (en) * | 2016-04-23 | 2016-07-13 | 张望高 | Laminaria japonica shredding blade |
| TWI659790B (en) * | 2018-10-24 | 2019-05-21 | 得力富企業股份有限公司 | Multiple half cutting tool set |
| CN110967212A (en) * | 2018-09-28 | 2020-04-07 | 长鑫存储技术有限公司 | Method for taking semiconductor device physical property fault analysis test piece |
| CN111098348A (en) * | 2018-10-26 | 2020-05-05 | 得力富企业股份有限公司 | Multiple half-cutting tool set |
-
2013
- 2013-10-11 TW TW102136883A patent/TWI530378B/en active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105751263A (en) * | 2016-04-23 | 2016-07-13 | 张望高 | Laminaria japonica shredding blade |
| CN110967212A (en) * | 2018-09-28 | 2020-04-07 | 长鑫存储技术有限公司 | Method for taking semiconductor device physical property fault analysis test piece |
| TWI659790B (en) * | 2018-10-24 | 2019-05-21 | 得力富企業股份有限公司 | Multiple half cutting tool set |
| CN111098348A (en) * | 2018-10-26 | 2020-05-05 | 得力富企业股份有限公司 | Multiple half-cutting tool set |
| CN111098348B (en) * | 2018-10-26 | 2021-04-27 | 得力富企业股份有限公司 | Multiple half-cutting tool set |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI530378B (en) | 2016-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI530378B (en) | Multiple half-cutting tools and methods of cutting boards using multiple half-cutting tools | |
| CN104853523A (en) | Buried and embedded copper block PCB manufacturing method | |
| TWI522219B (en) | Plate cutting method | |
| WO2013175478A3 (en) | Method for designing a cutting edge of a cutting tool, cutting tools comprising the same, and cutting elements with multiple such cutting portions | |
| WO2018025619A1 (en) | Blade die, film punching method using blade die, and punching device equipped with blade die | |
| CN104470214A (en) | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board | |
| CN203817466U (en) | Composite tool for reaming surface, boring hole, reversely milling plane and rounding off both sides of hole | |
| CN106625842A (en) | Flexible workpiece edge cutting tool | |
| CN105690201A (en) | PCB edge polishing device | |
| CN204090295U (en) | A kind of PCB jigsaw | |
| CN203775530U (en) | Splicing board | |
| GB2524915A (en) | Milling cutter having undulating chip breaker | |
| JP6169074B2 (en) | Metal core substrate manufacturing method | |
| KR101771504B1 (en) | Saw blade with noise and stress reducing structure | |
| CN104552398B (en) | Multiple half-cutting knife and method for cutting circuit board by using same | |
| CN103990822A (en) | Tool for machining double chamfers | |
| CN205362807U (en) | A twolip milling cutter for PCB board is made | |
| CN106670555A (en) | Method for processing outline of PCB made of PTFE material | |
| CN205362790U (en) | Drill structure | |
| JP2015170630A (en) | Method for manufacturing wiring board | |
| CN203391029U (en) | Window panel combined cutter | |
| CN204234885U (en) | A kind of process tool of electric machine iron core groove | |
| CN204504336U (en) | The shaping against shock milling cutter of pcb board | |
| CN202727125U (en) | Portable stone cutter | |
| JP2019119644A5 (en) |