CN206742223U - A kind of imaging sensor - Google Patents
A kind of imaging sensor Download PDFInfo
- Publication number
- CN206742223U CN206742223U CN201720508711.9U CN201720508711U CN206742223U CN 206742223 U CN206742223 U CN 206742223U CN 201720508711 U CN201720508711 U CN 201720508711U CN 206742223 U CN206742223 U CN 206742223U
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- Prior art keywords
- imaging sensor
- sensing chip
- layer
- pcb substrate
- support cofferdam
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Abstract
A kind of imaging sensor, including PCB substrate and sensing chip, the periphery of PCB substrate are provided with support cofferdam, protrusive board are provided with the middle part of the medial surface in the support cofferdam, and the lateral surface in the support cofferdam is provided with some gaps；The upper surface of the protrusive board is provided with transparent cover plate；The upper surface of the sensing chip is provided with photosensitive area, and the upper surface edge setting of the sensing chip is fluted, and composite cushion is provided with the groove, metal conducting layer is connected with above the composite cushion；Conductive adhesive layer is provided between the metal conducting layer and the protrusive board and between the support cofferdam and the PCB substrate.The utility model support strength is good, and metal solder joints are not in phenomenon of rupture, and heat shock resistance and steam the impact performance of product are better, substantially reduce line transmission distance, improve optical property, improve service life, reduce production cost.
Description
Technical field
It the utility model is related to technical field of semiconductors, and in particular to a kind of imaging sensor.
Background technology
Imaging sensor has been widely used in the digital devices such as such as digital camera, camera phone.Image sensing
Device module includes being used for the imaging sensor that image information is converted to power information.Specifically, may include can for imaging sensor
Electronics is converted photons to show the semiconductor devices with storage image.A kind of packaged type of conventional images sensor be
Box dam cavity and upper bonding glue are made on substrate, wafer and substrate are bonded together, it is complete using silicon hole and rewiring technology
Into the wafer-level packaging of chip, single crystal grain is finally cut to.But the packaged type is easily aobvious by alkalescence to aluminium welding pad
Shadow corrosion, easily has an impact to pixel region, and signal transmission is unstable；Product heat dispersion is poor, heat shock resistance and water
Vapour impact property can not meet people's demand.
Utility model content
It is good that the purpose of this utility model is to provide a kind of support strength, and metal solder joints are not in phenomenon of rupture, heat resistanceheat resistant
Impact and steam impact effect are good, reduce line transmission distance, improve optical property, and the image for reducing production cost passes
Sensor, to solve technical problem present in above-mentioned background technology.
To achieve the above object, the utility model provides following technical scheme：
A kind of imaging sensor, including PCB substrate and sensing chip, the periphery of the PCB substrate are provided with support cofferdam,
Protrusive board is provided with the middle part of the medial surface in the support cofferdam, the lateral surface in the support cofferdam is evenly arranged with some gaps；Institute
The upper surface for stating protrusive board is provided with transparent cover plate；The upper surface of the sensing chip is provided with photosensitive area, the sensing chip it is upper
The setting of surface edge is fluted, and composite cushion is provided with the groove, metal is connected with above the composite cushion
Conductive layer；It is provided between the metal conducting layer and the protrusive board and between the support cofferdam and the PCB substrate
Conductive adhesive layer.
Further, the gap is the linear pattern being parallel to each other, and the depth in the gap is less than the thickness in support cofferdam
Half.
Further, the depth of the groove is more than the height of composite cushion.
Further, the composite cushion bottom right is supreme is followed successively by aluminium layer, nickel dam, guard metal layer, titanium copper layer.
Further, the guard metal layer is nickel-gold layer.
The beneficial effects of the utility model are：Support strength is good, and metal solder joints are not in phenomenon of rupture, the heat resistanceheat resistant of product
Impact and steam impact performance are better, substantially reduce line transmission distance, improve optical property, improve using the longevity
Life, reduces production cost.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description are only of the present utility model
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of structure chart of imaging sensor described in the utility model embodiment.
Fig. 2 is schematic enlarged-scale view at A in Fig. 1.
Wherein：1-PCB substrates；2- sensing chips；3- supports cofferdam；301- gaps；4- protrusive boards；5- transparent cover plates；6- feels
Light area；7- grooves；8- composite cushions；9- metal conducting layers；10- conductive adhesive layers；801- aluminium layers；802- nickel dams；803- is protected
Metal level；804- titanium copper layers.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, every other embodiment that those of ordinary skill in the art are obtained all belongs to
In the scope of the utility model protection.
As shown in Fig. 1 to 2, a kind of imaging sensor described in the utility model embodiment, including PCB substrate 1 and sensing
Chip 2, the periphery of the PCB substrate 1 are provided with support cofferdam 3, protrusive board 4 are provided with the middle part of the medial surface in the support cofferdam 3,
The lateral surface in the support cofferdam 3 is evenly arranged with some gaps 301；The upper surface of the protrusive board 4 is provided with transparent cover plate 5；
The upper surface of the sensing chip 2 is provided with photosensitive area 6, and the upper surface edge of the sensing chip 6 sets fluted 7, institute
State and composite cushion 8 is provided with groove 7, the top of the composite cushion 8 is connected with metal conducting layer 9；The metal conducting layer 9
Conductive adhesive layer 10 is provided between the protrusive board 4 and between the support cofferdam 3 and the PCB substrate 1.
In a specific embodiment of the present utility model, the gap 301 is the linear pattern that is parallel to each other, the gap
301 depth is less than the half of the thickness in support cofferdam 3.
In a specific embodiment of the present utility model, the depth of the groove 7 is more than the height of composite cushion 8.
In a specific embodiment of the present utility model, the composite cushion 8 be followed successively by from the bottom to top aluminium layer 801,
Nickel dam 802, guard metal layer 803, titanium copper layer 804.
In a specific embodiment of the present utility model, the guard metal layer 803 is nickel-gold layer.
The utility model sets fluted 7 in the upper surface edge of sensing chip 6 when specifically used, in groove 7
Composite cushion 8 is provided with, can prevent metal layer from breakpoint occur, between transparent cover plate 5 and sensing chip 6 and sensing chip
Cavity is each formed between 6 and PCB substrate 1, and supports the lateral surface in cofferdam 3 to be provided with some gaps 301, image biography can be improved
The thermal-shock resistance and water vapor impact of sensor.
Embodiment described above is only preferred embodiment of the present utility model, not to limit the utility model,
All any modification, equivalent substitution and improvements within the spirit and principles of the utility model, made etc., should be included in this reality
Within new protection domain.
Claims (5)
1. a kind of imaging sensor, including PCB substrate（1）And sensing chip（2）, it is characterised in that：The PCB substrate（1）'s
Periphery is provided with support cofferdam（3）, the support cofferdam（3）Medial surface in the middle part of be provided with protrusive board（4）, the support cofferdam
（3）Lateral surface be evenly arranged with some gaps（301）；The protrusive board（4）Upper surface be provided with transparent cover plate（5）；It is described
Sensing chip（2）Upper surface be provided with photosensitive area（6）, the sensing chip（2）Upper surface edge set it is fluted
（7）, the groove（7）Inside it is provided with composite cushion（8）, the composite cushion（8）Top be connected with metal conducting layer（9）；
The metal conducting layer（9）With the protrusive board（4）Between and the support cofferdam（3）With the PCB substrate（1）Between be all provided with
It is equipped with conductive adhesive layer（10）.
A kind of 2. imaging sensor according to claim 1, it is characterised in that：The gap（301）It is parallel to each other
Linear pattern, the gap（301）Depth be less than support cofferdam（3）Thickness half.
A kind of 3. imaging sensor according to claim 1, it is characterised in that：The groove（7）Depth be more than it is compound
Bed course（8）Height.
A kind of 4. imaging sensor according to claim 3, it is characterised in that：The composite cushion（8）Bottom right it is supreme according to
Secondary is aluminium layer（801）, nickel dam（802）, guard metal layer（803）, titanium copper layer（804）.
A kind of 5. imaging sensor according to claim 4, it is characterised in that：The guard metal layer（803）For nickel gold
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720508711.9U CN206742223U (en) | 2017-05-09 | 2017-05-09 | A kind of imaging sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720508711.9U CN206742223U (en) | 2017-05-09 | 2017-05-09 | A kind of imaging sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206742223U true CN206742223U (en) | 2017-12-12 |
Family
ID=60565052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720508711.9U Active CN206742223U (en) | 2017-05-09 | 2017-05-09 | A kind of imaging sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206742223U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341796A (en) * | 2020-02-26 | 2020-06-26 | 南通智通达微电子物联网有限公司 | Fan-out type packaging method of image sensor |
-
2017
- 2017-05-09 CN CN201720508711.9U patent/CN206742223U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341796A (en) * | 2020-02-26 | 2020-06-26 | 南通智通达微电子物联网有限公司 | Fan-out type packaging method of image sensor |
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