CN210607238U - Integrated chip packaging plastic lead support - Google Patents
Integrated chip packaging plastic lead support Download PDFInfo
- Publication number
- CN210607238U CN210607238U CN201921915983.6U CN201921915983U CN210607238U CN 210607238 U CN210607238 U CN 210607238U CN 201921915983 U CN201921915983 U CN 201921915983U CN 210607238 U CN210607238 U CN 210607238U
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- Prior art keywords
- semi
- package
- open
- glue injection
- plastic lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses an integrated chip packaging plastic lead wire bracket, which comprises a bracket and a semi-open package arranged on the bracket, wherein the semi-open package is provided with a glue injection port, and a substrate on the semi-open package is exposed through the glue injection port; the semi-open packages are distributed on the bracket in an array. The utility model discloses can let the enterprise reduce cost of small-scale production to be favorable to protecting the trade secret.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technical field specifically is an integrated chip encapsulation plastic pin lead frame.
Background
The traditional package is also the most widely applicable package in the market, and the specific mode is that a wafer is pasted on a substrate of a lead frame, electrodes of the wafer are welded by leads, then solidification and glue fixation are carried out, and finally plastic package, rib punching, rib cutting and testing are carried out. Because the lead wire breaks very easily, and the plastic envelope process requires very high to equipment and technology precision, therefore above traditional packaging mode is unfavorable for small-scale production, and wherein the plastic envelope needs to utilize the encapsulation of electrical heating mould press mold process, under small-scale production, and is inefficient, and energy resource consumption is big, and is with high costs, if entrust other foundries to carry out the foundry work in addition, it is with high costs to small-scale enterprise to be unfavorable for the development, even probably reveal technical secret.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide an integrated chip encapsulates plastic lead wire support can let the enterprise reduce cost of small-scale production to be favorable to protecting the technical secret.
In order to achieve the above purpose, the utility model provides a following technical scheme: a plastic lead support for packaging an integrated chip comprises a support and a semi-open package arranged on the support, wherein a glue injection port is formed in the semi-open package, and a substrate on the semi-open package is exposed through the glue injection port; the semi-open packages are distributed on the bracket in an array.
As a further improvement of the present invention, the support comprises an outer frame, a plurality of horizontal bars and a plurality of vertical bars, wherein the horizontal bars and the vertical bars are staggered to form a plurality of array spaces for arranging the semi-open package; the crossband is located between two adjacent semi-open encapsulation, the both ends of semi-open encapsulation all can be dismantled and connect on the crossband or one end can be dismantled and connect on the crossband the other end can be dismantled and connect on the outline.
As a further improvement, the hollow groove used for providing the deformation space is arranged on the horizontal bar along the length direction.
As a further improvement of the present invention, the semi-open package joint is between two cross bars or between a cross bar and an outer frame.
As a further improvement of the utility model, the glue injection port is in the shape of a round table.
As a further improvement, the smaller end of the glue injection opening faces the substrate.
As a further improvement, the opening part of the glue injection port is provided with a sealing port, the sealing port and the glue injection port form a step structure, one end of the sealing port is communicated with the glue injection port, and the other end is communicated with the outside.
As a further improvement of the utility model, a baffle plate used for separating the base plate is arranged on the base plate.
As a further improvement, the baffle is highly parallel and level with the height of the glue injection port.
As a further improvement of the utility model, the base plate on the semi-open encapsulation comprises a plurality of pins, and the wafer laminating is on the pin.
The beneficial effects of the utility model, small-scale enterprise can directly purchase or customize this plastic lead wire support, because the encapsulation on this lead wire support is semi-open encapsulation, the follow-up wafer and bonding wire of pasting through oneself of user and carry out the injecting glue plastic envelope from the injecting glue mouth, can avoid revealing trade secret from this, help the protection to the technique. Because the existing integrated circuit packaging is firstly carried out by pasting the wafer on the substrate and then directly carrying out plastic packaging, the plastic packaging needs to be carried out by using an electric heating mold film pressing process, the process requirement is high, the equipment requirement is high, and a large amount of electric energy is consumed. And constitute the shell through plastic envelope earlier stage in this embodiment, laminate the wafer again and encapsulate this moment, and this packaging process only need go on some glue can, through pouring sealant into the injecting glue mouth in to the shell encapsulate, consequently can not touch the lead wire and lead to the disconnection, also need not high accuracy production facility and strict technology, for small-scale production this moment, saved the problem of senior talent and equipment acquisition cost, be favorable to small-scale production and development.
Drawings
Fig. 1 is a schematic view of the bracket structure of the present invention;
FIG. 2 is an enlarged view of the bracket of the present invention;
FIG. 3 is a schematic cross-sectional view of a semi-open package according to the present invention;
fig. 4 is a schematic diagram of a semi-open top view structure of the present invention.
Reference numerals: 1. a support; 11. an outer frame; 12. a horizontal bar; 13. vertical bars; 2. semi-open packaging; 3. a glue injection port; 4. hollowing out the grooves; 5. sealing the opening; 6. a baffle plate; 7. and (7) a pin.
Detailed Description
The present invention will be described in further detail with reference to embodiments shown in the drawings.
Referring to fig. 1 to 4, an integrated chip package plastic lead frame 1 of the present embodiment includes a frame 1 and a semi-open package 2 disposed on the frame 1, where the semi-open package 2 is provided with a glue injection opening 3, and a substrate on the semi-open package 2 is exposed through the glue injection opening 3; the semi-open packages 2 are distributed in an array on the support 1.
Above injecting glue mouth 3 can adopt square also can be circular, and in the preferred scheme, circular is superior to square.
The small-scale enterprise can directly purchase or customize the plastic lead support 1, and as the package on the lead support 1 is the semi-open package 2, and the attached drawings of the specification are combined, a user can automatically paste a wafer and a bonding wire and carry out glue injection plastic package from the glue injection port 3 subsequently, thereby avoiding the leakage of commercial secrets and being beneficial to the protection of the technology.
Because the existing integrated circuit packaging is firstly carried out by pasting the wafer on the substrate and then directly carrying out plastic packaging, the plastic packaging needs to be carried out by using an electric heating mold film pressing process, the process requirement is high, the equipment requirement is high, and a large amount of electric energy is consumed. And in this embodiment, the housing is formed after earlier stage plastic package, and then the wafer is attached for packaging, and the packaging process only needs to be performed with glue dispensing, and the housing is packaged by pouring sealant into the glue injection port 3, so that the lead is not broken due to the fact that the lead is touched, high-precision production equipment and strict processes are not needed, and at the moment, for small-scale production, the problems of high-grade talents and equipment purchase cost are solved, and small-scale production and development are facilitated.
In a further preferred embodiment, the rack 1 comprises an outer frame 11, a plurality of transverse bars 12 and a plurality of vertical bars 13, wherein the transverse bars 12 and the vertical bars 13 are staggered to form a plurality of array spaces for arranging the semi-open packages 2; the horizontal bar 12 is located between two adjacent semi-open encapsulation 2, the both ends of semi-open encapsulation 2 all can be dismantled and connect on horizontal bar 12 or one end can be dismantled and connect on horizontal bar 12 and the other end can be dismantled and connect on outline 11.
With reference to the drawings, one end of the semi-open package 2 at the edge is detachably connected with the horizontal bar 12, the other end is detachably connected with the outer frame 11, the non-edge is located between the two horizontal bars 12, and the two ends are detachably connected with the horizontal bars 12 at the two ends respectively. Can dismantle the mode of connecting and be different from traditional and horizontal 12 or the mode of vertical retort 13 integration, the tradition needs follow-up continuation to decide can normal use, and decide the equipment that needs again to correspond. Specifically, the connection is carried out in a clamping mode, and the external equipment can detach the package to be pasted only by extruding. Even when the template is manually welded, the template can be manually disassembled. The structure of its joint sets up the dogtooth on outer frame 11 and horizontal bar 12, carries out the joint through the recess on the dogtooth cooperation semi-open encapsulation 2, and when extrusion semi-open encapsulation 2, the dogtooth produces slight deformation, deviates from the recess, and then dismantles semi-open encapsulation 2 down.
As another optimized embodiment, the horizontal bar 12 is provided with a hollow groove 4 along the length direction thereof for providing a deformation space.
Because semi-open encapsulation 2 carries out the complex with horizontal bar 12, the fretwork groove 4 of seting up on horizontal bar 12 this moment can provide horizontal bar 12 deformation space, and is more convenient when artifical or equipment dismantlement semi-open encapsulation 2.
In a preferred embodiment, the glue injection port 3 is in a truncated cone shape.
The circular truncated cone-shaped glue injection port 3 in the embodiment can increase the glue injection capacity, so that the plastic packaging effect is better. The glue injection port 3 is in a circular truncated cone shape, so that the embodiment can be expanded into two implementation modes.
1. The great one side of injecting glue mouth 3 is towards the base plate, and the injecting glue is and after sealed glue condenses this moment, and sealed fixed action of gluing is better, is difficult to more become flexible.
2. The smaller side of injecting glue mouth 3 is towards the base plate, injects sealed glue more easily this moment to this structure is equivalent to the bowl shape, can let sealed glue begin to assemble from the bottom and seal, and great opening outwards can let equipment laminate the wafer on the base plate more easily.
In another embodiment, a sealing opening 5 is formed at an opening of the glue injection opening 3, the sealing opening 5 and the glue injection opening 3 form a step structure, one end of the sealing opening 5 is communicated with the glue injection opening 3, and the other end of the sealing opening 5 is communicated with the outside.
Through setting up sealing port 5 again at the opening part of injecting glue mouth 3, sealing port 5 can carry out the plastic envelope through the sealed glue of pouring into the higher sealed glue cooperation injecting glue mouth 3 of intensity this moment, can increase plastic envelope intensity. In addition, through setting up sealing port 5, even sealing port 5 does not mould plastics and also can let injecting glue mouth 3 have redundant space, avoids sealed glue to spill over, can reduce the requirement to equipment precision to do not influence actual effect yet, can adapt to small-scale production more.
In an optimization, the sealing port 5 may be cylindrical. This sealing opening 5 is cylindrically, the shape of sealing opening 5 of laminating more, and the circular shape edge lets sealed glue more easily simultaneously and fills, compares the structural scheme that has the edges and corners and can avoid sealed glue because tension can't fill to the corner to influence sealed effect. Of course, the boundary cross section of the sealing port 5 may be in a shape without any edge such as an oval shape.
In a further improved embodiment, the base plate is provided with a baffle 6 for separating the base plates.
Separate the base plate through baffle 6, can let 6 both sides of baffle relatively independent, can set up different wafers to can cooperate injecting glue mouth 3 to carry out the injecting glue to both sides, this injecting glue can pour into the sealed glue of different materials into to different wafers, and then reach better encapsulation effect, for example different wafers heat production is different.
More specifically, the height of the baffle 6 is flush with the height of the glue injection port 3.
Through above-mentioned technical scheme, let baffle 6 and injecting glue mouth 3 high parallel and level, can avoid the sealed premature mixture of gluing of 6 both sides of baffle and influence the injecting glue effect this moment, can ensure the sealed gluey plastic envelope effect of the 6 both sides of baffle injection through letting baffle 6 and injecting glue mouth 3 parallel and level.
As a modified specific embodiment, the substrate on the semi-open package 2 is composed of a plurality of leads 7, and the wafer is bonded on the leads 7.
The wafer is directly laminated on the pins 7, heat conduction and heat dissipation can be carried out through the pins 7, and because the pins 7 are mutually independent, the wafer is directly laminated on the pins 7 at the moment, and is arranged by adjusting the length of the pins 7, so that the wafer is suitable for different circuit connections, and therefore the wafer can be different from a traditional substrate and is convenient to produce.
In a preferred scheme, the wafer is attached to the pins 7 through conductive silver paste.
The conductive silver paste can directly paste the wafer on the pins 7 and can also be directly electrically connected, so that the connection steps are simplified.
Similarly, the wafer can be fixed on the pins 7 through the insulating glue, and the wafer and the pins 7 can be isolated and simultaneously can be cooled through the pins 7, so that the cooling effect is improved.
In a preferred embodiment, the side of the housing facing away from the glue injection opening 3 is a bonding surface to be welded with an external circuit.
The follow-up needs rethread notes glue paste on the PCB board or on other circuit boards of shell, and consequently the follow-up use of user of being convenient for is with 3 one sides of injecting glue mouth towards the outside, avoids sealed glue in the injecting glue mouth 3 to influence and pastes the effect.
In addition, a marking angle is arranged on one side face of the shell with the glue injection port 3, and the orientation of the package is convenient to determine through the angle.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The integrated chip packaging plastic lead support is characterized by comprising a support (1) and a semi-open package (2) arranged on the support (1), wherein a glue injection port (3) is formed in the semi-open package (2), and a substrate on the semi-open package (2) is exposed through the glue injection port (3); the semi-open packages (2) are distributed on the support (1) in an array.
2. The plastic lead frame for the integrated chip package according to claim 1, wherein the frame (1) comprises an outer frame (11), a plurality of horizontal bars (12) and a plurality of vertical bars (13), the horizontal bars (12) and the vertical bars (13) are staggered to form a plurality of array spaces for arranging the semi-open packages (2); the crossband (12) is located between two adjacent semi-open packages (2), the two ends of the semi-open packages (2) can be detachably connected to the crossband (12) or one end can be detachably connected to the crossband (12) and the other end can be detachably connected to the outer frame (11).
3. The IC package plastic lead frame according to claim 2, wherein the bar (12) has a hollow groove (4) along its length for providing a deformation space.
4. The IC package plastic lead frame according to claim 2 or 3, wherein the semi-open package (2) is clamped between two bars (12) or between a bar (12) and the outer frame (11).
5. The integrated chip package plastic lead frame according to claim 1, 2 or 3, wherein the glue injection opening (3) is in the shape of a truncated cone.
6. The IC package plastic lead frame according to claim 5, wherein the end of the glue injection opening (3) with smaller area faces the substrate.
7. The integrated chip package plastic lead frame according to claim 6, wherein a sealing opening (5) is formed at an opening of the glue injection opening (3), the sealing opening (5) and the glue injection opening (3) form a step structure, one end of the sealing opening (5) is communicated with the glue injection opening (3), and the other end of the sealing opening is communicated with the outside.
8. The IC package plastic lead frame according to claim 7, wherein the substrate has a baffle (6) for separating the substrates.
9. The IC package plastic lead frame according to claim 8, wherein the height of the baffle (6) is flush with the height of the glue injection port (3).
10. The plastic lead frame for integrated chip package according to claim 1, wherein the substrate of the semi-open package (2) is composed of a plurality of leads (7), and the wafer is bonded to the leads (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921915983.6U CN210607238U (en) | 2019-11-07 | 2019-11-07 | Integrated chip packaging plastic lead support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921915983.6U CN210607238U (en) | 2019-11-07 | 2019-11-07 | Integrated chip packaging plastic lead support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210607238U true CN210607238U (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921915983.6U Active CN210607238U (en) | 2019-11-07 | 2019-11-07 | Integrated chip packaging plastic lead support |
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| CN (1) | CN210607238U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022006998A1 (en) * | 2020-07-06 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Asic chip and manufacturing method |
-
2019
- 2019-11-07 CN CN201921915983.6U patent/CN210607238U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022006998A1 (en) * | 2020-07-06 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Asic chip and manufacturing method |
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