CN206312172U - Layering fingerprint module - Google Patents
Layering fingerprint module Download PDFInfo
- Publication number
- CN206312172U CN206312172U CN201621257779.6U CN201621257779U CN206312172U CN 206312172 U CN206312172 U CN 206312172U CN 201621257779 U CN201621257779 U CN 201621257779U CN 206312172 U CN206312172 U CN 206312172U
- Authority
- CN
- China
- Prior art keywords
- becket
- fingerprint recognition
- recognition chip
- connector
- substrate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of layering fingerprint module, its fingerprint recognition chip, circuit substrate, connector and becket, one becket is installed on the circuit substrate surface opposite with connector, the left end of the becket, right-hand member bottom are respectively provided with outside outward flange, the upper surface bottom of the becket has inside inward flange, and the fingerprint recognition chip is installed in becket and horizontally disposed with inward flange；The central region of circuit substrate further includes upper substrate layer and lower substrate layer between connector and fingerprint recognition chip, the upper surface of this upper substrate layer and the lower surface of lower substrate layer are covered with circuitous pattern layer, have gap between the upper substrate layer surface relative with lower substrate layer.The utility model substrate thickness is thinning, improves flexibility, increases purpose resistant to bending to reach, meanwhile, quoit is toward inner side boss long, it is ensured that quoit is Nian Jie with FPC firm.
Description
Technical field
The utility model is related to a kind of layering fingerprint module, belongs to technical field of semiconductor encapsulation.
Background technology
Current fingerprint recognition module is widely used to the electronic product industry such as mobile phone, flat board, notebook, conventional fingerprint mould
Group encapsulating structure includes：Sealer, fingerprint chip, component, connector and substrate, fingerprint chip by conductive material with
Substrate connection, component is connected by connector by scolding tin and substrate connection, substrate with mainboard.
The assembling process of fingerprint recognition module is：Step one, by module group assembling to mobile phone battery cover or TP；Step 2, again
Insert the connector into mainboard；Step 3, finally rear shell and fore shell fixed, to determine position of the module in whole machine.It is existing at present
Substrate reduces the flexibility of substrate to a certain extent for double-deck or multilayer line layer, and each layer are bonded together in having module,
Increasing bending causes the risk of rupture of line.
The content of the invention
The utility model purpose is to provide a kind of layering fingerprint module, and the layering fingerprint module group substrates thickness is thinning, to reach
To improving flexibility, increase purpose resistant to bending, meanwhile, quoit is toward inner side boss long, it is ensured that quoit is Nian Jie with FPC firm
Gu.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：One kind layering fingerprint module, including fingerprint is known
Other chip, circuit substrate, connector and becket, the fingerprint recognition chip are located at circuit substrate middle part and by scolding tin electricity
Connection, the fingerprint recognition chip surface opposite with circuit substrate is covered with a protective layer, the fingerprint recognition chip outside
Fluid sealant is provided between face and becket medial surface；
The connector is installed on circuit substrate rear end, and this connector and fingerprint recognition chip are located at circuit substrate two respectively
Side a, becket is installed on the circuit substrate surface opposite with connector, the left end of the becket, right-hand member bottom be respectively provided with to
Outer outward flange, the upper surface bottom of the becket has inside inward flange, and the fingerprint recognition chip is installed on metal
In ring and horizontally disposed with inward flange, the protective layer is covered in fingerprint recognition chip and inward flange top；
The central region of circuit substrate further includes upper substrate layer with between connector and fingerprint recognition chip
Substrate layer, the upper surface of this upper substrate layer and the lower surface of lower substrate layer are covered with circuitous pattern layer, and the upper substrate layer is with
There is gap between the relative surface of substrate layer.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the fingerprint recognition chip form is the length that four sides have the square of rounding, rounded
Square, track type or rhombus.
2. in such scheme, be provided with chamfered section at the left end of the becket, right-hand member and lower end base inner side, it is described in
Flange bottom is provided with chamfered section at inner side.
3. in such scheme, an electronic component is located at circuit substrate near the region of connector.
4. in such scheme, the lower surface bottom of the becket has outside outward flange.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. the utility model is layered fingerprint module, and it is located between connector and fingerprint recognition chip in circuit substrate
Portion region further includes upper substrate layer and lower substrate layer, and the upper surface of this upper substrate layer and the lower surface of lower substrate layer are covered with
Circuitous pattern layer, has gap between the upper substrate layer surface relative with lower substrate layer, it is ensureing that performance, profile are constant
In the case of, the central region of circuit substrate uses layered shaping between connector and fingerprint recognition chip, to reach electricity
The characteristics of middle part relatively small thickness, raising flexibility, increase bending resistance of base board.
2. the utility model layering fingerprint module, the left end of its becket, right-hand member and lower surface bottom are respectively provided with outside
Outward flange, the upper surface bottom of the becket has inside inward flange, and the fingerprint recognition chip is installed in becket
And it is horizontally disposed with inward flange, the space that fingerprint module takes equipment is reduced, allow the parts such as the TP of equipment more fully
Utilization space, effectively increases the accounting of screen effective display area domain, meanwhile, quoit is toward inner side boss long, it is ensured that quoit
It is Nian Jie with FPC firm.
Brief description of the drawings
Accompanying drawing 1 is the structural representation one that the utility model is layered fingerprint module；
Accompanying drawing 2 is the structural representation two that the utility model is layered fingerprint module；
Accompanying drawing 3 is the partial structural diagram of accompanying drawing 2.
In the figures above：In the figures above：1st, fingerprint recognition chip；2nd, circuit substrate；3rd, connector；4th, becket；5、
Protective layer；6th, fluid sealant；7th, outward flange；8th, inward flange；9th, electronic component；10th, chamfered section；11st, sheet metal；12nd, upper substrate
Layer；13rd, lower substrate layer；14th, circuitous pattern layer；15th, gap.
Specific embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：One kind layering fingerprint module, including fingerprint recognition chip 1, circuit substrate 2, connector 3 and becket
4, the fingerprint recognition chip 1 is located at the middle part of circuit substrate 2 and electrically connect by scolding tin, the fingerprint recognition chip 1 with it is electric
The opposite surface of base board 2 is covered with a protective layer 5, is set between the lateral surface of fingerprint recognition chip 1 and the medial surface of becket 4
It is equipped with fluid sealant 6；
The connector 3 is installed on the rear end of circuit substrate 2, and this connector 3 and fingerprint recognition chip 1 are located at circuit base respectively
The both sides of plate 2 a, sheet metal 11 is installed on the surface opposite with connector 3 of circuit substrate 2, the left end of the becket 4, right-hand member and
Lower surface bottom is respectively provided with outside outward flange 7, and the upper surface bottom of the becket 4 has inside inward flange 8, the finger
Line identification chip 1 is installed in becket 4 and horizontally disposed with inward flange 8, and the protective layer 5 is covered in fingerprint recognition chip 1
With the top of inward flange 8；
The central region of circuit substrate 2 further includes upper substrate layer 12 between connector 3 and fingerprint recognition chip 1
With lower substrate layer 13, the upper surface of this upper substrate layer 12 and the lower surface of lower substrate layer 13 are covered with circuitous pattern layer 14, described
There is gap 15 between the surface relative with lower substrate layer 13 of upper substrate layer 12.
Above-mentioned fingerprint recognition chip 1 is shaped as four sides has the square of rounding.
The left end of above-mentioned becket 4, right-hand member and lower end base are provided with chamfered section at inner side, at the inward flange bottom inside
It is provided with chamfered section 10.
One electronic component 9 is located at circuit substrate 2 near the region of connector 3；Above-mentioned protective layer 5 is ceramic cover plate.
Embodiment 2：One kind layering fingerprint module, including fingerprint recognition chip 1, circuit substrate 2, connector 3 and becket
4, the fingerprint recognition chip 1 is located at the middle part of circuit substrate 2 and electrically connect by scolding tin, the fingerprint recognition chip 1 with it is electric
The opposite surface of base board 2 is covered with a protective layer 5, is set between the lateral surface of fingerprint recognition chip 1 and the medial surface of becket 4
It is equipped with fluid sealant 6；
The connector 3 is installed on the rear end of circuit substrate 2, and this connector 3 and fingerprint recognition chip 1 are located at circuit base respectively
The both sides of plate 2 a, sheet metal 11 is installed on the surface opposite with connector 3 of circuit substrate 2, the left end of the becket 4, right-hand member and
Lower surface bottom is respectively provided with outside outward flange 7, and the upper surface bottom of the becket 4 has inside inward flange 8, the finger
Line identification chip 1 is installed in becket 4 and horizontally disposed with inward flange 8, and the protective layer 5 is covered in fingerprint recognition chip 1
With the top of inward flange 8；
The central region of circuit substrate 2 further includes upper substrate layer 12 between connector 3 and fingerprint recognition chip 1
With lower substrate layer 13, the upper surface of this upper substrate layer 12 and the lower surface of lower substrate layer 13 are covered with circuitous pattern layer 14, described
There is gap 15 between the surface relative with lower substrate layer 13 of upper substrate layer 12.
Above-mentioned fingerprint recognition chip 1 is shaped as the rectangle of rounded.
The left end of above-mentioned becket 4, right-hand member and lower end base are provided with chamfered section at inner side, at the inward flange bottom inside
It is provided with chamfered section；Above-mentioned protective layer 5 is sapphire cover plate.
During using above-mentioned layering fingerprint module, its middle region for being located at circuit substrate between connector and fingerprint recognition chip
Domain further includes upper substrate layer and lower substrate layer, and the upper surface of this upper substrate layer and the lower surface of lower substrate layer are covered with circuit
Graph layer, has gap between the upper substrate layer surface relative with lower substrate layer, it is ensureing the constant feelings of performance, profile
Under condition, the central region of circuit substrate uses layered shaping between connector and fingerprint recognition chip, to reach circuit base
The characteristics of middle part relatively small thickness, raising flexibility, increase bending resistance of plate；Secondly, the left end of its becket, right-hand member and lower end
Face bottom is respectively provided with outside outward flange, and the upper surface bottom of the becket has inside inward flange, the fingerprint recognition
Chip is installed in becket and horizontally disposed with inward flange, reduces the space that fingerprint module takes equipment, makes the TP of equipment
Deng part can more fully utilization space, effectively increase the accounting of screen effective display area domain, meanwhile, quoit is toward inner side
Boss long, it is ensured that quoit is Nian Jie with FPC firmly.
Above-described embodiment only to illustrate technology design of the present utility model and feature, technique is familiar with its object is to allow
Personage will appreciate that content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover protection domain of the present utility model it
It is interior.
Claims (6)
- It is 1. a kind of to be layered fingerprint module, it is characterised in that：Including fingerprint recognition chip（1）, circuit substrate（2）, connector（3）With Becket（4）, the fingerprint recognition chip（1）Positioned at circuit substrate（2）Middle part is simultaneously electrically connected by scolding tin, and the fingerprint is known Other chip（1）With circuit substrate（2）Opposite surface is covered with a protective layer（5）, the fingerprint recognition chip（1）Lateral surface with Becket（4）Fluid sealant is provided between medial surface（6）；The connector（3）It is installed on circuit substrate（2）Rear end, this connector（3）With fingerprint recognition chip（1）Electricity is located at respectively Base board（2）Both sides, a sheet metal（11）It is installed on circuit substrate（2）With connector（3）Opposite surface, the becket （4）Left end, right-hand member bottom be respectively provided with outside outward flange（7）, the becket（4）Upper surface bottom have it is inside interior Flange（8）, the fingerprint recognition chip（1）It is installed on becket（4）Interior and and inward flange（8）It is horizontally disposed, the protective layer （5）It is covered in fingerprint recognition chip（1）And inward flange（8）Top；Positioned at connector（3）With fingerprint recognition chip（1）Between circuit substrate（2）Central region further include upper substrate layer （12）And lower substrate layer（13）, this upper substrate layer（12）Upper surface and lower substrate layer（13）Lower surface be covered with circuitous pattern Layer（14）, the upper substrate layer（12）With lower substrate layer（13）There is gap between relative surface（15）.
- It is 2. according to claim 1 to be layered fingerprint module, it is characterised in that：The fingerprint recognition chip（1）It is shaped as four While having the square of rounding, the rectangle of rounded, track type or rhombus.
- It is 3. according to claim 1 to be layered fingerprint module, it is characterised in that：The becket（4）Left end, right-hand member and under Chamfered section is provided with the bottom inside of end, chamfered section is provided with the inward flange bottom inside（10）.
- It is 4. according to claim 1 to be layered fingerprint module, it is characterised in that：The protective layer（5）It is glass cover-plate, Lan Bao Stone cover plate, ceramic cover plate or ink layer.
- It is 5. according to claim 1 to be layered fingerprint module, it is characterised in that：One electronic component（9）Positioned at circuit substrate （2）Near connector（3）Region.
- It is 6. according to claim 1 to be layered fingerprint module, it is characterised in that：The becket（4）Lower surface bottom tool There is outside outward flange（7）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621257779.6U CN206312172U (en) | 2016-11-23 | 2016-11-23 | Layering fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621257779.6U CN206312172U (en) | 2016-11-23 | 2016-11-23 | Layering fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206312172U true CN206312172U (en) | 2017-07-07 |
Family
ID=59244146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621257779.6U Expired - Fee Related CN206312172U (en) | 2016-11-23 | 2016-11-23 | Layering fingerprint module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206312172U (en) |
-
2016
- 2016-11-23 CN CN201621257779.6U patent/CN206312172U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170707 Termination date: 20181123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |