CN205488200U - Encapsulation of full -color SMD display screen - Google Patents
Encapsulation of full -color SMD display screen Download PDFInfo
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- CN205488200U CN205488200U CN201620048707.4U CN201620048707U CN205488200U CN 205488200 U CN205488200 U CN 205488200U CN 201620048707 U CN201620048707 U CN 201620048707U CN 205488200 U CN205488200 U CN 205488200U
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Abstract
The utility model discloses an encapsulation of full -color SMD display screen is somebody's turn to do the encapsulation and includes three kinds of structures, the flip -chip support design that the positive flip -chip pad that be provided with two rows of parallel symmetric distributions in the bottom for polygon bowl cup was organized, and the thermal resistance is hanged down, need not the gold thread welding, encapsulates the finished product and avoids the gold thread to receive glue stress to influence and result in breaking, a six pins of the miniwatt design of the solid crystalline region between the bonding wire district that openly is provided with two rows of parallel symmetric distributions for the bottom of polygon bowl cup and the two rows of bonding wires districts, has guaranteed to improve reliability of an item by thermoelectric separation, one kind for the bottom front triangle of polygon bowl cup sets up respectively to bonding wire district, and one corner sets up to positive positive bonding pad altogether, and the bottom of polygon bowl cup openly removes four pins of the high -power design that the bonding wire foreign was solid crystalline region, guarantees thermoelectric separation, and realized three kind red, green, blue chips anodal be total to positive, the design of polygon bowl cup is favorable to increasing the bowl cup degree of depth, promotes angle and luminance, and is dampproofing effectual.
Description
Technical field
This utility model relates to SMD LED support technical field, particularly relates to a kind of full-color SMD display screen encapsulation.
Background technology
In prior art, along with the development of science and technology, LED product is gradually promoted and is come.The advantage of LED product is: environmental protection, power consumption is little, luminance is high, life-span length, non-maintaining, safe and reliable, response start fast and rich color.
Development along with industry, LED is turned to SMD paster structure by initial DIP straight cutting structure high-speed, the LED of SMD structure has that less, automatization lightweight, individual installs, lighting angle is big, color even, and light decay is slow and is prone to the advantages such as preservation, is becoming increasingly popular.Such as the most common 3528
RGB is full-color, 5050 RGB are full-color, has the feature of rich color, pure color, in particular for producing the 3528 of full color display
RGB all-colour LED, is gradually widely used.
But, along with the requirement of brightness and angle is more and more higher, often there is luminance shortage in the full-color lamp bead of existing display screen, angle is not enough and because the shallow problem of cup causes the bad phenomenon of moisture effect, or the bad phenomenon that light decay is fast.
Utility model content
For weak point present in above-mentioned technology, this utility model provides the encapsulation of a kind of simple in construction, easy to operate full-color SMD display screen.
In order to achieve the above object, this utility model one full-color SMD display screen encapsulates, including display/panel bracket, bipolar electrode red light chips, green glow chip, blue chip and glue, polygon bowl it is provided with on described display/panel bracket, the bottom front of described polygon bowl is provided with positive pole upside-down mounting pad group and the negative pole pad group anyway of two row's Parallel Symmetric distributions, described positive pole upside-down mounting pad group includes three positive pole upside-down mounting pads, the respectively first positive pole upside-down mounting pad, the second positive pole upside-down mounting pad and the 3rd positive pole upside-down mounting pad；Described negative pole upside-down mounting pad group includes three negative pole upside-down mounting pads, the respectively first negative pole upside-down mounting pad, the second negative pole upside-down mounting pad and the 3rd negative pole upside-down mounting pad；The positive pole of described bipolar electrode red light chips by common gold bonding on the first positive pole upside-down mounting pad, and the negative pole of described bipolar electrode red light chips by common gold bonding on the first negative pole upside-down mounting pad；The positive pole of described green glow chip by common gold bonding on the second positive pole upside-down mounting pad, and the negative pole of described green glow chip by common gold bonding on the second negative pole upside-down mounting pad；The positive pole of described blue chip by common gold bonding on the 3rd positive pole upside-down mounting pad, and the negative pole of described blue chip by common gold bonding on the 3rd negative pole upside-down mounting pad after, described glue injects curing molding in polygon bowl.
Wherein, described display/panel bracket being additionally provided with pedestal, described pedestal is connected by copper coin is fixing with the bottom of polygon bowl；The bottom rear of described polygon bowl is provided with multiple and positive pole upside-down mounting pad and negative pole upside-down mounting pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically；And the pin of each negative pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically.
Wherein, described polygon bowl be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and described pedestal be shaped as square；It is provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of positive terminal pad group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC；Described glue is epoxy resin, or silicones.
This utility model also provides for a kind of full-color SMD display screen encapsulation, including display/panel bracket, single electrode red light chips, green glow chip, blue chip and glue；Polygon bowl it is provided with on described display/panel bracket, the bottom front of described polygon bowl is provided with the crystal bonding area between wire welding area and the two row wire welding areas of two row's Parallel Symmetric distributions, two row wire welding areas are respectively positive pole bonding wire group and negative pole bonding wire group, and described positive pole bonding wire group includes three positive terminal pad, it is respectively the first positive terminal pad, the second positive terminal pad and the 3rd positive terminal pad, described negative pole bonding wire group includes three negative terminal pad, the respectively first negative terminal pad, the second negative terminal pad and the 3rd negative terminal pad；Described single electrode red light chips, green glow chip and blue chip cement on crystal bonding area successively, described single electrode red light chips is HONGGUANG forward chip, the electrode of described HONGGUANG forward chip is connected by bonding wire craft and the first positive terminal pad, and the bottom of described HONGGUANG forward chip is by elargol and the connection of the first negative terminal pad, the positive pole of described green glow chip is connected by bonding wire craft and the second positive terminal pad, and the negative pole of described green glow chip is by bonding wire craft and the connection of the second negative terminal pad, the positive pole of described blue chip is connected by bonding wire craft and the 3rd positive terminal pad, and described blue chip is by after bonding wire craft and the connection of the 3rd negative terminal pad, described glue injects curing molding in polygon bowl.
Wherein, described display/panel bracket being additionally provided with pedestal, described pedestal is connected by copper coin is fixing with the bottom of polygon bowl；The bottom rear of described polygon bowl is provided with multiple and positive terminal pad and negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically, and the pin of each negative terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically.
Wherein, described single electrode red light chips is the reverse chip of HONGGUANG, and the electrode of the reverse chip of described HONGGUANG is connected by bonding wire craft and the first negative terminal pad, and the bottom of the reverse chip of described HONGGUANG is connected by elargol and the first positive terminal pad.
Wherein, described polygon bowl be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and described pedestal be shaped as square；It is provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at positive terminal pad group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC；Described glue is epoxy resin, or silicones.
This utility model also provides for a kind of full-color SMD display screen encapsulation, including display/panel bracket, the reverse chip of HONGGUANG, green glow chip, blue chip and glue, polygon bowl it is provided with on described display/panel bracket, the bottom front triangle of described polygon bowl is disposed as wire welding area, one jiao is set to common anode positive terminal pad, and the bottom front of described polygon bowl is crystal bonding area in addition to wire welding area；Described wire welding area includes HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad；The reverse chip of described HONGGUANG, green glow chip and blue chip cement on crystal bonding area successively, the electrode of the reverse chip of described HONGGUANG is connected with HONGGUANG negative terminal pad by bonding wire craft, the bottom of described red light chips is connected with common anode positive terminal pad by elargol, and the positive pole of the positive pole of described green glow chip and blue chip is connected with common anode positive terminal pad by bonding wire craft respectively, the negative pole of described green glow chip is connected with green glow negative terminal pad by bonding wire craft, and after the negative pole of described blue chip is connected with blue light negative terminal pad by bonding wire craft, described glue injects curing molding in polygon bowl.
Wherein, described display/panel bracket being additionally provided with pedestal, described pedestal is connected by copper coin is fixing with the bottom of polygon bowl；The bottom rear of described polygon bowl be provided with respectively with common anode positive terminal pad, HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, described common anode positive terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, and described HONGGUANG negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, electrode pad and the pin of correspondence that described green glow negative terminal pad is corresponding are sequentially connected electrically, and described blue light negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically.
Wherein, described polygon bowl be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and described pedestal be shaped as square；It is provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of HONGGUANG negative terminal pad；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC；Described glue is epoxy resin, or silicones.
The beneficial effects of the utility model are:
Compared with prior art, this utility model provides a kind of full-color SMD display screen encapsulation, this full-color SMD display/panel bracket includes three kinds of structures, a kind of bottom front for polygon bowl is provided with the upside-down mounting support Design of the upside-down mounting pad group of two row's Parallel Symmetric distributions, and upside-down mounting support Design is applicable to bipolar electrode red light chips, and thermal resistance is low, light decay is little, its die bond wire soldering method welds without gold thread, and encapsulation finished product avoids gold thread to be caused broken string by glue stress influence, improves reliability；A kind of bottom front for polygon bowl is provided with the small-power six pin design of the crystal bonding area between wire welding area and the two row wire welding areas of two row's Parallel Symmetric distributions, the design of small-power six pin is applicable to single electrode red light chips, ensure that after encapsulation that thermoelectricity separates, improve the reliability of product, overcome conventional display screen full-color lamp pearly-lustre and decline fast problem；A kind of bottom front triangle for polygon bowl is respectively set to wire welding area, one jiao is set to common anode positive terminal pad, and the bottom front of polygon bowl is the high-power four pin designs of crystal bonding area in addition to wire welding area, high-power four pin designs are applicable to the reverse chip of high brightness HONGGUANG, not only ensure that after encapsulation that thermoelectricity separates, and achieve the positive pole common anode of three kinds of chips of red, green, blue；Being designed with of polygon bowl beneficially increases the bowl degree of depth, promotes angle and brightness, and moisture effect is good and extends the life-span.A kind of full-color SMD display screen encapsulation that this utility model provides, have be widely used, practical, encapsulation damp proofing effect of finished product is good, angle is big and brightness is high feature.
Accompanying drawing explanation
Fig. 1 is the top view of this utility model first embodiment；
Fig. 2 is the sectional view of this utility model first embodiment；
Fig. 3 is the top view of this utility model the second embodiment；
Fig. 4 is the sectional view of this utility model the second embodiment；
Fig. 5 is the top view of this utility model the 3rd embodiment；
Fig. 6 is the sectional view of this utility model the 3rd embodiment.
Main element symbol description is as follows:
In first embodiment:
10, pedestal
11, polygon bowl
12, copper coin
13, containment vessel
14, trimming
15, bipolar electrode red light chips
16, green glow chip
17, blue chip
111, first positive pole upside-down mounting pad the 112, second positive pole upside-down mounting pad
113, the 3rd positive pole upside-down mounting pad the 114, first negative pole upside-down mounting pad
115, the second negative pole upside-down mounting pad the 116, the 3rd negative pole upside-down mounting pad
117, electrode pad
In second embodiment:
20, pedestal
21, polygon bowl
22, copper coin
23, containment vessel
24, trimming
25, single electrode red light chips
26, green glow chip
27, blue chip
210, crystal bonding area
211, the first positive terminal pad
212, the second positive terminal pad
213, the 3rd positive terminal pad
214, the first negative terminal pad
215, the second negative terminal pad
216, the 3rd negative terminal pad
217, electrode pad
In 3rd embodiment:
30, pedestal
31, polygon bowl
32, copper coin
33, containment vessel
34, trimming
35, the reverse chip of HONGGUANG
36, green glow chip
37, blue chip
310, crystal bonding area
311, common anode positive terminal pad
312, HONGGUANG negative terminal pad
313, green glow negative terminal pad
314, blue light negative terminal pad
315, electrode pad.
Detailed description of the invention
In order to more clearly state this utility model, below in conjunction with the accompanying drawings this utility model is further described.
Refering to Fig. 1-2, a kind of full-color SMD display screen encapsulation of the present utility model, including display/panel bracket (not shown), bipolar electrode red light chips 15, green glow chip 16, blue chip 17 and glue, polygon bowl 11 it is provided with on display/panel bracket, the bottom front of polygon bowl 11 is provided with positive pole upside-down mounting pad group and the negative pole pad group anyway of two row's Parallel Symmetric distributions, positive pole upside-down mounting pad group includes three positive pole upside-down mounting pads, the respectively first positive pole upside-down mounting pad the 111, second positive pole upside-down mounting pad 112 and the 3rd positive pole upside-down mounting pad 113；Negative pole upside-down mounting pad group includes three negative pole upside-down mounting pads, the respectively first negative pole upside-down mounting pad the 114, second negative pole upside-down mounting pad 115 and the 3rd negative pole upside-down mounting pad 116；The positive pole of bipolar electrode red light chips 15 by common gold bonding on the first positive pole upside-down mounting pad 111, and the negative pole of bipolar electrode red light chips 15 by common gold bonding on the first negative pole upside-down mounting pad 114；The positive pole of green glow chip 16 by common gold bonding on the second positive pole upside-down mounting pad 112, and the negative pole of green glow chip 16 by common gold bonding on the second negative pole upside-down mounting pad 115；The positive pole of blue chip 17 by common gold bonding on the 3rd positive pole upside-down mounting pad 113, and the negative pole of blue chip 17 by common gold bonding on the 3rd negative pole upside-down mounting pad 116 after, glue injects curing molding in polygon bowl 11.
The bottom front of polygon bowl 11 be provided with two row's Parallel Symmetrics distribution positive pole upside-down mounting pad group and negative pole pad group anyway be designed as upside-down mounting support Design, upside-down mounting support Design is applicable to bipolar electrode red light chips 15, thermal resistance is low, light decay is little and welds without gold thread, avoid gold thread to be caused broken string by glue stress influence, improve reliability；Being designed with of polygon bowl 11 beneficially increases the bowl degree of depth, promotes angle and brightness, and moisture effect is good and extends the life-span.Certainly, this case is not limited to three positive pole upside-down mounting pads and the distribution mode of three negative pole upside-down mounting pads, if number of chips changes, so quantity of positive pole upside-down mounting pad and negative pole upside-down mounting pad can change according to the change of number of chips, corresponding electrode pad and pin number all can change, ratio is if desired for four bipolar electrode chips of die bond, then positive pole upside-down mounting pad and negative pole upside-down mounting number of pads are all corresponding is adjusted to four die bond bonding wires that can realize four chips；And, chip type in this case is not limited to bipolar electrode red light chips 15, green glow chip 16 and blue chip 17, it can also be the bipolar electrode chip of other colors, the quantity of chip can also be increased or decreased, and the pin of corresponding positive pole upside-down mounting pad, negative pole upside-down mounting pad, corresponding electrode pad and correspondence changes therewith.
In the present embodiment, display/panel bracket being additionally provided with pedestal 10, pedestal 10 is connected by copper coin 12 is fixing with the bottom of polygon bowl 11；The bottom rear of polygon bowl 11 is provided with multiple and positive pole upside-down mounting pad and negative pole upside-down mounting pad electrode pad 117 one to one, and each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive pole upside-down mounting pad, corresponding electrode pad 117 and correspondence is sequentially connected electrically；And the pin of each negative pole upside-down mounting pad, corresponding electrode pad 117 and correspondence is sequentially connected electrically.
In the present embodiment, polygon bowl 11 be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and pedestal 10 be shaped as square.It is provided with the trimming 14 for identifying polarity on pedestal 10, and trimming 14 is positioned at the side of positive terminal pad group；Being arranged with containment vessel 13 outside polygon bowl 11, polygon bowl 11, containment vessel 13 and pedestal 10 are made up of the one in PPA plastics, EMC or SMC；Glue is epoxy resin, or silicones.This figure is eight-sided formation figure, and tetragon, pentagon, hexagon, heptagon or the octagon beneficially positive pole upside-down mounting pad of symmetry and being evenly dividing of negative pole upside-down mounting pad, beneficially electric heating separate.And the operation of beneficially die bond, bonding wire and process for filling colloid, be conducive to improving yields.Trimming 14 is denoted as positive pole.Certainly, glue can add diffusant, increase angle.
PPA plastics are PPTA, its heat distortion temperature is up to more than 300 DEG C, use temperature up to 170 DEG C continuously, required short-term and long-term hot property can be met, and its superior mechanicalness characteristic can be kept, such as intensity, hardness, fatigue durability and creep resistance within the scope of broad temperature and in high humidity environment；EMC is epoxy resin, has good physics, chemical property, and it has the adhesive strength of excellence to the surface of metal and nonmetallic materials, dielectric properties are good, and deformation retract rate is little, product size good stability, hardness is high, and pliability is preferable, to alkali and major part solvent-stable；SMC is silicones, is to have highly cross-linked cancellated polysiloxane, has the double grading of organic resin and inorganic material concurrently, has the physics of uniqueness, chemical property.Therefore, a kind of containment vessel 13, polygon bowl 11 and the pedestal 10 prepared in selecting three kinds so that this full-color support has good physics and chemical property, it is ensured that the stability of structure；Using epoxy resin or the silicones of special import, through linear luminous, reduce light and reflect the light loss caused, angle is up to 130 degree.
Refer to Fig. 3-4, this utility model also provides for a kind of full-color SMD display screen encapsulation, including display/panel bracket (not shown), single electrode red light chips 25, green glow chip 26, blue chip 27 and glue, polygon bowl 21 it is provided with on display/panel bracket, the bottom front of polygon bowl 21 is provided with the crystal bonding area 210 between wire welding area and the two row wire welding areas of two row's Parallel Symmetric distributions, two row wire welding areas are respectively positive pole bonding wire group and negative pole bonding wire group, and positive pole bonding wire group includes three positive terminal pad, it is respectively the first positive terminal pad 211, second positive terminal pad 212 and the 3rd positive terminal pad 213, negative pole bonding wire group includes three negative terminal pad, it is respectively the first negative terminal pad 214, second negative terminal pad 215 and the 3rd negative terminal pad 216；Single electrode red light chips 25, green glow chip 26 and blue chip 27 cement on crystal bonding area 210 successively, single electrode red light chips 25 is HONGGUANG forward chip, the electrode of HONGGUANG forward chip is connected by bonding wire craft and the first positive terminal pad 211, and the bottom of HONGGUANG forward chip is connected by elargol and the first negative terminal pad 214, the positive pole of green glow chip 26 is connected by bonding wire craft and the second positive terminal pad 212, and the negative pole of green glow chip 26 is connected by bonding wire craft and the second negative terminal pad 215, the positive pole of blue chip 27 is connected by bonding wire craft and the 3rd positive terminal pad 213, and after blue chip 27 is connected by bonding wire craft and the 3rd negative terminal pad 216, glue injects curing molding in polygon bowl 21.
The bottom front of polygon bowl 21 is provided with small-power six pin that is designed as of the crystal bonding area between wire welding area and the two row wire welding areas of two row's Parallel Symmetric distributions and designs, the design of small-power six pin is applicable to single electrode red light chips 25, its die bond wire soldering method ensure that thermoelectricity separates, improve the reliability of product, overcome conventional display screen full-color lamp pearly-lustre and decline fast problem.
Certainly, this case is not limited to three positive terminal pad and the distribution mode of three negative terminal pad, if number of chips changes, so quantity of positive terminal pad and negative terminal pad can change according to the change of number of chips, corresponding electrode pad and pin number all can change, ratio is if desired for four bipolar electrode chips of die bond, then positive terminal pad and negative terminal pad quantity are all corresponding is adjusted to four die bond bonding wires that can realize four chips；And, chip type in this case is not limited to single electrode red light chips 25, green glow chip 26 and blue chip 27, it can also be the chip of other colors, single electrode or bipolar electrode are the most applicable, the quantity of chip can also be increased or decreased, and the pin number of corresponding positive terminal pad, negative terminal pad, corresponding electrode pad 217 and correspondence changes therewith.
In the present embodiment, display/panel bracket being additionally provided with pedestal 20, pedestal 20 is connected by copper coin 22 is fixing with the bottom of polygon bowl 21；The bottom rear of polygon bowl 21 is provided with multiple and positive terminal pad and negative terminal pad electrode pad 217 one to one, and each electrode pad 217 all run through copper coin 22 after be bent with the pin of correspondence, the pin of positive terminal pad, corresponding electrode pad 217 and correspondence is sequentially connected electrically, and the pin of negative terminal pad, corresponding electrode pad 217 and correspondence is sequentially connected electrically.
In the present embodiment, single electrode red light chips 25 is the reverse chip of HONGGUANG, and the electrode of the reverse chip of HONGGUANG is connected by bonding wire craft and the first negative terminal pad 214, and the bottom of the reverse chip of HONGGUANG is connected by elargol and the first positive terminal pad 211.
In the present embodiment, polygon bowl 21 be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and pedestal 20 be shaped as square.It is provided with the trimming 24 for identifying polarity on pedestal 20, and trimming 24 is positioned at positive terminal pad group；Being arranged with containment vessel 23 outside polygon bowl 21, polygon bowl 21, containment vessel 23 and pedestal 20 are made up of the one in PPA plastics, EMC or SMC；Glue is epoxy resin, or silicones.Trimming 24 is denoted as positive pole.Being evenly dividing of symmetrical tetragon, pentagon, hexagon, heptagon or octagon beneficially wire welding area and crystal bonding area, beneficially electric heating separates, and the operation of beneficially die bond, bonding wire and process for filling colloid, is conducive to improving yields.
Refer to Fig. 5-6, this utility model also provides for a kind of full-color SMD display screen encapsulation, including display/panel bracket (not shown), the reverse chip of HONGGUANG 35, green glow chip 36, blue chip 37 and glue, polygon bowl 31 it is provided with on display/panel bracket, the bottom front triangle of polygon bowl 31 is disposed as wire welding area, one jiao is set to common anode positive terminal pad 311, and the bottom front of polygon bowl 31 is crystal bonding area 310 in addition to wire welding area；Wire welding area includes HONGGUANG negative terminal pad 312, green glow negative terminal pad 313 and blue light negative terminal pad 314；The reverse chip of HONGGUANG 35, green glow chip 36 and blue chip 37 cement on crystal bonding area 310 successively, the electrode of the reverse chip of HONGGUANG 35 is connected with HONGGUANG negative terminal pad 312 by bonding wire craft, the bottom of red light chips is connected with common anode positive terminal pad 311 by elargol, and the positive pole of the positive pole of green glow chip 36 and blue chip 37 is connected with common anode positive terminal pad 311 by bonding wire craft respectively, the negative pole of green glow chip 36 is connected with green glow negative terminal pad 313 by bonding wire craft, and after the negative pole of blue chip 37 is connected with blue light negative terminal pad 314 by bonding wire craft, glue injects curing molding in polygon bowl 31.
The bottom front triangle of polygon bowl 31 is respectively set to wire welding area, one jiao is set to common anode positive terminal pad 311, and the bottom front of polygon bowl 31 in addition to wire welding area, be crystal bonding area 310 be designed as high-power four pin support Design, high-power four pin support Design are applicable to the reverse chip of single electrode HONGGUANG 35, its die bond wire soldering method ensure that thermoelectricity separates, improve the reliability of product, overcome conventional display screen full-color lamp pearly-lustre and decline fast problem.
In the present embodiment, display/panel bracket being additionally provided with pedestal 30, pedestal 30 is connected by copper coin 32 is fixing with the bottom of polygon bowl 31；The bottom rear of polygon bowl 31 be provided with respectively with common anode positive terminal pad 311, HONGGUANG negative terminal pad 312, green glow negative terminal pad 313 and blue light negative terminal pad 314 electrode pad 315 one to one, and each electrode pad 315 all run through copper coin 32 after be bent with the pin of correspondence, common anode positive terminal pad 311, corresponding electrode pad 315 and the pin of correspondence are sequentially connected electrically, and HONGGUANG negative terminal pad 312, corresponding electrode pad 315 and the pin of correspondence are sequentially connected electrically, the electrode pad 315 of green glow negative terminal pad 313 correspondence and the pin of correspondence are sequentially connected electrically, and blue light negative terminal pad 314, corresponding electrode pad 315 and the pin of correspondence are sequentially connected electrically.
In the present embodiment, polygon bowl 31 be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and pedestal 30 be shaped as square；；It is provided with the trimming 34 for identifying polarity on pedestal 30, and trimming 34 is positioned at the side of HONGGUANG negative terminal pad 312；Being arranged with containment vessel 33 outside polygon bowl 31, polygon bowl 31, containment vessel 33 and pedestal 30 are made up of the one in PPA plastics, EMC or SMC；Glue is epoxy resin, or silicones.Trimming 34 is denoted as HONGGUANG negative pole.The shape of polygon bowl 31, PPA plastics, EMC and SMC are described in detail the most.
Concrete advantage of the present utility model is:
1, upside-down mounting support Design realizes the effect that thermal resistance is low, light decay is little, it is not necessary to bonding wire, it is to avoid gold thread is caused broken string by glue stress influence, improves reliability；
2, polygon bowl makes it encapsulate finished product angle up to 130 degree, and compared to existing full-color lamp bead, angle and brightness are greatly improved；
3, deeper polygon bowl makes to encapsulate finished product and reaches good moisture effect, extends the life-span；
4, with high-power four pin support Design, small-power six pin support Design ensures that electric heating separates, improves the reliability of product.
Only several specific embodiments of the present utility model disclosed above, but this utility model is not limited to this, and the changes that any person skilled in the art can think of all should fall into protection domain of the present utility model.
Claims (10)
1. a full-color SMD display screen encapsulation, it is characterized in that, including display/panel bracket, bipolar electrode red light chips, green glow chip, blue chip and glue, polygon bowl it is provided with on described display/panel bracket, the bottom front of described polygon bowl is provided with positive pole upside-down mounting pad group and the negative pole pad group anyway of two row's Parallel Symmetric distributions, described positive pole upside-down mounting pad group includes three positive pole upside-down mounting pads, the respectively first positive pole upside-down mounting pad, the second positive pole upside-down mounting pad and the 3rd positive pole upside-down mounting pad；Described negative pole upside-down mounting pad group includes three negative pole upside-down mounting pads, the respectively first negative pole upside-down mounting pad, the second negative pole upside-down mounting pad and the 3rd negative pole upside-down mounting pad；The positive pole of described bipolar electrode red light chips by common gold bonding on the first positive pole upside-down mounting pad, and the negative pole of described bipolar electrode red light chips by common gold bonding on the first negative pole upside-down mounting pad；The positive pole of described green glow chip by common gold bonding on the second positive pole upside-down mounting pad, and the negative pole of described green glow chip by common gold bonding on the second negative pole upside-down mounting pad；The positive pole of described blue chip by common gold bonding on the 3rd positive pole upside-down mounting pad, and the negative pole of described blue chip by common gold bonding on the 3rd negative pole upside-down mounting pad after, described glue injects curing molding in polygon bowl.
Full-color SMD display screen the most according to claim 1 encapsulates, it is characterised in that be additionally provided with pedestal on described display/panel bracket, and described pedestal is connected by copper coin is fixing with the bottom of polygon bowl；The bottom rear of described polygon bowl is provided with multiple and positive pole upside-down mounting pad and negative pole upside-down mounting pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically；And the pin of each negative pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically.
Full-color SMD display screen the most according to claim 2 encapsulate, it is characterised in that described polygon bowl be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and described pedestal be shaped as square；It is provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of positive terminal pad group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC；Described glue is epoxy resin, or silicones.
4. a full-color SMD display screen encapsulation, it is characterised in that include display/panel bracket, single electrode red light chips, green glow chip, blue chip and glue；Polygon bowl it is provided with on described display/panel bracket, the bottom front of described polygon bowl is provided with the crystal bonding area between wire welding area and the two row wire welding areas of two row's Parallel Symmetric distributions, two row wire welding areas are respectively positive pole bonding wire group and negative pole bonding wire group, and described positive pole bonding wire group includes three positive terminal pad, it is respectively the first positive terminal pad, the second positive terminal pad and the 3rd positive terminal pad, described negative pole bonding wire group includes three negative terminal pad, the respectively first negative terminal pad, the second negative terminal pad and the 3rd negative terminal pad；Described single electrode red light chips, green glow chip and blue chip cement on crystal bonding area successively, described single electrode red light chips is HONGGUANG forward chip, the electrode of described HONGGUANG forward chip is connected by bonding wire craft and the first positive terminal pad, and the bottom of described HONGGUANG forward chip is by elargol and the connection of the first negative terminal pad, the positive pole of described green glow chip is connected by bonding wire craft and the second positive terminal pad, and the negative pole of described green glow chip is by bonding wire craft and the connection of the second negative terminal pad, the positive pole of described blue chip is connected by bonding wire craft and the 3rd positive terminal pad, and described blue chip is by after bonding wire craft and the connection of the 3rd negative terminal pad, described glue injects curing molding in polygon bowl.
Full-color SMD display screen the most according to claim 4 encapsulates, it is characterised in that be additionally provided with pedestal on described display/panel bracket, and described pedestal is connected by copper coin is fixing with the bottom of polygon bowl；The bottom rear of described polygon bowl is provided with multiple and positive terminal pad and negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically, and the pin of each negative terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically.
Full-color SMD display screen the most according to claim 4 encapsulates, it is characterized in that, described single electrode red light chips is the reverse chip of HONGGUANG, the electrode of the reverse chip of described HONGGUANG is connected by bonding wire craft and the first negative terminal pad, and the bottom of the reverse chip of described HONGGUANG is connected by elargol and the first positive terminal pad.
Full-color SMD display screen the most according to claim 5 encapsulate, it is characterised in that described polygon bowl be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and described pedestal be shaped as square；It is provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at positive terminal pad group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC；Described glue is epoxy resin, or silicones.
8. a full-color SMD display screen encapsulation, it is characterized in that, including display/panel bracket, the reverse chip of HONGGUANG, green glow chip, blue chip and glue, polygon bowl it is provided with on described display/panel bracket, the bottom front triangle of described polygon bowl is disposed as wire welding area, one jiao is set to common anode positive terminal pad, and the bottom front of described polygon bowl is crystal bonding area in addition to wire welding area；Described wire welding area includes HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad；The reverse chip of described HONGGUANG, green glow chip and blue chip cement on crystal bonding area successively, the electrode of the reverse chip of described HONGGUANG is connected with HONGGUANG negative terminal pad by bonding wire craft, the bottom of described red light chips is connected with common anode positive terminal pad by elargol, and the positive pole of the positive pole of described green glow chip and blue chip is connected with common anode positive terminal pad by bonding wire craft respectively, the negative pole of described green glow chip is connected with green glow negative terminal pad by bonding wire craft, and after the negative pole of described blue chip is connected with blue light negative terminal pad by bonding wire craft, described glue injects curing molding in polygon bowl.
Full-color SMD display screen the most according to claim 8 encapsulates, it is characterised in that be additionally provided with pedestal on described display/panel bracket, and described pedestal is connected by copper coin is fixing with the bottom of polygon bowl；The bottom rear of described polygon bowl be provided with respectively with common anode positive terminal pad, HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, described common anode positive terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, and described HONGGUANG negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, electrode pad and the pin of correspondence that described green glow negative terminal pad is corresponding are sequentially connected electrically, and described blue light negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically.
Full-color SMD display screen the most according to claim 9 encapsulate, it is characterised in that described polygon bowl be shaped as symmetry tetragon, pentagon, hexagon, heptagon or octagon in one, and described pedestal be shaped as square；It is provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of HONGGUANG negative terminal pad；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC；Described glue is epoxy resin, or silicones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620048707.4U CN205488200U (en) | 2016-01-19 | 2016-01-19 | Encapsulation of full -color SMD display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620048707.4U CN205488200U (en) | 2016-01-19 | 2016-01-19 | Encapsulation of full -color SMD display screen |
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| Publication Number | Publication Date |
|---|---|
| CN205488200U true CN205488200U (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620048707.4U Expired - Fee Related CN205488200U (en) | 2016-01-19 | 2016-01-19 | Encapsulation of full -color SMD display screen |
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| CN (1) | CN205488200U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898685A (en) * | 2017-01-04 | 2017-06-27 | 深圳市华天迈克光电子科技有限公司 | UV chip-packaging structures and its method for packing |
| WO2020108501A1 (en) * | 2018-11-28 | 2020-06-04 | 深圳Tcl新技术有限公司 | Led array and led display screen |
-
2016
- 2016-01-19 CN CN201620048707.4U patent/CN205488200U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898685A (en) * | 2017-01-04 | 2017-06-27 | 深圳市华天迈克光电子科技有限公司 | UV chip-packaging structures and its method for packing |
| WO2020108501A1 (en) * | 2018-11-28 | 2020-06-04 | 深圳Tcl新技术有限公司 | Led array and led display screen |
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Granted publication date: 20160817 Termination date: 20200119 |