CN206472371U - A kind of single-layer printed circuit plate - Google Patents
A kind of single-layer printed circuit plate Download PDFInfo
- Publication number
- CN206472371U CN206472371U CN201720113689.8U CN201720113689U CN206472371U CN 206472371 U CN206472371 U CN 206472371U CN 201720113689 U CN201720113689 U CN 201720113689U CN 206472371 U CN206472371 U CN 206472371U
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Abstract
The utility model provides a kind of single layer printed circuit plate, the single layer printed circuit plate includes circuit board body, some first holes perpendicular to the direction of plate face are provided with body, first resistor ink is filled with the first hole, the second hole is provided with first resistor ink, the first dielectric ink is filled with the second hole, first resistor ink connects to form serial or parallel connection structure by the metallic conductor on body, simultaneously, printed circuit board of the present utility model also includes basic unit, embedded capacitance is provided with basic unit, so as to reduce the consumption to form capacitor dielectric layer material requested, reduce the processing cost of electric capacity, process repeatability is preferable.
Description
Technical field
The utility model is related to art of printed circuit boards, more particularly to a kind of printed circuit board (PCB) of Embedded capacitance.
Background technology
With electronic product compactization increasingly, and its function higher growth requirement of multimode integrated level, make
For the motherboard of mounting related components：Printed circuit board (PCB:Print circuit board), its figure is more complicated fine, together
When more product requirements can give active chip reserved more attachment spaces, therefore embedment passive device technology is increasingly becoming print
A kind of inexorable trend of circuit board development processed.Embedment passive device technology can not only reduce attachment expense, and same design
Under the conditions of can reduce plate face size；The shortening of signal transmission distance can reduce electromagnetic interference, improve signal integrity；While device
Solder joint number reduces and is greatly improved product reliability.At present, although the silk-screen planar resistor of in the market is cheap, can significantly drop
The cost of low Embedded capacitance circuit board, but its complex process, silkscreen precision control high to the silk-screen performance requirement of resistance printing ink
Ability is poor, with the increase of resistance, and control ability is gradually reduced, and it has been extremely difficult that current industry, which can be controlled 20%, and
And in silk-screen printing process, resistance printing ink can the exhibition of oozing in the in-plane direction (exhibition of oozing be resistance printing ink in press and uncured forward direction oil
The irregular phenomenon in a kind of edge that black outer extends and presented, is somewhat similarly to ink and oozes paper phenomenon) bring micro- to circuit board
The bad phenomenon such as short, short-circuit.
Utility model content
The utility model aims to provide a kind of single-layer printed circuit plate, and by setting corresponding cavity, electric capacity is embedded to
In single-layer printed circuit plate, it can be very good to control the thickness of dielectric layer so that embedded capacitance has more accurate capacitance.
The technical solution of the utility model is as follows：
A kind of single-layer printed circuit plate, it is characterised in that the single-layer printed circuit plate includes circuit board body and setting
Embedded capacitance in the single layer printed circuit plate basic unit, wherein,
Body is provided with some first holes perpendicular to the direction of plate face, filled with first resistor oil in the first hole
Ink, is provided with the second hole on first resistor ink, and the first dielectric ink is filled with the second hole, and first resistor ink leads to
The metallic conductor crossed on body connects to form serial or parallel connection structure；
The bottom electrode metal level of the embedded capacitance is in contact with carrying out layers of copper, the upper electrode metal of the embedded capacitance
Layer and copper clad layers mutually insulated, the dielectric layer of the embedded capacitance be located at upper electrode metal layer and bottom electrode metal level it
Between.
Further, if in the depth and body of first hole single-layer insulation material layer thickness or dried layer insulation material
The thickness of the bed of material is adapted.
Further, the dielectric layer material of the embedded capacitance should select dielectric constant high dielectric material as far as possible.
Further, the dielectric material is heat-curable epoxy resin.
The utility model reduces attachment expense, and same design condition in circuit board vertical direction embedding resistance, electric capacity
Under can reduce plate face size；The shortening of signal transmission distance can reduce electromagnetic interference, improve signal integrity；While device solder joint
Number reduction is greatly improved product reliability；Reduce cost, the utility model both without expensive metal thin film resistor, without
Price high silk-screen planar resistor ink relatively (meets high-precision silk-screen demand), reduces the processing cost of electric capacity, technique is repeated
Property is preferable.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model
Embodiment
As shown in fig.1, a kind of printed circuit board of the present utility model, including body 1, along vertical plate face on body 1
Direction be provided with some first holes or the first blind hole 2, be filled with first resistor ink 3 in the first hole or the first blind hole 2,
The second hole or the second blind hole 4 are provided with first resistor ink 3, it is exhausted filled with first in the second hole or the second blind hole 4
Edge ink or electrically conductive ink 5, first resistor ink 3 form serial or parallel connection structure by the connection of metallic conductor 6 on body 1.
In the present embodiment, the body 1 is single layer printed circuit plate, double layer printed circuit plate or multilayer printed circuit
Plate.Meanwhile, if the depth of the first through hole or the first blind hole 2 and the thickness or dried layer of single-layer insulation material layer on body 1 are exhausted
The thickness of edge material layer is adapted, depending on real needs.
Wherein, when filling ink in hole, resistance printing ink is filled in hole；Consent mode can using manual consent or
Using semi-automatic hole plugging machine, or full-automatic hole plugging machine is used, or use vacuum taphole machine, for the hole less than 0.2mm, preferential choosing
Use vacuum taphole mode, resistance printing ink mainly includes two kinds of compositions, i.e. resin and conductive compositions, resin can be epoxy resin,
Phenolic resin, polyimides or BT resins etc., conductive compositions can be carbon dust, graphene particles, copper powder, silver powder etc., solidification
Even if resistance printing ink is fully cured, solidification temperature is higher than plexiglas inversion temperature in ink；After after resistance printing ink solidification, in electricity
Drilled on oil resistance ink, drilling can be realized by machine drilling or laser drill mode, laser drill can be swashed by infrared
Drill finish hole or Ultra-Violet Laser drilling are realized, for the through hole less than 0.1mm, preferably laser drill, and the depth of drilling can be with
The same depth in hole of resistance printing ink is filled in, the depth in the hole of resistance printing ink is might be less that, i.e., be able to can also both be bored blind with holes drilled through
Hole；Dielectric ink or electrically conductive ink are filled in hole, consent mode can use manual consent or use semi-automatic hole plugging machine,
Or full-automatic hole plugging machine is used, or vacuum taphole machine is used, it is preferential to select vacuum taphole mode for the hole less than 0.2mm, absolutely
Edge ink or electrically conductive ink mainly include two kinds of compositions, i.e. resin and filler, resin can be epoxy resin, phenolic resin,
Polyimides or BT resins etc., filler can be silica, talcum powder or aluminum oxide etc., and electrically conductive ink mainly includes two kinds
Composition, i.e. resin and metal packing, resin can be epoxy resin, phenolic resin, polyimides or BT resins etc., and metal is filled out
Material can be copper powder, silver powder or carbon dust etc., and the resistivity of electrically conductive ink is much smaller than resistance printing ink resistivity, and electrically conductive ink is produced
Resistance can ignore.Even if solidification dielectric ink or electrically conductive ink are fully cured, solidification temperature is higher than resin glass in ink
Glass inversion temperature；After dielectric ink or electrically conductive ink solidification after, grinding, remove protrusion resistance printing ink and dielectric ink or
Electrically conductive ink, makes each ink equal with plate surface, and removes the ink in the outer plate surface of hole；Lapping mode can be using hair formula mill
Brush, mill cloth or ceramic polish-brush etc., preferably ceramic polish-brush；Metallization, makes resistance printing ink be electrically connected with metallic conductor；Metallization is
Layer of metal is plated in the outer surface of plate, metal can be the metallization of electroless coating formula or the metallization of plating formula.
When carrying out the embedment of embedded capacitance 7, it will need to be embedded in the anticorrosive dry of the region of embedded capacitance in circuit board
Film, then etch away sections shoe layers of copper, forms groove, and layers of copper is carried out as the lower electricity of embedded capacitance in the remaining part of bottom portion of groove
Pole metal level, then the filled media material in groove.By photoetching process so that embedded capacitance upper electrode metal layer with
Other carry out the metal level insulation of layers of copper surface deposition.
The utility model reduces attachment expense, and same design condition in circuit board vertical direction embedding resistance, electric capacity
Under can reduce plate face size；The shortening of signal transmission distance can reduce electromagnetic interference, improve signal integrity；While device solder joint
Number reduction is greatly improved product reliability；Reduce cost, the utility model both without expensive metal thin film resistor, without
Price high silk-screen planar resistor ink relatively (meets high-precision silk-screen demand), reduces the processing cost of electric capacity, technique is repeated
Property is preferable.
Embodiment provided above is better embodiment of the present utility model, only for convenient explanation the utility model, and
It is non-to make any formal limitation, any those of ordinary skill in the art to the utility model, if not departing from
The utility model is carried in the range of technical characteristic, is locally changed or is repaiied using made by the utility model disclosed technology content
The equivalent embodiment of decorations, and without departing from the technical characteristic content of the present invention, still fall within the model of the utility model technical characteristic
In enclosing.
Claims (4)
1. a kind of single-layer printed circuit plate, it is characterised in that the single-layer printed circuit plate includes circuit board body and is arranged on
Embedded capacitance in the single layer printed circuit plate basic unit, wherein,
Body is provided with some first holes perpendicular to the direction of plate face, and first resistor ink is filled with the first hole,
The second hole is provided with first resistor ink, the first dielectric ink is filled with the second hole, first resistor ink passes through
Metallic conductor on body connects to form serial or parallel connection structure；
The bottom electrode metal level of the embedded capacitance is in contact with carrying out layers of copper, the upper electrode metal of embedded capacitance layer with
Copper clad layers mutually insulated, the dielectric layer of the embedded capacitance is located between upper electrode metal layer and bottom electrode metal level.
2. single-layer printed circuit plate according to claim 1, it is characterised in that in the depth and body of first hole
If the thickness of single-layer insulation material layer or the thickness of dried layer insulation material layer are adapted.
3. single-layer printed circuit plate according to claim 1, it is characterised in that the dielectric layer material of the embedded capacitance
Dielectric constant high dielectric material as far as possible should be selected.
4. single-layer printed circuit plate according to claim 3, it is characterised in that the dielectric material is heat curing epoxy tree
Fat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720113689.8U CN206472371U (en) | 2017-02-07 | 2017-02-07 | A kind of single-layer printed circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720113689.8U CN206472371U (en) | 2017-02-07 | 2017-02-07 | A kind of single-layer printed circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206472371U true CN206472371U (en) | 2017-09-05 |
Family
ID=59703242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720113689.8U Expired - Fee Related CN206472371U (en) | 2017-02-07 | 2017-02-07 | A kind of single-layer printed circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206472371U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022222282A1 (en) * | 2021-04-20 | 2022-10-27 | 梅州市志浩电子科技有限公司 | Method for manufacturing circuit board in which capacitor and resistor are embedded, and circuit board |
-
2017
- 2017-02-07 CN CN201720113689.8U patent/CN206472371U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022222282A1 (en) * | 2021-04-20 | 2022-10-27 | 梅州市志浩电子科技有限公司 | Method for manufacturing circuit board in which capacitor and resistor are embedded, and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 516100 Lianhu, left side of Yangping Road, Lianhu group, Licun village, Yangcun Town, BOLUO County, Huizhou City, Guangdong Province Patentee after: CHINA BRILLIANT ELECTRONIC Co.,Ltd. Address before: 516000, Guangdong, Huizhou province Boluo County town of Yang Lake Industrial Zone Patentee before: CHINA BRILLIANT ELECTRONIC Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170905 Termination date: 20220207 |