CN205601306U - A compound polyester film for flexible circuit board pressfitting technology - Google Patents
A compound polyester film for flexible circuit board pressfitting technology Download PDFInfo
- Publication number
- CN205601306U CN205601306U CN201620402311.5U CN201620402311U CN205601306U CN 205601306 U CN205601306 U CN 205601306U CN 201620402311 U CN201620402311 U CN 201620402311U CN 205601306 U CN205601306 U CN 205601306U
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- polyester film
- silica gel
- film
- utility
- model
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Abstract
The utility model provides a compound polyester film for flexible circuit board pressfitting technology, compound polyester film has three layer construction, and the bottom is the substrate, and the substrate top is silica gel adhesive layer, and silica gel adhesive layer top is for leaving the type membrane. The utility model discloses a PET film combines the integrated configuration of high -temperature -resistant silica gel glue, can reach high temperature resistant and effect no cull simultaneously. The utility model provides a compound polyester film, even coating, high temperature resistant, 180 DEG C of 30min do not have unusually.
Description
Technical field
This utility model belongs to microelectronic element production field, is specifically related to a kind of for flexible electrical
The film of road plate process for pressing.
Background technology
Flexible PCB is called for short soft board (also known as FPC), makes with the insulating substrate of flexibility
Printed circuit board (PCB), has the advantage that many rigid printed circuit boards do not possess, and it can be the most curved
Bent, wind, fold, thus be substantially reduced the volume of electronic product, be suitable for electronic product to height
The needs that density, miniaturization, highly reliable direction are developed.
PET film (polyester film) surface by coating process to just one layer of silica gel of topcoating cloth, can
Obtaining and have sticking micro-mucosa, PET glue coating is used for packaging industry, can effectively protect
Protect product surface, but due to its non-refractory characteristic, have cull, be rarely used in flexible PCB
Process for pressing in production process.
Utility model content
For solving the deficiency that prior art exists, the purpose of this utility model be propose a kind of for
The composite polyester film of flexible PCB pressing technique.
For realizing this utility model purpose technical scheme it is:
A kind of composite polyester film for flexible PCB pressing technique, described composite polyester film has
Having three-decker, the bottom is base material, and base material is arranged above silica gel bond layer, silica gel bonding agent
Layer is arranged above bidirectional stretching polypropylene film (BOPP film).
Further, described base material is the film of polyethylene terephthalate material, base material
Thickness is 40～60 μm.
Wherein, the thickness of described silica gel bond layer is 8～15 μm.
Wherein, the thickness of described BOPP film is 10～15 μm.
The preparation process of this composite polyester film can be: first by after deployed for silica gel glue, will
In PET film, machine makes face tight smooth through tension system, then crosses coating head scraper and is coated with
Cloth, drying, go up machine through tension system again, BOPP film, rolling molding cooled, compound
For composite polyester film.
The beneficial effects of the utility model are:
This utility model uses PET film to combine the group of the high temperature resistant silica gel glue with acid and alkali-resistance
Close structure, can reach effect high temperature resistant, without cull and acid and alkali-resistance simultaneously.
The composite polyester film that the utility model proposes, coating uniform, high temperature resistant (180 DEG C of * 30min)
Without exception.
Accompanying drawing explanation
Fig. 1 is the structure chart of this utility model embodiment 1 composite polyester film.
Fig. 2 is the process chart of composite polyester film.
In figure, 1 is base material, and 2 is silica gel bond layer, and 3 is BOPP film.
Detailed description of the invention
Following example are used for illustrating the present invention, but are not limited to the scope of the present invention.
In description of the present utility model, it should be noted that term " " center ", " ",
" laterally ", " on ", D score, "front", "rear", "left", "right", " perpendicular
Directly ", " level ", " top ", " end " " interior ", " outward " etc. instruction orientation or position
Relation of putting, for based on orientation shown in the drawings or position relationship, is for only for ease of this practicality of description
Novel and simplification describes rather than indicates or imply that the device of indication or element must have specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to of the present utility model
Limit.
Embodiment 1:
See Fig. 1.A kind of composite polyester film for flexible PCB pressing technique, described multiple
Closing polyester film and have three-decker, the bottom is base material 1, and base material is arranged above silica gel bond layer
2, silica gel bond layer is arranged above BOPP film 3.
Wherein base material 1 is the film of polyethylene terephthalate material, and the thickness of base material is
52μm.The thickness of silica gel bond layer is 11 μm.The material of BOPP film 3 is biaxial tension
Polypropylene film, the thickness of BOPP film 3 is 12 μm.During use, BOPP film is opened,
Silica gel bond layer is bonded at the substrate surface on single-sided flexible circuit plate, can sufficiently protect and support
Flexible PCB, makes flexible PCB keep smooth.
Preparation process such as Fig. 2.After silica gel glue is deployed, by machine in PET film through opening
Force system makes face tight smooth, then cross coating head scraper for coating, drying, tension system,
Cooling, compound composite membrane, rolling are shaped to PET composite polyester film.During silica gel glue allotment,
The ratio of its glue and organic solvent is 1；0.5, add catalyst cured dose and be stirred
30min.Measure silica gel glue layer thickness during scraper for coating, control the thickness of silica gel bond layer
In the range of requiring.
The PET composite polyester film obtained, coating uniform, high temperature resistant (180 DEG C of * 30min are as good as
Often), acid and alkali-resistance is without exception.
Above embodiment is only to be described preferred implementation of the present utility model, and
Non-scope of the present utility model is defined, before without departing from this utility model design spirit
Put, the various modification that technical scheme is made by this area ordinary skill technical staff
And improvement, all should fall in the protection domain that claims of the present utility model determine.
Claims (4)
1. the composite polyester film for flexible PCB pressing technique, it is characterised in that
Described composite polyester film has three-decker, and the bottom is base material, and it is bonding that base material is arranged above silica gel
Oxidant layer, silica gel bond layer is arranged above bidirectional stretching polypropylene film.
Composite polyester film the most according to claim 1, it is characterised in that described base material
For the film of polyethylene terephthalate material, the thickness of base material is 40～60 μm.
Composite polyester film the most according to claim 1, it is characterised in that described silica gel
The thickness of bond layer is 8～15 μm.
4. according to the arbitrary described composite polyester film of claims 1 to 3, it is characterised in that institute
The thickness stating bidirectional stretching polypropylene film is 10～15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620402311.5U CN205601306U (en) | 2016-05-04 | 2016-05-04 | A compound polyester film for flexible circuit board pressfitting technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620402311.5U CN205601306U (en) | 2016-05-04 | 2016-05-04 | A compound polyester film for flexible circuit board pressfitting technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205601306U true CN205601306U (en) | 2016-09-28 |
Family
ID=56968249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620402311.5U Expired - Fee Related CN205601306U (en) | 2016-05-04 | 2016-05-04 | A compound polyester film for flexible circuit board pressfitting technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205601306U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110116539A (en) * | 2018-02-05 | 2019-08-13 | 深圳市一心电子有限公司 | The release film and its manufacturing method of multi-layer compound structure |
-
2016
- 2016-05-04 CN CN201620402311.5U patent/CN205601306U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110116539A (en) * | 2018-02-05 | 2019-08-13 | 深圳市一心电子有限公司 | The release film and its manufacturing method of multi-layer compound structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20180504 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |