CN204869923U - A composite sheet layer structure for packing electronic product - Google Patents
A composite sheet layer structure for packing electronic product Download PDFInfo
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- CN204869923U CN204869923U CN201520369373.6U CN201520369373U CN204869923U CN 204869923 U CN204869923 U CN 204869923U CN 201520369373 U CN201520369373 U CN 201520369373U CN 204869923 U CN204869923 U CN 204869923U
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- China
- Prior art keywords
- resin layer
- polystyrene resin
- layer
- electronic product
- maleic anhydride
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Abstract
The utility model discloses a composite sheet layer structure for packing electronic product, include as the polystyrene resin layer of basic unit or the polystyrene resin layer of shocking resistance, polystyrene resin layer or shock resistance polystyrene resin layer upper end and be equipped with linear polyethylene layer, the polystyrene resin layer or shock resistance the polystyrene resin layer with still be equipped with maleic anhydride grafting resin layer or polyethylene and maleic anhydride grafting blend resin layer between the linear polyethylene layer, the utility model discloses simple structure has the wear resistant ability of antidetonation, utilizes the thermoforming machine to incite somebody to action the utility model discloses the electronic product of the packaging pallet that obtains behind plastic uptake packing receives in the transfer process that vibrations are fricative to be influenced for a short time, can not produce the plastics powder, is particularly useful for high -accuracy electronic component packing of product, and can produce poisonous, harmful substance in process of production, and leftover bits are recoverable recycles, does benefit to the environmental protection.
Description
[technical field]
The utility model relates to a kind of composite sheet Rotating fields for packing electronic product, especially a kind ofly makes it be subject to shake the little composite sheet Rotating fields of frictional influence for packing high-accuracy electronic component.
[background technology]
Polystyrene is a kind of thermoplastic resin, and colourless, transparent, optical property is fabulous, and has high rigidity, and easy machine-shaping is cheap, is widely used in packaging industry.Polystyrene shock resistance energy poor performance.
Impact-resistant polystyrene transparency is poor, and surface gloss is low, easily processing, excellent in dimensional stability, impact strength is high and have high stiffness.
Polyethylene is a kind of milky plastics, and better mechanical property, is rich in pliability, and tough, and resistance to capacitive is good.Have good process industrial art performance, be easy to fusion plastification, and not easily decompose, cooling is easy to shaping, and goods geometry and physical dimension are easy to control.
Maleic anhydride graft is a kind of conventional important basic organic chemical industry raw material.Be mainly used in synthesis unsaturated polyester (UP) resin, maleic anhydride is also the important intermediate of copolymer, and be beneficial to as coupling agent and reaction modifier use again, have been widely used at plastic applications tool, maleic anhydride graft price is higher.
Linear polyethylene is milky white granules that is nontoxic, tasteless, odorless, there is higher softening temperature and melt temperature, the features such as intensity is large, good toughness, rigidity are large, heat-resisting, cold resistance is good, also there is good environmental stress crack resistance, the performance such as impact strength, tear-resistant intensity, is widely used in the fields such as industry and daily living article.
Electronic product of the prior art packaging is general, and what adopt is plastic sheeting or on the basis of carton, increases in inner packing the object that plastic foam, bubble film etc. make product reach shockproof.In production transport process, due to electronic product and external packing friction, jolting shake easily produces plastic powders, and powder enter electronic component inner understand cause fatal infringement to electronic product, the impact for high-accuracy electronic component is more serious.
Therefore, be necessary to solve the problem.
[utility model content]
The utility model overcomes the deficiencies in the prior art, provides a kind of composite sheet Rotating fields for packing electronic product, and its structure is simple and easy to realize, effective.
The utility model is achieved through the following technical solutions:
A kind of composite sheet Rotating fields for packing electronic product, comprise the polystyrene resin layer as basic unit or impact-resistant polystyrene resin layer, described polystyrene resin layer or impact-resistant polystyrene resin layer upper end are provided with linear polyethylene layer, described polystyrene resin layer or be also provided with maleic anhydride grafted resin layer or polyethylene and maleic anhydride graft blending resin layer between impact-resistant polystyrene resin layer and described linear polyethylene layer.
As above for packing a composite sheet Rotating fields for electronic product, the thickness of described polystyrene resin layer or impact-resistant polystyrene resin layer is 0.3 ~ 2.0mm.
As above for packing a composite sheet Rotating fields for electronic product, the thickness of described maleic anhydride grafted resin layer or polyethylene and maleic anhydride graft blending resin layer is 0.05 ~ 0.1mm.
As above for packing a composite sheet Rotating fields for electronic product, the thickness of described linear polyethylene layer is 0.1 ~ 0.5mm.
Compared with prior art, the utility model has the following advantages:
The utility model is by the mode of MULTILAYER COMPOSITE, by the intensity of polystyrene resin layer or impact-resistant polystyrene resin layer reinforcing sheet sheet material layers structure, sheet layer structure is made to have stronger rub resistance ability by linear polyethylene layer, by maleic anhydride grafted resin layer or polyethylene and maleic anhydride graft blending resin layer, polystyrene resin layer or impact-resistant polystyrene resin layer and linear polyethylene layer are better bonded together, and maleic anhydride grafted resin layer or polyethylene and maleic anhydride graft blending resin layer have the effect of buffering.
The utility model structure is simple, utilizes the electronic product that the packaging pallet obtained after the utility model plastic uptake is packed by thermoforming machine, and the impact by vibrations friction in transport process is little, can not produce plastic powders.Can meet electronic product at the quality requirement producing available protecting electronic product in transport process and long-distance transport process, and can not produce poisonous and harmful substances in process of production, the recyclable recycling of leftover pieces, is beneficial to environmental protection.
[accompanying drawing explanation]
Fig. 1 is the utility model structural representation Fig. 1;
Fig. 2 is the utility model structural representation Fig. 2;
Fig. 3 is the utility model structural representation Fig. 3;
Fig. 4 is the utility model structural representation Fig. 4;
[detailed description of the invention]
Below in conjunction with accompanying drawing, the utility model is further described:
The utility model is three-layer composite structure, utilizes Multi-layer coextrusion sheet extruder extrusion sheet.Comprise the polystyrene resin layer 1 as basic unit or impact-resistant polystyrene resin layer 10, described polystyrene resin layer 1 or impact-resistant polystyrene resin layer 10 upper end are provided with linear polyethylene layer 3, described polystyrene resin layer 1 or be also provided with maleic anhydride grafted resin layer 2 or polyethylene and maleic anhydride graft blending resin layer 20 between impact-resistant polystyrene resin layer 10 and described linear polyethylene layer 3.Polystyrene has high rigidity, transparent, good in optical property, by intensity and the glossiness of polystyrene resin layer reinforcing sheet sheet material layers structure, impact-resistant polystyrene strong shock resistance, optical property is poor, poor transparency, adopt impact-resistant polystyrene resin layer, sheet layer structure has higher impact resistance, there is higher toughness and intensity, linear polyethylene intensity is large, good toughness, rigidity is large, sheet layer structure is made to have stronger rub resistance ability by linear polyethylene layer, maleic anhydride grafted resin layer has good capacitive and cohesive, maleic anhydride price is higher, polyethylene is cheap, polyethylene and maleic anhydride graft blending resin layer is adopted to have good capacitive and cohesive, by maleic anhydride grafted resin layer or polyethylene and maleic anhydride graft blending resin layer, polystyrene resin layer or impact-resistant polystyrene resin layer and linear polyethylene layer are better bonded together, maleic anhydride grafted resin layer or polyethylene and maleic anhydride graft blending resin layer have the effect of buffering.
Polystyrene, impact-resistant polystyrene, polyethylene, maleic anhydride graft and linear polyethylene are current material, in the middle of production application, utilize thermoforming machine the utility model plastic uptake can be become the packing box of electronic product.During Production and Packaging, electronic product is placed on the inside of packing box, and the inwall of packing box is linear polyethylene layer, and the outer wall of packing box is polystyrene resin layer or impact-resistant polystyrene resin layer.During actual production, there are four kinds of combinations, as required, different resin beds can be selected by self assemble, when selecting higher-strength, employing packing box outer wall is the packing box of impact-resistant polystyrene resin layer, and during the packing box selecting surperficial glossiness good, employing outer wall is the packing box of polystyrene resin layer, when considering low cost, select polyethylene and maleic anhydride graft blending resin layer.The Electron product packaging case adopting three-layer composite structure plastic uptake to become can protect electronic product impact by vibrations friction in transhipment.
The preferred thickness of described polystyrene resin layer 1 or impact-resistant polystyrene resin layer 10 is 0.3 ~ 2.0mm, the preferred thickness of described maleic anhydride grafted resin layer 2 or polyethylene and maleic anhydride graft blending resin layer 20 is 0.05 ~ 0.1mm, and the preferred thickness of described linear polyethylene layer 3 is 0.1 ~ 0.5mm.
Through vibrations experiment test, common electronic packaging carries out vibration test after 3 hours and start to occur plastic powders, use the electronic packaging that the utility model manufactures, without any powder after the vibration test of 24 hours, cleanliness factor meets the terms of packing of high-accuracy electronic product completely.
Claims (4)
1. one kind for packing the composite sheet Rotating fields of electronic product, it is characterized in that: comprise the polystyrene resin layer (1) as basic unit or impact-resistant polystyrene resin layer (10), described polystyrene resin layer (1) or impact-resistant polystyrene resin layer (10) upper end are provided with linear polyethylene layer (3), described polystyrene resin layer (1) or be also provided with maleic anhydride grafted resin layer (2) or polyethylene and maleic anhydride graft blending resin layer (20) between impact-resistant polystyrene resin layer (10) and described linear polyethylene layer (3).
2. a kind of composite sheet Rotating fields for packing electronic product according to claim 1, is characterized in that: the thickness of described polystyrene resin layer (1) or impact-resistant polystyrene resin layer (10) is 0.3 ~ 2.0mm.
3. a kind of composite sheet Rotating fields for packing electronic product according to claim 1, is characterized in that: the thickness of described maleic anhydride grafted resin layer (2) or polyethylene and maleic anhydride graft blending resin layer (20) is 0.05 ~ 0.1mm.
4. a kind of composite sheet Rotating fields for packing electronic product according to claim 1, is characterized in that: the thickness of described linear polyethylene layer (3) is 0.1 ~ 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520369373.6U CN204869923U (en) | 2015-06-01 | 2015-06-01 | A composite sheet layer structure for packing electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520369373.6U CN204869923U (en) | 2015-06-01 | 2015-06-01 | A composite sheet layer structure for packing electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204869923U true CN204869923U (en) | 2015-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520369373.6U Expired - Fee Related CN204869923U (en) | 2015-06-01 | 2015-06-01 | A composite sheet layer structure for packing electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204869923U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107825777A (en) * | 2017-12-07 | 2018-03-23 | 云南昆钢石头纸环保材料有限公司 | It is a kind of to be used to pack stone paper composite sheet of electronic product and preparation method thereof |
-
2015
- 2015-06-01 CN CN201520369373.6U patent/CN204869923U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107825777A (en) * | 2017-12-07 | 2018-03-23 | 云南昆钢石头纸环保材料有限公司 | It is a kind of to be used to pack stone paper composite sheet of electronic product and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20170601 |