CN207166883U - A kind of buffer structure for wiring board peg type heat pressure adhesive - Google Patents
A kind of buffer structure for wiring board peg type heat pressure adhesive Download PDFInfo
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- CN207166883U CN207166883U CN201720804977.8U CN201720804977U CN207166883U CN 207166883 U CN207166883 U CN 207166883U CN 201720804977 U CN201720804977 U CN 201720804977U CN 207166883 U CN207166883 U CN 207166883U
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- wiring board
- buffer structure
- splicing construction
- splicing
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Abstract
A kind of buffer structure for wiring board peg type heat pressure adhesive is the utility model is related to.A kind of buffer structure for wiring board peg type heat pressure adhesive, it includes cushion body；Alignment pin nail is provided with cushion body；Wherein, the region residing at least one alignment pin nail is arranged to splicing construction；Splicing construction is dismountable, and it is spliced to form buffer structure with cushion body；Alignment pin nail is provided with least one splicing construction.A kind of buffer structure for wiring board peg type heat pressure adhesive of the present utility model, splicing block is detachable, wiring board is after hot pressing, splicing block can be disassembled, re-used after individually clearing up, or directly change contaminated splicing block, without clearing up or changing whole cushioned material layer matrix, the use of consumptive material padded coaming is reduced, so as to reduce the manufacturing cost of wiring board；Meanwhile the cleaning difficulty of the isolation Preparation equipment such as steel plate and hot pressing disk is also reduced, improve operating efficiency.
Description
Technical field
Wiring board processing and manufacturing technology is the utility model is related to, is used for wiring board peg type heat more particularly to one kind
The buffer structure that pressure viscosity is closed.
Background technology
Wiring board is all electronics as electronic component installation and carrier and connection body main during grafting is provided
The indispensable part of product.Multilayer circuit board pressure programming main flow uses brown paper should for the padded coaming of basic material at present
For the process for pressing of multilayer circuit board, the epoxy resin in wiring board prepreg reaches its glass in pressure process is heated
It can be flowed (before solidification) after changing temperature, and overflow and spread in shop bolt hole location, PCB presses brown paper due to oozing
Water-based and water imbibition, after polymeric adsorbent can firm adhesion on isolation steel plate and platen, pollute process apparatus, add every
From the cleaning difficulty of the Preparation equipment such as steel plate and hot pressing disk, operating efficiency is reduced, while also result in circuit board pressing ox-hide
The waste of paper, add the manufacturing cost of multilayer circuit board.
Utility model content
The utility model provides a kind of buffer structure for wiring board peg type heat pressure adhesive, using detachable splicing
The mode of block, re-used after can solely clearing up, or directly change contaminated splicing block, it is whole slow without clearing up or changing
Material layer matrix is rushed, reduces the use of consumptive material padded coaming, so as to reduce the manufacturing cost of multilayer circuit board, improves work
Make efficiency.
A kind of buffer structure for wiring board peg type heat pressure adhesive, it includes cushion body；The cushion sheet
Alignment pin nail is provided with body；Wherein, the region residing at least one alignment pin nail is arranged to splicing construction；The splicing
Structure is dismountable, and it is spliced to form buffer structure with cushion body；Alignment pin is provided with least one splicing construction
Nail.
Multiple splicing constructions are distributed with the cushion body, corresponding sprocket bit is selected according to the wiring board of different model
The splicing construction put is positioned, using being provided with alignment pin nail on the splicing construction of positioning function.
It is not used on the splicing construction of positioning function and is not provided with alignment pin nail.
The cushion body is at least one layer of cushion, wherein, at least it is provided with splicing construction on one layer of cushion.
The cushion body is multi-buffering-layer, and multilayer is provided with splicing construction jointly or which part layer is provided with spelling
Binding structure.
Error-proof structure is provided with the splicing construction, for facilitating the splicing of splicing construction and cushion body.
Outwards it is provided with from alignment pin nail positioned at the splicing construction with alignment pin nail of cushion body edges excessive
Head piece.
Splicing construction with alignment pin nail is being provided with longitudinally through overflow launder on the inside of shop bolt hole.
The advantages of the utility model：A kind of buffer structure for wiring board peg type heat pressure adhesive of the present utility model,
Splicing block is detachable, and wiring board can disassemble splicing block after hot pressing, re-used after individually clearing up, or
Person directly changes contaminated splicing block, without clearing up or changing whole cushioned material layer matrix, reduces consumptive material padded coaming
Use, so as to reduce the manufacturing cost of wiring board；Meanwhile also reduce the clear of the Preparation equipments such as isolation steel plate and hot pressing disk
Difficulty is managed, improves operating efficiency.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of buffer structure for wiring board peg type heat pressure adhesive of embodiment one；
Fig. 2 is a kind of schematic diagram of buffer structure for wiring board peg type heat pressure adhesive of embodiment six；
Fig. 3 is a kind of heat pressure adhesive state of buffer structure for wiring board peg type heat pressure adhesive of embodiment one
Overall schematic diagram；
Fig. 4 is a kind of showing for the wiring board combination of buffer structure for wiring board peg type heat pressure adhesive of embodiment one
It is intended to.
Embodiment
In order to deepen to understanding of the present utility model, the utility model is done further below in conjunction with drawings and examples
It is described in detail, the embodiment is only used for explaining the utility model, and the scope of protection of the utility model is not formed and limited.
Embodiment one
As shown in figure 1, present embodiments providing a kind of buffer structure for wiring board peg type heat pressure adhesive, it includes
Cushion body 1；Alignment pin nail 2 is provided with the cushion body 1；Wherein, residing at least one alignment pin nail 2
Region is arranged to splicing construction 3；The splicing construction 3 is dismountable, and it is spliced to form buffer structure with cushion body 1；
Alignment pin nail 2 is provided with least one splicing construction 3；The cushion body 1 is at least one layer of cushion, wherein, extremely
Splicing construction 3 is provided with rare one layer of cushion；The cushion body 1 is multi-buffering-layer, and multilayer is provided with spelling jointly
Binding structure 3 or which part layer are provided with splicing construction 3；Error-proof structure is provided with the splicing construction 3, is spliced for convenient
Structure 3 and the splicing of cushion body 1；The splicing construction 3 with alignment pin nail 2 positioned at the edge of cushion body 1 is from calmly
Position pin hole 2 is outwards provided with overfall 32；Splicing construction 3 with alignment pin nail 2 is positioned at the inner side in shop bolt hole 2
It is provided with longitudinally through overflow launder 31.
A kind of splicing construction of buffer structure for wiring board peg type heat pressure adhesive of the present embodiment can be circle, three
The conventional geometry such as angular, square, polygon, also may be set to unconventional geometry.
A kind of buffer structure for wiring board peg type heat pressure adhesive of the present embodiment, positioned at cushion body edges
Splicing construction with alignment pin nail is outwards provided with overfall from alignment pin nail, facilitates resin from the breach stream
Go out, avoid resin stain cushioned material layer matrix and Preparation equipment.
A kind of buffer structure for wiring board peg type heat pressure adhesive of the present embodiment, the splicing with alignment pin nail
Structure is being provided with longitudinally through overflow launder on the inside of shop bolt hole, and the quantity of this overflow launder can be multiple, and overflow
The shape of chute can be the various shapes such as sawtooth, plum blossom, square groove.
A kind of buffer structure for wiring board peg type heat pressure adhesive of the present embodiment, cushion body and splicing construction
Material can be identical, also can be different.
As shown in figure 3, a kind of buffer structure for wiring board peg type heat pressure adhesive of the present embodiment is used for wiring board
During pin work heat pressure adhesive, it is specifically：First wiring board combination about 400 is stacked successively, up and down outside two of wiring board combination 400
Isolation steel plate 300 is placed in side, then sets buffer structure 200 up and down respectively in the outside of isolation steel plate 300, finally in buffer structure
200 outside sets two pieces of hot pressing disks 100 up and down, wiring board combination 400, each isolation steel plate 300, two layers of buffer structure respectively
200 and two pieces of hot pressing disks 100 above, be equipped with that quantity is identical, pin locating holes 500 of position correspondence, same position is determined
Position hole 500 wears same root pin, is then pressurizeed by the heating of upper and lower two pieces of hot pressing disks 100, to the wiring board being clipped in the middle
Combination 400 carries out heat pressure adhesive；Between buffer structure 200 is located at hot pressing disk 100 and isolates steel plate 300, in heating pressure process
In, buffer structure 200 can accurately control hot transmission, and pressure during balanced pressing in plate surface.
As shown in figure 4, wiring board combination 400 includes two-sided internal layer circuit plate 411, conductive layer 412, prepreg 413, lead
Electric layer 412 is oppositely arranged on the both sides up and down of the two-sided internal layer circuit plate 411, and prepreg 413 is oppositely arranged on described lead
Two outside up and down of electric layer 412, is spaced between wiring board 411 and prepreg 413 by conductive interlayer 412, wiring board 411,
Conductive layer 412, prepreg 413 successively carry out alignment overlapping by positioning hole.
Prepreg 413 can be made up of epoxy resin and glass fabric, and conductive layer 412 can be copper foil.
In actual mechanical process, first each group stratification for forming wiring board is stacked successively up and down, then outside upper and lower two
Isolation steel plate is placed in side, then sets cushioned material layer up and down respectively in the outside of isolation steel plate, finally in the outer of cushioned material layer
Side sets two pieces of hot pressing disks up and down respectively, each group stratification of wiring board, respectively isolates steel plate, two layers of cushioned material layer and two pieces of heat
Above platen, it is equipped with that quantity is identical, positioning hole of position correspondence, when stacking, place and setting, the positioning hole of same position is worn
Same root pin is crossed, is then pressurizeed by the heating of upper and lower two pieces of hot pressing disks, each group stratification of the wiring board to being clipped in the middle is entered
Row heat pressure adhesive, wherein, at least one layer is splicing structure among two layers of cushioned material layer, and the splicing structure includes
Cushioned material layer matrix and some splicing blocks, the splicing block is detachable, and using in the cushioned material layer of splicing structure
Positioning hole is arranged on above the splicing block.Because the splicing block is detachable, multilayer circuit board, can be by described in after hot pressing
Splicing block disassembles, and re-used after individually clearing up, or directly changes contaminated splicing block, without cleaning or
Whole cushioned material layer matrix is changed, reduces the use of consumptive material padded coaming, so as to reduce being manufactured into for multilayer circuit board
This.Meanwhile the cleaning difficulty of the isolation Preparation equipment such as steel plate and hot pressing disk is reduced, improve operating efficiency.
Embodiment two
The present embodiment and the difference of embodiment one are：Cushion body is identical with the material of splicing construction, all
Brown paper is pressed using multi-layer PCB, PCB pressing brown paper has the characteristics that hardness is moderate, buffering is uniform, multi-layer PCB pressing
Brown paper is spliced using docking mode, first can be superimposed by the use of 8-20 layers brown paper as cushion, splicing is formed slow afterwards
It is smooth to rush body structure surface.
When not using splicing construction, the epoxy resin in wiring board prepreg reaches its glass in pressure process is heated
It can be flowed (before solidification) after glass temperature, and overflow and spread in shop bolt hole location, because PCB pressing brown paper has
It seepage of water and water imbibition, can tightly be bonded together after its polymeric adsorbent, due to hardening of resin, cause fixed between layers
Brown paper at the pin of position is not flexible, and 2 points cause brown paper to reuse based on more than, causes PCB pressing oxen
The waste of mulberry paper, add the manufacturing cost of wiring board.
And when using the splicing construction of the present embodiment, can be by the brown paper splicing block at shop bolt after pressure programming
Change, can reuse 1-2 times, can so save material more than 50%, bring significant economic benefit.
Embodiment three
The present embodiment and the difference of embodiment one are：Cushion body uses brown paper, and splicing construction is using painting
There is mould release silicagel pad.Splicing construction is made using silicagel pad, used in shop bolt opening position, resin overflows in hot pressing
When, because silicagel pad splicing construction is detachable, individually cleaning is again reusable after being dismantled, so as to protect cushion sheet
The brown paper of body, brown paper can reuse 1-2 times more, so as to reduce the manufacturing cost of wiring board.
Example IV
The present embodiment and the difference of embodiment one are：Cushion body uses silicagel pad, and splicing block is silicagel pad
Splicing block or brown paper.
Material using silicagel pad as cushion body, silicagel pad have good mechanical tenacity, can with hundreds of times with
Upper recycling, brown paper are utilizing 2-3 hypoelasticity step-downs, are being not suitable for reusing.If can reuse, entirely using
Thousands of brown paper can be substituted under life-span, save material, while producing economic benefit, to environment and a kind of protection；Silicon
Rubber cushion has good thermal conductivity, and pyroconductivity is higher than brown paper several times, can effectively shorten adding in circuit board pressing processing procedure
The hot time, capacity utilization is improved, save the energy, reduce energy cost；Silicagel pad has density CONSENSUS excellent with respect to brown paper
Point, thickness change is uniform in bonding processes, and the flatness and thickness evenness for pressing rear board are significantly improved.Effectively
Improve the pressing quality of wiring board.But in existing technology, silicagel pad is the complex of glass fibre and silica gel, due to
Production and raw material are relatively expensive, so price is very high, the price of unit area is more than thousand times of brown paper；It must reuse
It is lower just to have an economic benefit, and during unused splicing construction, the pollution of pin location in pressure programming have impact on silicagel pad in circuit
Use in plate peg type pressure programming so that silicagel pad is difficult to apply.
Using the splicing construction of the present embodiment, splicing construction is pressing brown paper or silicagel pad, and both form after splicing
Complete cushioned material layer, after hot pressing only need to change by the small area of resin stain pressing brown paper or silicagel pad splicing
Structure, whole silicagel pad cushioned material layer matrix is effectively protected, so that silicagel pad assist side peg type pressure programming
In use be possibly realized, effectively reduce the cost of consumptive material padded coaming, reduce the manufacturing cost of wiring board, improve circuit
The pressing quality of plate.
Embodiment five
The present embodiment and the difference of embodiment one are：Cushion body is composite structure, wherein two up and down
The cushion that outermost layer contacts with platen, and cushion of upper and lower two innermost layers with isolating steel plate, may be configured as one layer or
The PCB pressing brown paper of multilayer, and the cushion matrix of internal layer is silicagel pad, after hot pressing, will can directly be connect with platen and steel plate
The tactile cheap PCB brown paper for having speckled with resin tears off or changes whole splicing construction, eliminates the fettler of silicagel pad
Sequence, improve operating efficiency.
Embodiment six
As shown in Fig. 2 the present embodiment and the difference of embodiment one are：It is distributed with the cushion body 1 more
Individual splicing construction 3, the splicing construction 3 for selecting corresponding position location according to the wiring board of different model are positioned, and use positioning
Alignment pin nail 2 is provided with the splicing construction 3 of function；It is not used on the splicing construction 3 of positioning function and is not provided with shop bolt
Hole 2.
The present embodiment can preset multiple splice regions on cushion body, when in use, according to the size of wiring board, selection
The splicing construction of correct position is positioned so that a cushion body can be used for the processing of Multiple Type wiring board, section
Cost-saving.
Above-described embodiment should not in any way limit the utility model, all by the way of equivalent substitution or equivalency transform
The technical scheme of acquisition is all fallen within the scope of protection of the utility model.
Claims (8)
1. a kind of buffer structure for wiring board peg type heat pressure adhesive, it includes cushion body；The cushion body
On be provided with alignment pin nail；It is characterized in that：Region residing at least one alignment pin nail is arranged to splicing construction；It is described
Splicing construction is dismountable, and it is spliced to form buffer structure with cushion body；It is fixed to be provided with least one splicing construction
Position pin hole.
A kind of 2. buffer structure for wiring board peg type heat pressure adhesive according to claim 1, it is characterised in that：Institute
State and multiple splicing constructions are distributed with cushion body, the splicing knot of corresponding position location is selected according to the wiring board of different model
Structure is positioned, using being provided with alignment pin nail on the splicing construction of positioning function.
A kind of 3. buffer structure for wiring board peg type heat pressure adhesive according to claim 2, it is characterised in that：Not
Using being not provided with alignment pin nail on the splicing construction of positioning function.
A kind of 4. buffer structure for wiring board peg type heat pressure adhesive according to claim 1, it is characterised in that：Institute
It is at least one layer of cushion to state cushion body, wherein, at least it is provided with splicing construction on one layer of cushion.
A kind of 5. buffer structure for wiring board peg type heat pressure adhesive according to claim 1, it is characterised in that：Institute
It is multi-buffering-layer to state cushion body, and multilayer is provided with splicing construction jointly or which part layer is provided with splicing construction.
A kind of 6. buffer structure for wiring board peg type heat pressure adhesive according to claim 1, it is characterised in that：Institute
State and error-proof structure is provided with splicing construction, for facilitating the splicing of splicing construction and cushion body.
A kind of 7. buffer structure for wiring board peg type heat pressure adhesive according to claim 1, it is characterised in that：Position
In the splicing construction with alignment pin nail of cushion body edges overfall is outwards provided with from alignment pin nail.
A kind of 8. buffer structure for wiring board peg type heat pressure adhesive according to claim 1, it is characterised in that：Band
The splicing construction for having alignment pin nail is being provided with longitudinally through overflow launder on the inside of shop bolt hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720804977.8U CN207166883U (en) | 2017-07-05 | 2017-07-05 | A kind of buffer structure for wiring board peg type heat pressure adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720804977.8U CN207166883U (en) | 2017-07-05 | 2017-07-05 | A kind of buffer structure for wiring board peg type heat pressure adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207166883U true CN207166883U (en) | 2018-03-30 |
Family
ID=61710952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720804977.8U Active CN207166883U (en) | 2017-07-05 | 2017-07-05 | A kind of buffer structure for wiring board peg type heat pressure adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207166883U (en) |
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2017
- 2017-07-05 CN CN201720804977.8U patent/CN207166883U/en active Active
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