CN107278063A - Print processing method of multi-layer circuit board - Google Patents
Print processing method of multi-layer circuit board Download PDFInfo
- Publication number
- CN107278063A CN107278063A CN201710665582.9A CN201710665582A CN107278063A CN 107278063 A CN107278063 A CN 107278063A CN 201710665582 A CN201710665582 A CN 201710665582A CN 107278063 A CN107278063 A CN 107278063A
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- CN
- China
- Prior art keywords
- rivet
- core material
- multilayer
- pieces
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of printing multilayer circuit board processing method, including：Target drone is bored in the long side drilling of core material using CCD；The correspondence core material bore position is drilled using PP drilling machines on the long side of multilayer PP pieces；The alignment pin of rivet driver entangles the multilayer PP pieces and the core material, and squeezes into rivet from edges of boards, is bloomed by the rivet and is fixedly connected with the multilayer PP pieces and the core material.The present invention solves the problem of multilayer circuit board slide plate occurs in bonding processes, improves operating efficiency, reduces production cost.
Description
Technical field
The present invention relates to circuit board printing technology, more particularly to a kind of printing processing method of multi-layer circuit board.
Background technology
Multi-layer sheet pressing is exactly by heat cure, so that by one or more using prepreg (PP pieces) after HTHP
Layer core plate and copper foil are bonded into one piece of multiple-plate process.The purpose of pressing plate is complete by HTHP using B b stage resin bs
Solidification is combined together each layer of multi-layer sheet, it is ensured that multiple-plate electric property and mechanical performance.
During conventional four laminates processing first typesetting, core material is sequenced with PP pieces and copper foil, will be sequenced by press
Multi-layer sheet (book) pressing layer is overall.As shown in figure 1,101 and 105 thickness are 12 microns of outer copper foil, 102 and 104 be 3
1080 pp pieces, 103 be the thick core materials of 1.20mm.
Pressing typically point three phases, temperature rise period, hot press period, cold pressing stage；Temperature rise period has suction vacuum and low
Resin melting in press operation, stage PP pieces is into low viscosity resin, the whole adhesive surfaces of infiltration and trace clearance, evict from bubble and
And gradually step up the dynamic viscosity of resin, into high pressure phase after be properly completed exhaust, calking and be evenly distributed to resin
Curing cross-linking reaction completely, and it is multi-layer sheet is remained dimensionally-stable in quick cooling to be cold-pressed.
In the prior art, there is the problem of slide plate is scrapped during multilayer circuit board stitching.
The content of the invention
The present invention provides a kind of printing processing method of multi-layer circuit board, to overcome above-mentioned technical problem.
A kind of printing multilayer circuit board processing method of the invention, including：
Target drone is bored in the long side drilling of core material using CCD；
The correspondence core material bore position is drilled using PP pieces drilling machine on the long side of multilayer PP pieces；
The alignment pin of rivet driver entangles the multilayer PP pieces and the core material, and squeezes into rivet from edges of boards, passes through
The rivet, which is bloomed, is fixedly connected with the multilayer PP pieces and the core material.
Further, it is described and squeezed into from edges of boards after rivet, in addition to：
The rivet is taken out in rivet location drilling after pressing.
Further, rivet drilling bore hole is shaped as plum blossom-shaped.
Further, bore position is the two ends of the core material.
Further, the number of the drilling is 4 or 6.
Further, the aperture is 3.175mm.
The present invention rivets together multilayer circuit board before multilayer circuit board processing, solves multilayer circuit board in pressure
The problem of slide plate occur during conjunction, improves operating efficiency, reduces production cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is prior art multilayer plate pressing layer overall structure diagram；
Fig. 2 is present invention printing processing method of multi-layer circuit board flow chart；
Fig. 3 is rivet Post flowering of the present invention by multilayer PP pieces and core material overall structure diagram；
Fig. 4 is the drilling bore hole structural representation of rivet location of the present invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 2 is present invention printing processing method of multi-layer circuit board flow chart, as shown in Fig. 2 the method for the present embodiment can be with
Including：
Step 101, target drone is bored using CCD drilled on the long side of core material；
Step 102, the correspondence core material bore position are drilled using PP pieces drilling machine on the long side of multilayer PP pieces；
The multilayer PP pieces and the core material are entangled, and squeeze into riveting from edges of boards by step 103, the alignment pin of rivet driver
Nail, is bloomed by the rivet and fixes the multilayer PP pieces and the core material.
Specifically, pre- lamination and lamination are carried out before printing multilayer circuit board, core material is bored into target drone using CCD exists
The long side drilling of core material, bore position is the two ends of the core material.The number of the drilling is 4 or 6.Enter
One step, the aperture is 3.175mm.
The bore position of correspondence core material is drilled using PP pieces drilling machine on the long side of multilayer PP pieces.The positioning of rivet driver
Pin entangles multilayer PP pieces and core material.And rivet is squeezed into from edges of boards, as shown in figure 3, in the multi-layer sheet (book) shown in Fig. 1
On pressing layer, the Post flowering of rivet 106 fixes multilayer PP pieces and core material.
Those multilayers PP pieces pressing when due to there is the fixation of rivet so that be not between PP pieces and core material because
Resin flowing occurs so as to caused slide plate；
Further, it is described and squeezed into from edges of boards after rivet, in addition to：
The rivet is taken out in rivet location drilling after pressing.
Further, rivet drilling bore hole is shaped as plum blossom-shaped.
Specifically, it is to avoid subsequent handling preserves liquid medicine in rivet location, causes wiring board to occur other adverse reactions.This
Embodiment gets out rivet in rivet location.As shown in Figure 4.Plum blossom-shaped drilling is overlapping by four isodiametric circles, and this four
Individual circular diameter is the bore diameter of rivet.
Present invention printing processing method of multi-layer circuit board can realize the pressing of multiple PP pieces, anti-limited slip plate, efficiency is higher, into
This reduction.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (6)
1. one kind printing multilayer circuit board processing method, it is characterised in that including：
Target drone is bored in the long side drilling of core material using CCD；
The correspondence core material bore position is drilled using PP drilling machines on the long side of multilayer PP pieces；
The alignment pin of rivet driver entangles the multilayer PP pieces and the core material, and squeezes into rivet from edges of boards, by described
Rivet, which is bloomed, is fixedly connected with the multilayer PP pieces and the core material.
2. according to the method described in claim 1, it is characterised in that described and squeezed into from edges of boards after rivet, in addition to：
The rivet is taken out in rivet location drilling after pressing.
3. method according to claim 2, it is characterised in that the rivet drilling bore hole is shaped as plum blossom-shaped.
4. according to the method described in claim 1, it is characterised in that bore position is the two ends of the core material.
5. method according to claim 4, it is characterised in that the number of the drilling is 4 or 6.
6. the method according to any one of claim 1 to 5, it is characterised in that the aperture is 3.175mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710665582.9A CN107278063A (en) | 2017-08-07 | 2017-08-07 | Print processing method of multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710665582.9A CN107278063A (en) | 2017-08-07 | 2017-08-07 | Print processing method of multi-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107278063A true CN107278063A (en) | 2017-10-20 |
Family
ID=60079978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710665582.9A Pending CN107278063A (en) | 2017-08-07 | 2017-08-07 | Print processing method of multi-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107278063A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260281A (en) * | 2017-12-13 | 2018-07-06 | 深圳崇达多层线路板有限公司 | A kind of method that rivet is pressed on removal force fit plate |
| CN109862703A (en) * | 2019-03-30 | 2019-06-07 | 奥士康科技股份有限公司 | A kind of localization method of mixed-compression board production |
| CN110788927A (en) * | 2019-11-13 | 2020-02-14 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN204425769U (en) * | 2014-12-24 | 2015-06-24 | 特新微电子（东莞）有限公司 | A kind of circuit board prebored hole structure |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| CN205657908U (en) * | 2016-04-01 | 2016-10-19 | 广州兴森快捷电路科技有限公司 | Conveniently get rid of circuit plate structure of flange rivet |
-
2017
- 2017-08-07 CN CN201710665582.9A patent/CN107278063A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| CN204425769U (en) * | 2014-12-24 | 2015-06-24 | 特新微电子（东莞）有限公司 | A kind of circuit board prebored hole structure |
| CN205657908U (en) * | 2016-04-01 | 2016-10-19 | 广州兴森快捷电路科技有限公司 | Conveniently get rid of circuit plate structure of flange rivet |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260281A (en) * | 2017-12-13 | 2018-07-06 | 深圳崇达多层线路板有限公司 | A kind of method that rivet is pressed on removal force fit plate |
| CN109862703A (en) * | 2019-03-30 | 2019-06-07 | 奥士康科技股份有限公司 | A kind of localization method of mixed-compression board production |
| CN110788927A (en) * | 2019-11-13 | 2020-02-14 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
| CN110788927B (en) * | 2019-11-13 | 2021-12-28 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171020 |