TWI655888B - Circuit board alignment hot pressing cushion setting method - Google Patents
Circuit board alignment hot pressing cushion setting method Download PDFInfo
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- TWI655888B TWI655888B TW106132439A TW106132439A TWI655888B TW I655888 B TWI655888 B TW I655888B TW 106132439 A TW106132439 A TW 106132439A TW 106132439 A TW106132439 A TW 106132439A TW I655888 B TWI655888 B TW I655888B
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Abstract
一種電路板對位熱壓合之緩衝墊設置法，包含A.耐熱緩衝墊上配置阻膠件步驟，係備置有兩具有複數個預留孔之環保緩衝墊，預留孔中設有阻膠件，且阻膠件設有一定位穿孔；B.於壓合加熱盤間配置待加工層及耐熱緩衝墊步驟，其係於兩熱壓盤之間固定有複數待加工層，且於熱壓盤與待加工層間設有環保緩衝墊，且該熱壓盤與該待加工層上設有穿孔，該穿孔對應於阻膠件之該定位穿孔，並令複數之定位柱設於其中做定位；C.加熱施壓步驟，係利用該熱壓盤加熱並壓合；及D.移除阻膠件步驟，係於加熱施壓結束後，將該阻膠件自該環保緩衝墊上卸除。 The utility model relates to a buffer plate setting method for the thermal compression of a circuit board, comprising the steps of: disposing a rubber resisting member on the heat-resistant cushion pad, and providing two environmental protection cushions having a plurality of reserved holes, and the rubber hole is provided in the reserved hole. And the step of resisting the rubber member is provided with a positioning perforation; B. the step of arranging the layer to be processed and the heat-resistant cushion between the pressing and heating plates, which are fixed between the two hot pressing plates with a plurality of layers to be processed, and in the hot pressing plate An environmental protection cushion is disposed between the layers to be processed, and the hot pressing plate and the layer to be processed are provided with perforations corresponding to the positioning perforations of the rubber resisting member, and a plurality of positioning posts are disposed therein for positioning; The heating pressing step is heated and pressed by the hot pressing plate; and D. the step of removing the rubber resisting member is performed, after the heating and pressing, the resisting member is removed from the environmental protection cushion.
Description
本發明係關於一種電路板對位熱壓合之緩衝墊設置法；詳細而言，係關於一種具有定位孔以輔助電路板製作之高耐熱緩衝環保阻膠墊片的熱壓合設置方法。 The invention relates to a buffer pad setting method for thermal bonding of a circuit board; in particular, it relates to a thermocompression setting method for a high heat-resistant cushioning environmentally-friendly rubber gasket having a positioning hole to assist the circuit board.
現有技術中，於多層結構的電路板壓合製程裡，主要係熱加壓之技術將多層結構壓合為一體，其中壓合之方向係來自於上、下兩反向端之施力，以及提供高溫。 In the prior art, in the multi-layer circuit board pressing process, the main technique of hot pressing is to press the multi-layer structure into one body, wherein the pressing direction is from the upper and lower opposite ends, and Provide high temperature.
而為了避免加工之過程中，因為直接之硬受力令電路膠合板等等的待加工物件受重壓而損壞，因此介於兩端接觸面之間，普遍會設置有提供緩衝之耐高溫緩衝層。較常見的如透過銅箔、鋼板或者是多層疊合之牛皮紙等等，但因為這些材料不具備有可多次重覆使用的特性，屬於隨用即丟的材質，對於環境保育而言，這類耗材並不理想，因此隨著材料科技的發達，可以重複使用上百次以上的具緩衝性環保材質成為高溫緩衝層的較佳選擇。 In order to avoid the process of processing, because the direct hard force causes the object to be processed of the circuit plywood and the like to be damaged by heavy pressure, a high temperature buffer layer for providing buffer is generally disposed between the contact surfaces of the two ends. . More common, such as through copper foil, steel plate or multi-layered kraft paper, etc., but because these materials do not have the characteristics of repeated use, it is a material that is thrown away, for environmental conservation, this The consumables are not ideal, so with the development of materials technology, it is better to reuse hundreds of times of cushioning environmentally friendly materials to become a high temperature buffer layer.
為了避免壓合加工時，多層次結構中壓合過程因為外力導致滑動，而導致各層次之間的對位產生偏移，產生結構上的誤差，因此於操作時，進一步會透過於各層次結構穿設有複數定位孔，而後並以複數貫穿各層次之定位柱來做為確保定位精準之方式，以確保各層結構之間可以達 到精準的對位。 In order to avoid the pressing process, the pressing process in the multi-level structure slides due to external force, which causes the alignment between the layers to shift, resulting in structural errors, so that in operation, it will further penetrate through the various structures. Wear a plurality of positioning holes, and then use a plurality of positioning posts running through the layers to ensure accurate positioning to ensure that the layers can reach each other. To the precise alignment.
但因為於耐高溫緩衝層上亦具有穿孔之因素，因此於實際操作高溫壓合過程中，各層次間的膠合成分會因為高溫液化，並於受壓後流入該穿孔，進而滲透到耐高溫緩衝層上，且於冷卻後凝固，令原本具有緩衝性的耐高溫緩衝層性質異變，例如局部硬化或脆化等，如此一來將可能大幅度的減少了耐高溫緩衝層可以重複使用之次數，造成耗材產生快速並對環境保育造成影響，為此技術領域中目前尚待克服的技術瓶頸。 However, because of the perforation factor on the high temperature buffer layer, in the actual operation of the high temperature pressing process, the glue synthesis points between the layers will be liquefied due to high temperature, and will flow into the perforation after being pressed, and then penetrate into the high temperature buffer. On the layer, and solidified after cooling, the properties of the buffer layer which is originally buffered are changed, such as local hardening or embrittlement, which may greatly reduce the number of times the high temperature buffer layer can be reused. , causing rapid consumption of consumables and affecting environmental conservation, which is a technical bottleneck that has yet to be overcome in the technical field.
故綜觀前所述，本發明之發明人思索並設計一種電路板對位熱壓合之緩衝墊設置法，以期針對現有技術之缺失加以改善，進而增進產業上之實施利用。 Therefore, the inventors of the present invention have conceived and designed a cushioning method for the thermal compression of the circuit board in order to improve the lack of the prior art, thereby enhancing the industrial use and utilization.
有鑒於前述之現有技術的不足點，本發明係設計一種具備新穎性、進步性及產業利用性等專利要件之電路板對位熱壓合之緩衝墊設置法，以期克服現有技術之難點。 In view of the above-mentioned shortcomings of the prior art, the present invention designs a cushioning method for the thermal compression of a circuit board with a patent, which is novel, progressive, and industrially utilized, in order to overcome the difficulties of the prior art.
為達到上述目的，本發明所採用的技術手段為設計一種電路板對位熱壓合之緩衝墊設置法，其包含：A.耐熱緩衝墊上配置阻膠件步驟，係備置有兩環保緩衝墊，該環保緩衝墊上具有複數個預留孔，而後並於各該預留孔中係配置有一阻膠件，且該阻膠件之中央處設有一定位穿孔；B.於壓合加熱盤間配置待加工層及耐熱緩衝墊步驟，其係於兩呈相對設置之熱壓盤之間，固定有複數層之待壓合的待加工層，且於各該熱壓盤與該些待加工層之間設有一該環保緩衝墊，且該熱壓盤與該待加工層上係設有相對應之穿孔，該穿孔位置對應於該環保緩衝墊上該阻膠件之該定位穿孔， 並令複數之定位柱設於該穿孔及該定位穿孔之中，確保該些待加工層之間不會彼此產生位移；C.加熱施壓步驟，係利用該熱壓盤加熱，且同時相對施力壓合，進而讓該些待加工層得以固定；及D.移除阻膠件步驟，係於加熱施壓結束後，將該阻膠件自該環保緩衝墊上卸除。 In order to achieve the above object, the technical means adopted by the present invention is to design a method for setting the thermal pad of the circuit board, which comprises: A. a step of disposing a rubber resist on the heat-resistant cushion, and two environmental protection cushions are disposed. The environmental protection cushion has a plurality of reserved holes, and then a rubber-proof member is disposed in each of the reserved holes, and a positioning hole is disposed at a center of the rubber-resisting member; B. is disposed between the pressure-heating plates a processing layer and a heat-resistant cushioning step are disposed between two oppositely disposed hot pressing plates, and a plurality of layers to be processed to be pressed are fixed, and between the hot pressing plates and the layers to be processed An environmentally-friendly cushion is disposed, and the hot-pressing plate is provided with a corresponding perforation corresponding to the layer to be processed, and the perforation position corresponds to the positioning perforation of the rubber-resistant member on the environmental protection cushion. And locating a plurality of positioning posts in the perforation and the positioning perforations to ensure that the layers to be processed do not interfere with each other; C. heating pressing step, using the hot platen to heat, and simultaneously applying The pressure is pressed to further fix the layers to be processed; and D. The step of removing the rubber resist is performed after the heat application is completed, and the rubber resist is removed from the environmental protection cushion.
其中，該阻膠件為可拆卸地固定於該預留孔。 The rubber resist is detachably fixed to the reserved hole.
其中，該阻膠件為一墊片。 Wherein, the rubber resist is a gasket.
其中，B.於壓合加熱盤間配置待加工層及耐熱緩衝墊步驟中，該環保緩衝墊係先以該預留孔穿套過該定位柱，而後再進一步以與該環保緩衝墊分離之該阻膠件的該定位穿孔穿套到該定位柱上，接著一邊橫向調整環保緩衝墊，一邊將阻膠件對齊該預留孔，並推移至該環保緩衝墊之該預留孔中做固定。 Wherein, in the step of arranging the layer to be processed and the heat-resistant cushion between the pressing and heating plates, the environmentally-friendly cushion is first passed through the positioning hole through the reserved hole, and then further separated from the environmental protection cushion. The positioning through hole of the rubber resisting member is sleeved on the positioning post, and then the environmental protection cushion is laterally adjusted, and the rubber resist member is aligned with the reserved hole, and is pushed into the reserved hole of the environmental protection cushion to be fixed. .
其中，該預留孔為圓形孔。 Wherein, the reserved hole is a circular hole.
本發明之電路板對位熱壓合之緩衝墊設置法於設計上，因為可以有效地在加熱加壓過程中隔離該環保緩衝墊，使其不會接觸到受熱融化的膠液，因此可以確保其材質特性不異變，進而能夠不斷重複的使用，以達到材料使用率最大化，直接地降低了耗材廢棄過快之成本問題，同時也減少習知因為耗材產生迅速而造成的環境保育問題，為現有技術所不能及者。 The circuit board aligning thermocompression cushion setting method of the invention is designed because the environmental protection cushion can be effectively isolated during heating and pressing so as not to contact the melted melt, thereby ensuring The material characteristics are not changed, and can be repeatedly used to maximize the material usage rate, directly reducing the cost of the waste material being discarded too quickly, and reducing the environmental conservation problem caused by the rapid consumption of consumables. Not available to the prior art.
而為了讓上述目的、技術特徵以及實際實施後之增益性更為明顯易懂，於下文中將係以較佳之實施範例輔佐對應相關之圖式來進行更詳細之說明。 In order to make the above-mentioned objects, technical features, and gains after actual implementation more obvious, a more detailed description will be given below with reference to the corresponding drawings in the preferred embodiments.
(10)‧‧‧環保緩衝墊 (10)‧‧‧Environmental cushion
(11)‧‧‧預留孔 (11) ‧‧‧Reserved holes
(20)‧‧‧阻膠件 (20) ‧‧‧Resistance parts
(21)‧‧‧定位穿孔 (21)‧‧‧ Positioning perforation
(30)‧‧‧熱壓盤 (30)‧‧‧Hot platen
(40)‧‧‧待加工層 (40) ‧ ‧ layers to be processed
(50)‧‧‧定位柱 (50)‧‧‧Positioning column
第1圖為本發明電路板對位熱壓合之緩衝墊設置法之流程圖；第2圖為本發明具電路板對位熱壓合之緩衝墊設置法之應用元件實施例圖；第3圖為本發明電路板對位熱壓合之緩衝墊設置法之應用元件局部剖面圖；第4圖為本發明電路板對位熱壓合之緩衝墊設置法之實施例剖面圖；第5圖為本發明電路板對位熱壓合之緩衝墊設置法之實施例局部剖面圖。 1 is a flow chart of a method for setting a buffer pad for thermal registration of a circuit board according to the present invention; and FIG. 2 is a view showing an embodiment of an application device for a buffer pad setting method for a board for thermal bonding of a circuit board according to the present invention; FIG. 4 is a cross-sectional view showing an embodiment of a cushioning method for a thermal compression bonding of a circuit board according to the present invention; FIG. 4 is a cross-sectional view showing an embodiment of a cushioning method for a thermal compression bonding of a circuit board according to the present invention; A partial cross-sectional view of an embodiment of a cushioning method for thermal bonding of a circuit board according to the present invention.
本發明之優點及特徵以及達到其方法將參照例示性實施例及附圖進行更詳細地描述而更容易理解。然而，本發明可以不同形式來實現且不應該被理解僅限於此處所陳述的實施例。相反地，對所屬技術領域具有通常知識者而言，所提供的此些實施例將使本揭露更加透徹與全面且完整地傳達本發明的範疇，且本發明將僅為所附加的申請專利範圍所定義。在圖中，成分或元件的尺寸及相對尺寸為了清晰易懂而以誇示方法表示。整篇說明書中，相同的元件符號指的是相同的組件。如後文中所使用的，術語”及/或”包含任何及所有一或多相關所列物件的組合。 The advantages and features of the present invention, as well as the method of achieving the same, will be more readily understood by referring to the exemplary embodiments and the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, the embodiments are provided to provide a thorough and complete and complete disclosure of the scope of the invention, and the invention Defined. In the figures, the dimensions and relative sizes of the components or elements are shown in an exaggerated manner for clarity and clarity. Throughout the specification, the same component symbols refer to the same components. As used hereinafter, the term "and/or" includes any and all combinations of one or more of the associated listed items.
除非另外定義，所有使用於後文的術語(包含科技及科學術語)具有與本發明所屬該領域的技術人士一般所理解相同的意思。將更可理解的是，例如於一般所使用的字典所定義的那些術語應被理解為具有與相關領域的內容一致的意思，且除非明顯地定義於後文，將不以過度理想化或過度正式的意思理解。 Unless otherwise defined, all terms (including technical and scientific terms) used hereinafter have the same meaning as commonly understood by those skilled in the art to which the invention belongs. It will be further understood that terms such as those defined by commonly used dictionaries should be understood to have the meaning consistent with the relevant art and will not be overly idealized or excessive unless explicitly defined below. Formal meaning understanding.
以下將配合圖式詳細敘述例示實施例。然而，這些實施例可以包含於不同的形式中，且不應被解釋為用以限制本發明之申請專利範圍。這些實施例之提供使得本發明之揭露完整與明暸，熟知此技術之人將能經由該些實施例瞭解本發明之範疇。 The exemplary embodiments will be described in detail below with reference to the drawings. However, the embodiments may be embodied in different forms and should not be construed as limiting the scope of the invention. The disclosure of the present invention is intended to be illustrative of the invention, and those skilled in the art will be able to understand the scope of the invention.
請配合參看第1圖所示，本發明係關於一種電路板對位熱壓合之緩衝墊設置法，其實施上包含下述步驟：A.耐熱緩衝墊上配置阻膠件；B.於壓合加熱盤間配置待加工層及耐熱緩衝墊；C.加熱施壓；及D.移除阻膠件。 Referring to FIG. 1 , the present invention relates to a method for setting a thermal compression pad of a circuit board, which comprises the following steps: A. a rubber resistant member is disposed on the heat-resistant cushion; The layer to be processed and the heat-resistant cushion are arranged between the heating plates; C. heating and pressing; and D. removing the rubber-resistant member.
請進一步配合參看第2及3圖所示，前述之A.耐熱緩衝墊上配置阻膠件步驟，係備置有兩環保緩衝墊(10)，該環保緩衝墊(10)上具有複數個預留孔(11)，其或可為圓形孔，而後並於各該預留孔(11)中係可拆卸地配置有一阻膠件(20)，且該阻膠件(20)之中央處設有一定位穿孔(21)。而其中該阻膠件(20)或可為一固定於該預留孔(11)中之墊片。 Please refer to the second and third figures. The A. heat-resistant cushion is equipped with a rubber-proof cushion. The two environmental protection cushions (10) are provided. The environmental protection cushion (10) has a plurality of reserved holes. (11), which may be a circular hole, and then detachably disposed in each of the reserved holes (11) with a rubber resist member (20), and a central portion of the rubber resist member (20) is provided with a Position the perforation (21). The rubber resist (20) may be a gasket fixed in the reserved hole (11).
請進一步配合參看第4及5圖所示，前述之B.於壓合加熱盤間配置待加工層及耐熱緩衝墊步驟，係於兩呈相對設置之熱壓盤(30)之間，固定有複數層之待壓合的待加工層(40)，其中該待加工層(40)內係包含有膠合層，且於各該熱壓盤(30)與該些待加工層(40)之間設有一該環保緩衝墊(10)，且該熱壓盤(30)與該待加工層(40)上係設有相對應之穿孔，該穿孔對應於該環保緩衝墊(10)上該阻膠件(20)之該定位穿孔(21)，而後令複數之定位柱(50)設於該穿孔及該定位穿孔(21)之中，進而可以確保該些待加工層(40)之間不會因為應力推擠的關係而彼此間產生相對位移。 Please refer to Figures 4 and 5 for further cooperation. The above B. The steps of arranging the layer to be processed and the heat-resistant cushion between the heating and heating plates are fixed between the two hot-pressing plates (30) which are oppositely disposed. a plurality of layers to be processed (40) to be processed, wherein the layer to be processed (40) contains a glue layer between each of the hot platen (30) and the layer to be processed (40) An environmental protection cushion (10) is disposed, and the hot pressing plate (30) and the layer to be processed (40) are provided with corresponding perforations corresponding to the anti-corrosion rubber on the environmental protection cushion (10). The positioning hole (21) of the piece (20), and then the plurality of positioning posts (50) are disposed in the perforation and the positioning perforation (21), thereby ensuring that the layers to be processed (40) are not Relative displacements occur with each other because of the relationship of stress pushing.
此外，該環保緩衝墊(10)係先以該預留孔(11)穿套過該定位 柱(50)，而後再進一步以該阻膠件(20)之該定位穿孔(21)穿套到該定位柱(50)上，接著一邊橫向調整環保緩衝墊(10)，一邊將阻膠件(20)對齊該預留孔(11)，並推移至該環保緩衝墊(10)之該預留孔(11)中。透過如此之操作方法係可以達到最快速將該環保緩衝墊(10)及該阻膠件(20)固定於該定位柱(50)上，操作此步驟者可以不需要搬移著沉重的環保緩衝墊(10)來做定位，而是可以先快速以該環保緩衝墊(10)上孔徑大於定位柱(50)的預留孔(11)直接套過定位柱(50)，而後僅須手持該重量相對輕巧甚多之阻膠件(20)，並以該阻膠件(20)上孔徑對應該定位柱(50)之定位穿孔(21)來套過該定位柱(50)，接著僅需橫向調整該環保緩衝墊(10)之位置，讓該阻膠件(20)可落入該預留孔(11)內，即能完成該環保緩衝墊(10)之定位。 In addition, the environmental protection cushion (10) is firstly threaded through the reserved hole (11). After the column (50), the positioning perforation (21) of the rubber resist member (20) is further sleeved onto the positioning post (50), and then the environmental protection cushion (10) is laterally adjusted, and the rubber resist member is (20) Align the reserved hole (11) and move it into the reserved hole (11) of the environmental protection cushion (10). Through such an operation method, the environmental protection cushion (10) and the rubber resistant member (20) can be fastened to the positioning post (50), and the step of moving the heavy environmental protection cushion can be eliminated. (10) For positioning, the positioning hole (11) of the environmental protection cushion (10) having a larger hole diameter than the positioning post (50) can be quickly applied directly, and then only the weight is required to be held. A relatively light and flexible resisting member (20), and the positioning hole (21) corresponding to the positioning post (50) of the resisting member (20) is passed over the positioning post (50), and then only laterally Adjusting the position of the environmental protection cushion (10) allows the resistance member (20) to fall into the reserved hole (11), that is, the positioning of the environmental protection cushion (10) can be completed.
前述之C.加熱施壓步驟，係利用該熱壓盤(30)加熱，且同時相對施力壓合，進而讓該些待加工層(40)得以固定。而當該熱壓盤(30)施壓時，該阻膠件(20)阻隔於該定位柱(50)及該環保緩衝墊(10)之間，從而可完全阻隔順延自該定位柱(50)流下之受熱融化的膠液，以保護該環保緩衝墊(10)。 In the foregoing C. heating pressing step, the hot pressing plate (30) is heated, and at the same time, pressed against the pressing force, thereby allowing the layers to be processed (40) to be fixed. When the hot pressing plate (30) is pressed, the resisting member (20) is blocked between the positioning post (50) and the environmental protection cushion (10), so that the positioning block can be completely blocked from the positioning column (50). The hot melted glue flows down to protect the environmentally friendly cushion (10).
前述之D.移除阻膠件，係於加熱施壓結束後，將該阻膠件(20)自該環保緩衝墊(10)上拆卸，以利該環保緩衝墊(10)重複來做下一次的應用。 In the foregoing D. removing the rubber resistant member, after the heating and pressing, the protective rubber member (20) is detached from the environmental protection cushion (10), so that the environmental protection cushion (10) is repeated. One application.
而透過本發明之電路板對位熱壓合之緩衝墊設置法的巧思設計，因為可以有效地在加熱加壓過程中，隔離該環保緩衝墊(10)，使其不會接觸到受熱融化的膠液，因此可以確保其材質特性不異變，進而能夠不斷重複的使用，以達到材料使用率最大化，直接地降低了耗材廢棄過快之 成本問題，同時也減少習知因為耗材產生迅速而造成的環境保育問題，為現有技術所不能及者。 The ingenious design of the cushioning method for the thermal compression of the circuit board of the present invention can effectively isolate the environmentally-friendly cushion (10) during heating and pressurization so that it does not come into contact with heat and melt. The glue can ensure the material properties are not changed, so that it can be used repeatedly to maximize the material usage and directly reduce the waste material. Cost issues, but also reduce the environmental conservation problems caused by the rapid production of consumables, which is beyond the reach of existing technologies.
上述之實施例僅用來例舉本發明之實施態樣，以及闡釋本發明之技術特徵，並非用來限制本發明之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍，本發明之權利保護範圍應以申請專利範圍為準。 The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims.
Claims (5)
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| TW106132439A TWI655888B (en) | 2017-09-21 | 2017-09-21 | Circuit board alignment hot pressing cushion setting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201328455A (en) * | 2011-12-23 | 2013-07-01 | Zhen Ding Technology Co Ltd | Positioning pin, method for manufacturing positioning pin and device for pressing printed circuit board |
| CN206506776U (en) * | 2017-03-16 | 2017-09-19 | 东莞市广磁电子有限公司 | A kind of plate of material of FR 4 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201328455A (en) * | 2011-12-23 | 2013-07-01 | Zhen Ding Technology Co Ltd | Positioning pin, method for manufacturing positioning pin and device for pressing printed circuit board |
| CN206506776U (en) * | 2017-03-16 | 2017-09-19 | 东莞市广磁电子有限公司 | A kind of plate of material of FR 4 |
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