CN110373703A - A kind of semiconductor crystal wafer plating clamping device - Google Patents
A kind of semiconductor crystal wafer plating clamping device Download PDFInfo
- Publication number
- CN110373703A CN110373703A CN201910828723.3A CN201910828723A CN110373703A CN 110373703 A CN110373703 A CN 110373703A CN 201910828723 A CN201910828723 A CN 201910828723A CN 110373703 A CN110373703 A CN 110373703A
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- electroplated
- clamping
- groups
- semiconductor crystal
- clamping device
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of semiconductor crystal wafers, and clamping device is electroplated, including workbench, hydraulic stem, cylinder, clamp mainboard and electroplated discs, the workbench is L-type structure, its inner lower edge face offers kerve lateral direction penetrating and in rectangular configuration, its outer tip end face is equipped with hydraulic stem far from the side of vertical end, its inside top end face is provided with roof supporting, the piston end bottom end of the hydraulic stem passes through workbench and is welded and fixed with roof supporting, the bottom end of the roof supporting is welded with the motor being vertically arranged, the arbor of the motor is connected with stirring flabellum by support baseboard.Clamping device is electroplated in the semiconductor crystal wafer, electroplate liquid in electroplating bath can be stirred, it can guarantee that the stirring flowing of electroplate liquid is abundant, to ensure that the uniformity of electroplating deposition thickness, the effect of plating is improved, and by the promotion of cylinder, completes clamping, keep the effect clamped more preferable, it is more stable.
Description
Technical field
The invention belongs to semiconductor crystal wafer electroplating technologies, and in particular to a kind of semiconductor crystal wafer plating clamping device.
Background technique
In the production process of semiconductor integrated circuit, needs to carry out crystal column surface plating and form metal layer.Therefore wafer is electric
Plating is one of the key link of semiconductor crystal wafer manufacturing process, and process is that wafer is placed in electroplate liquid, is coupled on wafer
Positive voltage is connected on dissolvable or insoluble anode, is made in electroplate liquid by electric field action as cathode by negative voltage
Metal ion deposition to crystal column surface.
In the electroplating process of semiconductor crystal wafer, to use electroplating clamp for being fixedly clamped to wafer, and it is existing
The effect of clamping device, clamping is poor, is easy to cause the abrasion to wafer, and wafer is pressing from both sides to overexerting in clamping process
During holding, existing clamping device, when clamping placement, wafer be electroplated, and the fixture for being also easy to wafer hides
Gear causes the effect of plating poor, and it is abundant not can guarantee stirring of the electrodeposit liquid in plating.
Summary of the invention
The purpose of the present invention is to provide a kind of semiconductor crystal wafers, and clamping device is electroplated, to solve to mention in above-mentioned background technique
Out the problem of.
To achieve the above object, the invention provides the following technical scheme: clamping device is electroplated in a kind of semiconductor crystal wafer, including
Workbench, hydraulic stem, cylinder, clamping mainboard and electroplated discs, the workbench are L-type structure, and inner lower edge face offers cross
To kerve perforation and in rectangular configuration, outer tip end face is equipped with hydraulic stem, medial roof far from the side of vertical end
End face is provided with roof supporting, and the piston end bottom end of the hydraulic stem passes through workbench and is welded and fixed with roof supporting, the branch
The bottom end of support plate is welded with the motor being vertically arranged, and the arbor of the motor is connected with stirring flabellum by support baseboard；
The clamping mainboard coincide in kerve, and clamping the upper surface of mainboard, to offer transversal cross-section between two parties in rectangular configuration
Electroplating bath, the bottom of electroplating bath is arranged in the electroplated discs circular array, the clamping mainboard quadrangle on the outside of the electroplating bath
Place is fixedly installed with cylinder, and for the cylinder in a ° setting, piston rod is symmetrically placed in the electroplated discs to have towards electroplated discs
Two groups of clamping plates, wherein wafer ontology clamping are placed between two groups of clamping plates.
Preferably, the arbor of the support baseboard top and motor is fixedly welded, the bottom end of support baseboard and stirring flabellum
Axis be fixedly welded, and support baseboard is in the form of annular discs connects, and the arbor three of support baseboard, stirring flabellum and motor coaxially sets
It sets.
Preferably, the stirring flabellum is made of two groups of vertical rectangle paddles arranged in a crossed manner, and axis is arranged two
The middle position of group rectangle paddle, and the horizontal length of paddle is less than in electroplating bath between two groups of electroplated discs arranged in a crossed manner
Distance, and stir flabellum axis vertically correspond in the center of electroplating bath.
Preferably, the handle of U-shaped structure, clamping are also equipped among the clamping symmetrical two groups of vertical sides of mainboard
The piston end of cylinder on mainboard protrudes into top in disc, and the depth of electroplating bath is greater than the height of electroplated discs.
Preferably, the lateral surface of clamping plate described in two groups and the arc-shaped structure of medial surface, and lateral surface and electroplated discs is interior
Side abuts against, and the bottom end of medial surface offers the clip slot of arcuate structure, and wherein wafer ontology clamping is placed on two groups of clip slots
Between, and the top of wafer ontology is not contacted with the roof of clip slot.
Preferably, the upper surface of clamping plate described in two groups is fixedly installed with starting stave and second close to middle vertically respectively
Riser, the starting stave and the second riser size structure are identical, and wherein starting stave is also opened backwards to the one side of the second riser
Equipped with inside groove corresponding with the piston end of adjacent cylinder, which is circular trough, has a diameter larger than the diameter of the piston rod of cylinder.
Preferably, the starting stave and the opposite one side top of the second riser be respectively welded be fixed with it is horizontally disposed
First support tube and the second support tube, sliding is provided with support rod, and first between first support tube and the second support tube
Spring is arranged on support rod between support tube and the second support tube.
Technical effect and advantage of the invention: clamping device is electroplated in the semiconductor crystal wafer, by the inside of workbench
Side is provided with stirring flabellum, and stirring flabellum connect with motor coaxle, and the bottom end of stirring flabellum can stretching by hydraulic stem,
The center of electroplating bath is stretched to, so as to be stirred to the electroplate liquid in electroplating bath, can guarantee stirring for electroplate liquid
It mixes flowing sufficiently, to ensure that the uniformity of electroplating deposition thickness, improves the effect of plating；Two groups of folders in electroplated discs simultaneously
Wafer ontology is placed between two groups of clamping plates by the setting of plate, can be during two groups of clamping plates clamp wafer, both
The stability of clamping to improve the clamping effect to wafer, can be guaranteed by the stretching, extension of cylinder and the elastic telescopic of spring,
And the bottom end of clamping plate offers corresponding clip slot, wafer ontology is in clip slot, and the side of side and clip slot fits, and by cylinder
Promotion, complete clamping, make its top do not contacted with clip slot roof, be not in part quilt to ensure that in electroplating process
Block plating less than situation, improve the effect of electrodeposit, in addition wafer be placed on clamping mainboard in, clamping mainboard can pass through handle
Hand from workbench get under, so that can be rapidly performed by wafer ontology collects work after the completion of plating.
Detailed description of the invention
Fig. 1 is main view of the invention；
Fig. 2 is clamping mainboard top view of the invention；
Fig. 3 is clamping mainboard structure schematic diagram of the invention；
Fig. 4 is plating disk center vertical cross-sectional of the invention.
In figure: 1 workbench, 2 kerves, 3 clamping mainboards, 4 handles, 5 cylinders, 6 first support tubes, 7 second support tubes, 8 liquid
Compression bar, 9 roof supportings, 10 motors, 11 support baseboards, 12 stirring flabellums, 13 electroplating baths, 14 electroplated discs, 15 support rods, 16 bullets
Spring, 17 starting staves, 18 second risers, 19 clamping plates, 20 clip slots, 21 inside grooves.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of semiconductor crystal wafers as shown in Figs 1-4, and clamping device is electroplated, including workbench 1, hydraulic
Bar 8, cylinder 5, clamping mainboard 3 and electroplated discs 14, the workbench 1 are L-type structure, and inner lower edge face offers lateral direction penetrating
And kerve 2 in rectangular configuration, outer tip end face hydraulic stem 8, inside top end face are installed far from the side of vertical end
It is provided with roof supporting 9, the piston end bottom end of the hydraulic stem 8 passes through workbench 1 and is welded and fixed with roof supporting 9, the branch
The bottom end of support plate 9 is welded with the motor 10 being vertically arranged, and the arbor of the motor 10 is connected with stirring by support baseboard 11
Flabellum 12；
The clamping mainboard 3 coincide in kerve 2, and the upper surface of clamping mainboard 3 offers transversal cross-section in rectangle between two parties
The bottom of electroplating bath 13 is arranged in the electroplating bath 13 of structure, 14 circular array of electroplated discs, 13 outside of electroplating bath
Clamping 3 four corners of mainboard are fixedly installed with cylinder 5, and the cylinder 5 is arranged in 45 ° (as shown in figure 3, cylinder 5 may be used also herein
To be replaced with electric pushrod), piston rod is symmetrically placed in the electroplated discs 14 to have two groups of clamping plates 19 towards electroplated discs 14,
Wherein wafer ontology clamping is placed between two groups of clamping plates 19.
Specifically, 11 top of support baseboard and the arbor of motor 10 are fixedly welded, the bottom end of support baseboard 11 with stir
The axis for mixing flabellum 12 is fixedly welded, and support baseboard 11 is in the form of annular discs connects, support baseboard 11, stirring flabellum 12 and motor 10
Arbor three coaxial arrangement is able to drive the rotation of stirring flabellum 12 to make the rotation of motor 10.
Specifically, the stirring flabellum 12 is made of two groups of vertical rectangle paddles arranged in a crossed manner, axis setting exists
The middle position of two groups of rectangle paddles, and the horizontal length of paddle is less than two groups of electroplated discs arranged in a crossed manner in electroplating bath 13
The distance between 14, and the axis for stirring flabellum 12 is corresponded to vertically in the center of electroplating bath 13, guarantees that hydraulic stem 8 stretches
When, stirring flabellum 12 enters in electroplating bath 13, electroplated discs 14 will not be touched in the course of rotation, to influence to rotate
Effect.
Specifically, being also equipped with the handle 4 of U-shaped structure, folder among described clamping 3 symmetrical two groups of vertical sides of mainboard
The piston end for holding the cylinder 5 on mainboard 3 protrudes into top in disc, and the depth of electroplating bath 13 is greater than the height of electroplated discs 14, from
And when rotating electroplate liquid in electroplating bath 13, the rotation being able to drive in electroplated discs 14 is allowed to be mixed.
Specifically, the arc-shaped structure of the lateral surface of clamping plate 19 and medial surface described in two groups, and lateral surface and electroplated discs 14
Medial surface abut against, the bottom end of medial surface offers the clip slot 20 of arcuate structure, wherein wafer ontology clamping be placed on two
Between group clip slot 20, and the top of wafer ontology is not contacted with the roof of clip slot 20, to ensure that in electroplating process, will not be gone out
Now partially be blocked plating less than situation, improve the effect of electrodeposit.
Specifically, the upper surface of clamping plate 19 described in two groups is fixedly installed with 17 He of starting stave close to middle vertically respectively
Second riser 18, the starting stave 17 is identical with 18 size structure of the second riser, and wherein starting stave 17 is backwards to the second riser
18 one side is also provided with inside groove 21 corresponding with the piston end of adjacent cylinder 5, which is circular trough, has a diameter larger than
The diameter of the piston rod of cylinder 5, when can guarantee that clamping plate 19 and starting stave 17, the second riser 18 are placed, by inside groove 21
Alignment cylinder 5 is placed.
Specifically, the starting stave 17 and the opposite one side top of the second riser 18 are respectively welded the level of being fixed with and set
The first support tube 6 and the second support tube 7 set, sliding is provided with support rod between first support tube 6 and the second support tube 7
15, and be arranged with spring 16 on the support rod 15 between the first support tube 6 and the second support tube 7, so as to by wafer ontology
It, can be by pushing the relative motion of the first support tube 6 and the second support tube 7 to adjust two groups of clamping plates 19 when being placed on electroplated discs 14
Clamping to wafer ontology.
Specifically, clamping device is electroplated in the semiconductor crystal wafer, in the work being electroplated, two groups of clamping plates 19 are used first
Wafer ontology is clamped, the both ends card of wafer ontology is placed in two groups of clip slots 20, then (can also be with using corresponding tool
In operation with palmistry to pressing) the first support tube 6 and the second support tube 7 are squeezed, receive support rod 15 in two groups of support tubes
Contracting completes clamping to wafer, and clamping plate 19 and wafer ontology is placed in electroplated discs 14, then rotary clamp plate 19, the
One riser 17 and the second riser 18, make the inside groove 21 of starting stave 17 be directed at the piston rod of cylinder 5, take dynamic handle 4 will folder later
It holds in the kerve 2 that mainboard 3 is placed in workbench 1, starts to fill electroplate liquid into electroplating bath 13, and adjust stretching for hydraulic stem 8
Exhibition enters stirring flabellum 12 at the center of electroplating bath 13, and opens motor 10, rotates motor 10 slowly, carries out to electricity
The stirring of electrodeposit liquid in coating bath 13, slowly agitation is trickling down in order to avoid electroplate liquid, stretches four groups of cylinders 5, cylinder 5 again at this time
Stretching, extension starts to enter in inside groove 21, and starts to squeeze starting stave 17, complete by starting stave 17 to extruding at the second riser 18
At the clamping by cylinder 5 to wafer ontology, subsequent plating work can be carried out at this time.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (7)
1. clamping device, including workbench (1), hydraulic stem (8), cylinder (5), clamping mainboard (3) is electroplated in a kind of semiconductor crystal wafer
With electroplated discs (14), it is characterised in that: the workbench (1) be L-type structure, inner lower edge face offer lateral direction penetrating and
Kerve (2) in rectangular configuration, outer tip end face are equipped with hydraulic stem (8) far from the side of vertical end, inside top end face
It is provided with roof supporting (9), it is solid that the piston end bottom end of the hydraulic stem (8) passes through workbench (1) and roof supporting (9) welding
Fixed, the bottom end of the roof supporting (9) is welded with the motor (10) being vertically arranged, and the arbor of the motor (10) passes through support bottom
Plate (11) is connected with stirring flabellum (12)；
The clamping mainboard (3) is coincide in kerve (2), and the upper surface of clamping mainboard (3) offers transversal cross-section in square between two parties
The electroplating bath (13) of shape structure, electroplated discs (14) circular array are arranged in the bottom of electroplating bath (13), the electroplating bath
(13) clamping mainboard (3) four corners on the outside of are fixedly installed with cylinder (5), and the cylinder (5) is in 45 ° of settings, piston rod
Symmetrically placed in the electroplated discs (14) to have two groups of clamping plates (19) towards electroplated discs (14), wherein wafer ontology clamping is placed on
Between two groups of clamping plates (19).
2. clamping device is electroplated in a kind of semiconductor crystal wafer according to claim 1, it is characterised in that: the support baseboard
(11) top and the arbor of motor (10) are fixedly welded, the bottom end of support baseboard (11) and the fixed weldering of the axis of stirring flabellum (12)
It connects, and support baseboard (11) is in the form of annular discs connects, the arbor three of support baseboard (11), stirring flabellum (12) and motor (10) is coaxial
Setting.
3. clamping device is electroplated in a kind of semiconductor crystal wafer according to claim 1, it is characterised in that: the stirring flabellum
(12) it being made of two groups of vertical rectangle paddles arranged in a crossed manner, the middle position of two groups of rectangle paddles is arranged in axis,
And the horizontal length of paddle is less than the distance between two groups of electroplated discs arranged in a crossed manner (14) in electroplating bath (13), and stirs fan
The axis of leaf (12) is corresponded to vertically in the center of electroplating bath (13).
4. clamping device is electroplated in a kind of semiconductor crystal wafer according to claim 1, it is characterised in that: the clamping mainboard
(3) handle (4) of U-shaped structure is also equipped among symmetrical two groups of vertical sides, the cylinder (5) in clamping mainboard (3)
Piston end protrudes into top in disc, and the depth of electroplating bath (13) is greater than the height of electroplated discs (14).
5. clamping device is electroplated in a kind of semiconductor crystal wafer according to claim 1, it is characterised in that: clamping plate described in two groups
(19) the arc-shaped structure of lateral surface and medial surface, and lateral surface and the medial surface of electroplated discs (14) abut against, medial surface
Bottom end offers the clip slot (20) of arcuate structure, and wherein wafer ontology clamping is placed between two groups of clip slots (20), and wafer
The top of ontology is not contacted with the roof of clip slot (20).
6. clamping device is electroplated in a kind of semiconductor crystal wafer according to claim 1, it is characterised in that: clamping plate described in two groups
(19) upper surface is fixedly installed with starting stave (17) and the second riser (18) close to middle vertically respectively, and described first is perpendicular
Plate (17) is identical with the second riser (18) size structure, and wherein one side of the starting stave (17) backwards to the second riser (18) is also opened
Equipped with inside groove (21) corresponding with the piston end of adjacent cylinder (5), which is circular trough, has a diameter larger than cylinder (5)
Piston rod diameter.
7. clamping device is electroplated in a kind of semiconductor crystal wafer according to claim 6, it is characterised in that: the starting stave
(17) it is respectively welded with the opposite one side top of the second riser (18) and is fixed with horizontally disposed first support tube (6) and second
Support tube (7), sliding is provided with support rod (15) between first support tube (6) and the second support tube (7), and the first support
Spring (16) are arranged on support rod (15) between pipe (6) and the second support tube (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910828723.3A CN110373703A (en) | 2019-09-03 | 2019-09-03 | A kind of semiconductor crystal wafer plating clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910828723.3A CN110373703A (en) | 2019-09-03 | 2019-09-03 | A kind of semiconductor crystal wafer plating clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110373703A true CN110373703A (en) | 2019-10-25 |
Family
ID=68261317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910828723.3A Pending CN110373703A (en) | 2019-09-03 | 2019-09-03 | A kind of semiconductor crystal wafer plating clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110373703A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112442722A (en) * | 2020-11-19 | 2021-03-05 | 湖州科峰磁业有限公司 | Electroplating device for manufacturing electronic accessories and using method |
| CN113604862A (en) * | 2021-07-29 | 2021-11-05 | 复旦大学 | Safe, reliable and intelligent semiconductor electroplating equipment |
| CN114075686A (en) * | 2020-08-21 | 2022-02-22 | 江苏澳光电子有限公司 | Convenient and flexible electroplating stable supporting device |
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| CN207629609U (en) * | 2017-11-20 | 2018-07-20 | 新昌县嘉德科技发展有限公司 | A kind of spindle processing fixture that can adjust clamping force |
| CN207646310U (en) * | 2017-12-19 | 2018-07-24 | 昆山成功环保科技有限公司 | A kind of wafer electroplating fixture |
| CN109457284A (en) * | 2018-12-27 | 2019-03-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor crystal wafer electroplating clamp |
| CN208847686U (en) * | 2018-09-28 | 2019-05-10 | 广东中京环境监测有限公司 | A kind of inorganic noxious material automatic detection device |
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Patent Citations (4)
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|---|---|---|---|---|
| CN207629609U (en) * | 2017-11-20 | 2018-07-20 | 新昌县嘉德科技发展有限公司 | A kind of spindle processing fixture that can adjust clamping force |
| CN207646310U (en) * | 2017-12-19 | 2018-07-24 | 昆山成功环保科技有限公司 | A kind of wafer electroplating fixture |
| CN208847686U (en) * | 2018-09-28 | 2019-05-10 | 广东中京环境监测有限公司 | A kind of inorganic noxious material automatic detection device |
| CN109457284A (en) * | 2018-12-27 | 2019-03-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor crystal wafer electroplating clamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114075686A (en) * | 2020-08-21 | 2022-02-22 | 江苏澳光电子有限公司 | Convenient and flexible electroplating stable supporting device |
| CN112442722A (en) * | 2020-11-19 | 2021-03-05 | 湖州科峰磁业有限公司 | Electroplating device for manufacturing electronic accessories and using method |
| CN112442722B (en) * | 2020-11-19 | 2022-02-25 | 湖州菱创科技有限公司 | Electroplating device for manufacturing electronic accessories and using method |
| CN113604862A (en) * | 2021-07-29 | 2021-11-05 | 复旦大学 | Safe, reliable and intelligent semiconductor electroplating equipment |
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Application publication date: 20191025 |
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