CN207646310U - A kind of wafer electroplating fixture - Google Patents
A kind of wafer electroplating fixture Download PDFInfo
- Publication number
- CN207646310U CN207646310U CN201721778298.4U CN201721778298U CN207646310U CN 207646310 U CN207646310 U CN 207646310U CN 201721778298 U CN201721778298 U CN 201721778298U CN 207646310 U CN207646310 U CN 207646310U
- Authority
- CN
- China
- Prior art keywords
- wafer
- connecting rod
- clamping block
- electroplating fixture
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model is related to a kind of wafer electroplating fixtures, including：Ontology is provided with the groove of accommodating wafer on the body, further includes automatic clamping mechanism.The automatic clamping mechanism includes bearing, connecting rod, clamping block and spring part etc..Wherein, bearing is fixedly attached on ontology, connecting rod is connect with bearing sliding, clamping block is used to carry out clamping positioning to wafer, it is provided with chamfering on the seamed edge opposite with ontology of its front end, the clamping block is fixed to be arranged in one end of connecting rod, and the other end of connecting rod is provided with hand-held part, spring part is linked on connecting rod, and is arranged between bearing and clamping block.The wafer electroplating fixture is simple in structure, and function is reliable, and under the action of spring part restoring force, clamping block automatically compresses wafer.
Description
Technical field
The utility model is related to wafer technical field of plating equipment more particularly to a kind of wafer electroplating fixtures.
Background technology
Plating is to plate the process of other metal or alloy of a thin layer in certain conductive material surfaces using electrolysis principle, is
The technique that layer of metal film is adhered on the surface for making metal or other materials make using electrolysis.Wafer electricity currently on the market
Plating fixture is fixed using screw or tabletting mostly, and operation sequence is complicated, and disassembly efficiency is relatively low, in addition the tightness and pressure of bolt
Piece intensity difference can also influence wafer plating thickness and differ, and cause electroplating quality irregular.
Utility model content
The purpose of this utility model is to overcome deficiencies in the prior art, provide a kind of simple in structure, automatic impaction
Wafer electroplating fixture.
In order to solve the above-mentioned technical problem, the utility model is related to a kind of wafer electroplating fixtures, including：Ontology, at this
It is provided with the groove of accommodating wafer on body, further includes automatic clamping mechanism.The automatic clamping mechanism includes bearing, connecting rod, clamping
Block and spring part.Bearing is fixedly attached on ontology, and connecting rod is connect with bearing sliding, and clamping block is used to carry out clamping to wafer
It positions, is provided with chamfering on the seamed edge opposite with ontology of front end, the clamping block is fixed to be arranged in one end of connecting rod, in connecting rod
The other end be provided with hand-held part, spring part is linked on connecting rod, and is arranged between bearing and clamping block.
The wafer electroplating fixture is simple in structure, and function is reliable.Wafer is previously positioned in the groove on electroplating clamp ontology,
Then, operating personnel decontrol automatic clamping mechanism hand-held part, and clamping block moves under the action of spring part restoring force to wafer direction
It is dynamic, automatic impaction, the wafer different to thickness are carried out to wafer by the chamfering being arranged on the seamed edge opposite with ontology of its front end
It can reliably be positioned, be suitable for the wafer of different size.
Automatic clamping mechanism quantity is 3 as a further improvement of the utility model, circumferentially uniformly distributed along groove.
Automatic clamping mechanism quantity is 3, and circumferentially uniformly distributed along groove, and it is reliable that such setting is convenient for wafer to compress, i.e.,
When making wafer by outer force effect, it is not easy to be subjected to displacement.
The wafer electroplating fixture further includes limiting device as a further improvement of the utility model, the limiting device packet
Include the positioning pin being arranged on connecting rod.
The overhang of connecting rod is controlled by limiting device, to be determined to the extreme position of clamping block.
Inclined working face is additionally provided on clamping block as a further improvement of the utility model, with falling on seamed edge
Angle is corresponding.
Inclined working face is provided on clamping block, and corresponding with the chamfering on seamed edge, so, when needs will be brilliant
When circle puts body recess into, wafer is then first pushed into wafer, in the effect of component by being placed on the inclined working face of clamping block
Under each clamping block automatic backing, continue to push, then under spring part selfer force effect, by the chamfering of its seamed edge to crystalline substance
Circle automatic impaction.
Transition arc is provided between working face and edge chamfering as a further improvement of the utility model,.
The arc transition between working face and edge chamfering, so, in placement process so that wafer is in clamping block
Smooth, reduction shock is run between chamfering on working face and seamed edge.
Bearing is fixedly connected with ontology by fastener as a further improvement of the utility model,.
Fastener connection type is used between bearing and ontology, simple in structure, connection is reliable, easy to disassemble.
Clamping block is connected through a screw thread with connecting rod as a further improvement of the utility model,.
Connecting rod one end is provided with screw thread, correspondingly, threaded hole compatible with above-mentioned screw thread is provided on clamping block,
So that the two assembling process is simple, especially when needing to change clamping block, facilitates and replaced.
Connecting rod cross sectional shape is non-circular as a further improvement of the utility model,.
Connecting rod cross sectional shape is designed as non-circular, and so, when connecting rod and bearing carry out Relative sliding, clamping block is not
Phenomenon can be rotated, convenient for wafer installation, positioning.
Ontology is made of high rigidity, resistant material as a further improvement of the utility model,.
In order to reduce the influence to deform to wafer electroplating quality by chuck body, and consider from prolonging the service life,
Wafer electroplating fixture ontology selects high rigidity, resistant material to be made.
Material is polytetrafluoroethylene (PTFE) as a further improvement of the utility model,.
Polytetrafluoroethylene (PTFE) in addition to having the characteristics that high rigidity, corrosion resistant also there is high temperature resistant, inadhesive feature to be convenient for
The cleaning of holding jig.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model wafer electroplating fixture.
Fig. 2 is the partial sectional view of the utility model wafer electroplating fixture.
Fig. 3 is the placement process demonstration graph of the utility model wafer electroplating fixture.
1- ontologies；11- grooves；2- wafers；3- automatic clampings mechanism；31- bearings；32- connecting rods；33- clamping blocks；331- works
Make face；332- chamferings；333- transition arcs；34- spring parts；The hand-held parts 35-；36- positioning pins.
Specific implementation mode
With reference to specific embodiment, the content of the utility model is described in further detail：
In order to reach the purpose of this utility model, Fig. 1 shows the structural schematic diagram of the utility model wafer electroplating fixture.
Fig. 2 shows the partial sectional views of the utility model wafer electroplating fixture.The wafer electroplating fixture includes：Ontology 1, in ontology 1
On be provided with groove 11 for housing wafer 2, the size and shape of groove 11 are according to 2 appearance of wafer of different size come really
It is fixed, additionally include automatic clamping mechanism 3.It is 3 that quantity, which is arranged, in the automatic clamping mechanism 3, and circumferential uniformly distributed along groove 11, this
Sample one compresses wafer 2 convenient for it, even if wafer 2 is by outer force effect, is not easy to be subjected to displacement.Further
Optimization, the center line extended lines of all automatic clamping mechanisms 3 all by the centre of form of groove 11, convenient for each automatic clamping mechanism into
Row self-balancing adjusts.The automatic clamping mechanism 3 includes bearing 31, connecting rod 32, clamping block 33 and spring part 34 etc..Bearing 31 passes through
The fasteners such as screw are permanently connected together with ontology 1, in addition to this, can also use any other suitable removable shape
Formula, certainly, the two can also be permanently fixed connection.The cross sectional shape of connecting rod 32 can be used it is non-circular, it is such as rectangular, and on bearing 31
It is provided with and is mutually slidably connected with bearing 31 with above-mentioned non-circular compatible through-hole, connecting rod 32.It is arranged in one end of connecting rod 32
There is clamping block 33, which is used to carry out clamping positioning to wafer 2, is provided with down on the seamed edge opposite with ontology 1 of front end
Angle 332,332 size of chamfering are determined according to the matching relationship of practical wafer 2 and gripping block 33.Spring part 34 is linked in
On connecting rod 32, and it is arranged between bearing 31 and clamping block 33.In addition, the other end in connecting rod 32 is additionally provided with hand-held part 35,
Operator can move 33 position of clamping block conveniently by control link 32, in order to which wafer 2 is put into chuck body 1
On groove 11.As a further improvement, being additionally provided with positioning pin 36 on connecting rod 32.By 36 come pairs of limiting device positioning pin
The overhang of connecting rod 32 is controlled, to be determined to the extreme position of clamping block 33.
Fig. 3 shows the placement process demonstration graph of the utility model wafer electroplating fixture.Concrete operation step is as follows：
One：By wafer 2 by being placed on 33 inclined working face 331 of clamping block；
Two：Push wafer 2；It needing especially to remind a bit herein, depressed position is close proximity to clamping block 33, in order to avoid wafer 2
Fracture phenomena occurs for unbalance stress；
Three：2 edge of wafer forces each clamping block 33 to retreat under the action of component；
Four：Wafer 3 crosses working face 331 and transition arc 333, is in contact with chamfering 332；
Five：It is automatic to wafer 2 by the chamfering 332 of seamed edge on clamping block 33 under 34 selfer force effect of spring part
It compresses.
Further optimization, in order to reduce the shadow to deform to 2 electroplating quality of wafer by wafer electroplating fixture ontology 1
It rings, and consider from its service life is extended, is made of high rigidity, corrosion-resistant material, preferably polytetrafluoroethylene.
To the explanation of the disclosed embodiments, professional and technical personnel in the field is enable to realize or use this practicality new
Type.Various modifications to these embodiments will be apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest range consistent with features of novelty.
Claims (10)
1. a kind of wafer electroplating fixture, including：Ontology is provided with the groove of accommodating wafer on the body, it is characterised in that：
It further include automatic clamping mechanism；The automatic clamping mechanism includes bearing, connecting rod, clamping block and spring part；The bearing is fixed
Ground connects on the body；The connecting rod is connect with the bearing sliding；It is fixed that the clamping block is used to carry out clamping to wafer
, it is provided with chamfering on the seamed edge opposite with ontology of front end；The clamping block is fixed to be arranged in one end of connecting rod, in connecting rod
The other end be provided with hand-held part；The spring part is linked on the connecting rod, and is arranged in the bearing and the clamping block
Between.
2. wafer electroplating fixture according to claim 1, which is characterized in that automatic clamping mechanism quantity is 3, edge
The groove is circumferentially uniformly distributed.
3. wafer electroplating fixture according to claim 2, which is characterized in that further include limiting device；The limiting device
Including the positioning pin on the connecting rod is arranged.
4. according to the wafer electroplating fixture described in claim 3, which is characterized in that be additionally provided on the clamping block inclined
Working face, it is corresponding with the chamfering on the seamed edge.
5. according to the wafer electroplating fixture described in claim 4, which is characterized in that in the working face and the edge chamfering
Between be provided with transition arc.
6. wafer electroplating fixture according to claim 1, which is characterized in that the bearing passes through fastener with the ontology
It is fixedly connected.
7. wafer electroplating fixture according to claim 1, which is characterized in that the clamping block passes through screw thread with the connecting rod
Connection.
8. wafer electroplating fixture according to claim 1, which is characterized in that the connecting rod cross sectional shape is non-circular.
9. wafer electroplating fixture according to claim 1, which is characterized in that the ontology is by high rigidity, resistant material
It is made.
10. wafer electroplating fixture according to claim 9, which is characterized in that the material is polytetrafluoroethylene (PTFE).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721778298.4U CN207646310U (en) | 2017-12-19 | 2017-12-19 | A kind of wafer electroplating fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721778298.4U CN207646310U (en) | 2017-12-19 | 2017-12-19 | A kind of wafer electroplating fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207646310U true CN207646310U (en) | 2018-07-24 |
Family
ID=62877768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721778298.4U Active CN207646310U (en) | 2017-12-19 | 2017-12-19 | A kind of wafer electroplating fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207646310U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108360051A (en) * | 2018-05-10 | 2018-08-03 | 东莞市联洲知识产权运营管理有限公司 | A kind of clamping device being applied to round plated item |
| CN109056018A (en) * | 2018-10-15 | 2018-12-21 | 安徽宏实自动化装备有限公司 | A kind of ultrasonic enhancing electroplanting device |
| CN110373703A (en) * | 2019-09-03 | 2019-10-25 | 扬州国润半导体科技有限公司 | A kind of semiconductor crystal wafer plating clamping device |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN112962129A (en) * | 2021-02-03 | 2021-06-15 | 广州兴金五金有限公司 | Wafer double-sided copper electroplating thick film equipment |
-
2017
- 2017-12-19 CN CN201721778298.4U patent/CN207646310U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108360051A (en) * | 2018-05-10 | 2018-08-03 | 东莞市联洲知识产权运营管理有限公司 | A kind of clamping device being applied to round plated item |
| CN109056018A (en) * | 2018-10-15 | 2018-12-21 | 安徽宏实自动化装备有限公司 | A kind of ultrasonic enhancing electroplanting device |
| CN109056018B (en) * | 2018-10-15 | 2020-05-12 | 安徽宏实自动化装备有限公司 | Ultrasonic wave reinforcing electroplating device |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN110373703A (en) * | 2019-09-03 | 2019-10-25 | 扬州国润半导体科技有限公司 | A kind of semiconductor crystal wafer plating clamping device |
| CN112962129A (en) * | 2021-02-03 | 2021-06-15 | 广州兴金五金有限公司 | Wafer double-sided copper electroplating thick film equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207646310U (en) | A kind of wafer electroplating fixture | |
| CN210998326U (en) | Clamping tool for thin-wall cylinder | |
| CN205237109U (en) | Three -jaw chuck that can 6 tight work pieces of clamp | |
| CN103243363A (en) | Locally-electroplating mold | |
| CN109605258A (en) | The floating type screw-in clamping and positioning device of one kind and its application method | |
| CN211661567U (en) | Machining clamp for three-way part | |
| CN208496985U (en) | A kind of robot cylinder cap turns line positioning mechanism | |
| CN208601367U (en) | A kind of magnetic-type frock clamp of gasket production | |
| CN203712553U (en) | Lotus-shaped energy-saving bulb assembling and positioning fixture | |
| CN215790893U (en) | Tool for processing milling grooves on inner wall surface and outer wall surface of carbon graphite split sealing ring | |
| CN202726139U (en) | Hole saw component capable of being quickly replaced | |
| CN212312166U (en) | Novel effective location frock of PVC | |
| CN210307628U (en) | Special tool for disassembling bearing of transmission | |
| CN213498774U (en) | Molybdenum electrode surface local silver coating clamp | |
| CN210237821U (en) | Plug structure | |
| CN211219370U (en) | Guided missile wing's fixed-position welding frock | |
| CN208592761U (en) | A kind of self-centering device for crankshaft connecting-rod neck | |
| CN111590530A (en) | Fastening device convenient to dismantle | |
| CN215950037U (en) | Novel fastener convenient to assemble and disassemble and used for nuclear power | |
| CN208977332U (en) | A kind of mobile board special fixture | |
| CN213080743U (en) | Adjustable clamping device for machining metal structural part | |
| CN218927550U (en) | Tool for three-coordinate detection and quick, accurate and repeatable positioning | |
| CN108161047A (en) | The drilling equipment and boring method of a kind of welding structural element | |
| CN209219773U (en) | A kind of detachable hanging mirror point | |
| CN219465937U (en) | Shell processing clamp for cylindrical battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee after: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee before: KUNSHAN CHENGGONG ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221208 Address after: No. 323, Jinchuan Road, Nantong Hi tech Industrial Development Zone, Nantong, Jiangsu 226399 Patentee after: Jiangsu Sizhi Semiconductor Technology Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee before: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. |