CN207752974U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
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- CN207752974U CN207752974U CN201820037879.0U CN201820037879U CN207752974U CN 207752974 U CN207752974 U CN 207752974U CN 201820037879 U CN201820037879 U CN 201820037879U CN 207752974 U CN207752974 U CN 207752974U
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- gas
- substrate
- turntable
- board treatment
- substrate board
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Abstract
This announcement provides a kind of substrate board treatment, including：One turntable, internal includes a first gas passage and a second gas channel；One pumping cells are connect with the turntable, a negative pressure state are maintained in the first gas passage for making, and then the substrate is maintained on the turntable；And a gas supply unit, it is connect with the turntable, for supplying a protective gas, wherein the protective gas is blown out by second interface channel on the substrate and around the base plate carrying portion of the turntable.
Description
Technical field
This announcement is related to a kind of substrate board treatment, is filled more particularly to a kind of processing substrate with dual gas supply pipeline
It sets.
Background technology
In traditional single-wafer rotary-cleaning Etaching device, in order to avoid the etching liquid being sprayed on substrate flow to base
Backboard (bottom) face and cause the pollution of vacuum cup and destroy the ability of its vacsorb.Industry is utilized in single-wafer at present
A fixed air-jet device separately is added by rotary-cleaning Etaching device, being will stream in a manner of towards substrate back jet
Liquid to substrate back is blown off.However, the air-jet device of this type can not be so difficult with the substrate synchronous rotary start of rotation
To reach comprehensive protection.
If however, above-mentioned air-jet device is incorporated into traditional single-wafer rotary-cleaning Etaching device so that
Air-jet device can then have certain difficulty with the start of substrate synchronous rotary.For example, in traditional single-wafer rotary-cleaning
In Etaching device, in order to which substrate is kept on a spinstand in a manner of vacsorb, it will usually assemble gas in turntable
Pipeline, to play vacsorb function.The device of this type only needs one gas piping of installation due to internal, thus need to only pass through by
Gas piping draws special joint design of either arranging in pairs or groups to spindle central, you can gas piping is caused when turntable being avoided to rotate
The problem of flexing.However, when configuring two or more gas pipings in single-wafer rotary-cleaning Etaching device, it is installed in rotation
There is with the rotation of turntable risk together wrapped around one another in two gas pipings inside platform.
In view of this, it is necessary to a kind of substrate board treatment with dual gas supply pipeline is proposed, to solve in the prior art
There are the problem of.
Utility model content
To solve above-mentioned problem of the prior art, this announcement is designed to provide a kind of substrate with dual gas supply pipeline
Processing unit, can efficiently solve in the prior art because two gas pipings can be with the rotation of turntable it is wrapped around one another
Together the problem of.
To reach above-mentioned purpose, this announcement provides a kind of substrate board treatment, including：One turntable, for keeping a base
Plate, and can be rotated around an axis of centres, the turntable inside includes a first gas passage and a second gas channel,
Described in first gas passage one end position in the base plate carrying portion of the turntable, and other end position is at first of turntable
It sets and the one end in second gas channel position is in the base plate carrying portion of the turntable, and other end position is rotating
The second position of platform；One pumping cells are connect with the first position of the turntable, for making the first gas passage
It is inside maintained at a negative pressure state, and then the substrate is maintained on the turntable；And a gas supply unit, and it is described
The second position of turntable connects, for supplying a protective gas, wherein the protective gas is connected by described second
Channel is blowed to the substrate back, and the protective gas is used to prevent to apply treatment fluid on the substrate described in
The back side of substrate flow to the base plate carrying portion.
In one of this announcement preferred embodiment, the pumping cells include：One first axle envelope surround and coats
The first position of turntable is stated in residence, including one first interface channel；One first gas chamber, setting first axle envelope with
Between the turntable, and it is connected to the first gas passage；And an air-extractor, described in first axle envelope
First interface channel connects, and is used for the gas in first interface channel, first gas chamber and the first gas passage
Body is extracted out.
In one of this announcement preferred embodiment, the gas supply unit includes：One second axle envelope, surround and
The second position of the turntable is enveloped, including one second interface channel；One second gas chamber, and with second gas
Body channel is connected to, and is arranged between second axle envelope and the turntable；And a gas supply equipment, connect with described second
Road connection is connected, for injecting the guarantor in second interface channel, second gas chamber and the second gas channel
Protect gas.
In this announcement one of them preferred embodiment, when the turntable rotates, the pumping cells with it is described
Gas supply unit, which is kept fixed, not to be rotated.
In one of this announcement preferred embodiment, substrate board treatment also includes a gas distribution ring, circumferentially
Be arranged around the base plate carrying portion, the protective gas for supplying the gas supply unit branch to it is multiple go out
Gas channel, and the protective gas is sent by the multiple outlet passageway to the substrate back.
In one of this announcement preferred embodiment, the edge of the gas distribution ring and the edge phase of the substrate
Every a distance so that the protective gas can generate on the substrate from the back side of the substrate it is intermediate around blow to it is described
The air-flow at the edge of substrate back.
In one of this announcement preferred embodiment, the protective gas includes nitrogen.
This announcement provides a kind of substrate board treatment, including：One turntable, for keeping a substrate；One driving unit, with
The turntable connection, for driving the turntable to rotate；One first axle envelope surround and envelopes one of the turntable
Point, including one first interface channel；And one first gas chamber, it is arranged between first axle envelope and the turntable, wherein
First interface channel of first axle envelope connects in first gas chamber and external environment, and the wherein described turntable
Portion is formed with a first gas passage, and one end is connected to first gas chamber and the other end is connected to the turntable
Base plate carrying portion.
In one of them preferred embodiment of this announcement, substrate board treatment also includes an air-extractor in the middle, with described the
First interface channel of one axle envelope connects, wherein the air-extractor is used for first interface channel, described first
Gas extraction in gas chamber and the first gas passage so that a negative pressure state is maintained in the first gas passage, into
And the substrate is maintained on the turntable.
In one of them preferred embodiment of this announcement, when the shaft and turntable rotation, first axle envelope
It is kept fixed and does not rotate.
In one of them preferred embodiment of this announcement, substrate board treatment also includes：One second axle envelope surround and envelopes
A part for the turntable, including one second interface channel；And one second gas chamber, setting second axle envelope with it is described
Between turntable, wherein second interface channel of second axle envelope connects second gas chamber and external environment, and
A second gas channel is formed with inside the wherein described turntable, one end is connected to second gas chamber and the other end connects
Pass to the base plate carrying portion of the turntable.
In one of them preferred embodiment of this announcement, when the shaft and turntable rotation, second axle envelope
It is kept fixed and does not rotate.
In one of them preferred embodiment of this announcement, substrate board treatment also includes a gas supply equipment, with described the
Second interface channel of two axle envelopes connects, in second interface channel, second gas chamber and second gas
A protective gas is injected in body channel so that the protective gas is sent by second interface channel to the substrate back
On.
In one of them preferred embodiment of this announcement, substrate board treatment includes also a gas distribution ring, is circumferentially arranged
Around the base plate carrying portion, for the protective gas to be branched to multiple outlet passageways, and the protective gas is logical
The multiple outlet passageway is crossed to send to the substrate back.
This announcement also provides a kind of substrate board treatment, including:One turntable, has：One shaft；One base plate carrying portion,
Position is in the shaft and can be driven by the shaft to rotate, and the base plate carrying portion makes described for keeping a substrate
Substrate is rotatable, can together be revolved with the shaft comprising a first gas passage and a second gas channel inside the shaft
Turn, the first gas passage is to apply in a vacuum to the substrate, and the second gas channel is applying protection gas
Body is in the position around the base plate carrying portion on the back side of the substrate, thereby to prevent from handling the fluid of the substrate along institute
The back side for stating substrate flow to the base plate carrying portion；One pumping cells are connected with the first passage；And one gas supply
Unit is connected with the second channel.
In one of them preferred embodiment of this announcement, the substrate is square.
Compared to prior art, this announcement by solid turntable design two independent gas passages, and
The position of the opening of corresponding two gas passages is separately connected two gas cells, and described two gas in the shaft of turntable
Body unit will not be rotated as turntable rotates, and can be so effectively prevented from the prior art because two gas pipings can be with
The rotation of turntable and it is wrapped around one another together the problem of.
Description of the drawings
Fig. 1 shows the block diagram of the substrate board treatment of the preferred embodiment of this announcement；
Fig. 2 shows the stereogram of the substrate board treatment of the preferred embodiment of this announcement；
Fig. 3 shows the section plan of the substrate board treatment of the turntable of Fig. 2；
Fig. 4 shows another section plan of the substrate board treatment of the turntable of Fig. 2；
Fig. 5 shows the sectional axonometric drawing of the substrate board treatment of the turntable of Fig. 2；
Fig. 6 shows the enlarged drawing of the parts E of Fig. 5；
Fig. 7 shows the enlarged drawing of the parts F of Fig. 5；
Fig. 8 shows the part explosive view of the substrate board treatment of the preferred embodiment of this announcement；
Fig. 9 shows the gas distribution ring of the substrate board treatment of Fig. 8 and the upward view of substrate；And
Figure 10 shows the sectional view along A-A face lines of Fig. 9.
Specific implementation mode
In order to which the above-mentioned and other purposes of this announcement, feature, advantage can be clearer and more comprehensible, it is excellent that spy is hereafter lifted into this announcement
Embodiment is selected, and coordinates attached drawing, is described in detail below.
Fig. 1 is please referred to, shows the block diagram of the substrate board treatment 1 of the preferred embodiment of this announcement.Processing substrate fills
It includes turntable 10, driving unit 20, pumping cells 30 and gas supply unit 40, wherein driving unit 20 and turntable to set 1
10 are electrically connected, for drive turntable 10 to rotate and pumping cells 30 and gas supply unit 40 also respectively with turntable
10 connections are to provide negative pressure (vacuum) and micro-positive pressure protective gas.
Fig. 2 to Fig. 5 is please referred to, Fig. 2 shows that the stereogram of the substrate board treatment 1 of the preferred embodiment of this announcement, Fig. 3 are aobvious
The section plan of the substrate board treatment 1 of the turntable of diagram 2, Fig. 4 show the substrate board treatment 1 of the turntable of Fig. 2
Another section plan and Fig. 5 show the sectional axonometric drawing of the substrate board treatment 1 of the turntable of Fig. 2.It should be noted that
It is the subelement of driving unit 20 and pumping cells 30 and gas supply unit 40, such as air-extractor and gas supply
Equipment is not depicted in Fig. 2 to Fig. 5.Turntable 10 includes base plate carrying portion 11, shaft 12, first gas passage 13 and second
Gas passage 14, wherein base plate carrying portion 11 be for by base plate carrying and keep thereon.Shaft 12 can pass through belt, tooth
The connectors such as wheel, chain are connect with driving unit 20, come from the power of driving unit 20 to receive, so drive shaft 12 around
Axis of centres Z rotations.Jointly, when the spindle is rotated, base plate carrying portion 11 and substrate can be driven to rotate together.In this announcement
In preferred embodiment, substrate is square substrate, such as rectangle or square.Driving unit 20 can be an electro-motor.
As shown in Figure 3 and Figure 4, first gas passage 13 and second gas channel 14 are formed in inside shaft 12, and first
Gas passage 13 independently of one another and is not connected to second gas channel 14.It is held in substrate the one end open position of first gas passage 13
The first position P1 of load portion 11 and another end opening position in shaft 12.First and second gas passage 13,14 can and institute
Shaft 12 is stated to rotate together.The same position of one end open in second gas channel 14 is in base plate carrying portion 11 and another end opening
Second position P2 of the position in shaft 12.It should be noted that the position in first gas passage 13 and second gas channel 14 is in substrate
Two openings of supporting part 11 are separated by a lateral distance, and then can avoid interference in air flow problem.Preferably, first gas passage
13 opening position in base plate carrying portion 11 close to the position of axis of centres Z, and the opening in second gas channel 14 then position in the first gas
The outside that body channel 13 is open.
As shown in Figure 3 and Figure 6, wherein Fig. 6 shows the enlarged drawing of the parts E of Fig. 5.The pumping cells 30 of Fig. 3 include first
Axle envelope 31, the first gas chamber 32, air-extractor (not shown) and the first connector 33.Air-extractor can be a vacuum pumps.First axle
Envelope 31 surround and envelopes the first position P1 of shaft 12.The shaft in the first axle envelope 31 and turntable 10 is arranged in first gas chamber 32
Between 12, and communicated with first gas passage 13.First axle envelope 31 includes the first interface channel 311, is connected to the first gas chamber 32
With external environment, wherein the first connector 33 is assembled in opening of the position in the outside of the first axle envelope 31 of the first interface channel 311, and
And first connector 33 be for being connect with air-extractor.
Thereby design, when air-extractor carries out pumping operation, the first interface channel 311, the first gas chamber 32 and the first gas
Gas in body channel 13 is extracted so that the first interface channel 311, the first gas chamber 32 and 13 inside of first gas passage are presented
Negative pressure state.
As shown in Figure 3 and Figure 5, the base plate carrying portion 11 of Fig. 5 includes vacuum cup 111 and shunting disk 112, and wherein vacuum is inhaled
Disk 111 is covered in shunting disk 112, and vacuum cup 111 is for being in contact with substrate.Preferably, vacuum cup 111 is porous material
Matter, such air can set another side by the hole on vacuum cup 111 from the wherein one side circulation of vacuum cup 111.First gas
The opening position in body channel 13 is on shunting disk 112.Thereby design, when the air-extractor of pumping cells 30 carries out pumping operation,
Air of the position between vacuum cup 111 and substrate can flow to shunting disk 112 by the hole of vacuum cup 111, then shunt
The air of disk 112 can converge in the opening of first gas passage 31, sequentially pass through first gas passage again with reference to 3 last air of figure
13 first gas chambers 32 and the first interface channel 311 and be extracted, substrate can be so stably maintained to the vacuum of turntable 10
On sucker 111.
On the other hand, when handling non-circular substrate using traditional single-wafer rotary-cleaning Etaching device, due to not rounded
Shape substrate has polygon feature, therefore there is the risk that the etching liquid being sprayed on substrate flow to substrate back, therefore meeting
Cause etching liquid to flow to the opening of vacuum cup 111, and then pollutes vacuum cup 111 and destroy the energy of its vacsorb
Power.Therefore, in this announcement, in order to avoid base plate carrying portion 11 is dirty not by the etching solution or treatment fluid being sprayed on substrate
Dye, by added inside turntable 10 second gas channel 14 and by gas supply unit 40 provide protective gas, with
The air-flow C (Figure 10) for blowing to substrate back edge around substrate back center is provided on substrate, and then place can be effectively prevented from
The problem of managing fluid contamination base plate carrying portion 11, corresponding concrete structure and feature will be described in detail in the following.
As shown in Fig. 3, Fig. 4 and Fig. 7, wherein Fig. 7 shows the enlarged drawing of the parts F of Fig. 5.The gas supply unit 40 of Fig. 4
Including the second axle envelope 41, the second gas chamber 42, gas supply equipment (not shown) and the second connector 43.Gas supply equipment can be
One nitrogen cylinder provides source nitrogen.Second axle envelope 41 surround and envelopes the second position P2 of shaft 12.Second gas chamber 42 is arranged
It is connected between the second axle envelope 41 and the shaft 12 of turntable 10, and with second gas channel 14.Second axle envelope 41 includes the
Two interface channels 411 are connected to the second gas chamber 42 and external environment, wherein the second connector 43 is assembled in the second interface channel 411
Position in the opening of the outside of the second axle envelope 41, and the second connector 43 is for being connect with gas supply equipment.Thereby design,
When gas supply equipment provides protective gas, protective gas can inject the second interface channel 411, the second gas chamber 42 and the second gas
In body channel 14, and then blow to substrate.Preferably, gas supply equipment can provide source nitrogen for a nitrogen cylinder.
It please refers to shown in Fig. 8, Fig. 9 and Figure 10, Fig. 8 shows the zero of the substrate board treatment 1 of the preferred embodiment of this announcement
Part explosive view, Fig. 9 show that the gas distribution ring 50 of the substrate board treatment 1 of Fig. 8 is shown with the upward view of substrate 2 and Figure 10
The sectional view along A-A face lines of Fig. 9.When protective gas is blowed by second gas channel 14 to substrate 2, in order to allow
The protective gas of blowout reaches each edge of substrate 2, it is necessary to allow protective gas court by the way that gas distribution element appropriate is arranged
Uniform blowout from all directions.Therefore, the substrate board treatment 1 of this announcement includes also gas distribution ring 50, is circumferentially arranged
Around the base plate carrying portion 11 of turntable 10, the protective gas for supplying gas supply unit 40 shunts as shown in Figure 8
To multiple outlet passageway T1 to T12, and protective gas is blowed by multiple outlet passageway T1 to T12 to substrate 2.
As shown in figure 3, after gas distribution ring 50 is assembled in around the base plate carrying portion 11 of turntable 10, gas distribution ring
The shunting gas chamber 60 of annular is formed between 50 and turntable 10, and second gas channel 14 can be connected to shunting gas chamber 60,
So that protective gas can be filled in inside shunting gas chamber 60.Also, as shown in figure 8, gas distribution ring 50 includes the first ring 51 and the
Two rings 52.First ring 51 is in the groove for being formed with multiple annular arrays in face of the surface of the second ring 52, so when 51 He of the first ring
After second ring, 52 mutual assembling is stacked, the outlet passageway T1 of multiple annular arrays can be formed between the first ring 51 and the second ring 52
To T12.For example gas distribution ring 50 includes 12 outlet passageway T1 to T12 in the present embodiment, only not limited to this.Again
Person, as shown in Figure 10, for gas distribution ring 50 in the side close to 2 edge of substrate, the first ring 51 and the second ring 52 are not close
Envelope formula assemble, but the end of the first ring 51 and the second ring 52 retain can allow protective gas by slit 53.Thereby design,
The protective gas being filled in inside shunting gas chamber 60, can be dispersed in gas distribution ring 50 by different outlet passageway T1 to T12
Inside is then discharged by corresponding slit 53, and then blown on a substrate 2.
As shown in Figure 9 and Figure 10, the spaced a distance R in edge at the edge of gas distribution ring 50 and substrate 2, so protects gas
Know from experience the air-flow C for generating the edge that 2 back side of substrate is blowed to around the center in the back of the body (bottom) face of substrate 2 on a substrate 2.That is, logical
Peripheral location at the back side of substrate 2 around center can first be brushed by crossing the protective gas of the discharge of corresponding slit 53, then be protected
Gas can advance along the edge at the back side towards 2 back side of substrate of substrate 2.In this way, when the etching liquid of sprinkling on a substrate 2 is flow to
When 2 back side of substrate, the air-flow C generated on a substrate 2 by protective gas can effectively prevent etching liquid from continuing towards rotation
The base plate carrying portion 11 of platform 10 is flowed, and then can be effectively prevented from the problem of etching liquid pollutes base plate carrying portion 11.
It should be noted that in this announcement, when turntable 10 rotates, pumping cells 30 and gas supply unit 40 are all
Be to maintain maintain static it is dynamic.Also, by opening up channel inside solid turntable 10 to be used as gas transport, rather than
By the way of traditional gas piping for installing entity inside hollow shaft, in this way, the turntable 10 when this announcement revolves
When turning, the problem of not having gas piping flexing.
In conclusion this announcement and is being rotated by designing two independent gas passages in solid turntable
The position of the opening of corresponding two gas passages is separately connected two gas cells, and described two gas cells in the shaft of platform
It will not rotate, can be so effectively prevented from the prior art because two gas pipings can be with turntable as turntable rotates
Rotation and it is wrapped around one another together the problem of.In addition, blowing extrorse gas around back center by applying on substrate
Stream, can prevent the etching liquid being sprayed on substrate from flowing to substrate back, and then prevents etching liquid from polluting or destroying vacuum and inhale
The problem of disk.
Although this announcement has used preferred embodiment disclosed above, so it is not limited to this announcement, the affiliated skill of this announcement
Art has usually intellectual in field, in the spirit and scope for not departing from this announcement, when can be used for a variety of modifications and variations, because
The protection domain of this this announcement is when subject to appended claims institute defender.
Claims (18)
1. a kind of substrate board treatment, which is characterized in that include：
One turntable for keeping a substrate, and can be rotated around an axis of centres, include one first gas inside the turntable
Body channel and a second gas channel, wherein one end position of the first gas passage is in the base plate carrying portion of the turntable,
And other end position the one end in the first position of turntable and the second gas channel position the turntable the base
Plate supporting part, and other end position is in the second position of turntable；
One pumping cells are connect with the first position of the turntable, are maintained in the first gas passage for making
One negative pressure state, and then the substrate is maintained on the turntable；And
One gas supply unit is connect with the second position of the turntable, for supplying a protective gas, wherein described
Protective gas is blowed by the second gas channel to the substrate back, and the protective gas is for preventing from being applied to institute
The treatment fluid stated on substrate flow to the base plate carrying portion along the back side of the substrate.
2. substrate board treatment as described in claim 1, which is characterized in that the pumping cells include：
One first axle envelope surround and envelopes the first position of the turntable, including one first interface channel；
One first gas chamber, setting are connected between first axle envelope and the turntable, and with the first gas passage；
And
One air-extractor is connect with first interface channel of first axle envelope, is used for first interface channel, institute
State the gas extraction in the first gas chamber and the first gas passage.
3. substrate board treatment as claimed in claim 2, which is characterized in that the gas supply unit includes：One second axis
Envelope surround and envelopes the second position of the turntable, including one second interface channel；
One second gas chamber, setting are connected between second axle envelope and the turntable, and with the second gas channel；
And
One gas supply equipment is connect with second interface channel, in second interface channel, second gas chamber
The protective gas is injected in the second gas channel.
4. substrate board treatment as described in claim 1, which is characterized in that when the turntable rotates, the pumping is single
First be kept fixed with the gas supply unit does not rotate.
5. substrate board treatment as described in claim 1, which is characterized in that the substrate board treatment also includes a gas point
Ring is flowed, is arranged circumferentially at around the base plate carrying portion, the protective gas for supplying the gas supply unit
Multiple outlet passageways are branched to, and the protective gas is blowed by the multiple outlet passageway to the substrate back.
6. substrate board treatment as claimed in claim 5, which is characterized in that the edge of the gas distribution ring and the substrate
Edge it is spaced a distance so that the protective gas can generate on the substrate from the back side of the substrate it is intermediate around
Blow to the air-flow at the edge of the substrate back.
7. substrate board treatment as described in claim 1, which is characterized in that the protective gas includes nitrogen.
8. a kind of substrate board treatment, which is characterized in that include：
One turntable, for keeping a substrate；
One driving unit is connect with the turntable, for driving the turntable to rotate；
One first axle envelope surround and envelopes a part for the turntable, including one first interface channel；And
One first gas chamber is arranged between first axle envelope and the turntable, wherein described the first of first axle envelope
It is logical it to be formed with a first gas inside interface channel connection first gas chamber and external environment, and the wherein described turntable
Road, one end is connected to first gas chamber and the other end is connected to the base plate carrying portion of the turntable.
9. substrate board treatment as claimed in claim 8, which is characterized in that the substrate board treatment also includes that a pumping is set
It is standby, it is connect with first interface channel of first axle envelope, wherein the air-extractor is used to lead to first connection
Gas extraction in road, first gas chamber and the first gas passage so that be maintained at one in the first gas passage
Negative pressure state, and then the substrate is maintained on the turntable.
10. substrate board treatment as claimed in claim 8, which is characterized in that when the turntable rotates, the first axle
Envelope, which is kept fixed, not to be rotated.
11. substrate board treatment as claimed in claim 8, which is characterized in that the substrate board treatment also includes：
One second axle envelope surround and envelopes a part for the turntable, including one second interface channel；And
One second gas chamber is arranged between second axle envelope and the turntable, wherein described the second of second axle envelope
It is logical it to be formed with a second gas inside interface channel connection second gas chamber and external environment, and the wherein described turntable
Road, one end is connected to second gas chamber and the other end is connected to the base plate carrying portion of the turntable.
12. substrate board treatment as claimed in claim 11, which is characterized in that when the turntable rotates, described second
Axle envelope, which is kept fixed, not to be rotated.
13. substrate board treatment as claimed in claim 11, which is characterized in that the substrate board treatment also includes a gas
Supply equipment is connect with second interface channel of second axle envelope, in second interface channel, described second
A protective gas is injected in gas chamber and the second gas channel so that the protective gas is sent by second interface channel
On to the substrate back.
14. substrate board treatment as claimed in claim 13, which is characterized in that the substrate board treatment also includes a gas
Flow splitter is arranged circumferentially at around the base plate carrying portion, for the protective gas to be branched to multiple outlet passageways, and
And the protective gas is sent by the multiple outlet passageway to the substrate back.
15. substrate board treatment as claimed in claim 14, which is characterized in that the edge of the gas distribution ring and the base
The edge of plate is spaced a distance so that the protective gas can generate the intermediate week from the back side of the substrate on the substrate
Enclose the air-flow at the edge for blowing to the substrate back.
16. substrate board treatment as claimed in claim 13, which is characterized in that the protective gas includes nitrogen.
17. a kind of substrate board treatment, which is characterized in that include:
One turntable, has：
One shaft；
One base plate carrying portion, position is in the shaft and can be driven by the shaft to rotate, and the base plate carrying portion is for protecting
A substrate is held, and keeps the substrate rotatable, it can comprising a first gas passage and a second gas channel inside the shaft
It is rotated together with the shaft, for the first gas passage to apply in a vacuum to the substrate, the second gas is logical
Road to apply protective gas on the back side of the substrate around the base plate carrying portion position, thereby with prevent processing institute
The fluid for stating substrate flow to the base plate carrying portion along the back side of the substrate；
One pumping cells are connected with the first gas passage；And
One gas supply unit is connected with the second gas channel.
18. substrate board treatment as claimed in claim 17, which is characterized in that the substrate is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820037879.0U CN207752974U (en) | 2018-01-10 | 2018-01-10 | Substrate board treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820037879.0U CN207752974U (en) | 2018-01-10 | 2018-01-10 | Substrate board treatment |
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| Publication Number | Publication Date |
|---|---|
| CN207752974U true CN207752974U (en) | 2018-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820037879.0U Active CN207752974U (en) | 2018-01-10 | 2018-01-10 | Substrate board treatment |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021536A (en) * | 2018-01-10 | 2019-07-16 | 弘塑科技股份有限公司 | Substrate board treatment |
| CN110957256A (en) * | 2018-09-27 | 2020-04-03 | 东京毅力科创株式会社 | Substrate processing apparatus |
| CN111304629A (en) * | 2018-12-11 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Chamber assembly and reaction chamber |
| CN111750110A (en) * | 2020-06-24 | 2020-10-09 | 江苏仅一联合智造有限公司 | Airflow curtain device of rotary table |
| CN115431169A (en) * | 2022-08-24 | 2022-12-06 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
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2018
- 2018-01-10 CN CN201820037879.0U patent/CN207752974U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021536A (en) * | 2018-01-10 | 2019-07-16 | 弘塑科技股份有限公司 | Substrate board treatment |
| CN110021536B (en) * | 2018-01-10 | 2023-03-31 | 弘塑科技股份有限公司 | Substrate processing apparatus |
| CN110957256A (en) * | 2018-09-27 | 2020-04-03 | 东京毅力科创株式会社 | Substrate processing apparatus |
| CN111304629A (en) * | 2018-12-11 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Chamber assembly and reaction chamber |
| CN111750110A (en) * | 2020-06-24 | 2020-10-09 | 江苏仅一联合智造有限公司 | Airflow curtain device of rotary table |
| CN111750110B (en) * | 2020-06-24 | 2023-10-20 | 江苏仅一联合智造有限公司 | Revolving stage air current curtain device |
| CN115431169A (en) * | 2022-08-24 | 2022-12-06 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
| CN115431169B (en) * | 2022-08-24 | 2023-09-01 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
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