CN207282317U - A kind of ceramic electronic components - Google Patents
A kind of ceramic electronic components Download PDFInfo
- Publication number
- CN207282317U CN207282317U CN201721111725.3U CN201721111725U CN207282317U CN 207282317 U CN207282317 U CN 207282317U CN 201721111725 U CN201721111725 U CN 201721111725U CN 207282317 U CN207282317 U CN 207282317U
- Authority
- CN
- China
- Prior art keywords
- identification layer
- ceramic
- electronic components
- ceramic electronic
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of ceramic electronic components are the utility model is related to, belong to field of electrical components.The ceramic electronic components of the utility model include ceramic body, termination electrode and at least one patterning identification layer, and the identification layer is arranged in the ceramic body and is parallel to each other or in the first side of the ceramic body and/or in second side with the first side of the ceramic body and second side.The ceramic electronic components of the utility model are by setting identification layer so that even if the width and thickness of ceramic electronic components are close to the degree for being difficult to differentiate from appearance, each side of ceramic electronic components is also easily identified.
Description
Technical field
The present invention relates to a kind of ceramic electronic components, belong to field of electrical components.
Background technology
When ceramic electronic components are designed to width and thickness is close to when being difficult to from the degree that appearance is differentiated, it is carried out
When metallographic cuts open piece analysis, there is the problem of being difficult to each side of ceramic body so as to which required viewing surface cannot be obtained exactly,
Especially for the sample for having enclosed termination electrode, since two end faces of electrode in exposure are covered by termination electrode, to identify
The each side of ceramic body is more difficult.
Furthermore when by such ceramic electronic components tape package, also because failing to identify each side of ceramic body,
Cause ceramic electronic components with different orientation positions by braid, as a result client is in use, electric within some ceramic electronic components
Pole is mounted on wiring board parallel to the mode of wiring board, some ceramic electronic components then within electrode perpendicular to wiring board
Mode is mounted on wiring board, causes the performance of ceramic electronic components inconsistent.
Utility model content
The purpose of the utility model is to overcome provide a kind of each side in place of above-mentioned the deficiencies in the prior art and be easy to
The ceramic electronic components of identification.
To achieve the above object, the technical solution of the utility model solution technical problem is：A kind of ceramic electronic components, its
Including ceramic body, termination electrode and at least one patterning identification layer, the ceramic body is cuboid, and the ceramic body includes mutual
Opposed first side and second side, the 3rd mutually opposing side and the 4th side and mutually opposing first end face and
Second end face；The first side and second side and the thickness direction of the ceramic body are perpendicular, the 3rd side and
Four sides and the width of the ceramic body are perpendicular, the first end face and second end face and the length side of the ceramic body
To perpendicular；
The termination electrode is respectively arranged in the first end face and second end face；The identification layer is arranged in the ceramic body
And be parallel to each other with the first side of the ceramic body and second side or in the first side of the ceramic body and/or
In second side.
The ceramic electronic components of the utility model are equipped with identification layer, and identification layer carries pattern, accordingly even when ceramic electrical sub-portion
The width and thickness of part are close to the degree for being difficult to differentiate from appearance, and each side of ceramic electronic components is also easily identified.
When cuing open piece analysis to ceramic electronic components progress metallographic, required viewing surface can be identified exactly using light microscope.And incite somebody to action
During ceramic electronic components tape package, it can be identified using optically screening machine and screen out the inconsistent ceramic electrical sub-portion of positioning orientating
Part, ensures ceramic electronic components with unified orientation positions by braid.
Further, the identification layer has the pattern that metal paste printing forms.Wherein, print and silk-screen printing may be selected
Technique.Metal paste with ceramic material cofiring, can adapt to the preparation process of ceramic electronic components.
Further, the metal in the metal paste is nickel, copper, monel, silver, palladium or silver palladium alloy.These gold
Belong to or its alloy can match different ceramic materials, adapt to variety classes or the ceramic electronic components of different performance requirement.Into
One step, the identification layer is 1 or 2.
Further, the identification layer is 1, and the identification layer and the distance of the first side or second side are
0.8 μm~2 μm.
Further, the identification layer is 2, respectively the first identification layer and the second identification layer, first identification layer
Than second identification layer closer to the first side, the distance of first identification layer and the first side and described
Second identification layer and the distance of the second side are 0.8 μm~2 μm；Or first identification layer and second identification
Layer and the distance of the first side are 0.8 μm~2 μm.
In the case where the distance of identification layer and first side and/or second side is 0.8 μm~2 μm, identification layer energy
Enough show through first side and/or second side and compare clearly image, identification ceramic electronic components of being so more convenient for
Each side.
Further, the identification layer be arranged on the ceramic body in and with the first side and second side of the ceramic body
It is parallel to each other, when the identification layer is 1, it exposes at least one in the 3rd side and the 4th side at least one
A side；It is respectively the first identification layer and the second identification layer when the identification layer is 2, first identification layer and described the
Gap is formed between four sides, and the 3rd side is exposed at first identification layer at least one, second identification
Gap is formed between layer and the 3rd side, and the 4th side is exposed at second identification layer at least one.By
It is more prone to identified in the surface exposed of ceramic body, each side of ceramic electronic components in identification layer.
Further, the ceramic electronic components further include protective layer, and the protective layer is coated on the outer of the identification layer
Surface.Since identification layer exposes to the surface of ceramic body, moisture invades the inside of ceramic body easily by identification layer exposed section,
Identification layer is arranged on to the inside of protective layer, can so avoid the reliability decrease of ceramic electronic components.
Further, the ceramic electronic components further include interior electrode, the interior electrode be arranged in the ceramic body and with
The first side and second side are parallel to each other, between being respectively formed between the interior electrode and the 3rd side and the 4th side
Gap；Dielectric layer is equipped between the interior electrode.Electrode in setting, can be conveniently adjusted the capacitance of ceramic electronic components,
Be conducive to prepare the ceramic electronic components of high power capacity.
Further, the interior electrode is made of electrode in multiple first and multiple the second inner electrodes, electric in described first
Pole and the second inner electrode are arranged alternately in the ceramic body, and electrode has in the first end face in described first draws side simultaneously
And gap is formed with the second end face, the second inner electrode has in the second end face draws side and with described first
End face forms gap.
The preparation method of the ceramic electronic components of the utility model comprises the following steps：
Prepare ceramic membrane；
Prepare identification layer；
Ceramic membrane poststack is obtained into first cascade substrate；
An identification layer is laminated respectively in the opposite sides of first cascade substrate, obtains the second multilayer board；
A ceramic membrane is laminated respectively in the opposite sides of the second multilayer board, obtains ceramic substrate；
Cut after ceramic substrate is pressed, obtain ceramic green；
Row is carried out to ceramic green to glue and sinter, and obtains ceramic body；
By ceramic body chamfer grinding；
The first end face of the ceramic body after chamfer grinding and second end face enclose two external electrodes respectively, obtain ceramic electrical
Subassembly.
Compared with prior art, the beneficial effects of the utility model are：
1st, the ceramic electronic components of the utility model are by setting identification layer so that though the width of ceramic electronic components and
Thickness is close to the degree for being difficult to differentiate from appearance, and each side of ceramic electronic components is also easily identified.
2nd, the utility model is 0.8 μm~2 μm by adjusting the distance of identification layer and first side and/or second side
Or identification layer is exposed to the surface of ceramic body so that each side of ceramic electronic components is more prone to identified.
3rd, identification layer is arranged on the inside of protective layer by the utility model, can so avoid the reliable of ceramic electronic components
Property decline.
Brief description of the drawings
Fig. 1 is the outside drawing of the utility model ceramic electronic components；
Fig. 2 is the dimensional structure diagram of ceramic electronic components described in embodiment 1；
Fig. 3 is the profile that the ceramic electronic components of Fig. 2 are observed along I-I direction；
Fig. 4 is the profile of ceramic electronic components described in embodiment 4；
Fig. 5 is the dimensional structure diagram of ceramic electronic components described in embodiment 5；
Fig. 6 is the dimensional structure diagram of ceramic electronic components described in embodiment 6；
Fig. 7 is the profile of ceramic electronic components described in embodiment 6；
Fig. 8 is the dimensional structure diagram of ceramic electronic components described in embodiment 7；
Fig. 9 is the profile of ceramic electronic components described in embodiment 7；
Figure 10 is the profile of ceramic electronic components described in embodiment 8 (identification layer is arranged in protective layer)；
For ceramic electronic components described in embodiment 8, (identification layer is arranged on electrode and the second inner electrode in adjacent first to Figure 11
Between) profile；
Figure 12 for ceramic electronic components described in embodiment 8 (identification layer with one of them in first electrode or one of them the
Electrode is located on same dielectric layer in two) profile.
In figure, 1 is first side, and 2 be second side, and 3 be the 3rd side, and 4 be the 4th side, and 5 be first end face, and 6 are
Second end face, 10 be ceramic body, and 101 be electrode in first, and 102 be the second inner electrode, and 201 be the first identification layer, and 202 be second
Identification layer, 31 be the first termination electrode, and 32 be the second termination electrode.
Embodiment
For the purpose of this utility model, technical solution and advantage is better described, below in conjunction with attached drawing and specific implementation
The utility model is described in further detail for example.
Embodiment 1
As shown in Figure 1, Figure 2 and Figure 3, a kind of ceramic electronic components of the utility model embodiment, including ceramic body 10, end
Electrode and at least one patterning identification layer, ceramic body 10 are cuboid, and ceramic body 10 includes mutually opposing 1 He of first side
Second side 2, the 3rd mutually opposing side 3 and the 4th side 4 and mutually opposing first end face 5 and second end face 6；The
One side 1 and second side 2 and the thickness direction of ceramic body 10 are perpendicular, the 3rd side 3 and the 4th side 4 and ceramic body 10
Width is perpendicular, and first end face 5 and second end face 6 and the length direction of ceramic body 10 are perpendicular；The termination electrode is two
It is a, it is respectively the first termination electrode 31 and the second termination electrode 32, the first termination electrode 31 is arranged in first end face 5, the second termination electrode 32
In second end face 6；Identification layer is arranged in ceramic body 10 and is mutually put down with the first side 1 of ceramic body 10 and second side 2
OK, and between identification layer and first end face 5 and second end face 6 it is respectively formed gap.
Above-mentioned ceramic electronic components are equipped with identification layer, and identification layer carries pattern, accordingly even when the width of ceramic electronic components
The degree for being difficult to differentiate from appearance is close to thickness, each side of ceramic electronic components is also easily identified.To ceramic electrical
When subassembly progress metallographic cuts open piece analysis, required viewing surface can be identified exactly using light microscope.And by ceramic electronic
During component tape package, it can be identified using optically screening machine and screen out the inconsistent ceramic electronic components of positioning orientating, ensured
Ceramic electronic components are with unified orientation positions by braid.
It should be noted that identification layer between first end face and second end face it is not necessary to be respectively formed gap.Identification layer
Also it can draw from end face and be connected with termination electrode.
Preferably, identification layer has the pattern that metal paste printing forms.Wherein, print and silk-screen printing technique may be selected.
Metal paste with ceramic material cofiring, can adapt to the preparation process of ceramic electronic components.
Preferably, the metal in metal paste is nickel, copper, monel, silver, palladium or silver palladium alloy.These metals or its
Alloy can match different ceramic materials, adapt to variety classes or the ceramic electronic components of different performance requirement.Certainly, it is described
Metal or its alloy are preferred metal, but in metal paste metal selection not limited to this.
Preferably, identification layer is 2, respectively the first identification layer 201 and the second identification layer 202,201 He of the first identification layer
Second identification layer 202 is with the 3rd side 3 and the 4th side 4 formed with gap；First identification layer, 201 to the second identification layer 202
Closer to first side 1, the first identification layer 201 and the distance of first side 1 and the second identification layer 202 and second side 2
Distance is 0.8 μm~2 μm.The shape of first identification layer 201 and the second identification layer 202 is not particularly limited.First identification layer
201 with the distance of first side 1 be 0.8 μm~2 μm, and the distance of the second identification layer 202 and second side 2 is 0.8 μm~2 μm,
Compare clearly image so as to which the first identification layer 201 can be showed through the first side 1 of ceramic body 10, the second identification layer 202
It can be showed through the second side 2 of ceramic body 10 and compare clearly image, each side for identification ceramic electronic components of being more convenient for
Face.
Preferably, the first termination electrode 31 covering first end face 5, the second termination electrode 32 covering second end face 6.Preferably,
One termination electrode 31 is also extended a distance into the bending of first side 1, second side 2, the 3rd side 3 and the 4th side 4 respectively, the
Two termination electrodes 32 are also extended a distance into the bending of first side 1, second side 2, the 3rd side 3 and the 4th side 4 respectively, such as
This is easy to be welded to ceramic electronic components on wiring board, and the connection of ceramic electronic components and wiring board is relatively more firm.The
Formed with gap so as to mutually insulated between one termination electrode 31 and the second termination electrode 32.
The preparation method of the ceramic electronic components of the present embodiment is：
Step 1, prepare ceramic membrane
In the present embodiment, ceramic powder, adhesive, organic solvent are obtained into ceramic slurry after mixing, with ceramic slurry
Expect ceramic membrane is prepared for raw material.
Preferably, ceramic powder, adhesive, organic solvent are uniformly mixed by the way of ball milling to obtain ceramic slurry.Into
One step, time of ball milling for 12 it is small when~16 it is small when.
Preferably, ceramic powder, adhesive, the mass ratio of organic solvent are 10：3~5：4~9.
Ceramic powder can be barium titanate powder, zirconic acid calcium powder, magnesium titanate powder etc., but not limited to this.
Further, adhesive is polyvinyl butyral resin, and organic solvent is that mass ratio is 1:1~2:1 toluene and second
The mixed solvent of alcohol.
Preferably, ceramic slurry is cast to form ceramic membrane using the tape casting.
Preferably, the thickness of ceramic membrane is 1 μm~60 μm.
Step 2, prepare identification layer
Metal paste is printed on the ceramic membrane that step 1 obtains and forms identification layer pattern, obtains printing after drying insighted
The ceramic membrane of other layer pattern.
Metal in metal paste can be nickel, copper, monel, silver, palladium or silver palladium alloy, but not limited to this；Printing
Select silk-screen printing technique.
Step 3, by ceramic film poststack obtain first cascade substrate
Multiple ceramic membranes are laminated by predetermined quantity, obtain first cascade substrate.Generally, the ceramic membrane quantity of stacking
It can be 4~500.
Step 4, first cascade substrate opposite sides be laminated respectively one be printed with identification layer pattern ceramic membrane, obtain
To the second multilayer board
A ceramic membrane for being printed with identification layer pattern is laminated respectively in the opposite sides of first cascade substrate, obtains second
Multilayer board.The ceramic membrane for being printed with identification layer pattern is contacted with the side of no identification layer pattern with first cascade substrate, is made
Identification layer pattern is located in the both side surface of the second multilayer board.
Step 5, in the opposite sides of the second multilayer board be laminated a ceramic membrane respectively, obtains ceramic substrate
A ceramic membrane is laminated respectively in the opposite sides of the second multilayer board, and identification layer pattern is completely covered, is obtained
Ceramic substrate.The thickness of the ceramic membrane of stacking is 1 μm~2.5 μm.In other implementations, wet method work can also be used
Ceramic slurry, the opposite sides of the second multilayer board is formed in by the method for silk-screen printing by skill, and covering the is formed after drying
The ceramic layer of the opposite sides of two multilayer boards, obtains ceramic substrate.
Step 6, cut after ceramic substrate is pressed, and obtains ceramic green
Ceramic substrate is fixed and is pressed on stainless steel with isostatic pressing method, each layer ceramic membrane in ceramic substrate is closely glued
Connect；Then preliminary dimension ceramic cutting substrate in length and breadth is pressed, ceramic substrate is cut to the ceramic green of multiple independent cuboid shapes
Base.There is identification layer pattern inside ceramic green, identify that each surface of layer pattern and ceramic green is each formed with gap.
Step 7, carry out ceramic green to arrange viscous and sintering, obtains ceramic body
Ceramic green arrange in viscous and sintering operation, arranging viscous detailed process is：Under air atmosphere, by ceramics
Green compact be heated to 260 DEG C~450 DEG C and keep the temperature 2 it is small when~4 it is small when to exclude adhesive；Or under protective gas atmosphere,
By ceramic green be heated to 400 DEG C~600 DEG C and keep the temperature 3 it is small when~6 it is small when to exclude adhesive.
Protective gas can be nitrogen, argon gas or helium.
Ceramic green arrange in viscous and sintering operation, the detailed process of sintering is：Under air atmosphere or
Under reducibility gas atmosphere, by arrange it is viscous after ceramic green be heated to 900 DEG C~1320 DEG C and keep the temperature 1 it is small when~4 it is small when carry out
Sinter, ceramic body is obtained after the completion of sintering.Wherein, ceramic membrane is formed as ceramic dielectric through sintering, and identification layer pattern is through sintering shape
As identification layer.
Reducibility gas can be the mixed gas of nitrogen and hydrogen, wherein, the volume ratio of hydrogen and nitrogen is 0.1~3：
100。
Step 8, by ceramic body chamfer grinding
Using planetary mills or the method for barreling by ceramic body chamfer grinding, so that the corner of ceramic body becomes more round and smooth,
Chamfer grinding can use one or more of conducts among alumina balls, quartz sand, alumina powder, carborundum powder, tap water
Grind medium.
Step 9, the respectively first end face of the ceramic body after chamfer grinding and second end face enclose two external electrodes, obtain
Ceramic electronic components
The step is specially：First end face and second end face coated copper metal paste in ceramic body, silver metal slurry respectively
Material or silver palladium alloy metal paste, then the sintered copper metal paste under protective gas atmosphere, or burnt under air atmosphere
Silver metal slurry or silver palladium alloy metal paste are tied, sintering temperature can be 700 DEG C~900 DEG C, and soaking time can be 10 points
Clock~12 minute, form two external electrodes of the first end face for being adhering closely to ceramic body respectively and second end face after sintering, obtain
To ceramic electronic components.
Protective gas can be nitrogen, argon gas or helium.
The preparation method of above-mentioned ceramic electronic components, technique is simple, is adapted to large-scale production.
Embodiment 2
A kind of ceramic electronic components of the utility model embodiment, its it is different from the ceramic electronic components of embodiment 1 it
Place is only that：In the present embodiment, the first identification layer 201 and the second identification layer 202 and the distance of the first side 1 of ceramic body 10 are equal
For 0.8 μm~2 μm.First identification layer 201 and the second identification layer 202 can be identical with the distance of the first side 1 of ceramic body 10,
Can not also be identical.First identification layer 201 and the second identification layer 202 and the distance of the second side 2 of ceramic body 10 be not special
Limitation.
Embodiment 3
A kind of ceramic electronic components of the utility model embodiment, its it is different from the ceramic electronic components of embodiment 1 it
Place is only that：In the present embodiment, identification layer is 1, the distance of identification layer and first side 1 or second side 2 for 0.8 μm~
2μm。
Embodiment 4
As shown in figure 4, a kind of ceramic electronic components of the utility model embodiment, its ceramic electrical sub-portion with embodiment 1
Part the difference is that only：In the present embodiment, the ceramic electronic components further include interior electrode, and interior electrode is arranged on ceramic body 10
It is interior and be parallel to each other with first side 1 and second side 2, between being respectively formed between interior electrode and the 3rd side 3 and the 4th side 4
Gap；Dielectric layer is equipped between the interior electrode.Dielectric layer is set between interior electrode, so that interior electrode is spaced.
Preferably, dielectric layer is made of ceramic dielectric.
Preferably, the interior electrode is made of electrode 101 in multiple first and multiple the second inner electrodes 102, electric in first
Pole 101 and the second inner electrode 102 are arranged alternately in ceramic body 10, and electrode 101 has in first end face 5 in first draws side simultaneously
And gap is formed with second end face 6, the second inner electrode 102 has in second end face 6 draws side and between the formation of first end face 5
Gap.
First termination electrode 31 covers first end face 5, the second termination electrode 32 covering second end face 6, so that the first termination electrode 31
With first in electrode 101 connect, the second termination electrode 32 and the second inner electrode 102 connect, and form the structure of multiple capacitance parallel connections, adjust
Save the quantity of electrode 101 and the second inner electrode 102 in first, the right opposite in first between electrode 101 and the second inner electrode 102
Spacing in product and first between electrode 101 and the second inner electrode 102, can be conveniently adjusted the capacitance of ceramic electronic components
Amount, is also beneficial to prepare the ceramic electronic components of high power capacity.
It is appreciated that in order to make ceramic electronic components meet different characteristic requirements, electricity in electrode 101 and second in first
The quantity of pole 102 is not particularly limited, and can there was only electrode 101 in first in ceramic body 10, can also be only in ceramic body sheet 10
There is the second inner electrode 102；Electrode 101 and the second inner electrode 102 can not be drawn in any surface of ceramic body 10 in first.
The preparation method of the ceramic electronic components of the present embodiment and the preparation method of the ceramic electronic components of embodiment 1 are not
It is with part：Electricity in being formed on ceramic membrane need to be increased before the step 3 of the preparation method of 1 ceramic electronic components of embodiment
The step of pole figure case.The step is specially：Metal paste is printed on the ceramic membrane that step 1 obtains to electrode pattern in being formed,
Obtain being printed with the ceramic membrane of interior electrode pattern after drying, interior electrode pattern step 7 formed after sintering in first electrode and
The second inner electrode.Wherein, the metal in metal paste can be nickel, copper, monel, silver, palladium or silver palladium alloy, but be not limited to
This；Printing selection silk-screen printing technique.Preferably, electrode pattern uses identical metal pulp with printing identification layer pattern in printing
Material, such preparation process are fairly simple.
In addition, in the present embodiment, step 3 is different from embodiment 1, and difference is：Will be multiple by predetermined quantity
The ceramic membrane stacking of interior electrode pattern is printed with, obtains first cascade substrate.Step 3 can also be will be multiple by predetermined quantity
The ceramic membrane stacking of interior electrode pattern is printed with, obtains lamination unit, then distinguishes layer on two opposite surfaces of lamination unit
Folded multiple ceramic membranes are covered each by two protective layers of two opposite sides of lamination unit to be formed, and form protective layer, stacking
The structure that unit and protective layer stack gradually, obtains first cascade substrate.Protective layer can improve the moisture-proof of ceramic electronic components
Ability and reliability.Protective layer is laminated to obtain for 1~30 ceramic membranes.
Embodiment 5
As shown in figure 5, a kind of ceramic electronic components of the utility model embodiment, its ceramic electrical sub-portion with embodiment 1
Part the difference is that only：In the present embodiment, identification layer is located at the surface of ceramic body 10, i.e. the first identification layer 201 is arranged on pottery
In the first side 1 of porcelain body 10, the second identification layer 202 is arranged in the second side 2 of ceramic body 10.Such then ceramic electronic components
Each side be more prone to identified.
It is noted that when identification layer is located at the surface of ceramic body, identification layer is not covered preferably by termination electrode, to prevent from knowing
Other layer is invisible.
The preparation method of the ceramic electronic components of the present embodiment and the preparation method of the ceramic electronic components of embodiment 1 are not
It is with part：Step 5 can be omitted in the preparation method of the ceramic electronic components of embodiment 1, and step 6 then makes into the second layer
Cut after laminated substrate pressing, obtain ceramic green；Or the preparation method of the ceramic electronic components of the present embodiment is adjusted to following
Step (detailed process of each step no longer Ao Shu)：
Step 1, prepare ceramic membrane；
Step 2, by ceramic film poststack obtain first cascade substrate；
Step 3, form identification layer pattern on first cascade substrate；
Step 4, will cut after the first cascade substrate pressing formed with identification layer pattern, obtain ceramic green；
Step 5, carry out ceramic green to arrange viscous and sintering, obtains ceramic body；
Step 6, by ceramic body chamfer grinding；
Step 7, the respectively first end face of the ceramic body after chamfer grinding and second end face enclose two external electrodes, obtain
Ceramic electronic components.
It is the method using silk-screen printing that identification layer pattern is formed on first cascade substrate, can be by first cascade base
Carry out, can also be carried out after by the pressing of first cascade substrate before plate pressing, can also be by first cascade substrate cut
Carry out afterwards；It can also be formed on the ceramic body that sintering obtains using the method for silk-screen printing and identify layer pattern, and according to
Need that double sintering can be carried out, identification layer is combined with ceramic body more firm.
Embodiment 6
As shown in Figure 6 and Figure 7, a kind of ceramic electronic components of the utility model embodiment, its ceramic electrical with embodiment 1
Subassembly the difference is that only：In the present embodiment, gap, and first are formed between the first identification layer 201 and the 4th side 4
The 3rd side 3 is exposed at identification layer 201 at least one, gap, and are formed between the second identification layer 202 and the 3rd side 3
The 4th side 4 is exposed at two identification layers 202 at least one.First identification layer 201 and first side 1 and second side 2 away from
From not limiting, the second identification layer 202 is not limited with the distance of first side 1 and second side 2.Due to the first identification layer
201 and second identification layer 202 it is exposed in surface of ceramic body, each side of ceramic electronic components is more prone to identified.
Embodiment 7
As shown in Figure 8 and Figure 9, a kind of ceramic electronic components of the utility model embodiment, its ceramic electrical with embodiment 1
Subassembly the difference is that only：In the present embodiment, identification layer is 1, it exposes to the 3rd side 3 and the at least one
At least one side in four sides 4, identification layer are not limited with the distance of first side 1 and second side 2.
Embodiment 8
As shown in Figure 10, a kind of ceramic electronic components of the utility model embodiment, its ceramic electrical sub-portion with embodiment 6
Part the difference is that only：In the present embodiment, the ceramic electronic components further include interior electrode, and interior electrode is arranged on ceramic body 10
It is interior and be parallel to each other with first side 1 and second side 2, between being respectively formed between interior electrode and the 3rd side 3 and the 4th side 4
Gap；Dielectric layer is equipped between the interior electrode.
Preferably, dielectric layer is made of ceramic dielectric.
Preferably, the interior electrode is made of electrode 101 in multiple first and multiple the second inner electrodes 102, electric in first
Pole 101 and the second inner electrode 102 are arranged alternately in ceramic body 10, and electrode 101 has in first end face 5 in first draws side simultaneously
And gap is formed with second end face 6, the second inner electrode 102 has in second end face 6 draws side and between the formation of first end face 5
Gap.
The ceramic electronic components of the present embodiment further include protective layer, and the protective layer is coated on the outer surface of identification layer.By
The surface of ceramic body 10 is exposed in identification layer, moisture invades the inside of ceramic body 10 easily by identification layer exposed section, knows
Other layer is arranged on the reliability decrease that ceramic electronic components can be avoided inside protective layer.It is of course also possible to it is located at identification layer
In adjacent first between electrode 101 and the second inner electrode 102, as shown in figure 11；Can also make identification layer with one of them the
Electrode 101 or one of the second inner electrode 102 are located on same layer dielectric layer in one, as shown in figure 12.
When identification layer and one of them be located at same layer ceramic for electrode 101 or one of the second inner electrode 102 in first
When on medium, identification layer pattern can be printed in first with one of them together with electrode 101 or one of the second inner electrode 102
Otherwise identification layer pattern can be individually printed on a ceramic membrane by brush on same ceramic membrane.
The utility model can be applied in the ceramic electrical sub-portion such as chip ceramic capacitor, chip inductor, type piezoresistor
Part.
Finally, it should be noted that above example is only illustrating the technical solution of the utility model rather than to this reality
With the limitation of novel protected scope, although being explained in detail with reference to preferred embodiment to the utility model, this area it is common
It will be appreciated by the skilled person that can be to the technical solution of the utility model technical scheme is modified or replaced equivalently, without departing from this reality
With the spirit and scope of new technique scheme.
Claims (10)
- A kind of 1. ceramic electronic components, it is characterised in that：Including ceramic body, termination electrode and at least one patterning identification layer, institute It is cuboid to state ceramic body, and the ceramic body includes mutually opposing first side and second side, the 3rd mutually opposing side Face and the 4th side and mutually opposing first end face and second end face；The first side and second side and the ceramics The thickness direction of body is perpendicular, and the 3rd side and the 4th side and the width of the ceramic body are perpendicular, and described End face and second end face and the length direction of the ceramic body are perpendicular；The termination electrode is respectively arranged in the first end face and second end face；The identification layer be arranged on the ceramic body in and with The first side and second side of the ceramic body are parallel to each other or in the first sides of the ceramic body and/or second On side.
- 2. ceramic electronic components as claimed in claim 1, it is characterised in that：There is the identification layer metal paste printing to form Pattern.
- 3. ceramic electronic components as claimed in claim 2, it is characterised in that：Metal in the metal paste is nickel, copper, nickel Copper alloy, silver, palladium or silver palladium alloy.
- 4. ceramic electronic components as claimed in claim 1, it is characterised in that：The identification layer is 1 or 2.
- 5. ceramic electronic components as claimed in claim 4, it is characterised in that：The identification layer is 1, the identification layer and institute The distance for stating first side or second side is 0.8 μm~2 μm.
- 6. ceramic electronic components as claimed in claim 4, it is characterised in that：The identification layer is 2, is respectively the first identification Layer and the second identification layer, first identification layer are identified than second identification layer closer to the first side, described first Layer is 0.8 μm~2 μm with the distance of the first side and second identification layer and the distance of the second side；Or First identification layer described in person and second identification layer and the distance of the first side are 0.8 μm~2 μm.
- 7. ceramic electronic components as claimed in claim 4, it is characterised in that：The identification layer be arranged on the ceramic body in and with The first side and second side of the ceramic body are parallel to each other, and when the identification layer is 1, it exposes to institute at least one State at least one side in the 3rd side and the 4th side；It is respectively the first identification layer and second when the identification layer is 2 Identification layer, forms gap between first identification layer and the 4th side, and at first identification layer at least one outside The 3rd side is exposed to, gap is formed between second identification layer and the 3rd side, and second identification layer is extremely The 4th side is exposed at rare one.
- 8. ceramic electronic components as claimed in claim 7, it is characterised in that：The ceramic electronic components further include protective layer, The protective layer is coated on the outer surface of the identification layer.
- 9. ceramic electronic components as claimed in claim 1, it is characterised in that：The ceramic electronic components further include interior electrode, The interior electrode is arranged in the ceramic body and is parallel to each other with the first side and second side, the interior electrode with it is described Gap is respectively formed between 3rd side and the 4th side；Dielectric layer is equipped between the interior electrode.
- 10. ceramic electronic components as claimed in claim 9, it is characterised in that：The interior electrode by electrode in multiple first and Multiple the second inner electrodes form, and electrode and the second inner electrode are arranged alternately in the ceramic body in described first, and described first Interior electrode has extraction side in the first end face and forms gap with the second end face, and the second inner electrode is described Second end face, which has, draws side and forms gap with the first end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721111725.3U CN207282317U (en) | 2017-08-31 | 2017-08-31 | A kind of ceramic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721111725.3U CN207282317U (en) | 2017-08-31 | 2017-08-31 | A kind of ceramic electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207282317U true CN207282317U (en) | 2018-04-27 |
Family
ID=61989625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721111725.3U Active CN207282317U (en) | 2017-08-31 | 2017-08-31 | A kind of ceramic electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207282317U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459402A (en) * | 2019-08-28 | 2019-11-15 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN110504104A (en) * | 2019-08-28 | 2019-11-26 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN110504103A (en) * | 2019-08-28 | 2019-11-26 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN110534343A (en) * | 2019-08-28 | 2019-12-03 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN111446079A (en) * | 2020-04-10 | 2020-07-24 | 肇庆市安捷电子有限公司 | Internal electrode slurry and internal electrode layer for preparing multilayer ceramic capacitor |
| US11430607B2 (en) * | 2020-05-20 | 2022-08-30 | Tdk Corporation | Ceramic electronic component |
-
2017
- 2017-08-31 CN CN201721111725.3U patent/CN207282317U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459402A (en) * | 2019-08-28 | 2019-11-15 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN110504104A (en) * | 2019-08-28 | 2019-11-26 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN110504103A (en) * | 2019-08-28 | 2019-11-26 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN110534343A (en) * | 2019-08-28 | 2019-12-03 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor |
| CN111446079A (en) * | 2020-04-10 | 2020-07-24 | 肇庆市安捷电子有限公司 | Internal electrode slurry and internal electrode layer for preparing multilayer ceramic capacitor |
| US11430607B2 (en) * | 2020-05-20 | 2022-08-30 | Tdk Corporation | Ceramic electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207282317U (en) | A kind of ceramic electronic components | |
| US8105453B2 (en) | Method for producing multilayer ceramic substrate | |
| KR100344923B1 (en) | Hybrid Laminate and Manufacturing Method Thereof | |
| EP0285873A2 (en) | Method of producing a multi-layered ceramic capacitor | |
| JPH09260206A (en) | Laminated capacitor | |
| CN107645879A (en) | A kind of ceramic electronic components and preparation method thereof | |
| JPH08236393A (en) | Manufacture of laminated ceramic capacitor | |
| CN207151029U (en) | A kind of ceramic electronic components | |
| JP2857552B2 (en) | Multilayer electronic component and method of manufacturing the same | |
| JPH11354370A (en) | Layered ceramic electronic parts | |
| CN207151010U (en) | A kind of ceramic electronic components | |
| JP2002343674A (en) | Manufacturing method of laminated ceramic capacitor | |
| JP2007053294A (en) | Process for manufacturing multilayer ceramic electronic component | |
| JP3744469B2 (en) | Conductive paste | |
| JP2000269074A (en) | Multilayer ceramic capacitor and manufacture thereof | |
| CN107690247A (en) | A kind of ceramic electronic components and preparation method thereof | |
| CN103200507B (en) | Manufacturing method of multi-layer piezoelectric loudspeaker oscillator and multi-layer piezoelectric loudspeaker oscillator | |
| JP3498200B2 (en) | Multilayer ceramic composite parts | |
| CN206076052U (en) | Chip is combined components and parts | |
| JPS5917227A (en) | Method of producing composite laminated ceramic part | |
| CN112071642B (en) | Preparation method of multilayer ceramic capacitor | |
| JP4610185B2 (en) | Wiring board and manufacturing method thereof | |
| JP2005268290A (en) | Multilayer ceramic electronic component and its production process | |
| CN206312768U (en) | Chip is combined component | |
| JPH1126279A (en) | Manufacture of laminated ceramic electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |