CN205830134U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- CN205830134U CN205830134U CN201620788497.2U CN201620788497U CN205830134U CN 205830134 U CN205830134 U CN 205830134U CN 201620788497 U CN201620788497 U CN 201620788497U CN 205830134 U CN205830134 U CN 205830134U
- Authority
- CN
- China
- Prior art keywords
- layer
- conducting wire
- circuit board
- flame
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003063 flame retardant Substances 0.000 claims abstract description 16
- 238000005299 abrasion Methods 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of multilayer circuit board, it includes wearing layer, waterproof layer, flame-retardant layer, insulating barrier, overcoat, signals layer, interior layer, first conducting wire, second conducting wire, 3rd conducting wire, 4th conducting wire, through hole, wearing layer and the first conducting wire connect, waterproof layer is connected with flame-retardant layer, flame-retardant layer is connected with insulating barrier, insulating barrier is connected with overcoat, overcoat is connected with signals layer, signals layer is connected with interior layer, second conducting wire is connected with wearing layer, first conducting wire is positioned on the left of the second conducting wire, 3rd conducting wire, 4th conducting wire is all connected with interior layer, wearing layer, waterproof layer, flame-retardant layer, insulating barrier, overcoat, signals layer, interior layer, first conducting wire, 3rd conducting wire is all connected with through hole.This utility model simple in construction, lightweight, cost price is low, and density is high, and volume is little.
Description
Technical field
This utility model relates to a kind of circuit board, particularly relates to a kind of multilayer circuit board.
Background technology
Common wiring board is all as base material with epoxy resin fiberglass cloth etc., the usual heat dispersion of this circuit board
Difference, is generally not capable of being connected with the electronic devices and components having higher heating, such as the lamp bead etc. of LED.Requirement according to circuit on base material
Make single or multiple lift circuit board, then be welded with the various electronic devices and components such as various electric capacity, electric capacity on circuit boards, due to electronics
Components and parts have certain volume, can be relatively big for complicated electric equipment products circuit board, in order to make compact conformation, reduce circuit board
Volume, that can the distance between various electronic devices and components be leaned on is close, and such structure easily produces decay and the interference of signal,
Affect the performance of product.
At present, being integrated in printed circuit board (PCB) by various electronic components has been the Development Technology that crowd is attracted attention in recent years.
The electronic product that function is complicated and build is more exquisite is the most constantly brought up in the development of advanced semiconductor technology.In response to this trend,
The demand of circuit board function is increased by people day by day, and requires to integrate more electronic component.For meeting this demand, need to hold
Continuous structure and the manufacture method constantly promoting multilayer circuit board.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of multilayer circuit board, and its simple in construction is lightweight, becomes
This price is low, and density is high, and volume is little.
This utility model solves above-mentioned technical problem by following technical proposals: a kind of multilayer circuit board, it wraps
Include wearing layer, waterproof layer, flame-retardant layer, insulating barrier, overcoat, signals layer, interior layer, the first conducting wire, the second conducting wire,
3rd conducting wire, the 4th conducting wire, through hole, wearing layer and the first conducting wire connect, and waterproof layer is connected with flame-retardant layer, resistance
Combustion layer is connected with insulating barrier, and insulating barrier is connected with overcoat, and overcoat is connected with signals layer, and signals layer is connected with interior layer, the
Two conducting wires are connected with wearing layer, and the first conducting wire is positioned on the left of the second conducting wire, the 3rd conducting wire, the 4th conduction
Circuit is all connected with interior layer, wearing layer, waterproof layer, flame-retardant layer, insulating barrier, overcoat, signals layer, interior layer, the first conduction
Circuit, the 3rd conducting wire are all connected with through hole.
Preferably, described wearing layer is provided with abrasion resistant particles ball.
Preferably, described waterproof layer is provided with aluminium foil.
Preferably, described through hole be shaped as rectangle.
Positive progressive effect of the present utility model is: this utility model simple in construction, lightweight, cost price is low, close
Degree height, volume is little.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model multilayer circuit board.
Detailed description of the invention
Provide this utility model preferred embodiment below in conjunction with the accompanying drawings, to describe the technical solution of the utility model in detail.
As it is shown in figure 1, this utility model multilayer circuit board includes wearing layer 1, waterproof layer 2, flame-retardant layer 3, insulating barrier 4, prevents
Sheath 5, signals layer 6, conducting wire, conducting wire the 10, the 4th, the 8, second conducting wire the 9, the 3rd, interior layer the 7, first conducting wire
11, through hole 12, wearing layer 1 is connected with the first conducting wire 8, and waterproof layer 2 is connected with flame-retardant layer 3, and flame-retardant layer 3 is with insulating barrier 4 even
Connecing, insulating barrier 4 is connected with overcoat 5, and overcoat 5 is connected with signals layer 6, and signals layer 6 is connected with interior layer 7, the second conductor wire
Road 9 is connected with wearing layer 1, and the first conducting wire 8 is positioned on the left of the second conducting wire 9, the 3rd conducting wire the 10, the 4th conductor wire
Road 11 is all connected with interior layer 7, wearing layer 1, waterproof layer 2, flame-retardant layer 3, insulating barrier 4, overcoat 5, signals layer 6, interior layer 7,
First conducting wire 10, conducting wire the 8, the 3rd is all connected with through hole 12.
The operation principle of this utility model treatment handbarrow multilayer circuit board is as follows: wearing layer cost price is low, wearability
Good, it is possible to prevent circuit board from wearing and tearing.Waterproof layer density is high, it is possible to prevent circuit board waterlogged damage.Flame-retardant layer prevents temperature too high
And burn.Insulating barrier convenient isolation external substance.Overcoat protection circuit plate.Signals layer transmission signal.Interior layer transmission circuit
Intralaminar part information.First conducting wire, the second conducting wire, the 3rd conducting wire, the convenient conduction in the 4th conducting wire, volume
Little.Through-hole structure is simple, convenient ventilative, prevents temperature too high.
Wearing layer 1 is provided with abrasion resistant particles ball 13, strengthens anti-wear performance, and increases stability.
Waterproof layer 2 is provided with aluminium foil, strengthens water resistance.
Through hole 12 be shaped as rectangle, strengthen breathability.
In sum, this utility model simple in construction, lightweight, cost price is low, and density is high, and volume is little.
Particular embodiments described above, to of the present utility model solving the technical problem that, technical scheme and beneficial effect
Further described, be it should be understood that and the foregoing is only specific embodiment of the utility model, not
For limiting this utility model, all within spirit of the present utility model and principle, any amendment, the equivalent made, change
Enter, within should be included in protection domain of the present utility model.
Claims (4)
1. a multilayer circuit board, it is characterised in that it includes wearing layer, waterproof layer, flame-retardant layer, insulating barrier, overcoat, signal
Layer, interior layer, the first conducting wire, the second conducting wire, the 3rd conducting wire, the 4th conducting wire, through hole, wearing layer and
One conducting wire connects, and waterproof layer is connected with flame-retardant layer, and flame-retardant layer is connected with insulating barrier, and insulating barrier is connected with overcoat, protection
Layer is connected with signals layer, and signals layer is connected with interior layer, and the second conducting wire is connected with wearing layer, and the first conducting wire is positioned at the
On the left of two conducting wires, the 3rd conducting wire, the 4th conducting wire are all connected with interior layer, wearing layer, waterproof layer, flame-retardant layer,
Insulating barrier, overcoat, signals layer, interior layer, the first conducting wire, the 3rd conducting wire are all connected with through hole.
2. multilayer circuit board as claimed in claim 1, it is characterised in that described wearing layer is provided with abrasion resistant particles ball.
3. multilayer circuit board as claimed in claim 1, it is characterised in that described waterproof layer is provided with aluminium foil.
4. multilayer circuit board as claimed in claim 1, it is characterised in that described through hole be shaped as rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620788497.2U CN205830134U (en) | 2016-07-26 | 2016-07-26 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620788497.2U CN205830134U (en) | 2016-07-26 | 2016-07-26 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205830134U true CN205830134U (en) | 2016-12-21 |
Family
ID=57560851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620788497.2U Expired - Fee Related CN205830134U (en) | 2016-07-26 | 2016-07-26 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205830134U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108215363A (en) * | 2017-12-28 | 2018-06-29 | 江阴市沪澄绝缘材料有限公司 | The production line and its production technology of brominated epoxy glass fabric insulation board |
-
2016
- 2016-07-26 CN CN201620788497.2U patent/CN205830134U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108215363A (en) * | 2017-12-28 | 2018-06-29 | 江阴市沪澄绝缘材料有限公司 | The production line and its production technology of brominated epoxy glass fabric insulation board |
| CN108215363B (en) * | 2017-12-28 | 2023-07-14 | 江阴市沪澄绝缘材料有限公司 | Production line and production process of brominated epoxy glass fiber cloth insulating board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 |