CN205665647U - Notebook heat radiation structure - Google Patents

Abstract

The utility model provides a notebook heat radiation structure relates to computer heat dissipation field, including setting up miniature semiconductor refrigeration piece, temperature controller, the CPU heat conduction structure on the computer bottom plate, miniature semiconductor refrigeration piece is fixed at the power inslot, the refrigeration face and computer power contact of miniature semiconductor refrigeration piece, and the face of heating of miniature semiconductor refrigeration piece meets with the bottom shell of computer bottom plate, temperature controller has two temperature sensor that link to each other with power, CPU last the company, and temperature controller passes through wire control miniature semiconductor refrigeration piece, fan work when the high temperature, can in time cool off the power, avoids the power to be burnt out, improves power life, effectively avoids water, dust, impurity etc. To get into the internal circuit board and damages CPU.

Description

A kind of laptop heat-dissipation structure

Technical field

This utility model relates to a kind of radiating structure of computer, particularly relates to a kind of laptop heat-dissipation structure.

Background technology

Notebook operationally power supply and CPU often produce bigger heat, if can not dispel the heat in time, will directly affect Operating rate and power supply and the service life of CPU.Computer volume and inner space are less, and heater element produces because of integrated distribution Raw heat dissipation problem is more prominent.In existing radiation processes, the conduction of heat between heat conduction original paper and heater element is relatively slow, high Warm amount is easily accumulated in conducting-heat elements, is difficult to fin conductive, causes radiating efficiency extremely low.Existing notebook does not all have Power supply is done radiating treatment, furthermore, existing solution CPU heat dissipation problem is usually and uses temperature-controlled fan to dispel the heat, i.e. installing dissipates Backing and fan, in this kind of radiator structure, fin, CPU, fan all with extraneous contact be in unified atmospheric environment In, when cpu temperature is too high, fan absorbs cold air and easily causes the water in the external world, dust, sandy soil etc. to enter internal electricity from the external world Road plate damages CPU.

Utility model content

In order to solve, the radiating effect of existing notebook is the best and fin, CPU, fan are all easily caused with extraneous contact The defect that internal circuit damages, this utility model spy provides a kind of laptop heat-dissipation structure.

The technical solution of the utility model is as follows:

A kind of laptop heat-dissipation structure, including the micro semiconductor cooling piece being arranged on computer base plate, temperature controller, CPU conductive structure, described micro semiconductor cooling piece is fixed in power slot, the chill surface of micro semiconductor cooling piece and computer Electrical power contacts, the face that heats of micro semiconductor cooling piece connects with the bottom shell of computer base plate；Described CPU conductive structure includes First conductive sole plate, the second conductive sole plate being arranged on CPU upper surface and two ends connect respectively the first conductive sole plate, second The heat pipe of conductive sole plate；Also include the nacelle being arranged on bottom cabinet, be arranged on the first conductive sole plate lower surface dissipate Backing and be fixed on the fan on fin side；Nacelle is the cavity structure of upper end open, described first conductive sole plate with Nacelle upper end open is connected to form a sealed compartment, and fin and fan are arranged in sealed compartment.In this programme, it is arranged on CPU The CPU heat absorbed is delivered to the first conductive sole plate, the first heat conduction by heat pipe by the second conductive sole plate on upper surface Base plate transfers heat on fin again, and in this programme, some fin are uniformly arranged in the first conductive sole plate so that dissipate Hot side is long-pending bigger.Furthermore, open respectively relative to the position of fin relative to the position of fan and the sidewall of nacelle bottom nacelle Being provided with air inlet and air outlet, the gap between fin forms vent passages, and when CPU runs overheated, fan will be from cabin Absorbing the cold air outside cabinet bottom body and deliver to fin, after cold air passes through fin, hot-air will be from air outlet Discharge.Traditional CPU heat radiation is dispelled the heat, at this kind of radiator structure generally by installing fin and fan on CPU In, fin, CPU, fan all with extraneous contact being in unified atmospheric environment, when cpu temperature is too high, fan is from outward Boundary absorbs cold air and easily causes the water in the external world, dust, sandy soil etc. to enter internal circuit board damage CPU.For solving this defect, send out A person of good sense is by being arranged on fan and fin in sealed compartment, by completely isolated to CPU, internal circuit board and fan, fin, The hot-air making fan sucks bottom nacelle in radiation processes cold air and discharge can only circulate in sealed compartment, Efficiently avoid water, dust, impurity etc. and enter internal circuit board damage CPU；Be connected with on described temperature controller with power supply, Two temperature sensors that CPU is connected, when temperature is too high, temperature controller passes through polygon control survey micro semiconductor cooling piece, wind Fan work.

Further, the bottom of described computer base plate is provided with ventilative with the relevant position, the face that heats of micro semiconductor cooling piece Hole, distributes the heat of micro semiconductor cooling piece self, it is to avoid aggravate power source temperature in turn in time.

Further, described heat pipe is hollow structure inside, and the inwall of heat pipe is evenly arranged with heat-conducting medium.Lead Heat pipe is that metal material is made, it is preferable that the heat pipe in this programme uses copper pipe.It is uniformly arranged on leading on heat pipe inwall Thermal medium makes heat pipe can quickly absorb the heat that CPU module sends, and heat is the quickest through the first conductive sole plate Conduction to fin so that heat be difficult to accumulation, be effectively improved heat transfer efficiency, improve CPU module heat radiation effect Really.

Further, described heat-conducting medium is powdery metal particles.Metal heat-conducting energy force rate nonmetallic heat conductive ability is strong, The powdery metal particles being uniformly arranged on heat pipe inwall further increases heat-conducting area, it is ensured that the heat on CPU Absorbed in time and transmitted.

Further, described nacelle upper surface offering seal groove, seal washer is arranged in seal groove, the first heat conduction Base plate is connected with nacelle by seal washer.The setting of seal washer ensure that to be formed between the first conductive sole plate and nacelle and seals Cabin, it is to avoid inadequate because sealing dynamics, the cold air that fan sucks from cabinet outside is from the junction of the first conductive sole plate Yu nacelle Exit into internal circuit board and damage CPU.

Further, also include that the position being fixed on the hangers on the first conductive sole plate side and corresponding hangers is arranged on Screwed hole on nacelle sidewall, the first conductive sole plate runs through hangers with nacelle by bolt is simultaneously attached with screwed hole.? In this programme, the first conductive sole plate is bolted with nacelle so that readily accessible between the first conductive sole plate and nacelle, is dissipating When heat goes wrong, it is simple to the fan in sealed compartment is overhauled with fin.

In sum, Advantageous Effects of the present utility model is as follows:

(1) setting of temperature controller, it is ensured that laptop and cpu temperature reach the timely of cooling mechanism during certain value Work, avoid simultaneously temperature relatively low time idle running；

(2) it is specially provided with micro semiconductor cooling piece on power supply, cools down power supply in time, it is to avoid power supply is burned, improve Power supply service life；

(3) fan and fin are arranged in sealed compartment, it is ensured that in radiation processes, fan sucks bottom nacelle Cold air and the hot-air of discharge can only circulate in sealed compartment, efficiently avoid water, dust, impurity etc. and enter internal Circuit board damage CPU；

(4) heat pipe is that the heat-conducting medium being uniformly arranged on the inwall of hollow structure inside and heat pipe makes on CPU Heat is difficult to accumulation, is effectively improved heat transfer efficiency, enhances radiating effect；

(5) heat conductivility of powdery metal particles is relatively strong, and heat-conducting medium uses powdery metal particles to further enhance The heat transfer efficiency of heat pipe；

(6) first conductive sole plate are sealed by seal washer with nacelle, it is to avoid inadequate because sealing dynamics, and cabinet is outside to be sucked Cold air exit into from the junction of the first conductive sole plate Yu nacelle internal circuit board damage CPU；

(7) first conductive sole plate connect by tethering with nacelle so that readily accessible between the first conductive sole plate and nacelle, are dissipating When heat goes wrong, it is simple to the fan in sealed compartment is overhauled with fin.

Accompanying drawing explanation

Fig. 1 is the structural representation of a kind of laptop heat-dissipation structure；

Fig. 2 is the structural representation of a kind of CPU conductive structure；

Fig. 3 is the structural representation of nacelle；

Fig. 4 is the partial schematic diagram in Fig. 3 at A；

Wherein the parts title corresponding to reference is as follows:

1, computer base plate；2, micro semiconductor cooling piece；3, power slot；4, temperature controller；41, temperature sensor；5、 CPU conductive structure；51, the first conductive sole plate；52, the second conductive sole plate；53, heat pipe；54, nacelle；55, fin；56, wind Fan；57, heat-conducting medium；58, seal groove；59, hangers；510, screwed hole；511, air-vent.

Detailed description of the invention

Below in conjunction with the accompanying drawings and this utility model is described in more detail by specific embodiment, but of the present utility model Embodiment is not limited to this.

Embodiment 1

As Figure 1-Figure 4, a kind of laptop heat-dissipation structure, including the micro semiconductor system being arranged on computer base plate 1 Cold 2, temperature controller 4, CPU conductive structure 5, described micro semiconductor cooling piece 2 is fixed in power slot 3, miniature partly leads The chill surface of body cooling piece 2 contacts with computer power, outside the face that heats of micro semiconductor cooling piece 2 is with the bottom of computer base plate 1 Shell connects；The second conductive sole plate 52 that described CPU conductive structure 5 includes the first conductive sole plate 51, be arranged on CPU upper surface with And two ends connect the heat pipe 53 of first conductive sole plate the 51, second conductive sole plate 52 respectively；Also include being arranged on bottom cabinet Nacelle 54, the fin 55 being arranged on the first conductive sole plate 51 lower surface and be fixed on the fan on fin 55 side 56；Nacelle 54 is the cavity structure of upper end open, and it is close that described first conductive sole plate 51 and nacelle 54 upper end open are connected to form one Batten down, fin 55 and fan 56 are arranged in sealed compartment；Two be connected with power supply, CPU it are connected with on described temperature controller 4 Temperature sensor 41, temperature controller 4 is connected with micro semiconductor cooling piece 2, fan 56 by wire.

The radiating principle of the present embodiment is as follows: the temperature recorded is conveyed to temperature controller 4 by temperature sensor 41, with work The work of notebook, power supply and cpu temperature raise gradually, and when temperature reaches higher than 30 DEG C, temperature controller 4 controls miniature half Conductor cooling piece 2, fan 56 work, and micro semiconductor cooling piece 2 helps power supply to lower the temperature, and fan 56 dispels the heat to CPU in time；Its In, the heat conduction principle of CPU conductive structure 5 is: the CPU heat that the second conductive sole plate 52 being arranged on CPU upper surface will absorb Amount is delivered to the first conductive sole plate 51 by heat pipe 53, and the first conductive sole plate 51 transfers heat on fin 55 again, cabin Air inlet is offered relative to the position of fan 56 and the sidewall of nacelle 54 respectively relative to the position of fin 55 bottom body 54 And air outlet, the gap between fin 55 forms vent passages, and when CPU runs overheated, fan 56 will be from nacelle 54 end Portion absorbs the cold air outside cabinet and delivers to fin 55, and after cold air passes through fin 55, hot-air will be from air outlet Discharge.The present embodiment is avoided in radiation processes bottom nacelle 54 by fan 56 and fin 55 being arranged in sealed compartment The cold air of suction, dust etc. enter internal circuit board and damage CPU.

Embodiment 2

The present embodiment on the basis of embodiment 1, the bottom of described computer base plate 1 and the system of micro semiconductor cooling piece 2 Hot side relevant position is provided with air-vent, is distributed by the heat of micro semiconductor cooling piece self in time, it is to avoid add in turn Acute power source temperature, improves radiating efficiency further.

Embodiment 3

The present embodiment is on the basis of embodiment 1, and described heat pipe 53 is hollow structure inside, on the inwall of heat pipe 53 It is evenly arranged with heat-conducting medium 57.Described heat-conducting medium 57 is powdery metal particles.

Metal heat-conducting energy force rate nonmetallic heat conductive ability is strong, the powdery metal being uniformly arranged on heat pipe 53 inwall Grain is effectively improved heat transfer efficiency, enhances radiating effect, it is ensured that the heat on CPU is absorbed in time and transmits.

Embodiment 4

The present embodiment, on the basis of embodiment 1 or embodiment 2, described nacelle 54 upper surface offers seal groove 58, Seal washer is arranged in seal groove 58, and the first conductive sole plate 51 is connected with nacelle 54 by seal washer.

The setting of seal washer ensure that formation sealed compartment between the first conductive sole plate 51 and nacelle 54, it is to avoid because of sealing force Degree causes fan 56 to flow out from the junction of the first conductive sole plate 51 with nacelle 54 from the outside cold air sucked of cabinet not And enter internal circuit board and damage CPU.

Embodiment 5

The present embodiment, on the basis of embodiment 1 or embodiment 2 or embodiment 3, also includes being fixed on the first conductive sole plate Hangers 59 and the position of corresponding hangers 59 on 51 sides are arranged on the screwed hole 510 on nacelle 54 sidewall, at the bottom of the first heat conduction Plate 51 runs through hangers 59 with nacelle 54 by bolt is simultaneously connected with screwed hole 510.

First conductive sole plate 51 is bolted with nacelle 54 so that be easy to tear open between the first conductive sole plate 51 and nacelle 54 Unload, when heat radiation goes wrong, it is simple to the fan 56 in sealed compartment is overhauled with fin 55.

It is embodiments of the invention as mentioned above.The present invention is not limited to above-mentioned embodiment, and anyone should learn The structure change made under the enlightenment of the present invention, every have same or like technical scheme with the present invention, each falls within this Within the protection domain of invention.

Claims (2)

1. a laptop heat-dissipation structure, it is characterised in that: include the micro semiconductor cooling piece being arranged on computer base plate (1) (2), temperature controller (4), CPU conductive structure (5), in described micro semiconductor cooling piece (2) is fixed on power slot (3), micro- The chill surface of type semiconductor chilling plate (2) contacts with computer power, the face that heats of micro semiconductor cooling piece (2) and computer base plate (1) bottom shell connects；Described CPU conductive structure (5) includes the first conductive sole plate (51), is arranged on CPU upper surface Second conductive sole plate (52) and two ends connect the first conductive sole plate (51), the heat pipe of the second conductive sole plate (52) respectively (53), described heat pipe (53) is hollow structure inside, and the inwall of heat pipe (53) is evenly arranged with heat-conducting medium (57), institute Stating heat-conducting medium (57) is powdery metal particles；Also include the nacelle (54) being arranged on bottom cabinet, be arranged on first and lead Fin (55) on hot base plate (51) lower surface and the fan (56) being fixed on fin (55) side；Nacelle (54) is The cavity structure of upper end open, described first conductive sole plate (51) and nacelle (54) upper end open are connected to form a sealed compartment, dissipate Backing (55) and fan (56) are arranged in sealed compartment, and described nacelle (54) upper surface offers seal groove (58), sealing gasket Circle is arranged in described seal groove (58), and the first conductive sole plate (51) is connected with nacelle (54) by seal washer；Described temperature Being connected with two temperature sensors (41) being connected with power supply, CPU on controller (4), temperature controller (4) passes through wire with miniature Semiconductor chilling plate (2), fan (56) are connected；The bottom of described computer base plate (1) heats with micro semiconductor cooling piece (2) Relevant position, face is provided with air-vent.

A kind of laptop heat-dissipation structure the most according to claim 1, it is characterised in that: also include being fixed at the bottom of the first heat conduction Hangers (59) and the position of corresponding hangers (59) on plate (51) side are arranged on the screwed hole on nacelle (54) sidewall (510), the first conductive sole plate (51) and nacelle (54) run through hangers (59) by bolt simultaneously and screwed hole (510) is carried out even Connect.