CN202648481U - Liquid phase change heat transfer type pumping cooling system with booster pump - Google Patents
Liquid phase change heat transfer type pumping cooling system with booster pump Download PDFInfo
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- CN202648481U CN202648481U CN 201220215752 CN201220215752U CN202648481U CN 202648481 U CN202648481 U CN 202648481U CN 201220215752 CN201220215752 CN 201220215752 CN 201220215752 U CN201220215752 U CN 201220215752U CN 202648481 U CN202648481 U CN 202648481U
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Abstract
The utility model discloses a liquid phase change heat transfer type pumping cooling system with a booster pump. The cooling system comprises an evaporator system (2), a liquid supply pump (6), evaporable cooling media, a condenser (5), a pipeline system and the like, wherein the evaporator system (2) is arranged in electrical equipment (1), the liquid supply pump (6) supplies liquids for the evaporator system (2), the evaporable cooling media are used for evaporating in the evaporator system (2) to generate vapor, and the condenser (5) is used for condensing vapor from the evaporator system to generate single-phase liquids. The liquid phase change heat transfer type pumping cooling system further comprises a booster pump (3) which is arranged in the pipeline system at an outlet of the evaporator system and used for reducing evaporating pressure and improving condensing pressure simultaneously. The evaporator system (2) further comprises one or more evaporators composed of heat pipes (7) and a heat exchanger (9), the one or more evaporators are used for taking away heat produced in electrical equipment through the evaporators to cool the electrical equipment, and distributed heat source electrical equipment has high cooling efficiency by means of the liquid phase change heat transfer type pumping cooling system.
Description
Technical field
The utility model relates to a kind of phase-change heat transfer formula cooling system, more particularly, relates to the liquid phase-change heat transfer type pumping cooling system with booster pump that a kind of phase-change heat transfer that utilizes liquid comes cooling electric equipment.
Background technology
Thermal characteristics particularly has high power consumption or higher IP(shell protection grade for electrical equipment) low pressure and the high voltage electric equipment that require are very important.Reliability/the performance of its internal temperature and this electrical equipment/safety is closely related during electrical equipment work.On the other hand, the IEC/GB/IEEE standard particular requirement of temperature value have to(for) electrical equipment and its internal part for example.Therefore suitable cooling means has important function for product design.
At present, the cooling means that is generally used for cooling off the low-voltage and medium voltage electrical equipment is the air cooling, and it comprises natural air convection current or forced air convection current cooling, and this type of cooling is come cooling electric equipment and internal part thereof by air current flow.The air cooling has simple in structure, expense is cheap, advantage easy to maintenance, but this type of cooling need to have the cooling structure of good ventilation design, therefore require in the hole that electrical equipment leaves not only large but also many, taken the larger device space, and its for the large and concentrated heat-producing device of caloric value meeting so that because thereby the too high problem that causes electrical equipment to damage of local temperature rise appears in electrical equipment, this outer air cooling effectiveness is not high, and can cause dust and noise problem, and also be not suitable for environment temperature above in 40 degrees centigrade the hot environment.
The another kind of method that is used for cooling electric equipment is to use heat pipe, heat pipe is the heat transfer element that a kind of phase transformation that leans on the hydraulic fluid of self inside realizes the heat that thermal source produces is delivered to low-temperature receiver, be widely used in recent years, its advantage is: have very high thermal conductivity, good isothermal etc.Traditional liquid-sucking core heat pipe is to finish fluid by the capillarity of the liquid phase of core rope to carry, the manufacturing process of this liquid-sucking core heat pipe and theory analysis complexity and its heat transfer efficiency are subject to the impact of thermic load usually, so that the heat-transfer capability scope of this liquid-sucking core heat pipe and the fed distance of heat are restricted.The liquid-sucking core heat pipe is applicable to heat flow density and concentrates and the electronics of miniaturization and the heat radiation of electrical equipment.
High-termal conductivity for the phase-change heat transfer that utilizes heat pipe, avoid simultaneously the shortcoming of the liquid-sucking core heat pipe of above-mentioned self-circulation type, while strengthening system radiating effect (with respect to the conventional air cooling system), carried out in recent years the pumped liquid cooling system that utilizes liquid phase-change to conduct heat, this system is mainly by evaporimeter, and condenser and solution feed pump form.Wherein evaporimeter is arranged in the electrical equipment of concentrating heating and produces phase transformation in order to make liquid wherein in the situation that be heated, condenser be arranged on outside be used for cooling from evaporimeter out add hot fluid, solution feed pump is used for overcoming the resistance of ducting realizes condensed liquid supply liquid to evaporimeter circulation be arranged on condenser in closed circuit after.The advantage of this cooling system is the high-termal conductivity of having utilized phase-change heat transfer, simultaneously owing to utilizing lower-powered solution feed pump to promote liquid-circulating, so heat-transfer capability scope limitation more much bigger than traditional liquid-sucking core heat pipe and that overcome the liquid-sucking core heat pipe is not subject to the restriction of the transmission range of heat simultaneously yet.This pumped liquid cooling system is suitable for the heat radiation of Electrical and Electronic device that thermal source concentrates (such as microprocessor, IGBT, power semiconductor etc.), its electronic device that normally will need to cool off is placed on the heat that by the heat conduction electronic device is produced on the heat conduction platform of heat pipe and passes to liquid in the heat pipe and take away heat, but for the distributing thermal source, the low pressure or the middle piezoelectricity gas holder that relatively disperse such as thermal source, because thermal source relatively disperses, therefore the cooling effect of this cooling system is not good.
Therefore, need to improve the pumped liquid cooling system of prior art so that it can be in the situation that centralized thermal source can also still have higher cooling effectiveness simultaneously at the distributing thermal source again under higher ambient temperature conditions.
The utility model content
The utility model is made in view of the problem of above-mentioned prior art, and the purpose of this utility model is to provide a kind of effective liquid phase-change heat transfer type pumping cooling system.The utility model mainly is to reduce evaporator outlet pressure and increase condenser inlet pressure and rational deployment by heat pipe in the evaporimeter realizes having the low pressure of distributing thermal source or the effective cooling of middle piezoelectricity gas equipment by booster pump.Because system of the present utility model can be by regulating solution feed pump and booster pump power, adjust the operating temperature of evaporimeter and condenser, and by making the heat pipe structure rational deployment to be suitable for the distributing thermal source, therefore can not only advantageously improve the cooling performance of this cooling system and enlarge the range of application of this cooling system, therefore the high ambient temperature in the time of will effectively promoting the shell protection grade of existing low pressure or middle piezoelectricity gas equipment and normal operation allows and uses the product with present technique more competitive.
The utility model by be used for a kind of in low pressure or the piezoelectricity gas equipment can reduce booster pump that evaporator outlet pressure can increase again condenser inlet pressure simultaneously the heat transfer structure for heat pipe by suitable layout in the evaporimeter a kind of efficient liquid phase-change heat transfer type pumping cooling system that not only had been suitable for the distributing thermal source but also had been suitable for centralized thermal source is provided.
The purpose of this utility model is by providing a kind of liquid phase-change heat transfer type pumping cooling system with booster pump to be achieved, this liquid phase-change heat transfer type pumping cooling system comprises: evaporator system is arranged on the heating position in described low pressure or the middle piezoelectricity gas equipment; Solution feed pump is used for to described evaporator system feed flow; But evaporative cooling medium, it is recycled to described evaporator system by described solution feed pump, thereby but should evaporate to produce steam by the heat that is produced by the heating position in described low pressure or the middle piezoelectricity gas equipment by evaporative cooling medium; Condenser is used for condensation from described evaporator system steam out, to produce single-phase liquid; Pipe-line system, but but be used for connecting in turn described evaporator system, described condenser and described solution feed pump to form the closed circuit of described evaporative cooling medium by described evaporative cooling medium flow direction, this liquid phase-change heat transfer type pumping cooling system also comprises booster pump, this booster pump is configured to be arranged in the pipe-line system in exit of described evaporator system, improves simultaneously the condensing pressure of the porch of described condenser for reducing the evaporating pressure in the exit of described evaporator system.
In preferred embodiment of the present utility model, described pipe-line system comprises the first pipeline, the second pipeline and the 3rd pipeline, described the first pipeline connects described evaporator system and described condenser, described the second pipeline connects described condenser and described solution feed pump, and described the 3rd pipeline connects described solution feed pump and described evaporator system.
In preferred embodiment of the present utility model, described evaporator system can comprise one or more evaporimeter.
In preferred embodiment of the present utility model, described a plurality of evaporimeters are series, parallel or series connection and the form that combines in parallel.
In preferred embodiment of the present utility model, each described evaporimeter comprises heat exchanger and one or more heat pipe, each heat pipe has the first of endcapped and the second portion of endcapped, the sealing of described first is fixed in the described heat exchanger, described second portion is positioned at the outside of described heat exchanger, but passes to evaporative cooling medium in the described heat exchanger in order to the heat that the heating position in described low pressure or the middle piezoelectricity gas equipment is produced by described heat pipe.
In preferred embodiment of the present utility model, the outer surface of described first can be provided with screw thread or little fin, but with increase with described heat exchanger in the contact area of evaporative cooling medium.
In preferred embodiment of the present utility model, be provided with radiating fin on the outer surface of the second portion of described heat pipe, the direction of this radiating fin is parallel to the flow direction of circulating current in described low pressure or the middle piezoelectricity gas equipment, and the heat that is used for making the heating position in described low pressure or the piezoelectricity gas equipment to produce passes to described heat pipe by this radiating fin.
In preferred embodiment of the present utility model, described heat pipe is circle or flat, and can bend.
In preferred embodiment of the present utility model, described heat pipe can be arranged to for the poor row's mode that strengthens heat exchange.
In preferred embodiment of the present utility model, but can be for one or more ostiums of described evaporative cooling medium inflow and one or more tap holes that can supply described evaporative cooling medium or its steam to flow out but be provided with on the described heat exchanger, described ostium is used for being connected with described the 3rd pipeline fluid, and described tap hole is used for being connected with described the first pipeline fluid.
In preferred embodiment of the present utility model, described heat exchanger can be provided with the heat exchanger radiating fin on its outer surface, but is used for the heat that the heating position in described low pressure or the piezoelectricity gas equipment produces is directly passed to evaporative cooling medium in the described heat exchanger.
In preferred embodiment of the present utility model, this liquid phase-change heat transfer type pumping cooling system also comprises the gas-liquid separator in the first pipeline that is arranged between described booster pump and the described condenser, but is used for described evaporative cooling medium is separated with its steam.
In preferred embodiment of the present utility model, described gas-liquid separator comprises first interface, the second interface and the 3rd interface, described first interface is connected with described booster pump fluid by described the first pipeline, described the second interface is connected with the entrance of described condenser by described the first pipeline, but the flow of vapor that is used for making described evaporative cooling medium to described condenser to be condensed into liquid, described the 3rd interface is arranged on the bottom of described gas-liquid separator and is connected with described the second pipeline fluid by the 4th pipeline, but is used for making unevaporated evaporative cooling medium flow to described solution feed pump.
In preferred embodiment of the present utility model, described booster pump is plunger type or the screw type booster pump that has than small reduction ratio.
In preferred embodiment of the present utility model, but described evaporative cooling medium is the cooling medium of lower boiling electric insulation.
In preferred embodiment of the present utility model, the cooling medium of described lower boiling electric insulation is CFC-113, R-134a or VFX4310.
Description of drawings
Other purposes of the present utility model, feature and industry and technical significance will be more readily understood by below in conjunction with accompanying drawing the detailed description of the specific embodiment of the present utility model being become, among the figure:
Fig. 1 is the schematic diagram according to the embodiment for the liquid phase-change heat transfer type pumping cooling system in low pressure or the piezoelectricity gas equipment of the present utility model;
Fig. 2 is the schematic diagram that is applied to the heat pipe of liquid phase-change heat transfer type pumping cooling system shown in Figure 1;
Fig. 3 is the schematic diagram of the single evaporimeter that is made of as shown in Figure 2 three heat pipes and heat exchanger;
Fig. 4 is the schematic diagram of the single evaporimeter that is made of as shown in Figure 2 four heat pipes and heat exchanger;
Fig. 5 is the schematic diagram of the parallel evaporator that is made of as shown in Figure 4 three evaporimeters; And
Fig. 6 is the schematic diagram of the serial evaporator that is made of as shown in Figure 4 three evaporimeters.
The specific embodiment
Describe with reference to the accompanying drawings preferred embodiment of the present utility model in detail.
Fig. 1 is the schematic diagram according to the embodiment of liquid phase-change heat transfer type pumping cooling system of the present utility model.As shown in Figure 1, this liquid phase-change heat transfer type pumping cooling system mainly comprises evaporator system 2, be arranged on the heating position in described low pressure or the middle piezoelectricity gas equipment 1, but be used for making evaporative cooling medium wherein be subjected to thermal evaporation to take away heat, thereby reach the purpose of cooling electric equipment; Solution feed pump 6, but come to evaporator system 2 feed flows for the flow resistance that overcomes evaporative cooling medium; But evaporative cooling medium, it is recycled to evaporator system 2 by described solution feed pump 6, thereby but should evaporate to produce steam by the heat that is produced by the heating position in low pressure or the middle piezoelectricity gas equipment 1 by evaporative cooling medium; Condenser 5 is used for condensation from described evaporator system 2 steam out, and to produce single-phase liquid, this condenser 5 can be traditional condenser, such as being fan-cooled condenser, also can be the condenser etc. of cooling by water; Pipe-line system, but but be used for connecting in turn described evaporator system 2, described condenser 5 and described solution feed pump 6 to form the closed circuit of described evaporative cooling medium by described evaporative cooling medium flow direction B, described pipe-line system comprises the first pipeline 13, the second pipeline 14 and the 3rd pipeline 15, described the first pipeline 13 connects described evaporator system 2 and described condenser 5, described the second pipeline 14 connects described condenser 5 and described solution feed pump 6, and described the 3rd pipeline 15 connects described solution feed pump 6 and described evaporator system 2.
This liquid phase-change heat transfer type pumping cooling system also comprises booster pump 3, this booster pump 3 is configured to be arranged in the pipe-line system in exit of described evaporator system 2, along the flow entrance of direction of cooling medium, simultaneously improve the condensing pressure of the porch of described condenser 5 for reducing the evaporating pressure in the exit of described evaporator system 2 such as above-mentioned the first pipeline 13.For steam, because temperature and pressure is mutually corresponding, be that pressure rising temperature then raises, the pressure decreased temperature then reduces, and therefore by the evaporating pressure that reduces evaporimeter and the condensing pressure that improves condenser 5, can reduce evaporating temperature and improve simultaneously condensation temperature, thereby realized as much as possible isothermal heat transfer, reduced thermal loss, simultaneously owing to having improved condensation temperature, so steam more easily condenses into liquid.Wherein this booster pump 3 is the pumps that have than small reduction ratio, for example plunger type or screw type booster pump, and its power is less, is beneficial to the consumption that reduces energy.
This liquid phase-change heat transfer type pumping cooling system further comprises the gas-liquid separator 4 in the first pipeline 13 that is arranged between booster pump 3 and the condenser 4, but is used for described evaporative cooling medium is separated with its steam, improves condensation efficiency.Described gas-liquid separator comprises first interface 41, the second interface 42 and the 3rd interface 43, described first interface 41 is connected with described booster pump 3 fluids by described the first pipeline 13, described the second interface 42 is connected with the entrance of described condenser 5 by described the first pipeline 13, but the flow of vapor that is used for making described evaporative cooling medium to described condenser 5 to be condensed into liquid, described the 3rd interface 43 is arranged on the bottom of described gas-liquid separator 4 and is connected with described the second pipeline 14 fluids by the 4th pipeline 16, but is used for making unevaporated evaporative cooling medium flow to described solution feed pump 6.Gas-liquid separator 4 is gas-liquid separators of commonly using, so its structure does not repeat them here.
The schematic diagram that is applied to the heat pipe 7 of liquid phase-change heat transfer type pumping cooling system shown in Figure 1 such as Fig. 2.Heat pipe 7 of the present utility model can be selected liquid-sucking core heat pipe, gravity assisted heat pipe commonly used at present, perhaps novel super heat-conductive pipe, preferred super heat-conductive pipe, because its arrangement is not subjected to the impact of the working medium in it, this has great importance for the flexible topology of heat pipe 7 in electrical equipment 1.The length of heat pipe 7 and concrete shape can be selected according to concrete cooling structure, be not limited to length shown in Figure 2 and round-shaped, for example heat pipe 7 can be for flat increasing its heat-transfer effect, and can bend, so that the electrical equipment of needs cooling is had better structure adaptability.
Fig. 3 is the schematic diagram of the single evaporimeter that is made of three heat pipes 7 and heat exchanger 9.Each described evaporimeter can comprise a heat exchanger 9 and one or more heat pipe 7, although show in this embodiment three heat pipes 7, but the heat pipe of any desired number can be set as required, each heat pipe 7 has the first of endcapped and the second portion of endcapped, the sealing of described first is fixed in the described heat exchanger 9, described second portion is positioned at the outside of described heat exchanger 9, but passes to evaporative cooling medium in the described heat exchanger 9 in order to the heat that the heating position in described low pressure or the middle piezoelectricity gas equipment 1 is produced by described heat pipe 7.
The first of described heat pipe 7 can preferably be provided with screw thread or little fin (rectangle, annular, corrugated etc.) etc., but with increase with described heat exchanger 9 in the contact area of evaporative cooling medium, thereby strengthen heat transfer effect.For the distributing thermal source, the second portion of described heat pipe can be provided with radiating fin 8, the heat that produces for the heating position that makes described electrical equipment 1 passes to described heat pipe 7 by this radiating fin 8, preferably, the direction of radiating fin 8 is parallel to the flow direction (shown in the thick arrow A among Fig. 1) of circulating current in low pressure or the middle piezoelectricity gas equipment 1, so that by bringing into play the heat-sinking capability of each radiating fin.In addition, preferably, described heat pipe 7 can be arranged to for the poor row's mode that strengthens heat exchange.For centralized thermal source, the second portion of heat pipe 7 can arrange radiating fin 8 and be set directly at this centralized thermal source (or concentrated heater element) inside and dispel the heat, be set directly under the heater element such as the second portion with heat pipe that usually adopts, perhaps the second portion with heat pipe is arranged on the platform, and then heater element is placed on this platform dispels the heat, the heater element that certainly also can cool off according to actual needs adopts other suitable set-up modes, does not repeat them here.
But can be for one or more ostiums 10 of described evaporative cooling medium inflow and one or more tap holes 11 that can supply described evaporative cooling medium or its steam to flow out but be provided with on the described heat exchanger 9, described ostium 10 is used for being connected with described the 3rd pipeline 15 fluids, and described tap hole 11 is used for being connected with described the first pipeline 13 fluids.
Preferably, described heat exchanger 9 can be provided with heat exchanger radiating fin 12 on its outer surface, is directly passed to evaporative cooling medium in the described heat exchanger 9 but be used for heat that the heating position with described electrical equipment 1 produces.In addition, the concrete shape of heat exchanger 9 and structure also can be carried out appropriate design according to the equipment of concrete needs cooling, and are not limited to described here.
Fig. 4 is the schematic diagram of the single evaporimeter that is made of four heat pipes 7 and heat exchanger 9.In conjunction with Fig. 1, can see, in low pressure or middle piezoelectricity gas equipment 1, the top of this evaporimeter is provided with fan, and its hot-air that is used for making this electrical equipment 1 is via the evaporimeter shuttling movement, and the direction of motion of air is shown in the thick arrow A among Fig. 1 and Fig. 4.
Below in conjunction with Fig. 1 and Fig. 4 the process that liquid phase-change heat transfer type pumping cooling system of the present utility model is used for cooling off described low pressure or piezoelectricity gas equipment 1 is described.After solution feed pump 6 startings, under the driving of solution feed pump 6, but the evaporative cooling medium in the liquid phase-change heat transfer type pumping cooling system is fed in the heat exchanger 9 of evaporimeter 2 (but the flow direction of evaporative cooling medium is shown in thin arrow B among Fig. 1), the described low pressure of fans drive of evaporimeter top or the hot-air in the middle piezoelectricity gas equipment 1 move downward the radiating fin 8 on the second portion of superheater tube 7 at this moment, radiating fin 8 by convection current and heat conduction with 7 working medium in the heat transferred heat pipe of hot-air, then but heat is delivered to rapidly the first in the evaporative cooling medium that is immersed in heat exchanger 9 of heat pipe 7, then but heat passes to evaporative cooling medium the heat exchanger 9 from this first, simultaneously but the part hot-air also is directly passed to evaporative cooling medium in the heat exchanger 9 by the heat exchanger radiating fin 12 on heat exchanger 9 outer surfaces, but should the evaporative cooling medium heat absorption evaporate, the booster pump 3 but steam that produces and unevaporated evaporative cooling medium are flowed through under the driving of solution feed pump 6, booster pump 3 makes the pressure decreased at evaporator outlet place that pressure through the gas-liquid mixture of this booster pump 3 is raise, and (pressure that reduces the evaporator outlet place can reduce its evaporating temperature, to utilize liquid evaporation; The pressure that improves the gas-liquid mixture of process booster pump can improve its condensation temperature, to utilize devaporation), gas-liquid mixture enters into gas-liquid separator 4, but liquid evaporative cooling medium passes through the 4th pipeline 16 that is connected with the second pipeline 14 and flow in the solution feed pump 6 therein, but the steam of evaporative cooling medium flows in the condenser 5 further to be condensed into liquid, then also enter in the solution feed pump to carry out next time cool cycles by the second pipeline 14, so far, but the heat in low pressure or the middle piezoelectricity gas equipment 1 absorb via the circulation of the evaporative cooling medium device 5 that is condensed.
Fig. 5 is the schematic diagram of the parallel evaporator that is made of as shown in Figure 4 three evaporimeters.Fig. 6 is the schematic diagram of the serial evaporator that is made of as shown in Figure 4 three evaporimeters.The form that the evaporimeter of liquid phase-change heat transfer type pumping cooling system of the present utility model can adopt as shown in Figure 5 parallel evaporator structure, serial evaporator structure shown in Figure 6 or parallel evaporator structure and serial evaporator structure to combine specifically adopts the heat structure of the electrical equipment which kind of evaporation structure can cool off as required to carry out choose reasonable.In addition, the quantity of evaporimeter is not limited to Fig. 5 and three shown in Figure 6, and its quantity can freely be selected by the structure that those skilled in the art cool off according to actual needs, does not repeat them here.
In addition, preferably, but evaporative cooling medium of the present utility model is the cooling medium of lower boiling electric insulation, such as CFC-113, R-134a, VFX4310 etc., these cooling mediums can evaporate under lower temperature, such as 30 degrees centigrade, this is conducive to reduce the operating temperature of heater element, improves the IP grade of electrical equipment, insulate owing to it simultaneously, even therefore cooling system appearance seepage does not a little affect the safe operation of electrical equipment yet, has very high security.
Structure and the course of work thereof with liquid phase-change heat transfer type pumping cooling system of booster pump of the present utility model more than described, to have effective cooling characteristics in order verifying according to the liquid phase-change heat transfer type pumping cooling system with booster pump of the present utility model, the product of prior art and the energy consumption of the product behind application the utility model to be contrasted:
Under identical refrigerating capacity, the volume flow of this liquid phase-change heat transfer type pumping cooling system only needs 20% of water-cooling system, thereby can significantly reduce the volume (pump, pipeline etc.) of whole cooling system.
Compare with common forced air cooling, under identical radiating effect, can significantly improve the IP(shell protection of product) grade, and can make the Temperature Distribution in the electrical equipment relatively even, be unlikely to occur the situation of hot-spot.
Compare conventional air-cooled and water-cooled (its high ambient temperature that carries out work is generally 40-50 degree centigrade), liquid phase-change heat transfer type pumping cooling system of the present utility model can carry out it high ambient temperature of work and bring up to 50-55 degree centigrade, even this is so that also can realize the cooling of electrical equipment in the environment of sweltering heat, thereby can make its normal operation.
Although describe the utility model in detail with reference to preferred embodiment of the present utility model in the above, but the utility model is not limited to the above-mentioned specific embodiment, those skilled in the art also can be according to suitable evaporator system 2 arrangements of concrete application choice under inspiration of the present utility model, increase or reduce some parts of cooling system, as long as can realize the purpose of this utility model.Therefore, scope of the present utility model is only limited by appending claims and equivalent thereof.
Claims (16)
1. liquid phase-change heat transfer type pumping cooling system that is used in low pressure or the piezoelectricity gas equipment (1) comprises:
Evaporator system (2) is arranged on the heating position in described low pressure or the middle piezoelectricity gas equipment (1);
Solution feed pump (6) is used for to described evaporator system (2) feed flow;
But evaporative cooling medium, it is recycled to described evaporator system (2) by described solution feed pump (6), thereby but should evaporate to produce steam by the heat that is produced by the heating position in described low pressure or the middle piezoelectricity gas equipment (1) by evaporative cooling medium;
Condenser (5) is used for condensation from described evaporator system (2) steam out, to produce single-phase liquid;
Pipe-line system, but be used for by described evaporative cooling medium flow direction (B) connect in turn described evaporator system (2), described condenser (5) and described solution feed pump (6) but forming the closed circuit of described evaporative cooling medium,
It is characterized in that, this liquid phase-change heat transfer type pumping cooling system also comprises booster pump (3), this booster pump (3) is configured to be arranged in the pipe-line system in exit of described evaporator system (2), improves simultaneously the condensing pressure of the porch of described condenser (5) for reducing the evaporating pressure in the exit of described evaporator system (2).
2. liquid phase-change heat transfer type pumping cooling system as claimed in claim 1, it is characterized in that, described pipe-line system comprises the first pipeline (13), the second pipeline (14) and the 3rd pipeline (15), described the first pipeline (13) connects described evaporator system (2) and described condenser (5), described the second pipeline (14) connects described condenser (5) and described solution feed pump (6), and described the 3rd pipeline (15) connects described solution feed pump (6) and described evaporator system (2).
3. liquid phase-change heat transfer type pumping cooling system as claimed in claim 2 is characterized in that, described evaporator system (2) comprises one or more evaporimeter.
4. liquid phase-change heat transfer type pumping cooling system as claimed in claim 3 is characterized in that, described a plurality of evaporimeters are series, parallel or series connection and the form that combines in parallel.
5. liquid phase-change heat transfer type pumping cooling system as claimed in claim 4, it is characterized in that, each described evaporimeter comprises heat exchanger (9) and one or more heat pipe (7), each heat pipe (7) has the first of endcapped and the second portion of endcapped, the sealing of described first is fixed in the described heat exchanger (9), described second portion is positioned at the outside of described heat exchanger (9), in order to the heat that the heating position in described low pressure or the middle piezoelectricity gas equipment (1) is produced by described heat pipe pass to described heat exchanger (9) but in evaporative cooling medium.
6. liquid phase-change heat transfer type pumping cooling system as claimed in claim 5 is characterized in that, the outer surface of described first is provided with screw thread or little fin, to increase with described heat exchanger (9) but in the contact area of evaporative cooling medium.
7. liquid phase-change heat transfer type pumping cooling system as claimed in claim 5, it is characterized in that, be provided with radiating fin (8) on the outer surface of the second portion of described heat pipe (7), the direction of this radiating fin is parallel to the flow direction (A) of circulating current in described low pressure or the middle piezoelectricity gas equipment (1), and the heat that is used for making the heating position in described low pressure or the piezoelectricity gas equipment (1) to produce passes to described heat pipe (7) by this radiating fin (8).
8. liquid phase-change heat transfer type pumping cooling system as claimed in claim 5 is characterized in that, described heat pipe (7) is circle or flat, and can bend.
9. liquid phase-change heat transfer type pumping cooling system as claimed in claim 5 is characterized in that, described heat pipe (7) is arranged to for the poor row's mode that strengthens heat exchange.
10. such as each the described liquid phase-change heat transfer type pumping cooling system among the claim 5-9, it is characterized in that, described heat exchanger (9) but on be provided with one or more ostiums (10) that can flow into for described evaporative cooling medium but and one or more tap holes (11) that can flow out for described evaporative cooling medium or its steam, described ostium (10) is used for being connected with described the 3rd pipeline (15) fluid, and described tap hole (11) is used for being connected with described the first pipeline (13) fluid.
11. liquid phase-change heat transfer type pumping cooling system as claimed in claim 10, it is characterized in that, described heat exchanger (9) is provided with heat exchanger radiating fin (12) on its outer surface, be used for described low pressure or piezoelectricity gas equipment (1) but in the heat that produces of heating position be directly passed to evaporative cooling medium in the described heat exchanger.
12. such as each the described liquid phase-change heat transfer type pumping cooling system among the claim 2-9, it is characterized in that, this liquid phase-change heat transfer type pumping cooling system also comprises the gas-liquid separator (4) in the first pipeline (13) that is arranged between described booster pump (3) and the described condenser (5), but is used for described evaporative cooling medium is separated with its steam.
13. liquid phase-change heat transfer type pumping cooling system as claimed in claim 12, it is characterized in that, described gas-liquid separator (4) comprises first interface (41), the second interface (42) and the 3rd interface (43), described first interface (41) is connected with described booster pump (3) fluid by described the first pipeline (13), described the second interface (42) is connected with the entrance of described condenser (5) by described the first pipeline (13), but the flow of vapor that is used for making described evaporative cooling medium to described condenser (5) to be condensed into liquid, described the 3rd interface (43) is arranged on the bottom of described gas-liquid separator and is connected with described the second pipeline (14) fluid by the 4th pipeline (16), but is used for making unevaporated evaporative cooling medium flow to described solution feed pump (6).
14. the described liquid phase-change heat transfer type pumping cooling system as among the claim 1-9 is characterized in that, described booster pump (3) is for having plunger type or the screw type booster pump than small reduction ratio.
15. such as the described liquid phase-change heat transfer type of claim 1-9 pumping cooling system, it is characterized in that, but described evaporative cooling medium is the cooling medium of lower boiling electric insulation.
16. liquid phase-change heat transfer type pumping cooling system as claimed in claim 15 is characterized in that the cooling medium of described lower boiling electric insulation is CFC-113, R-134a or VFX4310.
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| CN 201220215752 CN202648481U (en) | 2012-05-14 | 2012-05-14 | Liquid phase change heat transfer type pumping cooling system with booster pump |
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| CN 201220215752 CN202648481U (en) | 2012-05-14 | 2012-05-14 | Liquid phase change heat transfer type pumping cooling system with booster pump |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103424018A (en) * | 2012-05-14 | 2013-12-04 | 施耐德电器工业公司 | Liquid phase-change heat transfer type pumping cooling system with booster pump |
| CN103490597A (en) * | 2013-09-27 | 2014-01-01 | 深圳市禾望电气有限公司 | Cooling system of converter |
| CN105244830A (en) * | 2015-10-22 | 2016-01-13 | 上海振大电器成套有限公司 | Water treatment system and heat recovery device |
| CN108335759A (en) * | 2018-02-06 | 2018-07-27 | 华中科技大学 | The cooling system for tokamak device divertor based on evaporation cooling principle |
-
2012
- 2012-05-14 CN CN 201220215752 patent/CN202648481U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103424018A (en) * | 2012-05-14 | 2013-12-04 | 施耐德电器工业公司 | Liquid phase-change heat transfer type pumping cooling system with booster pump |
| CN103490597A (en) * | 2013-09-27 | 2014-01-01 | 深圳市禾望电气有限公司 | Cooling system of converter |
| CN103490597B (en) * | 2013-09-27 | 2016-08-17 | 深圳市禾望电气股份有限公司 | A kind of cooling system of current transformer |
| CN105244830A (en) * | 2015-10-22 | 2016-01-13 | 上海振大电器成套有限公司 | Water treatment system and heat recovery device |
| CN108335759A (en) * | 2018-02-06 | 2018-07-27 | 华中科技大学 | The cooling system for tokamak device divertor based on evaporation cooling principle |
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Granted publication date: 20130102 Termination date: 20170514 |