CN208240726U - A kind of LED illuminating source with substratum transparent - Google Patents
A kind of LED illuminating source with substratum transparent Download PDFInfo
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- CN208240726U CN208240726U CN201820178781.7U CN201820178781U CN208240726U CN 208240726 U CN208240726 U CN 208240726U CN 201820178781 U CN201820178781 U CN 201820178781U CN 208240726 U CN208240726 U CN 208240726U
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- substratum transparent
- illuminating source
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Abstract
The utility model discloses a kind of LED illuminating source with substratum transparent, the LED illuminating source are formed by stacking by mixed arogel layer, LED core lamella, substratum transparent, substrate and primer layer from top to bottom；Or be formed by stacking from top to bottom by the first mixed arogel layer, LED core lamella, substrate and the second mixed arogel layer, on the top and lower part of the top of LED core lamella or the lower part of the LED core lamella or the LED core lamella, substratum transparent is set；The double-layer structure that packing colloid part has transparent adhesive tape that chip and substrate or mixed arogel is separated, this structure has the characteristics that good heat dissipation, light transmittance height, high temperature resistant, good with bracket and fluorescent powder associativity, it can prevent production and the solder joint virtual connection in use process or fall off, improve chip light emitting efficiency, whole encapsulation performance and appearance are not influenced simultaneously, are conducive to the production yield, use reliability and the long durability that improve LED.
Description
Technical field
The utility model belongs to LED field more particularly to a kind of LED illuminating source with substratum transparent.
Background technique
Light emitting diode (Light Emitting Diode) is a kind of 21 century most promising cold light source, because
The advantages that its energy-saving and environmental protection, high reliablity and flexible design, obtains extensive exploitation and application in lighting area.With being forbidden to use
The implementation of incandescent lamp plan, tungsten incandescent lamp are about to disappear, and LED filament lamp gradually replaces ground of the tungsten lamp in the minds of people
Position.Filament lamp due to packaging technology yield is low and weak heat-dissipating and raw material transportational process in cracky, envelope bubble technology it is stringent
It is required that causing filament lamp manufacturing cost high, LED filament lamp is hindered to be difficult to come into common people house.Wherein LED filament encapsulating products
Weak heat-dissipating and this high two hang-up of fraction defective, annoying always LED encapsulation personnel.
LED filament is substantially without radiator, and substrate is usually the very poor glass material of heating conduction, and electrode, which does not have, yet leads
Hot property, LED filament can not carry out heat conducting and radiating, so being difficult to conduct the heat that LED chip generates, heat can only
Thermally conductive and heat dissipation is carried out by radiation and the convection current of internal gas, the accumulation of heat is be easy to cause, so that the service life of LED filament contracts
It is short.Heat is in LED filament building up inside simultaneously, it is most likely that it is empty to will cause solder joint of the LED filament in production and use process
It connects or falls off, show as LED filament lamp flashing light or dead lamp.
Summary of the invention
The purpose of this utility model is that in view of the deficiencies of the prior art, it is luminous to provide a kind of LED with substratum transparent
Light source, to improve the yields, heat-sinking capability and light efficiency of LED.
The purpose of this utility model is achieved through the following technical solutions: a kind of LED with substratum transparent is luminous
Light source, the LED illuminating source are superimposed by mixed arogel layer, LED core lamella, the first substratum transparent, substrate and primer layer from top to bottom
It forms, two pins is drawn on the LED core lamella.
Further, the material of first substratum transparent is epoxy resin, silica gel or silicone resin.
Further, the second substratum transparent is set between the LED core lamella and mixed arogel layer.
Further, the material of first substratum transparent and the second substratum transparent is selected from epoxy resin, silica gel or silicon
Resin.
Further, the substrate is selected from glass substrate, sapphire substrate, ceramic substrate, metal substrate, FPC substrate, stone
Black substrate；The metal substrate is selected from the alloy of aluminum substrate, iron substrate, copper base or various metals.
Further, fluorescent powder is mixed in the primer layer.
Further, the mixed arogel layer is the mixture of fluorescent powder and glue.
A kind of LED illuminating source with substratum transparent, the LED illuminating source is from top to bottom by the first mixed arogel layer, LED
Chip layer, substrate and the second mixed arogel layer are formed by stacking；Under the top of the LED core lamella or the LED core lamella
Substratum transparent is arranged in the top and lower part of portion or the LED core lamella；Two pins are drawn on the LED core lamella.
Further, the material of the substratum transparent is epoxy resin, silica gel or silicone resin.
Further, the substrate is selected from glass substrate, sapphire substrate, ceramic substrate, metal substrate, FPC substrate, stone
Black substrate；The metal substrate is selected from the alloy of aluminum substrate, iron substrate, copper base or various metals.
Compared with prior art, the utility model has the beneficial effects that after the utility model LED illuminating source is made, core
Piece upper surface or bottom or surface and bottom are wrapped up by transparent adhesive tape, form double-layer structure.With existing LED packaging technology compatibility
It is good, it is low to equipment, technology and personnel requirement.The double-layer structure of the utility model, have good heat dissipation, high temperature resistant, with bracket and glimmering
The features such as light powder associativity is good can prevent production and the solder joint virtual connection in use process or fall off, improve chip light emitting efficiency, together
When do not influence whole encapsulation performance and appearance, be conducive to improve LED production yield, use reliability and long durability.
Detailed description of the invention
Fig. 1 is the LED illuminating source layering encapsulation schematic diagram of embodiment 1；
Fig. 2 is the LED illuminating source layering encapsulation schematic diagram of embodiment 2；
Fig. 3 is the LED illuminating source layering encapsulation schematic diagram of embodiment 3；
Fig. 4 is the LED illuminating source layering encapsulation schematic diagram of embodiment 4；
Fig. 5 is the LED illuminating source layering encapsulation schematic diagram of embodiment 5；
In figure, it is transparent to mix arogel layer 1, LED core lamella 2, the first substratum transparent 3, substrate 4, primer layer 5, pin 6, second
Glue-line 7, the first mixed arogel layer 8, the second mixed arogel layer 9, third substratum transparent 10.
Specific embodiment
Invention is further described in detail in the following with reference to the drawings and specific embodiments.
Embodiment 1
As shown in Figure 1, a kind of LED illuminating source with substratum transparent provided in this embodiment, from top to bottom by mixing powder
Glue-line 1, LED core lamella 2, the first substratum transparent 3, substrate 4 and primer layer 5 are formed by stacking, and draw two on the LED core lamella 2
A pin 6.The material of first substratum transparent 3 is epoxy resin.The substrate 4 is glass substrate.
Embodiment 2
As shown in Fig. 2, a kind of LED illuminating source with substratum transparent provided in this embodiment, from top to bottom by mixing powder
Glue-line 1, the second substratum transparent 7, LED core lamella 2, the first substratum transparent 3, substrate 4 and primer layer 5 are formed by stacking, the LED core
Two pins 6 are drawn on lamella 2.The material of first substratum transparent 3 and the second substratum transparent 7 is silica gel.The substrate 4
For ceramic substrate.
Embodiment 3
As shown in figure 3, a kind of LED illuminating source with substratum transparent provided in this embodiment, from top to bottom by first
Mixed arogel layer 8, third substratum transparent 10, LED core lamella 2, substrate 4 and the second mixed arogel layer 9 are formed by stacking；The LED chip
Two pins 6 are drawn on layer 2.The material of the third substratum transparent 10 is silicone resin.The substrate 4 is aluminum substrate.
Embodiment 4
As shown in figure 4, a kind of LED illuminating source with substratum transparent provided in this embodiment, from top to bottom by first
Mixed arogel layer 8, LED core lamella 2, third substratum transparent 10, substrate 4 and the second mixed arogel layer 9 are formed by stacking；The LED chip
Two pins 6 are drawn on layer 2.The material of the third substratum transparent 10 is silicone resin.The substrate 4 is FPC substrate.
Embodiment 5
As shown in figure 5, a kind of LED illuminating source with substratum transparent provided in this embodiment, from top to bottom by first
Mixed arogel layer 8, third substratum transparent 10, LED core lamella 2, third substratum transparent 10, substrate 4 and the second mixed superposition of arogel layer 9 and
At；Two pins 6 are drawn on the LED core lamella 2.The material of two third substratum transparents 10 is epoxy resin.The base
Plate 4 is graphite substrate.
Above-described embodiment is the preferred embodiment of the present invention, is the further explanation to the content of present invention and its application,
It should not be construed as the present invention and be only applicable to above-described embodiment.All technologies realized based on the principle of the invention and summary of the invention are belonged to
In the scope of the present invention.
Claims (9)
1. a kind of LED illuminating source with substratum transparent, which is characterized in that the LED illuminating source is from top to bottom by mixing arogel
Layer, the second substratum transparent, LED core lamella, the first substratum transparent, substrate and primer layer are formed by stacking, and are drawn on the LED core lamella
Two pins out.
2. a kind of LED illuminating source with substratum transparent according to claim 1, which is characterized in that described first thoroughly
The material of gelatin layer is epoxy resin, silica gel or silicone resin.
3. a kind of LED illuminating source with substratum transparent according to claim 1, which is characterized in that described first thoroughly
The material of gelatin layer and the second substratum transparent is selected from epoxy resin, silica gel or silicone resin.
4. a kind of LED illuminating source with substratum transparent according to claim 1-3, which is characterized in that institute
It states substrate and is selected from glass substrate, sapphire substrate, ceramic substrate, metal substrate, FPC substrate, graphite substrate；The metal substrate
Alloy selected from aluminum substrate, iron substrate, copper base or various metals.
5. a kind of LED illuminating source with substratum transparent according to claim 1-3, which is characterized in that institute
It states and is mixed with fluorescent powder in primer layer.
6. a kind of LED illuminating source with substratum transparent according to claim 1-3, which is characterized in that institute
State the mixture that mixed arogel layer is fluorescent powder and glue.
7. a kind of LED illuminating source with substratum transparent, which is characterized in that the LED illuminating source is mixed by first from top to bottom
Arogel layer, LED core lamella, substrate and the second mixed arogel layer are formed by stacking；Top or the LED core in the LED core lamella
Substratum transparent is arranged in the top and lower part of the lower part of lamella or the LED core lamella；Two pipes are drawn on the LED core lamella
Foot.
8. a kind of LED illuminating source with substratum transparent according to claim 7, which is characterized in that the transparent adhesive tape
The material of layer is epoxy resin, silica gel or silicone resin.
9. a kind of LED illuminating source with substratum transparent according to claim 7, which is characterized in that the substrate choosing
From glass substrate, sapphire substrate, ceramic substrate, metal substrate, FPC substrate, graphite substrate；The metal substrate is selected from aluminium base
Plate, iron substrate, copper base or various metals alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820178781.7U CN208240726U (en) | 2018-02-01 | 2018-02-01 | A kind of LED illuminating source with substratum transparent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820178781.7U CN208240726U (en) | 2018-02-01 | 2018-02-01 | A kind of LED illuminating source with substratum transparent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240726U true CN208240726U (en) | 2018-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820178781.7U Active CN208240726U (en) | 2018-02-01 | 2018-02-01 | A kind of LED illuminating source with substratum transparent |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739999A (en) * | 2020-06-24 | 2020-10-02 | 杭州杭科光电集团股份有限公司 | High-light-efficiency LED light source capable of improving color rendering R8 value |
-
2018
- 2018-02-01 CN CN201820178781.7U patent/CN208240726U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739999A (en) * | 2020-06-24 | 2020-10-02 | 杭州杭科光电集团股份有限公司 | High-light-efficiency LED light source capable of improving color rendering R8 value |
| CN111739999B (en) * | 2020-06-24 | 2021-12-17 | 杭州杭科光电集团股份有限公司 | High-light-efficiency LED light source capable of improving color rendering R8 value |
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