TWI530971B - Wings coil and its making method - Google Patents
Wings coil and its making method Download PDFInfo
- Publication number
- TWI530971B TWI530971B TW104124571A TW104124571A TWI530971B TW I530971 B TWI530971 B TW I530971B TW 104124571 A TW104124571 A TW 104124571A TW 104124571 A TW104124571 A TW 104124571A TW I530971 B TWI530971 B TW I530971B
- Authority
- TW
- Taiwan
- Prior art keywords
- magnetic induction
- soft board
- board
- dielectric layer
- induction coil
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 15
- 230000006698 induction Effects 0.000 claims description 110
- 239000010410 layer Substances 0.000 claims description 98
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 40
- 229910052737 gold Inorganic materials 0.000 claims description 40
- 239000010931 gold Substances 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 19
- 239000011247 coating layer Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 239000003989 dielectric material Substances 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000012777 electrically insulating material Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Landscapes
- General Induction Heating (AREA)
- Coils Or Transformers For Communication (AREA)
Description
本發明係有關於一種翅膀線圈及其製作方法，尤其是利用具可加熱壓合特性的連接栓以緊密結合上部連接墊及下部連接墊，而且利用上部軟板的摺線以使得上部軟板的二側邊區很容易彎折，而提供具可撓曲、可彎折及線圈功能的翅膀線圈。 The invention relates to a wing coil and a manufacturing method thereof, in particular to using a connecting bolt with heat pressable characteristics to tightly bond an upper connecting mat and a lower connecting mat, and utilizing a fold line of the upper soft board to make the upper soft board The side areas are easily bent and provide wing coils with flexible, bendable and coil functions.
一般而言，任何電器產品都需要適當的電路板以承載並連接各種電子元件，通常是使用具有良好機械強度及電氣絕緣的硬質電路板，比如具高度電氣絕緣性的環氧樹脂基板。不過硬質電路板為平板狀，所以無法彎折以配合實際應用，或節省整體空間，很難應用於像手機這一類在空間上相當有限的領域。因此，需要使用具可彎折、可撓曲的軟質電路板，一般稱為軟板，而目前軟板的製作技術已相當成熟。 In general, any electrical product requires a suitable circuit board to carry and connect various electronic components, typically using a rigid circuit board with good mechanical strength and electrical insulation, such as an epoxy substrate with high electrical insulation. However, the rigid circuit board is flat, so it cannot be bent to match the actual application, or the overall space is saved, and it is difficult to apply to a space-constrained field such as a mobile phone. Therefore, it is necessary to use a flexible circuit board with bendable and flexible, which is generally called a soft board, and the current soft board manufacturing technology is quite mature.
此外，由於電氣線路上常需要線圈以提供電感功能，比如磁感應線圈，而傳統的技術是利用金屬銅或銅合金，藉蝕刻或電鍍方式形成螺旋圖案，當作線圈，並藉化學蝕刻、機械加工或雷射鑽孔而形成孔洞。因現有的線圈及軟板都是不同廠商製作，而且線圈及軟板在出廠時已有打孔，所以需要貼合加工，將線圈及軟板相互貼合以完成所需載板，增加製作程序，而且在貼合線圈及軟板時，很容易造成線圈的孔洞與軟板的孔洞之間發生對位公差的問題，亦即對位不準，嚴重影響整體載板的電氣特性。 In addition, since coils are often required on electrical circuits to provide inductive functions, such as magnetic induction coils, conventional techniques use metallic copper or copper alloys to form spiral patterns by etching or electroplating, as coils, and by chemical etching and machining. Or laser drilling to form holes. Since the existing coils and flexible boards are made by different manufacturers, and the coils and the flexible boards are already punched at the factory, it is necessary to perform the lamination processing, and the coils and the soft boards are attached to each other to complete the required carrier board, and the production procedure is increased. Moreover, when the coil and the flexible board are attached, it is easy to cause a problem of alignment tolerance between the hole of the coil and the hole of the soft board, that is, the alignment is not accurate, which seriously affects the electrical characteristics of the overall carrier.
再者，傳統上可將多個磁感應線圈製作在同一平面上，以加大磁感應線圈的感應範圍，不過會佔據有限的面積，或加大外觀面積，非常不利於實際的應用。 Furthermore, a plurality of magnetic induction coils can be conventionally fabricated on the same plane to increase the sensing range of the magnetic induction coil, but occupy a limited area or increase the appearance area, which is highly disadvantageous for practical applications.
因此，很需要一種新式的翅膀線圈及其製作方法，利用具可加熱壓合特性的連接栓以緊密結合上部連接墊及下部連接墊，而且利用上 部軟板的摺線以使得上部軟板的二側邊區很容易彎折，而提供具可撓曲、可彎折及線圈功能的翅膀線圈，尤其是，上部磁感應線圈、下部磁感應線圈及底部磁感應線圈是整合成多層堆疊結構，不僅可避免貼合加工時發生對位公差的情形，還能增強磁感應功效，進而解決上述習用技術的問題。 Therefore, there is a need for a new type of wing coil and a manufacturing method thereof, which utilize a connecting bolt having heat-pressable pressing characteristics to tightly bond the upper connecting pad and the lower connecting pad, and utilize the upper The fold line of the soft board is such that the two side edges of the upper soft board are easily bent, and the wing coils with flexible, bendable and coil functions are provided, in particular, the upper magnetic induction coil, the lower magnetic induction coil and the bottom magnetic induction The coils are integrated into a multi-layer stack structure, which not only avoids the occurrence of alignment tolerances during the bonding process, but also enhances the magnetic induction effect, thereby solving the problems of the above-mentioned conventional techniques.
本發明之主要目的在於提供一種翅膀線圈，包括上部軟板、至少一上部磁感應線圈、至少一上部連接墊、下部軟板、至少一下部磁感應線圈、至少一下部連接墊、至少一金手指、介電層以及至少一連接栓，用以提供具可撓曲、可彎折以及線圈功能的特性。整體而言，本發明翅膀線圈的中間區的厚度較厚且向下凸出，而翅膀線圈的二側邊區較薄，因而具有翅膀狀的外觀，且翅膀線圈的中間區具有中間孔洞。 The main object of the present invention is to provide a wing coil, comprising an upper soft board, at least one upper magnetic induction coil, at least one upper connection pad, a lower soft board, at least a lower magnetic induction coil, at least a lower connection pad, at least one gold finger, and a medium The electrical layer and the at least one connecting plug provide characteristics that are flexible, bendable, and coil functional. In general, the intermediate portion of the wing coil of the present invention is thicker and convex downward, while the two side edges of the wing coil are thinner and thus have a wing-like appearance, and the intermediate portion of the wing coil has an intermediate hole.
上部軟板及下部軟板為可撓曲性的基板，是由電氣絕緣材料構成，而介電層是包夾在上部軟板及下部軟板之間，且上部軟板的橫向尺寸是大於下部軟板的橫向尺寸。 The upper soft board and the lower soft board are flexible substrates, which are made of an electrically insulating material, and the dielectric layer is sandwiched between the upper soft board and the lower soft board, and the horizontal size of the upper soft board is larger than the lower part. The lateral dimensions of the soft board.
上部磁感應線圈及下部磁感應線圈是分別包埋在上部軟板及下部軟板內，並具有螺旋狀，其中上部磁感應線圈是靠近上部軟板的上表面，而下部磁感應線圈是靠近下部軟板的下表面。此外，上部磁感應線圈及下部磁感應線圈是配置在中間孔洞的周圍，並由介電層隔離開。 The upper magnetic induction coil and the lower magnetic induction coil are respectively embedded in the upper soft board and the lower soft board, and have a spiral shape, wherein the upper magnetic induction coil is close to the upper surface of the upper soft board, and the lower magnetic induction coil is close to the lower soft board. surface. In addition, the upper magnetic induction coil and the lower magnetic induction coil are disposed around the intermediate hole and are separated by a dielectric layer.
金手指是配置在上部軟板的二側邊區上，並電氣連接至相對應的上部磁感應線圈，而每個上部連接墊是電氣連接至相對應的上部磁感應線圈，且每個下部連接墊是電氣連接至相對應的下部磁感應線圈，尤其是上部連接墊及相對應下部連接墊在垂直方向上是相互對齊。 The gold fingers are disposed on the two side edges of the upper flexible board and are electrically connected to the corresponding upper magnetic induction coils, and each upper connection pad is electrically connected to the corresponding upper magnetic induction coil, and each lower connection pad is Electrically connected to the corresponding lower magnetic induction coil, especially the upper connection pad and the corresponding lower connection pad are aligned with each other in the vertical direction.
連接栓具有可加熱而壓合的特性，可填塞到上部連接墊及下部連接墊之間，或是先在上部連接墊的下表面形成連接栓，或將連接栓先貼附到上部連接墊的下表面，再經加熱、壓合處理以使得連接栓結合上部連接墊及下部連接墊。 The connecting plug has the characteristics of being heatable and pressed, and can be stuffed between the upper connecting pad and the lower connecting pad, or first forming a connecting bolt on the lower surface of the upper connecting pad, or attaching the connecting plug to the upper connecting pad first. The lower surface is further heated and pressed to form the connecting plug to bond the upper connecting pad and the lower connecting pad.
因此，本發明的金手指、上部磁感應線圈、上部連接墊、下部連接墊、連接栓、下部連接墊及下部磁感應線圈實質上是電氣連接。 Therefore, the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad, and the lower magnetic induction coil of the present invention are substantially electrically connected.
再者，上部軟板的下表面在與下部軟板的交接處個別具有摺 線，其中摺線具有向內或向上凹陷的溝槽狀，可使得上部軟板的二側邊區容易彎折，比如向上彎折或向下彎折，而且介電層未延伸到摺線，亦即溝槽狀的摺線不具有介電層，因此本發明的翅膀線圈具有可彎折性、可撓曲性。 Furthermore, the lower surface of the upper flexible board has an individual fold at the intersection with the lower soft board. a line, wherein the fold line has a groove shape that is recessed inward or upward, so that the two side edges of the upper flexible board are easily bent, such as bending upward or downward, and the dielectric layer does not extend to the fold line, that is, Since the groove-shaped fold line does not have a dielectric layer, the wing coil of the present invention has bendability and flexibility.
本發明之另一目的在於提供一種翅膀線圈的製作方法，包括依序進行備製上部軟板、備製介電層、備製下部軟板以及加熱壓合，用以製作可彎折、可撓曲的翅膀線圈。 Another object of the present invention is to provide a method for manufacturing a wing coil, which comprises preparing an upper soft board, preparing a dielectric layer, preparing a lower soft board, and heating and pressing in order to make a bendable and flexible Curved wings coil.
具體而言，在備製上部軟板時，是將至少一上部磁感應線圈、至少一上部連接墊、至少一金手指以及至少一連接栓配置在上部軟板中，而且上部軟板在中間區具有中間孔洞。上部磁感應線圈以及上部連接墊是電氣連接並內埋在上部軟板的中間區內且靠近上部軟板的上表面。金手指是設置在上部軟板的二側邊區的上表面。此外，連接栓是設置在上部軟板A的中間區的下表面，並貼附於相對應上部連接墊的底部，且連接栓為球狀、柱狀或塊狀，並由銅、錫、含銅合金或含錫合金所構成，使得連接栓具有可加熱而壓合的特性，很容易在加熱下經壓合而變形、塑形。尤其，上部軟板的下表面在中間與二側邊區的交接處個別具有向內或向上凹陷的溝槽狀的摺線。 Specifically, when preparing the upper flexible board, at least one upper magnetic induction coil, at least one upper connection pad, at least one gold finger, and at least one connection plug are disposed in the upper soft board, and the upper soft board has an intermediate area Middle hole. The upper magnetic induction coil and the upper connection pad are electrically connected and buried in the intermediate portion of the upper flexible board and adjacent to the upper surface of the upper flexible board. The gold finger is disposed on the upper surface of the two side regions of the upper flexible board. In addition, the connecting bolt is disposed on the lower surface of the middle portion of the upper soft board A, and is attached to the bottom of the corresponding upper connecting mat, and the connecting bolt is spherical, columnar or block-shaped, and is made of copper, tin, or The copper alloy or the tin-containing alloy is formed so that the connecting plug has the characteristics of being heatable and pressed, and is easily deformed and deformed by pressing under heating. In particular, the lower surface of the upper flexible sheet individually has a groove-like fold line that is recessed inward or upward at the intersection of the middle and the two side edges.
在備製介電層的步驟中，介電層是備製成具有相同於上部軟板的中間區的橫向尺寸，且介電層的中間區具有中間孔洞。 In the step of preparing the dielectric layer, the dielectric layer is prepared to have a lateral dimension equal to the intermediate portion of the upper flexible sheet, and the intermediate portion of the dielectric layer has an intermediate hole.
在備製下部軟板時，下部軟板是備製成在中間區具有中間孔洞，且下部磁感應線圈以及下部連接墊是內埋在下部軟板內，並靠近下部軟板的下表面。 When preparing the lower soft board, the lower soft board is prepared to have an intermediate hole in the middle portion, and the lower magnetic induction coil and the lower connection pad are buried in the lower soft board and are close to the lower surface of the lower soft board.
最後在進行加熱壓合步驟中，將下部軟板、介電層以及上部軟板依序由下而上堆疊成多層堆疊結構，而且個別的中間孔洞是相互對齊，並在加熱下，利用適當壓模以壓合多層堆疊結構，使得在加熱、壓合下結合成一體，其中連接栓可在加熱壓合時緊密上部連接墊及下部連接墊，而形成良好的電氣連接。 Finally, in the heating and pressing step, the lower soft board, the dielectric layer and the upper soft board are sequentially stacked from bottom to top into a multi-layer stack structure, and the individual intermediate holes are aligned with each other, and under heating, using appropriate pressure The mold is pressed to laminate the multi-layer stack structure so as to be integrated under heating and pressing, wherein the connecting bolt can tightly connect the upper connecting mat and the lower connecting mat when heating and pressing, thereby forming a good electrical connection.
由於本發明具有分別位於靠近軟板的上表面及下表面的上部磁感應線圈及下部磁感應線圈，可在有限面積下大幅增強磁感應功效， 且本發明的摺線可使得軟板的二側邊區很容易向上彎折或向下彎折，而不會對內埋的上部磁感應線圈及下部磁感應線圈造成損壞，可擴大應用領域，並改善載板在後續組裝及加工的方便性、可靠性。 Since the present invention has an upper magnetic induction coil and a lower magnetic induction coil respectively located near the upper surface and the lower surface of the soft board, the magnetic induction effect can be greatly enhanced under a limited area. Moreover, the fold line of the invention can make the two side edges of the soft board easily bend upward or bend downward without causing damage to the buried upper magnetic induction coil and the lower magnetic induction coil, which can expand the application field and improve the load. The convenience and reliability of the board in subsequent assembly and processing.
10‧‧‧上部磁感應線圈 10‧‧‧Upper magnetic induction coil
10A‧‧‧連接墊 10A‧‧‧ connection pad
11‧‧‧下部磁感應線圈 11‧‧‧Lower magnetic induction coil
11A‧‧‧連接墊 11A‧‧‧Connecting mat
12‧‧‧底層磁感應線圈 12‧‧‧Bottom magnetic induction coil
12A‧‧‧底層連接墊 12A‧‧‧Bottom connection pad
20A‧‧‧上部軟板 20A‧‧‧Upper soft board
20B‧‧‧下部軟板 20B‧‧‧low soft board
20C‧‧‧底層軟板 20C‧‧‧ bottom soft board
22‧‧‧金手指 22‧‧‧ Gold Finger
23‧‧‧摺線 23‧‧‧ fold line
24‧‧‧介電層 24‧‧‧ dielectric layer
24A‧‧‧外部介電層 24A‧‧‧External dielectric layer
25‧‧‧披覆層 25‧‧‧coating
26‧‧‧連接栓 26‧‧‧Connecting bolt
30‧‧‧輔助緩衝材 30‧‧‧Auxiliary cushioning material
H‧‧‧中間孔洞 H‧‧‧Intermediate hole
S10~S16‧‧‧步驟 S10~S16‧‧‧Steps
S20~S29‧‧‧步驟 S20~S29‧‧‧Steps
第一圖顯示依據本發明第一實施例翅膀線圈的上視。 The first figure shows a top view of a wing coil in accordance with a first embodiment of the present invention.
第二圖顯示第一圖中翅膀線圈的側面剖示圖。 The second figure shows a side cross-sectional view of the wing coil in the first figure.
第三圖顯示依據本發明第二實施例翅膀線圈的側面剖示圖。 The third figure shows a side cross-sectional view of a wing coil in accordance with a second embodiment of the present invention.
第四圖顯示依據本發明第三實施例翅膀線圈的製作方法的操作流程圖。 The fourth figure shows an operational flowchart of a method of fabricating a wing coil in accordance with a third embodiment of the present invention.
第五A圖及第五D圖顯示第三實施例製作方法中個別處理步驟的示意圖。 The fifth A diagram and the fifth D diagram show schematic diagrams of individual processing steps in the fabrication method of the third embodiment.
第六圖顯示依據本發明第四實施例翅膀線圈的製作方法的操作流程圖。 Fig. 6 is a flow chart showing the operation of the method of manufacturing the wing coil according to the fourth embodiment of the present invention.
第七A圖及第七E圖顯示第四實施例製作方法中個別處理步驟的示意圖。 7A and 7E show schematic views of individual processing steps in the fabrication method of the fourth embodiment.
以下配合圖式及元件符號對本發明之實施方式做更詳細的說明，俾使熟習該項技藝者在研讀本說明書後能據以實施。 The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;
請參閱第一圖及第二圖，其中第一圖為本發明第一實施例翅膀線圈的上視圖，而第二圖為第一圖中割線AA的側面剖示圖。如第一圖及第二圖所示，本發明第一實施例的翅膀線圈主要是包括上部軟板20A、至少一上部磁感應線圈10、至少一上部連接墊10A、下部軟板20B、至少一下部磁感應線圈11、至少一下部連接墊11A、至少一金手指22、介電層24以及至少一連接栓26。 Referring to the first and second figures, the first figure is a top view of the wing coil of the first embodiment of the present invention, and the second figure is a side cross-sectional view of the secant line AA of the first figure. As shown in the first and second figures, the wing coil of the first embodiment of the present invention mainly includes an upper soft board 20A, at least one upper magnetic induction coil 10, at least one upper connection pad 10A, a lower soft board 20B, and at least a lower portion. The magnetic induction coil 11, at least a lower connection pad 11A, at least one gold finger 22, a dielectric layer 24, and at least one connection plug 26.
上部軟板20A及下部軟板20B為可撓曲性的基板，是由電 氣絕緣材料構成，比如樹脂或塑膠材料。介電層24是包夾在上部軟板20A及下部軟板20B之間，且上部軟板20A是位於介電層24的上表面，而下部軟板20B是位於介電層24的下表面，尤其是上部軟板20A的橫向尺寸是大於下部軟板20B的橫向尺寸。因此，整體而言，第一實施例翅膀線圈的中間區具有較厚的厚度且向下凸出，而翅膀線圈的二側邊區的厚度是比中間區的厚度還薄，因而具有翅膀狀的外觀。 The upper flexible board 20A and the lower soft board 20B are flexible substrates and are electrically Made of a gas-insulated material, such as a resin or plastic material. The dielectric layer 24 is sandwiched between the upper flexible board 20A and the lower flexible board 20B, and the upper flexible board 20A is located on the upper surface of the dielectric layer 24, and the lower flexible board 20B is located on the lower surface of the dielectric layer 24. In particular, the lateral dimension of the upper flexible panel 20A is greater than the lateral dimension of the lower flexible panel 20B. Therefore, as a whole, the intermediate portion of the wing coil of the first embodiment has a thick thickness and protrudes downward, and the thickness of the two side regions of the wing coil is thinner than the thickness of the intermediate portion, and thus has a wing shape. Exterior.
再者，本發明翅膀線圈的上表面為平面，而下表面具有中間凸出狀，且翅膀線圈的中間區具有中間孔洞H，其中包夾在上部軟板20A及下部軟板20B之間的介電層24是被中間孔洞H貫穿。 Furthermore, the upper surface of the wing coil of the present invention is a flat surface, and the lower surface has an intermediate convex shape, and the intermediate portion of the wing coil has an intermediate hole H in which the sandwich between the upper soft board 20A and the lower soft board 20B is sandwiched. The electrical layer 24 is penetrated by the intermediate hole H.
具體而言，上部磁感應線圈10及下部磁感應線圈11是分別包埋在上部軟板20A及下部軟板20B內，並具有螺旋狀，其中上部磁感應線圈10是靠近上部軟板20A的上表面，而下部磁感應線圈11是靠近下部軟板20B的下表面，且上部磁感應線圈10及下部磁感應線圈11是配置在中間孔洞H的周圍，並由介電層24隔離開。 Specifically, the upper magnetic induction coil 10 and the lower magnetic induction coil 11 are respectively embedded in the upper soft board 20A and the lower soft board 20B, and have a spiral shape, wherein the upper magnetic induction coil 10 is close to the upper surface of the upper soft board 20A, and The lower magnetic induction coil 11 is near the lower surface of the lower flexible board 20B, and the upper magnetic induction coil 10 and the lower magnetic induction coil 11 are disposed around the intermediate hole H and are separated by the dielectric layer 24.
金手指22是配置在上部軟板20A的二側邊區上，並電氣連接至相對應的上部磁感應線圈10，而每個上部連接墊10A是電氣連接至相對應的上部磁感應線圈10，且每個下部連接墊11A是電氣連接至相對應的下部磁感應線圈11，尤其是上部連接墊10A及相對應下部連接墊11A在垂直方向上是相互對齊。此外，介電層24是進一步設計成具有至少一孔洞，且每個孔洞是對齊於相對應的上部連接墊10A及下部連接墊11A，因此，上部連接墊10A及下部連接墊11A可經由連接栓26而電氣連接。 The gold fingers 22 are disposed on the two side edges of the upper flexible board 20A and are electrically connected to the corresponding upper magnetic induction coils 10, and each of the upper connection pads 10A is electrically connected to the corresponding upper magnetic induction coil 10, and each The lower connection pads 11A are electrically connected to the corresponding lower magnetic induction coils 11, and in particular, the upper connection pads 10A and the corresponding lower connection pads 11A are aligned with each other in the vertical direction. In addition, the dielectric layer 24 is further designed to have at least one hole, and each hole is aligned with the corresponding upper connection pad 10A and lower connection pad 11A. Therefore, the upper connection pad 10A and the lower connection pad 11A can be connected via the connection pin 26 and electrical connection.
較佳的，上述的連接栓26是由導電金屬材料構成，比如銅、錫、含銅合金或含錫合金。尤其是，連接栓26具有可加熱而壓合的特性，比如可用球狀、柱狀或塊狀的連接栓26填塞到上部連接墊10A及下部連接墊11A之間，或是先在上部連接墊10A的下表面形成連接栓26，或將連接栓26先貼附到上部連接墊10A的下表面，再經加熱、壓合處理以使得連接栓26結合上部連接墊10A及下部連接墊11A而成一體。 Preferably, the connecting plug 26 is made of a conductive metal material such as copper, tin, a copper-containing alloy or a tin-containing alloy. In particular, the connecting bolt 26 has the characteristics of being heatable and pressed, for example, it can be stuffed between the upper connecting pad 10A and the lower connecting pad 11A by a ball, column or block connecting bolt 26, or the upper connecting pad is first used. The lower surface of the 10A forms the connecting plug 26, or the connecting plug 26 is first attached to the lower surface of the upper connecting pad 10A, and then heated and pressed to make the connecting bolt 26 combine with the upper connecting pad 10A and the lower connecting pad 11A. One.
因此，本發明的金手指22、上部磁感應線圈10、上部連接墊10A、下部連接墊11A、連接栓26、下部連接墊11A及下部磁感應線圈 11整體而言實質上是電氣連接。 Therefore, the gold finger 22, the upper magnetic induction coil 10, the upper connection pad 10A, the lower connection pad 11A, the connection pin 26, the lower connection pad 11A, and the lower magnetic induction coil of the present invention 11 is essentially an electrical connection as a whole.
上述的上部磁感應線圈10、上部連接墊10A、下部磁感應線圈11、下部連接墊11A以及金手指22可由相同或不相同的導電材料構成，比如金屬銅、銅合金、或金，而介電層24是由介電材料構成。 The upper magnetic induction coil 10, the upper connection pad 10A, the lower magnetic induction coil 11, the lower connection pad 11A, and the gold finger 22 may be composed of the same or different conductive materials, such as metallic copper, copper alloy, or gold, and the dielectric layer 24 It is made of a dielectric material.
再次參考第二圖，上部軟板20A的下表面在與下部軟板20B的交接處個別具有摺線23，其中摺線23具有向內或向上凹陷的溝槽狀，可使得上部軟板20A的二側邊區容易彎折，比如向上彎折或向下彎折，尤其是，介電層24並未延伸到摺線23，亦即溝槽狀的摺線23不具有介電層24。因此，本發明的翅膀線圈具有可彎折性，同時能提供線圈的電氣功能，很適合應用於需要磁感應的領域。 Referring again to the second figure, the lower surface of the upper flexible board 20A has a fold line 23 at the intersection with the lower soft board 20B, wherein the fold line 23 has a groove shape which is recessed inward or upward, so that the two sides of the upper soft board 20A can be made The edge region is easily bent, such as bent upward or downwardly. In particular, the dielectric layer 24 does not extend to the fold line 23, that is, the groove-shaped fold line 23 does not have the dielectric layer 24. Therefore, the wing coil of the present invention is bendable and can provide electrical functions of the coil, and is well suited for use in fields requiring magnetic induction.
此外，上部軟板20A的二側邊區的底面可貼附或塗佈外部介電層24A，以加強隔絕保護作用，其中外部介電層24A可為相同於或不同於介電層24的介電材料構成。 In addition, the bottom surface of the two side regions of the upper flexible board 20A may be attached or coated with an external dielectric layer 24A to enhance the isolation protection, wherein the external dielectric layer 24A may be the same as or different from the dielectric layer 24. Made up of electrical materials.
本發明的翅膀線圈可進一步包括披覆層25，是披覆在上部軟板20A的上表面及下部軟板20B的下表面，並披覆在金手指22的周圍，其中披覆層25可由透光性或不透光性的電氣絕緣材料構成。 The wing coil of the present invention may further include a coating layer 25 covering the upper surface of the upper soft board 20A and the lower surface of the lower soft board 20B, and covering the periphery of the gold finger 22, wherein the coating layer 25 may be transparent. It is composed of a light or opaque electrical insulating material.
進一步參考第三圖，本發明第二實施例翅膀線圈的側面剖示圖，其中第二實施例的翅膀線圈是類似於第一圖的第一實施例，且具有如同第一圖的上視圖，因而相同技術特徵將不再贅述。 Referring further to the third figure, a side cross-sectional view of a wing coil of a second embodiment of the present invention, wherein the wing coil of the second embodiment is similar to the first embodiment of the first figure, and has a top view like the first figure, Therefore, the same technical features will not be described again.
如第三圖所示，第二實施例與第一實施例的主要差異在於第二實施例的翅膀線圈進一步包括底層基板20C、至少一底層磁感應線圈12以及至少一底層連接墊12A，其中底層基板20C是貼附於下部軟板20B的下表面，而且電氣連接的底層磁感應線圈12以及底層連接墊12A是包埋在底層基板20C內，並靠近底層基板20C的下表面。尤其是，每個底層連接墊12A是貼附到相對應的下部連接墊11A。此外，底層基板20C與下部軟板20B具有相同的橫向尺寸。 As shown in the third figure, the main difference between the second embodiment and the first embodiment is that the wing coil of the second embodiment further includes an underlying substrate 20C, at least one underlying magnetic induction coil 12, and at least one underlying connection pad 12A, wherein the underlying substrate 20C is attached to the lower surface of the lower flexible board 20B, and the underlying magnetic induction coil 12 and the underlying connection pad 12A which are electrically connected are embedded in the underlying substrate 20C and are close to the lower surface of the underlying substrate 20C. In particular, each of the bottom connection pads 12A is attached to the corresponding lower connection pad 11A. Further, the base substrate 20C and the lower flexible board 20B have the same lateral dimension.
第二實施例的另一差異點是在於第二實施例的翅膀線圈可進一步包括披覆層25，是披覆在上部軟板20A的上表面及底層基板20C的下表面，而非第一實施例中披覆層25是披覆在上部軟板20A的上表面及下 部軟板20B的下表面。 Another difference of the second embodiment is that the wing coil of the second embodiment may further include a coating layer 25 which is coated on the upper surface of the upper flexible board 20A and the lower surface of the base substrate 20C instead of the first implementation. In the example, the coating layer 25 is coated on the upper surface and the lower surface of the upper soft board 20A. The lower surface of the soft board 20B.
因此，在第二實施例的翅膀線圈中，金手指22、上部磁感應線圈10、上部連接墊10A、連接栓26、下部連接墊11A、下部磁感應線圈11、底部連接墊12A、底部磁感應線圈12是實質上是依序電氣連接。 Therefore, in the wing coil of the second embodiment, the gold finger 22, the upper magnetic induction coil 10, the upper connection pad 10A, the connection plug 26, the lower connection pad 11A, the lower magnetic induction coil 11, the bottom connection pad 12A, and the bottom magnetic induction coil 12 are Essentially, they are electrically connected in sequence.
要注意的是，第三圖中第二實施例的翅膀線圈是包括上部軟板20B、下部軟板20B以及底層基板20C的三層堆疊結構，這只是本發明第二實施例的示範性實例而已，並非用以限定本發明的範圍，亦即，本發明的翅膀線圈實質上可包括上部軟板20B、下部軟板20B以及至少一底層基板20C，亦即本發明也可包含多個底層基板20C，藉以構成三層以上的堆疊結構。 It is to be noted that the wing coil of the second embodiment in the third embodiment is a three-layer stacked structure including the upper flexible board 20B, the lower flexible board 20B, and the base substrate 20C, which is merely an exemplary embodiment of the second embodiment of the present invention. It is not intended to limit the scope of the present invention, that is, the wing coil of the present invention may substantially include an upper flexible board 20B, a lower soft board 20B, and at least one bottom substrate 20C, that is, the present invention may also include a plurality of bottom substrate 20C. In order to form a stack structure of three or more layers.
參考第四圖及第五A圖及第五D圖，其中第四圖為本發明第三實施例翅膀線圈的製作方法的操作流程圖，而第五A圖及第五D圖是第三實施例製作方法中個別處理步驟的示意圖。 Referring to the fourth and fifth A and fifth figures, wherein the fourth figure is an operational flowchart of the method for fabricating the wing coil of the third embodiment of the present invention, and the fifth and fifth figures are the third embodiment. A schematic diagram of individual processing steps in the method of making the example.
如第四圖所示，本發明第三實施例翅膀線圈的製作方法是包括步驟S10、S12、S14及S16，用以製作翅膀線圈。 As shown in the fourth figure, the method for fabricating the wing coil of the third embodiment of the present invention includes steps S10, S12, S14 and S16 for making a wing coil.
首先，第三實施例翅膀線圈的製作方法先執行步驟S10，藉以備製如第五A圖所示的上部軟板20A，且在上部軟板20A中配置至少一上部磁感應線圈10、至少一上部連接墊10A、至少一金手指22以及至少一連接栓26，而上部軟板20A在中間區具有中間孔洞H。 First, the method for fabricating the wing coil of the third embodiment first performs step S10 to prepare the upper flexible board 20A as shown in FIG. 5A, and at least one upper magnetic induction coil 10 and at least one upper portion are disposed in the upper flexible board 20A. The pad 10A, at least one gold finger 22, and at least one connecting pin 26 are connected, and the upper flexible plate 20A has an intermediate hole H in the intermediate portion.
上部磁感應線圈10以及上部連接墊10A是電氣連接並內埋在上部軟板20A的中間區內且靠近上部軟板20A的上表面，而金手指22是設置在上部軟板20A的二側邊區的上表面。此外，連接栓26是設置在上部軟板20A的中間區的下表面，並貼附於相對應上部連接墊10A的底部。較佳的，連接栓26可為球狀、柱狀或塊狀，並由銅、錫、含銅合金或含錫合金所構成，且連接栓26具有可加熱而壓合的特性，因此很容易在加熱下經壓合而變形、塑形。 The upper magnetic induction coil 10 and the upper connection pad 10A are electrically connected and buried in the intermediate portion of the upper flexible board 20A and close to the upper surface of the upper flexible board 20A, and the gold fingers 22 are disposed on the two side areas of the upper flexible board 20A. Upper surface. Further, the connecting pin 26 is provided on the lower surface of the intermediate portion of the upper flexible board 20A and attached to the bottom of the corresponding upper connecting pad 10A. Preferably, the connecting pin 26 can be spherical, columnar or block-shaped, and is composed of copper, tin, a copper-containing alloy or a tin-containing alloy, and the connecting plug 26 has the characteristics of being heatable and pressed, so that it is easy It is deformed and shaped by pressing under heating.
此外，上部軟板20A的下表面在中間區與二側邊區的交接處個別具有摺線23，其中摺線23具有向內或向上凹陷的溝槽狀。 Further, the lower surface of the upper flexible board 20A has a fold line 23 at the intersection of the intermediate portion and the two side edges, wherein the fold line 23 has a groove shape which is recessed inward or upward.
接著，在步驟S12中，備製如第五B圖所示的介電層24， 其中介電層24的橫向尺寸是相同於上部軟板20A的中間區的橫向尺寸，且在介電層24的中間區具有中間孔洞H。然後執行步驟S14，備製如第五C圖所示的下部軟板20B，其中下部軟板20B的中間區具有中間孔洞H，且相互電氣連接的至少一下部磁感應線圈11以及至少一下部連接墊11A是內埋在下部軟板20B內，尤其是靠近下部軟板20B的下表面。 Next, in step S12, a dielectric layer 24 as shown in FIG. The lateral dimension of the dielectric layer 24 is the same as the lateral dimension of the intermediate portion of the upper flexible board 20A, and has an intermediate hole H in the intermediate portion of the dielectric layer 24. Then, step S14 is performed to prepare a lower flexible board 20B as shown in FIG. 5C, wherein the middle portion of the lower flexible board 20B has an intermediate hole H, and at least a lower magnetic induction coil 11 and at least a lower connection pad electrically connected to each other 11A is embedded in the lower soft board 20B, especially near the lower surface of the lower soft board 20B.
最後，進入步驟S16，將下部軟板20B、介電層24以及上部軟板20A依序由下而上堆疊成多層堆疊結構，其中個別的中間孔洞H是相互對齊，並在加熱下，利用適當壓模以壓合多層堆疊結構，使得多層堆疊結構在加熱、壓合下結合成一體，尤其是，連接栓26可緊密上部連接墊10A及下部連接墊11A，如第五D圖所示，而形成良好的電氣連接。 Finally, proceeding to step S16, the lower flexible board 20B, the dielectric layer 24, and the upper soft board 20A are sequentially stacked from bottom to top into a multi-layer stack structure, wherein the individual intermediate holes H are aligned with each other and heated under appropriate use. The stamper is pressed to laminate the multi-layer stack structure, so that the multi-layer stack structure is integrated under heating and pressing. In particular, the connecting bolt 26 can tightly connect the upper connecting pad 10A and the lower connecting pad 11A, as shown in FIG. 5D. Form a good electrical connection.
此外，本實施例還可進一步包括形成披覆層25，藉以以披覆上部軟板20A的中間區的上表面以及底部軟板20C的下表面，同時披覆金手指22的周圍，因而形成所需的翅膀線圈。 In addition, the embodiment may further include forming a coating layer 25 to cover the upper surface of the intermediate portion of the upper flexible board 20A and the lower surface of the bottom flexible board 20C while covering the periphery of the gold finger 22, thereby forming a Required wing coils.
進一步參考第六圖及第七A圖及第七E圖，其中第六圖為本發明第四實施例翅膀線圈的製作方法的操作流程圖，而第七A圖及第七E圖是第四實施例製作方法中個別處理步驟的示意圖。 Further referring to the sixth figure, the seventh A picture and the seventh E picture, wherein the sixth figure is an operation flowchart of the method for manufacturing the wing coil according to the fourth embodiment of the present invention, and the seventh picture A and the seventh picture E are fourth A schematic representation of individual processing steps in the fabrication methods of the examples.
如第六圖所示，本發明第四實施例翅膀線圈的製作方法是包括步驟S20、S22、S24、S26及S28，用以製作翅膀線圈，是類於上述第三實施例的製作方法，其中第四實施例的步驟S20、S22及S24是相同於第三實施例的S10、S12及S14，分別備製上部軟板20A、介電層24、備製下部軟板20B，並如第七A圖、第七B圖、第七C圖所示，因而不再贅述。 As shown in the sixth embodiment, the method for fabricating the wing coil of the fourth embodiment of the present invention includes steps S20, S22, S24, S26, and S28 for fabricating a wing coil, which is a manufacturing method similar to the third embodiment described above, wherein Steps S20, S22, and S24 of the fourth embodiment are the same as S10, S12, and S14 of the third embodiment, respectively preparing the upper flexible board 20A, the dielectric layer 24, and the preparation lower soft board 20B, and as in the seventh A The figure, the seventh B, and the seventh C are shown, and thus will not be described again.
具體而言，在第四實施例製作方法的步驟S26中備製如第七C圖所示的底部軟板20C，並將底部軟板20C貼附到下部軟板20B的下表面而結合成堆疊體，其中底部軟板20C是類似於下部軟板20B，具有電氣連接的至少一底部磁感應線圈12以及至少一底部連接墊12A，且在底部軟板20C的中間區具有中間孔洞H。 Specifically, in the step S26 of the manufacturing method of the fourth embodiment, the bottom soft board 20C as shown in FIG. C is prepared, and the bottom soft board 20C is attached to the lower surface of the lower soft board 20B to be combined into a stack. The bottom soft board 20C is similar to the lower soft board 20B, has at least one bottom magnetic induction coil 12 and at least one bottom connection pad 12A electrically connected, and has an intermediate hole H in the middle portion of the bottom soft board 20C.
最後，在步驟S28中，進行加熱壓合而形成如第七D圖所示的多層堆疊結構，主要是將堆疊體、介電層24及上部軟板20A由下而上依序堆疊，尤其是個別中間孔洞H需相互對齊，並再加熱下，利用壓模壓 合而使得相鄰的上部軟板20A、下部軟板20B、底部軟板20C相互結合，同時連接墊26因加熱壓合下可緊密結合上部連接墊10A及下部連接墊11A而形電氣連接。 Finally, in step S28, heating and pressing are performed to form a multi-layer stack structure as shown in FIG. 7D, mainly stacking the stack, the dielectric layer 24 and the upper soft board 20A sequentially from bottom to top, in particular Individual intermediate holes H need to be aligned with each other and heated again, using compression molding The adjacent upper soft board 20A, the lower soft board 20B, and the bottom soft board 20C are combined with each other, and the connection pad 26 is electrically connected by tightly bonding the upper connection pad 10A and the lower connection pad 11A by heat pressing.
此外，本實施例還可進一步包括步驟S29，如第七E圖所示，形成披覆層25以披覆上部軟板20A的中間區的上表面以及底部軟板20C的下表面，同時披覆金手指22的周圍，因而形成所需的翅膀線圈。 In addition, the embodiment may further include a step S29, as shown in the seventh E, forming the cladding layer 25 to cover the upper surface of the intermediate portion of the upper flexible board 20A and the lower surface of the bottom flexible board 20C while being covered. The circumference of the gold finger 22 thus forms the desired wing coil.
此外，如果第七A圖的上部軟板20A及第七B圖的介電層24大於第七C圖的下部軟板20B，則在步驟S28中進行加熱壓合時，上部軟板20A及介電層24的二側邊緣部分會因未被下部軟板20B支撐住而變成懸空狀態，很容易發生彎折、變形，尤其是上部軟板20A的金手指22，會嚴重影響加熱壓合處理的良率。因此，為改善步驟S28的良率，可在底部軟板20C的底部加入等於或大於上部軟板20A的輔助緩衝材30，其中輔助緩衝材30具有當作墊體用的二凸起部，分別對齊上部軟板20A的金手指22，用以支撐上部軟板20A及介電層24的二側邊緣部分，進而保護上部軟板20A的金手指22。接著，如第七E圖所示，移除輔助緩衝材30，並在上部軟板20A的上表面及底層軟板20C的下表面分別形成披覆層25。 In addition, if the upper flexible board 20A and the seventh B-shaped dielectric layer 24 of FIG. 7 are larger than the lower flexible board 20B of the seventh C diagram, the upper flexible board 20A and the intermediate soft board 20A and the medium are pressed in step S28. The two side edge portions of the electric layer 24 are suspended by the lower soft board 20B, and are easily bent and deformed, especially the gold finger 22 of the upper soft board 20A, which seriously affects the heating and pressing process. Yield. Therefore, in order to improve the yield of the step S28, the auxiliary cushioning material 30 equal to or larger than the upper soft board 20A may be added to the bottom of the bottom soft board 20C, wherein the auxiliary cushioning material 30 has two convex portions for the cushion body, respectively The gold fingers 22 of the upper flexible board 20A are aligned to support the upper side edges of the upper flexible board 20A and the dielectric layer 24, thereby protecting the gold fingers 22 of the upper flexible board 20A. Next, as shown in FIG. E, the auxiliary cushioning material 30 is removed, and a coating layer 25 is formed on the upper surface of the upper flexible board 20A and the lower surface of the bottom soft board 20C, respectively.
較佳的，上述的輔助緩衝材30可由矽膠或紙漿構成，還可進一步以離型膜覆蓋輔助緩衝材30的表面，藉以幫助輔助緩衝材30的直接移除。 Preferably, the auxiliary cushioning material 30 may be composed of silicone or pulp, and the surface of the auxiliary cushioning material 30 may be further covered with a release film to help facilitate the direct removal of the cushioning material 30.
因此，在第四實施例所製作的翅膀線圈中，金手指22、上部磁感應線圈10、上部連接墊10A、連接栓26、下部連接墊11A、下部磁感應線圈11、底部連接墊12A、底部磁感應線圈12是質上是依序電氣連接。 Therefore, in the wing coil manufactured in the fourth embodiment, the gold finger 22, the upper magnetic induction coil 10, the upper connection pad 10A, the connection plug 26, the lower connection pad 11A, the lower magnetic induction coil 11, the bottom connection pad 12A, and the bottom magnetic induction coil 12 is qualitatively connected in sequence.
綜上所述，本發明的特點在於將配置上部磁感應線圈、下部磁感應線圈以及底部磁感應線圈設置於個別軟板中，並藉加熱壓合而結合一體，使得線圈密度大幅增加，進而加強磁感應能力，可避免傳統線圈載板在將個別製作的線圈及軟板貼合加工時遇到個別孔洞的對位公差問題。 In summary, the present invention is characterized in that the upper magnetic induction coil, the lower magnetic induction coil and the bottom magnetic induction coil are disposed in an individual soft board, and are integrated by heating and pressing, so that the density of the coil is greatly increased, thereby enhancing the magnetic induction capability. The problem of the alignment tolerance of the individual holes encountered in the conventional coil carrier when the individually fabricated coil and the flexible board are processed can be avoided.
本發明的另一特點在於軟板具有摺線的設計，可使得軟板的二側邊區很容易向上彎折或向下彎折，而不會對內埋的上部磁感應線圈、下部磁感應線圈或底部磁感應線圈造成損壞，可配合實際幾何構造上的需 要而做適當的彎折，擴大應用領域，改善載板在後續組裝及加工的方便性、可靠性。 Another feature of the present invention is that the flexible board has a fold line design, so that the two side edges of the soft board can be easily bent upward or bent downward without the buried upper magnetic induction coil, the lower magnetic induction coil or the bottom. The magnetic induction coil causes damage and can be matched with the actual geometric construction. It is necessary to make appropriate bending, expand the application field, and improve the convenience and reliability of the subsequent assembly and processing of the carrier.
此外，本發明的連接栓具可加熱壓合的特性，能緊密結合連接墊而形成良好的電氣連接，因而相當具有較低製造成本的優點，可助於市場上的價格優勢，能大幅提高在現有市場上的產業利用性。 In addition, the connecting bolt of the present invention can be heated and pressed, can be tightly combined with the connecting mat to form a good electrical connection, and thus has the advantages of lower manufacturing cost, can help the price advantage in the market, and can greatly improve Industrial utilization in the existing market.
以上所述者僅為用以解釋本發明之較佳實施例，並非企圖據以對本發明做任何形式上之限制，是以，凡有在相同之發明精神下所作有關本發明之任何修飾或變更，皆仍應包括在本發明意圖保護之範疇。 The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.
10‧‧‧上部磁感應線圈 10‧‧‧Upper magnetic induction coil
10A‧‧‧連接墊 10A‧‧‧ connection pad
11‧‧‧下部磁感應線圈 11‧‧‧Lower magnetic induction coil
11A‧‧‧連接墊 11A‧‧‧Connecting mat
20A‧‧‧上部軟板 20A‧‧‧Upper soft board
20B‧‧‧下部軟板 20B‧‧‧low soft board
20C‧‧‧底層基板 20C‧‧‧Bottom substrate
22‧‧‧金手指 22‧‧‧ Gold Finger
23‧‧‧摺線 23‧‧‧ fold line
24‧‧‧介電層 24‧‧‧ dielectric layer
24A‧‧‧外部介電層 24A‧‧‧External dielectric layer
25‧‧‧披覆層 25‧‧‧coating
26‧‧‧連接栓 26‧‧‧Connecting bolt
H‧‧‧中間孔洞 H‧‧‧Intermediate hole
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104124571A TWI530971B (en) | 2015-07-29 | 2015-07-29 | Wings coil and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104124571A TWI530971B (en) | 2015-07-29 | 2015-07-29 | Wings coil and its making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI530971B true TWI530971B (en) | 2016-04-21 |
| TW201705160A TW201705160A (en) | 2017-02-01 |
Family
ID=56361535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104124571A TWI530971B (en) | 2015-07-29 | 2015-07-29 | Wings coil and its making method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI530971B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI655649B (en) * | 2018-04-12 | 2019-04-01 | 品翔電通股份有限公司 | Passive component structure |
| US10971298B2 (en) | 2018-06-25 | 2021-04-06 | Pin Shine Industrial Co., Ltd. | Passive component structure |
-
2015
- 2015-07-29 TW TW104124571A patent/TWI530971B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201705160A (en) | 2017-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20230154665A1 (en) | Inductor assembly and manufacturing method for inductor assembly | |
| TWI530971B (en) | Wings coil and its making method | |
| CN102047403A (en) | Electronic device and method of manufacturing an electronic device | |
| US10366822B2 (en) | Method of manufacturing winged coil structure | |
| CN104768318B (en) | Rigid-flexible circuit board and preparation method thereof | |
| CN111475064B (en) | Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device | |
| CN106550540B (en) | Wing coil and preparation method thereof | |
| US9439290B1 (en) | Carrier board structure | |
| JPWO2017010228A1 (en) | Resin substrate, component-mounted resin substrate, and manufacturing method thereof | |
| CN208227405U (en) | Resin substrate and component install resin substrate | |
| TWI603658B (en) | Magnetic induction coil and soft board carrier structure | |
| JP6070290B2 (en) | Resin multilayer part and manufacturing method thereof | |
| US20200258805A1 (en) | Electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing method of the same | |
| CN110137679B (en) | NFC antenna device and manufacturing method thereof | |
| JP6268776B2 (en) | Multilayer substrate manufacturing method | |
| TWI442844B (en) | Embedded flex circuit board and method of fabricating the same | |
| JP5221682B2 (en) | Printed circuit board and manufacturing method thereof | |
| JP5585035B2 (en) | Circuit board manufacturing method | |
| JP2013165149A (en) | Multilayer ceramic substrate and manufacturing method of the same | |
| JPH06252558A (en) | Multilayered glass ceramic cavity substrate | |
| WO2021106713A1 (en) | Method for producing circuit board, circuit board, method for producing molded article, and molded article | |
| KR102016612B1 (en) | Board laminate structure and manufacturing method thereof | |
| KR101140795B1 (en) | Bonding tip for manufacturing touch panel and bonding method using the same | |
| CN206312172U (en) | Layering fingerprint module | |
| JP2002230504A (en) | Ic card and method of manufacturing for ic card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |