CN207151010U - A kind of ceramic electronic components - Google Patents
A kind of ceramic electronic components Download PDFInfo
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- CN207151010U CN207151010U CN201721111708.XU CN201721111708U CN207151010U CN 207151010 U CN207151010 U CN 207151010U CN 201721111708 U CN201721111708 U CN 201721111708U CN 207151010 U CN207151010 U CN 207151010U
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Abstract
A kind of ceramic electronic components are the utility model is related to, belong to field of electrical components.Ceramic electronic components of the present utility model include ceramic body, and the ceramic body is cuboid, and it includes mutually opposing first side and second side, the 3rd mutually opposing side and the 4th side and mutually opposing first end face and second end face；The first side and second side and the thickness direction of the ceramic body are perpendicular, and the 3rd side and the 4th side and the width of the ceramic body are perpendicular, and the first end face and second end face and the length direction of the ceramic body are perpendicular；Seamed edge on any one length direction of the ceramic body is provided with groove, and the depth in section of the groove on two sides where it differs；Or it is all provided with the seamed edge on two articles of length directions of the first side or the 3rd side fluted.Ceramic electronic components of the present utility model on the seamed edge of ceramic body by setting groove so that its each side is easily identified.
Description
Technical field
A kind of ceramic electronic components are the utility model is related to, belong to field of electrical components.
Background technology
When ceramic electronic components are designed to width and thickness is close to when being difficult to from the degree that outward appearance is differentiated, it is carried out
When metallographic cuts open piece analysis, the problem of being difficult to each side of ceramic body so as to which required sightingpiston can not be obtained exactly be present,
Especially for the sample for having enclosed termination electrode, by two end faces of electrode in exposure are covered by termination electrode, to identify
The each side of ceramic body is more difficult.
Furthermore when by such ceramic electronic components tape package, also because failing to identify each side of ceramic body,
Cause ceramic electronic components with different orientation positions by braid, as a result client is in use, electric within some ceramic electronic components
Pole is mounted on wiring board parallel to the mode of wiring board, some ceramic electronic components then within electrode perpendicular to wiring board
Mode is mounted on wiring board, causes the performance of ceramic electronic components inconsistent.
Utility model content
The purpose of this utility model is to overcome in place of above-mentioned the deficiencies in the prior art and to provide a kind of each side easy
Identified ceramic electronic components.
To achieve the above object, the technical scheme that the utility model is taken is:A kind of ceramic electronic components, it includes ceramics
Body, the ceramic body are cuboid, it include mutually opposing first side and second side, the 3rd mutually opposing side and
4th side and mutually opposing first end face and second end face；The first side and second side and the ceramic body
Thickness direction is perpendicular, and the 3rd side and the 4th side and the width of the ceramic body are perpendicular, the first end
Face and second end face and the length direction of the ceramic body are perpendicular；
Seamed edge on any one length direction of the ceramic body is provided with groove, and the groove where it two
The depth in the section on individual side differs；
Or it is all provided with the seamed edge on two articles of length directions of the first side or the 3rd side fluted.
Ceramic electronic components of the present utility model, the seamed edge on the length direction of its ceramic body are provided with groove, so i.e.
The width of ceramic electronic components and thickness is set to be close to the degree for being difficult to differentiate from outward appearance, each side of ceramic electronic components
It is easily identified.When cuing open piece analysis to ceramic electronic components progress metallographic, it can be identified exactly using light microscope required
Sightingpiston.And during by ceramic electronic components tape package, it can be identified using optically screening machine and to screen out positioning orientating inconsistent
Ceramic electronic components, ensure ceramic electronic components with unified orientation positions by braid.
Further, the depth in the section on two sides of the groove where it is the thickness of the ceramic body
1/1st to eight/10th.So both it is easy to identify each side of ceramic electronic components, can avoids to ceramic electrical again
The structural intergrity of subassembly influences too much, and prevents that chip mounter suction nozzle is to ceramic electrical when installing ceramic electronic components
The suction deficiency of subassembly.
Further, the vertical section of the groove be rectangle, triangle, trapezoidal or irregular shape.
Further, length of the length of the groove no more than the seamed edge on the length direction of the ceramic body.
Further, the ceramic electronic components also include two termination electrodes, and the termination electrode is respectively arranged on described first
On end face and second end face.
Further, the groove is not completely covered for the termination electrode.The groove is not completely covered for termination electrode, so just
In each side of identification ceramic electronic components.
Further, the ceramic electronic components also include interior electrode, the interior electrode in the ceramic body and with
The first side and second side are parallel to each other, and gap is respectively formed between the interior electrode and the 3rd side and the 4th side；
Dielectric layer is provided between the interior electrode；The groove located at the ceramic body any one length direction on seamed edge on or
Person is on the seamed edge on two length directions of the first side.Electrode in setting, ceramic electronic can be conveniently adjusted
The capacitance of part, it is also beneficial to prepare the ceramic electronic components of high power capacity.
Further, the interior electrode is made up of electrode in multiple first and multiple the second inner electrodes, electric in described first
Pole and the second inner electrode are arranged alternately in the ceramic body, and electrode has in the first end face in described first draws side simultaneously
And gap is formed with the second end face, the second inner electrode has in the second end face draws side and with described first
End face forms gap.
The utility model additionally provides a kind of preparation method of above-mentioned ceramic electronic components, and it comprises the following steps：
(1) grooving is formed on ceramic green, obtains the ceramic green with grooving；
(2) row is carried out to the ceramic green with grooving to glue and sinter, and obtains ceramic body；
(3) by ceramic body chamfer grinding；
(4) first end face of the ceramic body after chamfer grinding and second end face enclose termination electrode respectively, obtain ceramic electrical
Subassembly.
Further, the preparation method of the ceramic green is：Ceramic membrane is first prepared, ceramic film poststack is laminated
Substrate, then cut after multilayer board is pressed, obtain ceramic green.
Compared with prior art, the beneficial effects of the utility model are：The utility model provides a kind of new ceramic electrical
Subassembly and preparation method thereof.Ceramic electronic components of the present utility model on the seamed edge of ceramic body by setting groove so that
Its each side is easily identified.Also, the utility model further controls section of the groove on two sides where it
Depth be ceramic body thickness 1/1st to eight/10th, be so both easy to identify ceramic electronic components each side
It face, can avoid influencing too much the structural intergrity of ceramic electronic components again, and prevent in installation ceramic electrical sub-portion
Suction deficiency of the chip mounter suction nozzle to ceramic electronic components during part.
Brief description of the drawings
Fig. 1 is the outside drawing of the ceramic electronic components of the utility model embodiment 1；
Fig. 2 is the dimensional structure diagram of the ceramic electronic components of the utility model embodiment 1；
Fig. 3 is profile of Fig. 1 ceramic electronic components along I-I direction；
Fig. 4 is the profile of the ceramic electronic components of the utility model embodiment 3；
Fig. 5 is the profile of the ceramic electronic components of the utility model embodiment 4；
Fig. 6 is the profile of the ceramic electronic components of the utility model embodiment 5.
In figure, 1 is first side, and 2 be second side, and 3 be the 3rd side, and 4 be the 4th side, and 5 be first end face, and 6 are
Second end face, 10 be ceramic body, and 11 be the first seamed edge, and 12 be the second seamed edge, and 21 be the first termination electrode, and 22 be the second termination electrode,
101 be electrode in first, and 102 be the second inner electrode, and 111 be the first groove, and 112 be the second groove.
Embodiment
For the purpose of this utility model, technical scheme and advantage is better described, below in conjunction with accompanying drawing and specific implementation
The utility model is described in further detail for example.
In following embodiments, the vertical section of groove refers to that texturearunaperpendicular cuts open in the length direction of ceramic electronic components
Face.
Embodiment 1
As shown in Figure 1, Figure 2 and Figure 3, a kind of ceramic electronic components of the utility model embodiment, it includes ceramic body 10,
Ceramic body 10 is cuboid, and it includes mutually opposing first side 1 and second side 2, the 3rd mutually opposing side 3 and
Four sides 4 and mutually opposing first end face 5 and second end face 6；First side 1 and second side 2 and the thickness of ceramic body 10
It is perpendicular to spend direction, the 3rd side 3 and the 4th side 4 and the width of ceramic body 10 are perpendicular, the end of first end face 5 and second
Face 6 and the length direction of ceramic body 10 are perpendicular；The seamed edge of first side 1 and the intersection of the 3rd side 3 is the first seamed edge 11, the
One side 1 and the seamed edge of the intersection of the 4th side 4 are the second seamed edge 12, and the first seamed edge 11 is provided with the first groove 111.Certainly,
The position of first groove is not limited on the first seamed edge, and it can be also located on the second seamed edge, can also be located at second side 2 and the 3rd
On the seamed edge of side intersection or on the seamed edge of second side and the 4th side intersection.As shown in figure 3, along I-I side
To during observation, the vertical section of the first groove 111 is preferably shaped to rectangle, and the first groove 111 is in first side 1
The depth W in the section of the depth L in section and the first groove 111 on the 3rd side 3 is differed, i.e. L ≠ W.
Certainly, the shape of the vertical section of the first groove is not limited to rectangle or triangle, trapezoidal or irregular
Shape, those skilled in the art can select suitable groove shapes according to being actually needed.But no matter which kind of shape selected
Groove, for the ease of identify ceramic electronic components each side, the depth in section of first groove 111 in first side 1
The depth W for spending the section of L and the first groove 111 on the 3rd side 3 is differed.
The ceramic electronic components of the present embodiment, the first groove 111, and the first groove 111 are provided with the first seamed edge 11
The depth W in the section of the depth L in the section in first side 1 and the first groove 111 on the 3rd side 3 is differed, so
Even if the width and thickness of ceramic electronic components are close to the degree for being difficult to differentiate from outward appearance, each side of ceramic electronic components
Also it is easily identified.When cuing open piece analysis to ceramic electronic components progress metallographic, institute can be identified exactly using light microscope
Need sightingpiston.And during by more ceramic electronic components tape packages, it can be identified using optically screening machine and screen out positioning orientating not
Consistent ceramic electronic components, ensure ceramic electronic components ceramic electronic components with unified orientation positions by braid.
Further, the depth L in section of first groove 111 in first side 1 and the first groove 111 are in the 3rd side
The depth W in the section on 3 is 1st/1st to eight/10th of the thickness of ceramic body 10.So both it is easy to identify ceramic electronic
It each side of part, can avoid influencing too much the structural intergrity of ceramic electronic components again, and prevent from pacifying
Suction deficiency of the chip mounter suction nozzle to ceramic electronic components when filling ceramic electronic components.
Further, the first groove 111 extends to second end face 6 on the first seamed edge 11 from first end face 5, i.e., first is recessed
The length of groove 111 is equal to the length of the first seamed edge 11.
Further, ceramic electronic components also include two termination electrodes, and termination electrode is respectively arranged on the first end face 3 and
On biend 4.Termination electrode in first end face 3 is the first termination electrode 21, and the electrode in second end face 4 is the second end
Electrode 22, the first termination electrode 21 covering first end face 5, the second termination electrode 22 covering second end face 6.Preferably, the first termination electrode
21 also extend a distance into the bending of first side 1, second side 2, the 3rd side 3 and the 4th side 4 respectively, the second termination electrode
22 also extend a distance into the bending of first side 1, second side 2, the 3rd side 3 and the 4th side 4 respectively, are so easy to handle
Ceramic electronic components are welded on wiring board, and the connection of ceramic electronic components and wiring board is relatively more firm.First termination electrode
And second between termination electrode formed with gap so as to mutually insulated.
The preparation method of the ceramic electronic components of the present embodiment comprises the following steps：
Step 1, prepare ceramic membrane.
Ceramic slurry is obtained after ceramic powder, adhesive, organic solvent are well mixed, is prepared into by raw material of ceramic slurry
To ceramic membrane.
Preferably, ceramic powder, adhesive, organic solvent are well mixed by the way of ball milling and obtain ceramic slurry.Enter
One step, the time of ball milling is 12 hours~16 hours.
Preferably, ceramic powder, adhesive, the mass ratio of organic solvent are 10：3~5：4~9.
Ceramic powder can be barium titanate powder, zirconic acid calcium powder, magnesium titanate powder etc., but not limited to this.
Further, adhesive is polyvinyl butyral resin, and organic solvent is that mass ratio is 1:1~2:1 toluene and second
The mixed solvent of alcohol.
Preferably, ceramic slurry is cast to form ceramic membrane using the tape casting.
Preferably, the thickness of ceramic membrane is 1 μm~60 μm.
Step 2, ceramic film poststack obtained into multilayer board.
Multiple ceramic membranes are laminated by predetermined quantity, obtain multilayer board.
In general, the ceramic membrane quantity of stacking can be 4~500.
Step 3, cut after multilayer board is pressed, be fixed ceramic green on stainless steel.
Multilayer board is fixed and pressed on stainless steel with isostatic pressing method, each layer ceramic membrane in multilayer board is closely glued
Connect；Then multilayer board is cut in length and breadth by preliminary dimension, multilayer board is cut to the ceramic green of multiple independent cuboid shapes
Base.Ceramic green is remained fixed on stainless steel plate, formed with cutting tool marks between ceramic green.
Step 4, grooving is formed on ceramic green, obtained under the ceramic green with grooving departs from from stainless steel plate
Come.
Using such as scribing machine on ceramic green cutting-up, formed on a seamed edge on ceramic green length direction and cut
Groove, then the ceramic green formed with grooving is separated from stainless steel plate.
Grooving on ceramic green is corresponding with the first groove of ceramic body.
Because, formed with cutting tool marks, positioning during cutting-up is more convenient between ceramic green.
It is appreciated that the position of cutting-up, the shape of cutting-up blade and cutting-up depth can be according to prepared ceramic electronics
The location and shape size of first groove of part is selected and set.
Step 5, the ceramic green with grooving is carried out to arrange viscous and sintering, obtain ceramic body.
Ceramic green with grooving arrange in viscous and sintering operation, arranging viscous detailed process is：In air atmosphere
Under enclosing, the ceramic green formed with grooving is heated to 260 DEG C~450 DEG C and is incubated 2 hours~4 hours to exclude adhesive；
Or under protective gas atmosphere, the ceramic green formed with grooving is heated to 400 DEG C~600 DEG C and insulation 3 hours~6
Hour to exclude adhesive.
Protective gas can be nitrogen, argon gas or helium.
Ceramic green with grooving arrange in viscous and sintering operation, the detailed process of sintering is：In air atmosphere
Under enclosing or under reducibility gas atmosphere, the ceramic green that the formation arranged after gluing has grooving is heated to 900 DEG C~1320 DEG C
And be incubated 1 hour~4 hours and be sintered, ceramic body is obtained after the completion of sintering.Wherein, ceramic membrane is sintered is formed as ceramic Jie
Matter.
Reducibility gas can be the mixed gas of nitrogen and hydrogen, wherein, the volume ratio of hydrogen and nitrogen is 0.1~3：
100。
Step 6, by ceramic body chamfer grinding.
Using planetary mills or the method for barreling by ceramic body chamfer grinding, so that the corner of ceramic body becomes more round and smooth,
Chamfer grinding can use one or more of conducts among alumina balls, quartz sand, alumina powder, carborundum powder, running water
Grind medium.
Step 7, the respectively first end face of the ceramic body after chamfer grinding and second end face enclose two external electrodes, obtain
Ceramic electronic components.
The step is specially：First end face and second end face coated copper metal paste in ceramic body, silver metal slurry respectively
Material or silver palladium alloy metal paste, then the sintered copper metal paste under protective gas atmosphere, or burnt under air atmosphere
Silver metal slurry or silver palladium alloy metal paste are tied, sintering temperature can be 700 DEG C~900 DEG C, and soaking time can be 10 points
Clock~12 minute, two external electrodes of the first end face for being adhering closely to ceramic body respectively and second end face are formed after sintering, are obtained
To ceramic electronic components.
Protective gas can be nitrogen, argon gas or helium.
The preparation method of above-mentioned ceramic electronic components, technique is simple, is adapted to large-scale production.
Embodiment 2
A kind of ceramic electronic components of the utility model embodiment, its difference with the ceramic electronic components of embodiment 1
It is only that：In the present embodiment, the length of the first groove 111 is less than the length of the first seamed edge 11.
Position of first groove 111 on the first seamed edge 11 is not particularly limited, but for the ease of identifying ceramic electrical sub-portion
Each side of part, the first groove 111 are not completely covered by the first termination electrode 21 and the second termination electrode 22.
Embodiment 3
As shown in figure 4, a kind of ceramic electronic components of the utility model embodiment, itself and the ceramic electronic components of embodiment 1
Difference be：In the present embodiment, the second seamed edge 12 is provided with the second groove 112；First groove 111 is in first side 1
On the depth in section be L1, the depth in section of first groove 111 on the 3rd side 3 is W1, the second groove 112 is first
The depth in the section on side 1 is L2, the depth in section of second groove 112 on the 4th side 4 is W2；L1、W1、L2And W2
It is identical or different.
It should be noted that in the present embodiment, the first groove 111 and the second groove 112 are located at the two long of first side
Spend on the seamed edge on direction, in fact, the first groove and the second groove can be also located on two articles of length directions of the 3rd side
On seamed edge.
Further, the vertical section of the second groove 112 is rectangle.
Further, the depth L in section of first groove 111 in first side 11With the first groove 111 in the 3rd side
The depth W in the section on face 31It is 1st/1st to eight/10th of the thickness of ceramic body 10, the second groove 112 is in the first side
The depth L in the section on face 12With the depth W in section of second groove 112 on the 4th side 42It is the thickness of ceramic body 10
1/1st to eight/10th.So both it is easy to identify each side of ceramic electronic components, can avoids to ceramic electrical again
The structural intergrity of subassembly influences too much, and prevents that chip mounter suction nozzle is to ceramic electrical when installing ceramic electronic components
The suction deficiency of subassembly.
Embodiment 4
As shown in figure 5, a kind of ceramic electronic components of the utility model embodiment, itself and the ceramic electronic components of embodiment 1
Difference be：In the present embodiment, ceramic electronic components also include interior electrode, and interior electrode is in ceramic body 10 and with the
One side 1 and second side 2 are parallel to each other, and gap is respectively formed between interior electrode and the 3rd side 3 and the 4th side 4；In described
Dielectric layer is provided between electrode.Dielectric layer is set between interior electrode, so as to which interior electrode is spaced.
Preferably, dielectric layer is made up of ceramic dielectric.
Preferably, the interior electrode is made up of electrode 101 in multiple first and multiple the second inner electrodes 102, electric in first
Pole 101 and the second inner electrode 102 are arranged alternately in ceramic body 10, and electrode 101 has in first end face 5 in first draws side simultaneously
And gap is formed with second end face 6, the second inner electrode 102 has in second end face 6 draws side and between the formation of first end face 5
Gap.
First termination electrode 21 covers first end face 5, the second termination electrode 22 covering second end face 6, so as to the first termination electrode 21
With first in electrode 101 connect, the second termination electrode 22 and the second inner electrode 102 connect, and form multiple electric capacity structure in parallel, adjust
Save the quantity of electrode 101 and the second inner electrode 102 in first, the right opposite in first between electrode 101 and the second inner electrode 102
Spacing in product and first between electrode 101 and the second inner electrode 102, the electric capacity of ceramic electronic components can be conveniently adjusted
Amount, it is also beneficial to prepare the ceramic electronic components of high power capacity.
It is appreciated that in order that ceramic electronic components meet different characteristic requirements, electricity in electrode 101 and second in first
The quantity of pole 102 is not particularly limited, and can there was only electrode 101 in first in ceramic body 10, can also only have in ceramic body 10
The second inner electrode 102；Electrode 101 and the second inner electrode 102 can not be drawn in any surface of ceramic body 10 in first.
In the present embodiment, electrode 101 and the second inner electrode 102 expose preferably not at the first groove 111 in first, with
Ensure that ceramic electronic components have preferable moisture protection and reliability.
The preparation method of the ceramic electronic components of the present embodiment, its preparation method with the ceramic electronic components of embodiment 1
Difference be：In being formed on ceramic membrane the step of electrode pattern, the step has for increase between step 1 and step 2
Body is：Metal paste is printed on the ceramic membrane that step 1 obtains to electrode pattern in being formed, obtains being printed with interior electrode after drying
The ceramic membrane of pattern, interior electrode pattern form electrode and the second inner electrode in first after step 5 is sintered.
Metal in metal paste can be nickel, copper, monel, silver, palladium or silver palladium alloy, but not limited to this.Printing
Select silk-screen printing technique.
In the present embodiment, step 2 is different compared with embodiment 1, and difference is：It is printed with by predetermined quantity by multiple
The ceramic membrane stacking of interior electrode pattern, obtains multilayer board.Step 2 can also be printed with interior electricity by multiple by predetermined quantity
The ceramic membrane stacking of pole figure case, obtains lamination unit, is then laminated multiple ceramics respectively on two relative surfaces of lamination unit
Film is covered each by two protective layers of two relative sides of lamination unit to be formed, and forms protective layer, lamination unit and protection
The structure that layer stacks gradually, obtains multilayer board.Protective layer can improve the moisture protection and reliability of ceramic electronic components.Protect
Sheath is that 1~30 ceramic membranes are laminated to obtain.
In the present embodiment, row is carried out in step 5 to the ceramic green with grooving to glue and sinter, in first
The metal material of electrode and the second inner electrode selects suitable atmosphere.It is if for example, electric in electrode and second in first
The metal material of pole is nickel, copper or monel, then can use protective gas atmosphere.
Embodiment 5
As shown in fig. 6, a kind of ceramic electronic components of the utility model embodiment, itself and the ceramic electronic components of embodiment 1
Difference be：In the present embodiment, the rectangular triangle of vertical section of the first groove 111, the first groove 111 is first
The depth in the section on side 1 is L, and the depth in section of first groove 111 on the 3rd side 3 is W, and L ≠ W.
Further, the depth L in section of first groove 111 in first side 1 and the first groove 111 are in the 3rd side
The depth W in the section on 3 is 1st/1st to eight/10th of the thickness of ceramic body 10.So both it is easy to identify ceramic electronic
It each side of part, can avoid influencing too much the structural intergrity of ceramic electronic components again, and prevent from pacifying
Suction deficiency of the chip mounter suction nozzle to ceramic electronic components when filling ceramic electronic components.
The utility model can be applied in the ceramic electrical sub-portion such as chip ceramic capacitor, chip inductor, type piezoresistor
Part.
Finally, it should be noted that above example is only illustrating the technical solution of the utility model rather than to this reality
With the limitation of novel protected scope, although being explained in detail with reference to preferred embodiment to the utility model, this area it is common
It will be appreciated by the skilled person that the technical solution of the utility model can be modified or equivalent substitution, without departing from this reality
With the spirit and scope of new technique scheme.
Claims (8)
- A kind of 1. ceramic electronic components, it is characterised in that：Including ceramic body, the ceramic body is cuboid, and it includes mutually right First side and second side, the 3rd mutually opposing side and the 4th side put and mutually opposing first end face and Biend；The first side and second side and the thickness direction of the ceramic body are perpendicular, the 3rd side and the 4th Side and the width of the ceramic body are perpendicular, the first end face and second end face and the length direction of the ceramic body It is perpendicular；Seamed edge on any one length direction of the ceramic body is provided with groove, and two sides of the groove where it The depth in the section on face differs；Or it is all provided with the seamed edge on two articles of length directions of the first side or the 3rd side fluted.
- 2. ceramic electronic components as claimed in claim 1, it is characterised in that：The groove is on two sides where it The depth in section is 1st/1st to eight/10th of the thickness of the ceramic body.
- 3. ceramic electronic components as claimed in claim 1, it is characterised in that：The vertical section of the groove is rectangle, three Angular, trapezoidal or irregular shape.
- 4. ceramic electronic components as claimed in claim 1, it is characterised in that：The length of the groove is not more than the ceramic body Length direction on seamed edge length.
- 5. ceramic electronic components as claimed in claim 1, it is characterised in that：The ceramic electronic components also include two end electricity Pole, the termination electrode are respectively arranged in the first end face and second end face.
- 6. ceramic electronic components as claimed in claim 5, it is characterised in that：The groove is not completely covered for the termination electrode.
- 7. ceramic electronic components as claimed in claim 1, it is characterised in that：The ceramic electronic components also include interior electrode, The interior electrode is parallel to each other in the ceramic body and with the first side and second side, the interior electrode and the 3rd Gap is respectively formed between side and the 4th side；Dielectric layer is provided between the interior electrode；The groove is located at the ceramic body Any one length direction on seamed edge on or on the seamed edge on two length directions of the first side.
- 8. ceramic electronic components as claimed in claim 7, it is characterised in that：The interior electrode is by electrode in multiple first and more Individual the second inner electrode is formed, and electrode and the second inner electrode are arranged alternately in the ceramic body in described first, in described first Electrode has in the first end face draws side and forms gap with the second end face, and the second inner electrode is described the Biend, which has, draws side and forms gap with the first end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721111708.XU CN207151010U (en) | 2017-08-31 | 2017-08-31 | A kind of ceramic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721111708.XU CN207151010U (en) | 2017-08-31 | 2017-08-31 | A kind of ceramic electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207151010U true CN207151010U (en) | 2018-03-27 |
Family
ID=61676813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201721111708.XU Active CN207151010U (en) | 2017-08-31 | 2017-08-31 | A kind of ceramic electronic components |
Country Status (1)
| Country | Link |
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| CN (1) | CN207151010U (en) |
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2017
- 2017-08-31 CN CN201721111708.XU patent/CN207151010U/en active Active
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