CN207519027U - 适配卡的散热结构 - Google Patents
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- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
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Abstract
本实用新型公开了一种适配卡的散热结构,主要结构包括复数个设于一适配卡上的散热鳍片、至少一界定于该些散热鳍片一侧且位于该适配卡上的弯折部、至少一界定于各该弯折部之间的空隙部、及至少一界定于该些散热鳍片上的第一穿孔部;如此,透过散热鳍片可使适配卡散热,并且藉由散热鳍片上的空隙部及第一穿孔部可以使空气流通,而加强散热的效果。
Description
技术领域
本实用新型提供了一种适配卡的散热结构,尤其是指一种可使适配卡散热的散热鳍片,且散热鳍片具有通风的功效的适配卡的散热结构。
背景技术
随着科技的发展,人类发展出各式各样的计算器使生活更加便利,最普遍的计算器为几乎家家户户都有计算机,透过计算机人们可以上网查数据吸收知识,并且可以玩游戏、听音乐、或看电影来从事各种娱乐,计算器使人类进入信息***时代,并且改变了人类的生活,然而计算器内具有许多供处理信息并计算的适配卡,当适配卡在运作时,适配卡会产生多余的热量,而当适配卡温度过高时,适配卡便会故障而无法运作,因此人们会在适配卡上设置散热装置,最常见的散热装置便是散热鳍片,散热鳍片一般为金属材质,具有导热系数高的特性,藉由将复数个散热鳍片设置于适配卡上,可将适配卡产生的余热传导至散热鳍片上,并利用复数个散热鳍片增加散热的表面积,而达到快速散热的功效,使适配卡可正常运作。
然而上述散热鳍片于使用时,为确实存在下列问题与缺失尚待改进:
散热鳍片上通常设有可帮助散热的风扇,但是由于散热鳍片的数量越多,其与空气接触的表面积就越大,散热鳍片散热的效率就越高,而过多的散热鳍片却造成计算器体积与重量的增加,使计算器使用上相当不便;人们往往会追求体积小的计算器,碍于空间的限制,因此散热鳍片的设置系为密集并列的态样,如此虽然散热鳍片上设有风扇,但由于散热鳍片之间没有空间使空气流通,散热的效果还是大打折扣。
所以,要如何解决上述现有技术中的问题与缺失,即为本实用新型的申请人与从事此行业之相关厂商所亟欲研究和改善的方向。
实用新型内容
本实用新型的申请人有鉴于上述缺失,乃搜集相关资料,经由多方评估及考虑,并以从事于此行业累积之多年经验,经由不断试作及修改,始设计出此种可使适配卡散热的散热鳍片,且散热鳍片具有通风的功效的适配卡的散热结构的实用新型。
本实用新型之主要目的在于:透过散热鳍片的设计得以使适配卡散热。
本实用新型之再一主要目的在于:透过空隙部的设计,使空气流通于散热鳍片之间,以加速散热。
本实用新型之又一主要目的在于:透过第一穿孔部的设计,使空气流通于散热鳍片之间,以加速散热。
本新型能够达成上述目的的主要结构包括复数个设于一适配卡上之散热鳍片,该些散热鳍片上界定有至少一位于该适配卡上的弯折部,而各该弯折部之间界定有至少一空隙部,且该些散热鳍片上界定有至少一第一穿孔部,当适配卡运作时会产生高温,而藉由散热鳍片上的弯折部可将适配卡上的热量传导至散热鳍片上,并且散热鳍片具有导热系数高的特性,且藉由将复数个散热鳍片并列设置于适配卡上而增加散热鳍片接触空气的表面积,以达到加速散热的效果,而弯折部之间的空隙部及散热鳍片上的第一穿孔部可使空气流通,可利用风扇等工具让受到散热鳍片加热的热空气离开散热鳍片,使冷空气流至散热鳍片上进行热交换,形成空气循环而达到快速散热功效,让适配卡可持续正常运作。
藉由上述技术,可针对现有技术的散热鳍片所存在的无法使空气流通,使受散热鳍片加热的空气与冷空气循环不良,而降低适配卡散热的效率的问题加以突破,达到本新型如上述优点的实用进步性。
附图说明
图1为本实用新型较佳实施例的立体图。
图2为本实用新型较佳实施例的内部结构示意图。
图3为本实用新型较佳实施例的分解图。
图4为本实用新型较佳实施例的另一角度分解图。
图5为本实用新型较佳实施例的实施示意图。
具体实施方式
为达成上述目的、功效和本实用新型所采用之技术手段及构造,兹绘图就本实用新型较佳实施例详加说明其特征与功能如下,以利于本领域技术人员完全了解。
请参阅图1至图4所示,其为本实用新型较佳实施例的立体图至另一角度分解图,由图中可清楚看出本新型系包括:
复数个设于一适配卡4上之散热鳍片1,该散热鳍片1及该适配卡4之间设有至少一导热底板100;
至少一界定于该些散热鳍片1一侧且位于该适配卡4上之弯折部11,而各该弯折部11之间界定有至少一空隙部111,以供空气流通;
至少一界定于该些散热鳍片1上之第一穿孔部12,以供空气流通,并且该些散热鳍片1上界定有至少一第二穿孔部13,且该第二穿孔部13上穿设有至少一导热管体31,以供串接该些散热鳍片1;
至少一设于该些散热鳍片1上之风扇2;及
至少一设于该些散热鳍片1及该适配卡4之间的导热组件3。
请同时配合参阅图1至图5所示,其为本新型较佳实施例的立体图至实施示意图,由图中可清楚看出,藉由上述构件组构时,适配卡4于运作时会产生热量,而适配卡4过热时会故障而无法运作,因此于适配卡4上设置散热鳍片1供适配卡4散热,设于适配卡4上之导热组件3与散热鳍片1系为金属材质,具有导热系数高的特性,且散热鳍片1与导热组件3接触,导热组件3可将适配卡4上的热量快速地传导至散热鳍片1上,并且散热鳍片1及该适配卡4之间设有导热底板100,可藉由直接接触下方的适配卡4将其热量快速的吸收,散热鳍片1上之弯折部11也可使适配卡4上的热量快速地传导至散热鳍片1上,而藉由复数个散热鳍片1并列设置以增加散热鳍片1与空气接触的表面积,以快速地与空气交换热量,而风扇2可使空气循环,使受到散热鳍片1加热的热空气离开散热鳍片1,让冷空气流至散热鳍片1上以加速散热,并且在弯折部11之间具有空隙部111可使空气流通到导热底板100上,而散热鳍片1上之第一穿孔部12也可使空气于散热鳍片1之间流通,可使空气循环效果更好,而加强散热效果,另外,于该第二穿孔部13上穿设有导热管体31,系供串接该些散热鳍片1,而导热管体31也可与空气接触并将散热鳍片1上之热量传导至空气中,而增加散热的功效,使适配卡4可冷却以持续正常运作(本实施例具有导热底板100,若无导热底板100,则空气可透过散热鳍片1上的空隙部111流至适配卡4上,帮助适配卡4散热)。
以上所述仅为本实用新型之较佳实施例而已,非因此即局限本新型之专利范围,故举凡运用本实用新型说明书及图式内容所为之简易修饰及等效结构变化,均应同理包含于本实用新型的保护范围内。
请参阅全部附图所示,本实用新型使用时,与现有技术相较,着实存在下列优点:
透过散热鳍片1的设计得以使适配卡4散热。
透过空隙部111的设计,使空气流通于散热鳍片1之间,以加速散热。
透过第一穿孔部12的设计,使空气流通于散热鳍片1之间,以加速散热。
Claims (8)
1.一种适配卡的散热结构,其特征在于,所述适配卡的散热结构包括:
复数个设于适配卡上的散热鳍片;
至少一界定于所述散热鳍片一侧且位于适配卡上的弯折部;
至少一界定于所述弯折部之间的空隙部,其用于供空气流通;及
至少一界定于所述散热鳍片上的第一穿孔部,其用于供空气流通。
2.如权利要求1所述的适配卡的散热结构,其特征在于,所述散热鳍片上设有至少一风扇。
3.如权利要求1所述的适配卡的散热结构,其特征在于,所述散热鳍片与适配卡之间设有至少一导热组件。
4.如权利要求3所述的适配卡的散热结构,其特征在于,所述导热组件为金属材质。
5.如权利要求1所述的适配卡的散热结构,其特征在于,所述散热鳍片上界定有至少一第二穿孔部。
6.如权利要求5所述的适配卡的散热结构,其特征在于,所述第二穿孔部上穿设有至少一导热管体,其用于供串接所述散热鳍片。
7.如权利要求1所述的适配卡的散热结构,其特征在于,所述散热鳍片为金属材质。
8.如权利要求1所述的适配卡的散热结构,其特征在于,所述散热鳍片与适配卡之间设有至少一导热底板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW106200259U TWM542170U (zh) | 2017-01-06 | 2017-01-06 | 介面卡之散熱結構 |
TW106200259 | 2017-01-06 |
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CN207519027U true CN207519027U (zh) | 2018-06-19 |
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Country | Link |
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US (1) | US10031565B1 (zh) |
JP (1) | JP3214262U (zh) |
KR (1) | KR200490663Y1 (zh) |
CN (1) | CN207519027U (zh) |
DE (1) | DE202017101406U1 (zh) |
TW (1) | TWM542170U (zh) |
Cited By (1)
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CN110164486A (zh) * | 2019-03-27 | 2019-08-23 | 宜鼎国际股份有限公司 | M.2适配卡的散热构造 |
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USD928161S1 (en) * | 2019-03-14 | 2021-08-17 | Cambricon Technologies Corporation Limited | Graphics card |
CN112020266A (zh) * | 2019-05-31 | 2020-12-01 | 中科寒武纪科技股份有限公司 | 多用途散热器及其制造方法、板卡和多用途散热器平台 |
DE102019135060A1 (de) * | 2019-12-19 | 2021-06-24 | Dspace Digital Signal Processing And Control Engineering Gmbh | Mehrzonenkühlkörper für Platinen |
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USD997109S1 (en) * | 2022-10-31 | 2023-08-29 | Dtg Neo Scientific Limited | Graphics card GPU support cooler |
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KR20100039693A (ko) * | 2008-10-08 | 2010-04-16 | 윤령희 | 그래픽카드의 코어 냉각장치 |
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- 2017-03-13 DE DE202017101406.1U patent/DE202017101406U1/de active Active
- 2017-10-11 CN CN201721307542.9U patent/CN207519027U/zh active Active
- 2017-10-19 JP JP2017004777U patent/JP3214262U/ja active Active
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CN110164486A (zh) * | 2019-03-27 | 2019-08-23 | 宜鼎国际股份有限公司 | M.2适配卡的散热构造 |
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US20180196483A1 (en) | 2018-07-12 |
DE202017101406U1 (de) | 2017-03-30 |
JP3214262U (ja) | 2017-12-28 |
TWM542170U (zh) | 2017-05-21 |
US10031565B1 (en) | 2018-07-24 |
KR200490663Y1 (ko) | 2019-12-12 |
KR20190002402U (ko) | 2019-09-27 |
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