CN110116539A - The release film and its manufacturing method of multi-layer compound structure - Google Patents
The release film and its manufacturing method of multi-layer compound structure Download PDFInfo
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- CN110116539A CN110116539A CN201810108950.4A CN201810108950A CN110116539A CN 110116539 A CN110116539 A CN 110116539A CN 201810108950 A CN201810108950 A CN 201810108950A CN 110116539 A CN110116539 A CN 110116539A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
- C08J7/065—Low-molecular-weight organic substances, e.g. absorption of additives in the surface of the article
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Health & Medical Sciences (AREA)
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- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of release film of multi-layer compound structure and its manufacturing methods, the release film includes one layer of sandwich layer, the material of the sandwich layer includes the mixture that methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~10%, tackifier 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethylsilane 1%~30% and hexamethyldisiloxane 1%~10% form, and above-mentioned component is weight percentage；Two layers of substrate layer and two layers of release layer；The two sides of sandwich layer is glued with one layer of substrate layer respectively, and one layer of release layer is each coated on each substrate layer.Release film of the present invention has many advantages, such as to be adhesively fixed, and firm, tensile property is good and heat resistance is good, in use, the plate face of printed circuit board will not be made to have the defect of brownification and melanism, sandwich layer, which will not flow out, to be adhered in the plate face of printed circuit board and printed circuit board is caused to be scrapped.
Description
[technical field]
The present invention relates to laminar products, more particularly to the laminar product being actually made of synthetic resin, more particularly, to
Printed circuit board release membrane structure and its manufacturing method used when pressing.
[background technique]
Soft, embossing seal printed circuit board needs to make by press pressing in flexible printed circuit board and embossing seal printed circuit board cohesive process
The two combines；During the pressing process, can occur after high temperature melting due to the prepreg in conjunction with the plate face of printed circuit board
It flows, the meeting that the glue flowed out after prepreg high temperature melting has flow to the hole on printed circuit board, and some meetings flow to print
Golden finger face on printed circuit board, some meetings flow to other places for having control to require on printed circuit board, also
Cause the steel plate that can not separate with printed circuit board on steel plate when can adhere to pressing, thus needs to carry out subsequent processing
It could complete normal process flow.
Therefore soft, embossing seal printed circuit board need to use a kind of release film in its pressing, which is used for printed circuit board pressure
The plate face for flowing to printed circuit board after mainly preventing prepreg high temperature melting from hole is closed, that is, plays resistance glue;And
The release film can isolate steel plate when printed circuit board and pressing, and steel plate is avoided to pollute, and be easy to steel plate and printing electricity
The separation of road plate.
Due to communication technology advances, higher and higher, system is required to the printed circuit board for constituting Communication Equipment and its carrier
The structure and technique of work also become increasingly complex, for example, in bury, be embedded in and/or the modes such as soft or hard combination are more and more and more and more multiple
It is miscellaneous.Also just higher and higher to the auxiliary material requirement in manufacturing process, also only all kinds of auxiliary materials, which correspondingly increase, is just able to satisfy
The demand for development of entire industry.Release membrane material plays an important role in the manufacture craft of printed circuit panel products.
Prior art release film includes following classification: PET release film, OPP release film, TPX release film etc.；PET release film
There is no better tensile property, not being able to satisfy in the plate face of printed circuit board has difference in height, there are the positions such as windowing, aperture or slot
The requirement of gummosis control；OPP release film is not able to satisfy the requirement of higher and higher manufacturing process for printed circuit board temperature；TPX from
Type film or PMP release film make the plate face of printed circuit board have brownification perhaps melanism or to be had out in the plate face of printed circuit board
Slot, bore edges be right angle in the case where will lead to product adhesion printed circuit board plate face and sandwich layer buffer layer outflow cause to print
The problem of printed circuit board is scrapped.PET is the abbreviation of English Polyethylene terephthalate, and Chinese means poly- to benzene
Naphthalate；OPP is the abbreviation of English O-phenylphenol, and Chinese means o-phenyl phenol；TPX is English
The abbreviation of Transparent Polymer X, Chinese mean 4- methylpentene -1.
[summary of the invention]
The technical problem to be solved in the present invention is that providing a kind of MULTILAYER COMPOSITE knot in place of avoiding above-mentioned the deficiencies in the prior art
The release film and its manufacturing method of structure, having many advantages, such as to be adhesively fixed, firm, tensile property is good and heat resistance is good, this is compound
The release film of structure in use, will not make the plate face of printed circuit board have a defect of brownification and melanism, and sandwich layer is not yet
It can flow out and be adhered in the plate face of printed circuit board and printed circuit board is caused to be scrapped.
The present invention solve the technical problem the technical solution adopted is that:
A kind of manufacturing method of multi-layer compound structure release film is provided, successively the following steps are included:
Step A, prepare core material, core material include methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~
10%, tackifier 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethyl
Base silane 1%~30% and hexamethyldisiloxane 1%~10%, above-mentioned component are weight percentage；By methyl phenyl vinyl silicon rubber
Glue, coupling agent, tackifier, dibutyl tin dilaurate, dimethyl diethylsilane and hexamethyldisiloxane mix in advance, and carry out
Stirring, adds silica and pigment during stirring, stands 30~50 minutes after mixing evenly, obtains sandwich layer mixing
Object；
Sandwich layer mixture is uniformly coated on the surface of substrate layer, then baking molding by step B, is made molten in sandwich layer mixture
Agent evaporation, and sandwich layer mixture is made to be uniformly adhered to the surface of substrate layer, be formed solid sandwich layer and with the sandwich layer one
One layer of substrate layer that face is connected；
Step C after baking molding, is closely bonded another layer of substrate layer in the another side of sandwich layer, just sequentially formed substrate layer,
The three-decker of sandwich layer and substrate layer；
Step D stands above-mentioned three-decker, and time of repose is no less than 15 hours, such as time of repose is small 15 hours~30
When between；
Mould release is coated on any layer substrate layer of above-mentioned three-decker by step E, and then baking molding, consolidates mould release
It is melted into one layer of release layer, obtains four-layer structure；
Step F stands above-mentioned four-layer structure, and time of repose is between 45 minutes~20 hours；
Mould release is coated on another layer of substrate layer of above-mentioned four-layer structure by step G, and then baking molding, consolidates mould release
Be melted into another layer of release layer, then stand again, time of repose between 45 minutes~20 hours, just obtained five-layer structure from
Type film, the release film of the five-layer structure successively include release layer, substrate layer, sandwich layer, substrate layer and release layer.
The coupling agent is organosilicon；The tackifier include silicone resin or polyacrylate elastomer.The base
The material of material layer includes polyethylene terephtalate, Parylene butanediol ester or polyethylene naphthalate.
The mould release includes methyl-monosilane or dimethyl siloxane；The mould release can also be non-silicon mould release, such as described
Mould release can also include fluorine element mould release or long chain alkane, such as 18 long alkyl chain alkene.
When operating procedure B, temperature and time when baking molding from apparatus for baking one end to the other end is successively are as follows: 70 DEG C
± 3 DEG C, 5~30 minutes；115 DEG C ± 3 DEG C, 5~30 minutes；150 DEG C ± 3 DEG C, 10~60 minutes；180 DEG C ± 3 DEG C, 10~60
Minute；120 DEG C ± 3 DEG C, 5~30 minutes.
When operating procedure C, the temperature of sandwich layer is maintained between 110 DEG C~120 DEG C when fitting, it has to be ensured that applying when fitting
Add uniform pressure, the pressure is between 1.4Mpa~1.6Mpa.
It after step c, further include step C before step D1, two layers of substrate layer of three-decker is carried out at surface
Reason, which includes sided corona treatment or basification.
When operating procedure E and step G, temperature and time when baking molding from apparatus for baking one end to the other end is successively
Are as follows: 80 DEG C ± 3 DEG C, 5~30 minutes；100 DEG C ± 3 DEG C, 5~30 minutes；135 DEG C ± 3 DEG C, 30~60 minutes；140 DEG C ± 3 DEG C,
60~120 minutes；80 DEG C ± 3 DEG C, 5~30 minutes.
A kind of release film of multi-layer compound structure is additionally provided, includes:
One layer of sandwich layer, the material of the sandwich layer include methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~10%, thickening
Agent 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethylsilane 1%
~30% and the mixture that forms of hexamethyldisiloxane 1%~10%, above-mentioned component is weight percentage；
Two layers of substrate layer and two layers of release layer；
The two sides of the sandwich layer is glued with one layer of substrate layer respectively, and one layer of release layer is each coated on each substrate layer.
Compared with the existing technology compared with the release film of multi-layer compound structure of the present invention and its beneficial effect of manufacturing method exist
In:
The material of the sandwich layer of release film of the present invention uses special formulation, has elasticity and shrinkage well, under the high temperature conditions
The retractility of sandwich layer toward horizontal direction is less than the retractility in vertical direction；And use special facture technique by sandwich layer and base
Material layer and substrate layer are combined with release layer, and the firm and quality that is adhesively fixed is good；Therefore release film of the present invention has viscous
The advantages that fixed, tensile property is good and heat resistance is good is connect, in use, the plate face of printed circuit board will not be made
There is the defect of brownification and melanism, sandwich layer, which will not flow out, to be adhered in the plate face of printed circuit board and lead to printed circuit blackboard newspaper
It is useless.
[Detailed description of the invention]
Fig. 1 is the orthographic projection main cross-sectional schematic diagram of the release film of multi-layer compound structure of the present invention.
[specific embodiment]
Below with reference to each attached drawing, invention is further described in detail.
Referring to Fig. 1, a kind of manufacturing method of multi-layer compound structure release film, successively the following steps are included:
Step A, prepare core material, core material include methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~
10%, tackifier 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethyl
Base silane 1%~30% and hexamethyldisiloxane 1%~10%, above-mentioned component are weight percentage；By methyl phenyl vinyl silicon rubber
Glue, coupling agent, tackifier, dibutyl tin dilaurate, dimethyl diethylsilane and hexamethyldisiloxane mix in advance, and carry out
Stirring, adds silica and pigment during stirring, stands 30~50 minutes after mixing evenly, obtains sandwich layer mixing
Object；
Sandwich layer mixture is uniformly coated on the surface of substrate layer 20, then baking molding by step B, is made in sandwich layer mixture
Solvent evaporation, and sandwich layer mixture is made to be uniformly adhered to the surface of substrate layer 20, be formed solid sandwich layer 30 and with this
One layer of substrate layer 20 that sandwich layer 30 is connected on one side；
Step C after baking molding, is closely bonded another layer of substrate layer 20 in the another side of sandwich layer 30, has just sequentially formed base
The three-decker of material layer 20, sandwich layer 30 and substrate layer 20；
Step D stands above-mentioned three-decker, and time of repose is no less than 15 hours, such as time of repose is small 15 hours~30
When between；Standing in step D, effect is that the release film internal stress of above-mentioned three-decker is waited to restore balance；
Mould release is coated on any layer substrate layer 20 of above-mentioned three-decker by step E, and then baking molding, makes mould release
It is solidified into one layer of release layer 10, obtains four-layer structure；Process equipment when coating includes three-roll coating equipment, two roller coating apparatus
Or dimple coating equipment etc..
Step F stands above-mentioned four-layer structure, and time of repose is between 45 minutes~20 hours；Standing in step F,
Its effect stood is that the release film internal stress of above-mentioned four-layer structure is waited to restore balance；
Mould release is coated on another layer of substrate layer 20 of above-mentioned four-layer structure by step G, and then baking molding, makes mould release
It is solidified into another layer of release layer 10, is then stood again, time of repose has just obtained five-layer structure between 45 minutes~20 hours
Release film, the release film of the five-layer structure successively includes release layer 10, substrate layer 20, sandwich layer 30, substrate layer 20 and release layer
10；Standing in step G, the effect stood is that the release film internal stress of above-mentioned five-layer structure is waited to restore balance.
Referring to Fig. 1, the coupling agent is organosilicon；The tackifier include silicone resin or polyacrylate elasticity
Body.The material of the substrate layer 20 includes polyethylene terephtalate, Parylene butanediol ester or poly- naphthalene diformazan
Sour glycol ester.The mould release includes methyl-monosilane or dimethyl siloxane；The mould release can also be that non-silicon is release
Agent, such as the mould release can also include fluorine element mould release or long chain alkane, such as 18 long alkyl chain alkene.
The pigment is chosen according to the requirement of client, such as can be using white pigment, the pigment or black of yellow
Pigment etc..
When operating procedure B, temperature and time when baking molding from apparatus for baking one end to the other end is successively are as follows: 70 DEG C
± 3 DEG C, 5~30 minutes；115 DEG C ± 3 DEG C, 5~30 minutes；150 DEG C ± 3 DEG C, 10~60 minutes；180 DEG C ± 3 DEG C, 10~60
Minute；120 DEG C ± 3 DEG C, 5~30 minutes.
Referring to Fig. 1, when operating procedure C, the temperature of sandwich layer 30 is maintained between 110 DEG C~120 DEG C when fitting, and when fitting must
It need guarantee to apply uniform pressure, the pressure is between 1.4Mpa~1.6Mpa.
It further include step C before step D after step c referring to Fig. 11, to two layers of substrate layer 20 of three-decker into
Row surface treatment, which includes sided corona treatment or basification.Carry out surface treatment can allow release layer 10 preferably with
Substrate layer 20 is combined together, to be unlikely to release layer 10 occurs in use to be transferred to the printed circuit board pressed
Plate on.
When operating procedure E and step G, temperature and time when baking molding from apparatus for baking one end to the other end is successively
Are as follows: 80 DEG C ± 3 DEG C, 5~30 minutes；100 DEG C ± 3 DEG C, 5~30 minutes；135 DEG C ± 3 DEG C, 30~60 minutes；140 DEG C ± 3 DEG C,
60~120 minutes；80 DEG C ± 3 DEG C, 5~30 minutes.
The material of the sandwich layer 30 of multi-layer compound structure release film of the present invention uses special formulation, has elasticity well and receives
Contracting, the retractility of sandwich layer toward horizontal direction is less than the retractility in vertical direction under the high temperature conditions；And use special system
Sandwich layer is combined with substrate layer and substrate layer with release layer as technique, the firm and quality that is adhesively fixed is good；This hair
The manufacturing method of bright multi-layer compound structure release film, is different from the prior art the manufacturing method of extrusion form, passes through roller and roller knife
By on sandwich layer mixture even spread to one layer of substrate layer 20, then by apparatus for baking such as oven cooking cycle, sandwich layer is mixed
Solvent volatilization in object is adhering completely to sandwich layer 30 above substrate layer 20, by the reaction under hot conditions, so that viscosity flow
Sandwich layer mixture be cured as solid state, form sandwich layer 30, while the one layer of substrate layer 20 to be dried come out does not have with sandwich layer 30
When having complete cooling, one layer of other substrate layer 20 is fitted in the another side of sandwich layer 30 by the pressing of hot pressing roller mode
On；Mould release is respectively coated on two layers of substrate layer 20 again, baking molding, stand a period of time, just obtained successively include from
Type layer 10, substrate layer 20, sandwich layer 30, substrate layer 20 and release layer 10 five-layer structure release film.
Referring to Fig. 1, the present invention also provides a kind of release films of multi-layer compound structure, include:
One layer of sandwich layer 30, the material of the sandwich layer 30 include methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~10%,
Tackifier 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethyl silicon
The mixture that alkane 1%~30% and hexamethyldisiloxane 1%~10% form, above-mentioned component are weight percentage；
Two layers of substrate layer 20 and two layers of release layer 10；
The two sides of the sandwich layer 30 is glued with one layer of substrate layer 20 respectively, and one layer of release layer 10 is each coated on each substrate layer 20.
Referring to Fig. 1, the material of the release layer 10 includes methyl-monosilane or dimethyl siloxane.
The release film of the multi-layer compound structure of the present patent application production is the release film of five layers of composite construction, sandwich layer 30
With a thickness of 10~200 μm (microns)；The thickness of two layers of substrate layer 20 is all 30~80 μm；The thickness of two layers of release layer 10 is all
0.1~2 μm.The effects of effect of the sandwich layer 30 of release film of the present invention includes buffering, resistance glue and leveling；The effect of substrate layer 20 is
Release layer 10 is coated, is riveted together with sandwich layer 20；Release layer 10 with pressed and printed circuit board be not bonded together, press
After the completion, it can be stripped down from printed circuit board together with substrate layer 20.
Embodiment one:
Referring to Fig. 1, a kind of manufacturing method of multi-layer compound structure release film, successively the following steps are included:
Step A prepares core material, and core material includes methyl phenyl vinyl silicone rubber 55%, coupling agent 5%, tackifier
15%, silica 5%, dibutyl tin dilaurate 3%, pigment 2%, dimethyl diethylsilane 9% and hexamethyldisiloxane 6%, on
Component is stated to be weight percentage；By methyl phenyl vinyl silicone rubber, coupling agent, tackifier, dibutyl tin dilaurate, dimethyl
Diethylsilane and hexamethyldisiloxane mix in advance, and are stirred, and add silica and color during stirring
Element stands 45 minutes after mixing evenly, obtains sandwich layer mixture；Coupling agent uses organosilicon in the present embodiment；Tackifier use
Silicone resin；Pigment uses the pigment of black；
Above-mentioned sandwich layer mixture is added in the coating head of scraper or roll coating apparatus, then is uniformly coated on substrate layer by step B
Then 20 surface is formed by apparatus for baking such as oven cooking cycle, apparatus for baking such as oven length is 25 meters~30 meters, point
It is toasted at several temperature sections, temperature and time when baking molding from apparatus for baking such as oven one end to the other end is successively
Are as follows: 70 DEG C, 25 minutes；115 DEG C, 25 minutes；150 DEG C, 30 minutes；180 DEG C, 20 minutes；120 DEG C, 25 minutes；Mix sandwich layer
Solvent evaporation in object, and sandwich layer mixture is made to be uniformly adhered to the surface of substrate layer 20, it is formed solid sandwich layer 30
With one layer of substrate layer 20 being connected on one side with the sandwich layer 30；The material of substrate layer 20 uses poly terephthalic acid in the present embodiment
Glycol ester PET；
Step C, after baking molding, the substrate layer 20 that sandwich layer 30 adheres on one side goes out after baking oven by a composite roll, by another layer
Substrate layer 20 is closely adhered on the another side of sandwich layer 30, since sandwich layer 30 has certain viscosity, aforesaid way obtain three
It will nearly fit together between layer structure release film, thus sequentially form substrate layer 20, sandwich layer 30 and substrate layer
20 three-decker；Temperature when being bonded sandwich layer 30 is maintained at 115 DEG C, it has to be ensured that applying uniform pressure when fitting,
The pressure is in 1.5Mpa, to ensure not generating bubble after being bonded among three-decker and guarantee that the thickness of three-decker meets setting
Technical requirements；
Step C1, basification is carried out to two layers of substrate layer 20 of above-mentioned three-decker, is handled for example, by using the thick fog of NAOH；
Step D stands above-mentioned three-decker, and time of repose is 19 hours；Standing in step D, effect are that waiting is above-mentioned
The release film internal stress of three-decker restores balance；
Mould release is coated on any layer substrate layer 20 of above-mentioned three-decker by step E, then for example roasting by apparatus for baking
Case baking molding, temperature and time when baking molding from apparatus for baking such as oven one end to the other end is successively are as follows: and 80 DEG C, 25
Minute；100 DEG C, 20 minutes；135 DEG C, 40 minutes；140 DEG C, 80 minutes；80 DEG C, 25 minutes, mould release is made to be solidified into a leafing
Type layer 10, obtains four-layer structure；Process equipment when the present embodiment coats is dimple coating equipment, due to above-mentioned three-decker
Sandwich layer 30 has elasticity, therefore when coating, the platen pressure of coating equipment cannot be excessive, generally uses pressure for 0.1
Between~2.0Mpa, prevent the uniform thickness of the uneven thickness of above structure from reducing；When coating, mould release is coated by dimple
The upper glue roller of the dimple roller of equipment is transferred on any layer substrate layer 20 of above-mentioned three-decker, then by scraper to scrape off surface more
Remaining mould release, to control the thickness for needing the mould release coated；
Step F stands above-mentioned four-layer structure, and time of repose is 5 hours；Standing in step F, the effect stood are to wait
The release film internal stress of above-mentioned four-layer structure restores balance；
Step G, this step G and step E and step F are similar, and mould release is coated in another layer of substrate layer of above-mentioned four-layer structure
It on 20, is then formed by apparatus for baking such as oven cooking cycle, from apparatus for baking such as oven one end to another when baking molding
The temperature and time at end is successively are as follows: 80 DEG C, 25 minutes；100 DEG C, 20 minutes；135 DEG C, 40 minutes；140 DEG C, 80 minutes；80
DEG C, 25 minutes, so that mould release is solidified into another layer of release layer 10, then stand again, time of repose is 5 hours, has just obtained five
The release film of layer structure, the release film of the five-layer structure successively includes release layer 10, substrate layer 20, sandwich layer 30,20 and of substrate layer
Release layer 10；Standing in step G, the effect stood is that the release film internal stress of above-mentioned five-layer structure is waited to restore balance.
The release film of the multi-layer compound structure of the present embodiment production is the release film of five layers of composite construction, the thickness of sandwich layer 30
Degree is 150 μm, and the thickness of two layers of substrate layer 20 is all 60 μm；The thickness of two layers of release layer 10 is all 1.1 μm.
Embodiment two:
Referring to Fig. 1, a kind of manufacturing method of multi-layer compound structure release film, successively the following steps are included:
Step A, prepare core material, core material include methyl phenyl vinyl silicone rubber 75%, coupling agent 8%, tackifier 7%,
Silica 2%, dibutyl tin dilaurate 2%, pigment 2%, dimethyl diethylsilane 2% and hexamethyldisiloxane 2%, above-mentioned group
Part is weight percentage；By methyl phenyl vinyl silicone rubber, coupling agent, tackifier, dibutyl tin dilaurate, dimethyl diethyl
Base silane and hexamethyldisiloxane mix in advance, and are stirred, and add silica and pigment during stirring, stir
40 minutes are stood after mixing uniformly, obtains sandwich layer mixture；Coupling agent uses organosilicon in the present embodiment；Tackifier use polypropylene
Esters of gallic acid elastomer；Pigment is using white pigment；
Above-mentioned sandwich layer mixture is added in the coating head of scraper or roll coating apparatus, then is uniformly coated on substrate layer by step B
Then 20 surface is formed by apparatus for baking such as oven cooking cycle, when baking molding from apparatus for baking such as oven one end to
The temperature and time of the other end is successively are as follows: 70 DEG C, 25 minutes；115 DEG C, 25 minutes；150 DEG C, 30 minutes；180 DEG C, 20 minutes；
120 DEG C, 25 minutes；The solvent in sandwich layer mixture is evaporated, and sandwich layer mixture is made to be uniformly adhered to the table of substrate layer 20
Face, the one layer of substrate layer 20 for being formed solid sandwich layer 30 and being connected on one side with the sandwich layer 30；Substrate layer in the present embodiment
20 material uses polyethylene naphthalate；
Step C, after baking molding, the substrate layer 20 that sandwich layer 30 adheres on one side goes out after baking oven by a composite roll, by another layer
Substrate layer 20 is closely adhered on the another side of sandwich layer 30, since sandwich layer 30 has certain viscosity, aforesaid way obtain three
It will nearly fit together between layer structure release film, thus sequentially form substrate layer 20, sandwich layer 30 and substrate layer
20 three-decker；Temperature when being bonded sandwich layer 30 is maintained at 118 DEG C, it has to be ensured that applying uniform pressure when fitting,
The pressure is in 1.6Mpa, to ensure not generating bubble after being bonded among three-decker and guarantee that the thickness of three-decker meets setting
Technical requirements；
Step C1, sided corona treatment is carried out to two layers of substrate layer 20 of above-mentioned three-decker；
Step D stands above-mentioned three-decker, and time of repose is 20 hours；Standing in step D, effect are that waiting is above-mentioned
The release film internal stress of three-decker restores balance；
Mould release is coated on any layer substrate layer 20 of above-mentioned three-decker by step E, then for example roasting by apparatus for baking
Case baking molding, temperature and time when baking molding from apparatus for baking such as oven one end to the other end is successively are as follows: and 80 DEG C, 25
Minute；100 DEG C, 20 minutes；135 DEG C, 40 minutes；140 DEG C, 80 minutes；80 DEG C, 25 minutes, mould release is made to be solidified into a leafing
Type layer 10, obtains four-layer structure；Process equipment when the present embodiment coats is dimple coating equipment, due to above-mentioned three-decker
Sandwich layer 30 has elasticity, therefore when coating, the platen pressure of coating equipment cannot be excessive, generally uses pressure for 0.1
Between~2.0Mpa, such as pressure is 1.1Mpa, prevents the uniform thickness of the uneven thickness of above structure from reducing；When coating,
Mould release is transferred on any layer substrate layer 20 of above-mentioned three-decker by the upper glue roller of the dimple roller of dimple coating equipment, then
The mould release of excess surface is scraped off by scraper, to control the thickness for needing the mould release coated；
Step F stands above-mentioned four-layer structure, and time of repose is 3 hours；Standing in step F, the effect stood are to wait
The release film internal stress of above-mentioned four-layer structure restores balance；
Step G, this step G and step E and step F are similar, and mould release is coated in another layer of substrate layer of above-mentioned four-layer structure
It on 20, is then formed by apparatus for baking such as oven cooking cycle, from apparatus for baking such as oven one end to another when baking molding
The temperature and time at end is successively are as follows: 80 DEG C, 25 minutes；100 DEG C, 20 minutes；135 DEG C, 40 minutes；140 DEG C, 80 minutes；80
DEG C, 25 minutes, so that mould release is solidified into another layer of release layer 10, then stand again, time of repose is 3 hours, has just obtained five
The release film of layer structure, the release film of the five-layer structure successively includes release layer 10, substrate layer 20, sandwich layer 30,20 and of substrate layer
Release layer 10；Standing in step G, the effect stood is that the release film internal stress of above-mentioned five-layer structure is waited to restore balance.
The release film of the multi-layer compound structure of the present embodiment production is the release film of five layers of composite construction, the thickness of sandwich layer 30
Degree is 100 μm, and the thickness of two layers of substrate layer 20 is all 40 μm；The thickness of two layers of release layer 10 is all 0.8 μm.
Embodiment three:
Referring to Fig. 1, a kind of manufacturing method of multi-layer compound structure release film, successively the following steps are included:
Step A prepares core material, and core material includes methyl phenyl vinyl silicone rubber 45%, coupling agent 9%, tackifier
18%, silica 4%, dibutyl tin dilaurate 4%, pigment 2%, dimethyl diethylsilane 13% and hexamethyldisiloxane 5%, on
Component is stated to be weight percentage；By methyl phenyl vinyl silicone rubber, coupling agent, tackifier, dibutyl tin dilaurate, dimethyl
Diethylsilane and hexamethyldisiloxane mix in advance, and are stirred, and add silica and color during stirring
Element stands 48 minutes after mixing evenly, obtains sandwich layer mixture；Coupling agent uses organosilicon in the present embodiment；Tackifier use
Silicone resin；Pigment uses the pigment of yellow；
Above-mentioned sandwich layer mixture is added in the coating head of scraper or roll coating apparatus, then is uniformly coated on substrate layer by step B
Then 20 surface is formed by apparatus for baking such as oven cooking cycle, when baking molding from apparatus for baking such as oven one end to
The temperature and time of the other end is successively are as follows: 70 DEG C, 25 minutes；115 DEG C, 25 minutes；150 DEG C, 30 minutes；180 DEG C, 20 minutes；
120 DEG C, 25 minutes；The solvent in sandwich layer mixture is evaporated, and sandwich layer mixture is made to be uniformly adhered to the table of substrate layer 20
Face, the one layer of substrate layer 20 for being formed solid sandwich layer 30 and being connected on one side with the sandwich layer 30；Substrate layer in the present embodiment
20 material uses Parylene butanediol ester；
Step C, after baking molding, the substrate layer 20 that sandwich layer 30 adheres on one side goes out after baking oven by a composite roll, by another layer
Substrate layer 20 is closely adhered on the another side of sandwich layer 30, since sandwich layer 30 has certain viscosity, aforesaid way obtain three
It will nearly fit together between layer structure release film, thus sequentially form substrate layer 20, sandwich layer 30 and substrate layer
20 three-decker；Temperature when being bonded sandwich layer 30 is maintained at 116 DEG C, it has to be ensured that applying uniform pressure when fitting,
The pressure is in 1.55Mpa, to ensure not generating bubble among three-decker after being bonded and guarantee that the thickness satisfaction of three-decker is set
Fixed technical requirements；
Step C1, sided corona treatment is carried out to two layers of substrate layer 20 of above-mentioned three-decker；
Step D stands above-mentioned three-decker, and time of repose is 22 hours；Standing in step D, effect are that waiting is above-mentioned
The release film internal stress of three-decker restores balance；
Mould release is coated on any layer substrate layer 20 of above-mentioned three-decker by step E, then for example roasting by apparatus for baking
Case baking molding, temperature and time when baking molding from apparatus for baking such as oven one end to the other end is successively are as follows: and 80 DEG C, 25
Minute；100 DEG C, 20 minutes；135 DEG C, 40 minutes；140 DEG C, 80 minutes；80 DEG C, 25 minutes, mould release is made to be solidified into a leafing
Type layer 10, obtains four-layer structure；Process equipment when the present embodiment coats is dimple coating equipment, due to above-mentioned three-decker
Sandwich layer 30 has elasticity, therefore when coating, the platen pressure of coating equipment cannot be excessive, generally uses pressure for 0.1
Between~2.0Mpa, such as pressure is 0.9Mpa, prevents the uniform thickness of the uneven thickness of above structure from reducing；When coating,
Mould release is transferred on any layer substrate layer 20 of above-mentioned three-decker by the upper glue roller of the dimple roller of dimple coating equipment, then
The mould release of excess surface is scraped off by scraper, to control the thickness for needing the mould release coated；
Step F stands above-mentioned four-layer structure, and time of repose is 6 hours；Standing in step F, the effect stood are to wait
The release film internal stress of above-mentioned four-layer structure restores balance；
Step G, this step G and step E and step F are similar, and mould release is coated in another layer of substrate layer of above-mentioned four-layer structure
It on 20, is then formed by apparatus for baking such as oven cooking cycle, from apparatus for baking such as oven one end to another when baking molding
The temperature and time at end is successively are as follows: 80 DEG C, 25 minutes；100 DEG C, 20 minutes；135 DEG C, 40 minutes；140 DEG C, 80 minutes；80
DEG C, 25 minutes, so that mould release is solidified into another layer of release layer 10, then stand again, time of repose is 6 hours, has just obtained five
The release film of layer structure, the release film of the five-layer structure successively includes release layer 10, substrate layer 20, sandwich layer 30,20 and of substrate layer
Release layer 10；Standing in step G, the effect stood is that the release film internal stress of above-mentioned five-layer structure is waited to restore balance.
The release film of the multi-layer compound structure of the present embodiment production is the release film of five layers of composite construction, the thickness of sandwich layer 30
Degree is 120 μm, and the thickness of two layers of substrate layer 20 is all 50 μm；The thickness of two layers of release layer 10 is all 1.0 μm.
The release membrane structure of multi-layer compound structure of the present invention plays resistance glue when for pressing to soft, embossing seal printed circuit board, and
Steel plate when printed circuit board and pressing is isolated, avoids steel plate from polluting, steel plate is made to be easy to separate with printed circuit board.
The preferred embodiment of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as;It should be appreciated that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range;Therefore, all equivalents and modification done with scope of the invention as claimed, should belong to the claims in the present invention
Covering scope.
Claims (10)
1. a kind of manufacturing method of multi-layer compound structure release film, it is characterised in that successively the following steps are included:
Step A, prepare core material, core material include methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~
10%, tackifier 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethyl
Base silane 1%~30% and hexamethyldisiloxane 1%~10%, above-mentioned component are weight percentage；By methyl phenyl vinyl silicon rubber
Glue, coupling agent, tackifier, dibutyl tin dilaurate, dimethyl diethylsilane and hexamethyldisiloxane mix in advance, and carry out
Stirring, adds silica and pigment during stirring, stands 30~50 minutes after mixing evenly, obtains sandwich layer mixing
Object；
Sandwich layer mixture is uniformly coated on the surface of substrate layer (20), then baking molding by step B, is made in sandwich layer mixture
Solvent evaporation, and sandwich layer mixture is made to be uniformly adhered to the surface of substrate layer (20), is formed solid sandwich layer (30)
With one layer of substrate layer (20) being connected on one side with the sandwich layer (30)；
Step C after baking molding, is closely bonded another layer of substrate layer (20) in the another side of sandwich layer (30), just sequentially forms
Substrate layer (20), sandwich layer (30) and substrate layer (20 three-decker；
Step D stands above-mentioned three-decker, and time of repose is no less than 15 hours；
Mould release is coated on any layer substrate layer (20) of above-mentioned three-decker by step E, and then baking molding, makes release
Agent is solidified into one layer of release layer (10), obtains four-layer structure；
Step F stands above-mentioned four-layer structure, and time of repose is between 45 minutes~20 hours；
Mould release is coated on another layer of substrate layer (20) of above-mentioned four-layer structure by step G, and then baking molding, makes release
Agent is solidified into another layer of release layer (10), then stands again, and time of repose has just obtained five layers between 45 minutes~20 hours
The release film of structure, the release film of the five-layer structure successively include release layer (10), substrate layer (20), sandwich layer (30), substrate layer
(20) and release layer (10).
2. the manufacturing method of multi-layer compound structure release film according to claim 1, it is characterised in that:
The coupling agent is organosilicon；The tackifier include silicone resin or polyacrylate elastomer；The substrate layer
(20) material includes polyethylene terephthalate (PET), Parylene butanediol ester or poly- naphthalenedicarboxylic acid ethylene glycol
Ester；The mould release includes methyl-monosilane or dimethyl siloxane.
3. the manufacturing method of multi-layer compound structure release film according to claim 1, it is characterised in that:
When operating procedure B, temperature and time when baking molding from apparatus for baking one end to the other end is successively are as follows: 70 DEG C ± 3
DEG C, 5~30 minutes；115 DEG C ± 3 DEG C, 5~30 minutes；150 DEG C ± 3 DEG C, 10~60 minutes；180 DEG C ± 3 DEG C, 10~60 points
Clock；120 DEG C ± 3 DEG C, 5~30 minutes.
4. the manufacturing method of multi-layer compound structure release film according to claim 1, it is characterised in that:
When operating procedure C, the temperature of sandwich layer (30) is maintained between 110 DEG C~120 DEG C when fitting, it has to be ensured that applying when fitting
Add uniform pressure, the pressure is between 1.4Mpa~1.6Mpa.
5. the manufacturing method of multi-layer compound structure release film according to claim 1, it is characterised in that:
It after step c, further include step C before step D1, two layers of substrate layer (20) of three-decker is surface-treated,
The surface treatment includes sided corona treatment or basification.
6. the manufacturing method of multi-layer compound structure release film according to claim 1, it is characterised in that:
When operating procedure E and step G, temperature and time when baking molding from apparatus for baking one end to the other end is successively are as follows: 80
DEG C ± 3 DEG C, 5~30 minutes；100 DEG C ± 3 DEG C, 5~30 minutes；135 DEG C ± 3 DEG C, 30~60 minutes；140 DEG C ± 3 DEG C, 60~
120 minutes；80 DEG C ± 3 DEG C, 5~30 minutes.
7. a kind of release film of multi-layer compound structure, it is characterised in that include:
One layer of sandwich layer (30), the material of the sandwich layer (30) include methyl phenyl vinyl silicone rubber 30%~93%, coupling agent 1%~
10%, tackifier 1%~30%, silica 1 %~10%, dibutyl tin dilaurate 1%~5%, pigment 1%~3%, dimethyl diethyl
The mixture that base silane 1%~30% and hexamethyldisiloxane 1%~10% form, above-mentioned component are weight percentage；
Two layers of substrate layer (20) and two layers of release layer (10)；
The two sides of the sandwich layer (30) is glued with one layer of substrate layer (20) respectively, is each coated with a leafing type on each substrate layer (20)
Layer (10).
8. the release film of multi-layer compound structure according to claim 7, it is characterised in that:
The coupling agent is organosilicon；The tackifier include silicone resin or polyacrylate elastomer.
9. the release film of multi-layer compound structure according to claim 7, it is characterised in that:
The material of the release layer (10) includes methyl-monosilane or dimethyl siloxane；The material of the substrate layer (20) includes
Polyethylene terephthalate (PET), Parylene butanediol ester or polyethylene naphthalate.
10. the release film of multi-layer compound structure according to claim 7, it is characterised in that:
The sandwich layer (30) with a thickness of 10~200 μm；The substrate layer (20) with a thickness of 30~80 μm；The release layer
(10) with a thickness of 0.1~2 μm.
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| JP2003334903A (en) * | 2002-05-23 | 2003-11-25 | Asahi Glass Co Ltd | Release film |
| CN103009734A (en) * | 2012-12-11 | 2013-04-03 | 宁波大榭开发区综研化学有限公司 | High-temperature resistant protecting film of electronic circuit board |
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Effective date of registration: 20200917 Address after: 7 Fushan 8th Road, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province (workshop 4) Applicant after: Zhuhai Yixin Material Technology Co.,Ltd. Address before: 518054 Zhongxing Industrial City, Nanshan District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Yixin Electronics Co.,Ltd. |
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Application publication date: 20190813 |